CN112977949B - Automatic blanking device for silicon wafer inspection and control method thereof - Google Patents
Automatic blanking device for silicon wafer inspection and control method thereof Download PDFInfo
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- CN112977949B CN112977949B CN201911301663.6A CN201911301663A CN112977949B CN 112977949 B CN112977949 B CN 112977949B CN 201911301663 A CN201911301663 A CN 201911301663A CN 112977949 B CN112977949 B CN 112977949B
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- packaging
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 118
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 115
- 239000010703 silicon Substances 0.000 title claims abstract description 115
- 238000007689 inspection Methods 0.000 title claims abstract description 25
- 238000000034 method Methods 0.000 title claims abstract description 12
- 230000005540 biological transmission Effects 0.000 claims abstract description 151
- 238000004806 packaging method and process Methods 0.000 claims abstract description 65
- 230000000149 penetrating effect Effects 0.000 claims abstract description 5
- 235000012431 wafers Nutrition 0.000 claims description 101
- 238000012856 packing Methods 0.000 claims description 29
- 238000007599 discharging Methods 0.000 claims description 7
- 238000012546 transfer Methods 0.000 claims description 6
- 238000013461 design Methods 0.000 abstract description 3
- 239000000463 material Substances 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 238000001514 detection method Methods 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
- B65B35/00—Supplying, feeding, arranging or orientating articles to be packaged
- B65B35/30—Arranging and feeding articles in groups
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
- B65B35/00—Supplying, feeding, arranging or orientating articles to be packaged
- B65B35/56—Orientating, i.e. changing the attitude of, articles, e.g. of non-uniform cross-section
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
- B65B43/00—Forming, feeding, opening or setting-up containers or receptacles in association with packaging
- B65B43/42—Feeding or positioning bags, boxes, or cartons in the distended, opened, or set-up state; Feeding preformed rigid containers, e.g. tins, capsules, glass tubes, glasses, to the packaging position; Locating containers or receptacles at the filling position; Supporting containers or receptacles during the filling operation
- B65B43/46—Feeding or positioning bags, boxes, or cartons in the distended, opened, or set-up state; Feeding preformed rigid containers, e.g. tins, capsules, glass tubes, glasses, to the packaging position; Locating containers or receptacles at the filling position; Supporting containers or receptacles during the filling operation using grippers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention provides an automatic blanking device for silicon wafer inspection and a control method thereof, comprising a fixed table, wherein a transmission unit, a packaging unit and a positioning unit are arranged above the fixed table; the packaging unit is arranged at one end, far away from the transmission unit, of the positioning unit in a penetrating manner, and the opening direction of the packaging unit is arranged towards one side, close to the transmission unit; one end of the operation unit is connected with the fixed table, the other end of the operation unit is connected with the packaging unit, and the operation unit can enable the packaging unit to vertically move up and down. The blanking device solves the technical problems of low working efficiency and high quality risk caused by manual blanking collection in the prior art, and has the advantages of high degree of automation, reasonable structural design, good controllability and high working efficiency.
Description
Technical Field
The invention belongs to the technical field of solar silicon wafer inspection, and particularly relates to an automatic blanking device for silicon wafer inspection and a control method thereof.
Background
The existing silicon wafer inspection is carried out by automatic detection equipment, and when qualified silicon wafers are placed in a collection bin, the silicon wafers are manually retrieved and then stacked in a packing box placed in another independent area. For the existing small-size silicon wafers with the diameter of 120-160mm, the blanking collection mode can ensure normal operation, but the operation of matching multiple persons is often needed, and the materials are easy to mix. For large-size silicon wafers with the diameter of 200-300mm, the silicon wafers are large and thin, the silicon wafers are easily damaged by collision due to manual material taking or discharging, and the large-size silicon wafers are large in workload due to the increase of areas, so that the working efficiency is lower, and the risks of collision, damage and mixing of the silicon wafers are extremely high.
Disclosure of Invention
The invention provides an automatic blanking device for silicon wafer inspection and a control method thereof, which are particularly suitable for an automatic blanking and collecting device for large-size silicon wafer inspection, and solve the technical problems of low working efficiency and high quality risk caused by manual blanking and collecting in the prior art.
In order to solve the technical problems, the invention adopts the following technical scheme:
The automatic blanking device for the silicon wafer inspection comprises a fixed table, wherein a transmission unit, a packaging unit and a positioning unit are arranged above the fixed table, an operation unit matched with the packaging unit is arranged on the side surface of the fixed table, one end of the transmission unit is connected with an outlet for the silicon wafer inspection, and the other end of the transmission unit is connected with the positioning unit; the packaging unit is arranged at one end, far away from the transmission unit, of the positioning unit in a penetrating manner, and the opening direction of the packaging unit is arranged towards one side, close to the transmission unit; one end of the operation unit is connected with the fixed table, the other end of the operation unit is connected with the packaging unit, and the operation unit can enable the packaging unit to vertically move downwards.
Further, the transmission unit comprises a main transmission section, a plurality of auxiliary transmission sections and auxiliary transmission sections respectively connected with the main transmission section and the auxiliary transmission sections, wherein the main transmission section and the auxiliary transmission sections are coaxially arranged, and the auxiliary transmission sections are uniformly distributed along one end, far away from the main transmission section, of the auxiliary transmission section.
Further, the number of the auxiliary transmission sections is three, and the included angles between the auxiliary transmission sections and between the auxiliary transmission sections are 90 degrees.
Further, the auxiliary transmission section and the auxiliary transmission section are both positioned on the inner side of the fixed table, and the main transmission section is positioned on the outer side of the fixed table.
Further, the positioning units are respectively arranged at one end, far away from the auxiliary transmission section, of the auxiliary transmission section and are positioned at the outer side of the fixed table, and the main transmission section, the auxiliary transmission section and the positioning units are all positioned on the same horizontal plane.
Further, the packaging unit is vertically arranged through the thickness direction of the positioning unit, a plurality of parallel placing grooves are formed in the length direction of the packaging unit, and the width of each placing groove is matched with the length of the silicon wafer; the width of the placing groove is smaller than that of the positioning unit, and the lower end face of the placing groove and the upper end face of the positioning unit are arranged at the same height.
Further, the operation unit is a manipulator which is arranged in a telescopic manner, each packaging unit is provided with the manipulator, one end of the manipulator is connected with a motor arranged in the fixed table, and the other end of the manipulator is connected with the packaging unit.
Further, the device also comprises a connecting unit, wherein the connecting unit is perpendicular to the transmission unit and is respectively connected with the transmission unit and the fixed table.
The control method of the automatic silicon wafer inspection discharging device comprises the steps that horizontally arranged silicon wafers are conveyed to any packaging unit which is arranged in the positioning unit in a penetrating way along the conveying unit, and each time a stack of silicon wafers is filled, the packaging unit is driven to vertically move downwards by the operation unit; and continuing to convey the silicon chip to the packaging unit through the conveying unit until the packaging unit is filled with the silicon chip.
Further, when one side of the packaging unit is filled with the silicon wafer, the silicon wafer is rotated by 90 degrees or 180 degrees along the transmission unit and then is conveyed into the other packaging unit until the packaging unit is filled with the silicon wafer.
The automatic discharging device for silicon wafer inspection and the control method thereof provided by the invention have the advantages of high degree of automation, reasonable structural design, capability of ensuring the stability of silicon wafer placement, improving the collection quantity of silicon wafers, ensuring the quality of the silicon wafers, good controllability and high working efficiency.
Drawings
FIG. 1 is a schematic structural view of an automatic silicon wafer inspection and blanking device according to an embodiment of the present invention;
FIG. 2 is a top view of a blanking apparatus according to an embodiment of the present invention;
FIG. 3 is a side view of a blanking apparatus according to an embodiment of the present invention;
fig. 4 is a schematic structural view of a packing unit according to an embodiment of the present invention.
In the figure:
10. Fixed station 20, transmission unit 21, main transmission section
22. Auxiliary transmission section 23, auxiliary transmission section 30, and positioning unit
31. Through-hole 32, detachable edge 40, packaging unit
41. Packaging box 42, placement groove 50, and operation unit
51. Cross frame 52, adjustable frame 53 and support frame
60. Connection unit
Detailed Description
The invention will now be described in detail with reference to the drawings and specific examples.
The invention provides an automatic silicon wafer inspection blanking device, which is shown in fig. 1, is used for blanking and packaging large-size silicon wafers with the diameter of 200-300mm, can be round silicon wafers or square silicon wafers, and comprises a fixing table 10, a transmission unit 20 used for conveying the silicon wafers to move, a packaging unit 40 used for collecting the blanking silicon wafers, a positioning unit 30 used for clamping and fixing the packaging unit 40, an operation unit 50 used for controlling the packaging unit 40 to vertically move up and down and a connecting unit 60 used for fixedly connecting the transmission unit 20 and the fixing table 10, wherein the transmission unit 20, the positioning unit 30 and the packaging unit 40 are all positioned above the fixing table 10 and are fixed on the upper end face of the fixing table 10 through the connecting unit 60, the transmission unit 20 and the positioning unit 30 are all arranged in parallel with the upper end face of the fixing table 10, the operation unit 50 is arranged on the side face of the fixing table 10 and is matched with the packaging unit 40, one end of the transmission unit 20 is connected with a blanking outlet of the silicon wafers to be inspected, and the other end of the transmission unit 20 is connected with the positioning unit 30; the packing unit 40 is disposed at one end of the positioning unit 30 away from the transmission unit 20, and an opening direction of the packing unit 40 is disposed toward a side close to the transmission unit 20; one end of the operation unit 50 is connected to the fixed table 10, and the other end is connected to the packing unit 40, and the operation unit 50 can vertically move the packing unit 40 up and down.
Specifically, as shown in fig. 1 to 3, the transmission unit 20 includes a main transmission section 21, a plurality of auxiliary transmission sections 22, and auxiliary transmission sections 23 connected to the main transmission section 21 and the auxiliary transmission sections 22, respectively, the main transmission section 21 and the auxiliary transmission section 23 being coaxially disposed, and the auxiliary transmission sections 22 being uniformly distributed along one end of the auxiliary transmission section 23 remote from the main transmission section 21. In this embodiment, the auxiliary transmission sections 22 have three auxiliary transmission sections 22, the included angles between the auxiliary transmission sections 22 and the auxiliary transmission sections 23 and between the adjacent auxiliary transmission sections 22 are 90 °, that is, one auxiliary transmission section 22 and the auxiliary transmission section 23 are coaxially arranged, the other two auxiliary transmission sections 22 are perpendicular to the auxiliary transmission section 23 and symmetrically arranged relative to the auxiliary transmission section 23, one ends of the three auxiliary transmission sections 22 close to the auxiliary transmission section 23 are commonly connected to one end of the auxiliary transmission section 23, the lengths of the auxiliary transmission section 22 and the auxiliary transmission section 23 are the same and are both positioned on the inner side of the upper end face of the fixed table 10, and the main transmission section 21 is positioned on the outer side of the fixed table 10. That is, the silicon wafer cluster inspection outlet enters the main transmission section 21, flows into the auxiliary transmission section 23 after passing through the main transmission section 21, flows into each auxiliary transmission section 22 through the auxiliary transmission section 23, the silicon wafer can adjust the path of the silicon wafer flowing into the packaging unit 40 through the auxiliary transmission section 22 in a rotating way, and the silicon wafer can rotate 90 degrees clockwise from the rightmost auxiliary transmission section 22 to the auxiliary transmission section 22 at the middle position or rotate 180 degrees clockwise to the left auxiliary transmission section 22 from the main transmission section 21 through the auxiliary transmission section 23; of course, the silicon wafer can also rotate 90 degrees anticlockwise from the left side auxiliary transmission section 22 to the middle position auxiliary transmission section 22 or rotate 180 degrees anticlockwise to the right side auxiliary transmission section 22; the silicon wafer may also be rotated 90 ° clockwise from the middle auxiliary transfer section 22 to the right auxiliary transfer section 22 and then rotated 180 ° counter-clockwise from the right auxiliary transfer section 22 to the left auxiliary transfer section 22. When the flow is transferred to each auxiliary transmission section 22, the peripheral controller controls the movement state of the belt, and when the controller controls the corresponding auxiliary transmission section 22 to move, the other auxiliary transmission sections 22 stop moving, and the silicon wafer moves along the moving auxiliary transmission section 22 until reaching the inside of the packaging unit 40 on the positioning unit 30; when the packing unit 40 corresponding to the moving sub-transmission section 22 is filled with silicon wafers, the sub-transmission section 22 is not moved, and the silicon wafers flowing through the auxiliary transmission section 23 are again flowed to the other moving sub-transmission section 22 until the packing unit 40 corresponding to the moving sub-transmission section 22 is filled with silicon wafers, and then the movement is stopped. The main transmission section 21, the auxiliary transmission section 22 and the auxiliary transmission section 23 are all located on the same horizontal plane and are all belt transmission, the width of the belt is smaller than the maximum width of the silicon wafer and is larger than half of the width of the silicon wafer, the belt is symmetrical to the axis of the silicon wafer, and the belt transmission is a common structure in the art and is not described in detail herein. The transmission unit 20 that this structure set up, the linkage is nimble, and easy control and simple structure are fit for the transmission of various size shape silicon chips, especially are fit for jumbo size silicon chip, utilize the frictional force between horizontal migration speed belt of transmission belt and the silicon chip, guarantee the stationarity that the silicon chip was placed, easily change the control of silicon chip circulation direction, and can not produce other piece risks, can guarantee the silicon chip quality.
As shown in fig. 1 and 2, the positioning units 30 are respectively and fixedly arranged at one end of the auxiliary transmission section 22 away from the auxiliary transmission section 23 and are positioned at the outer side of the fixing table 10, that is, the number of the positioning units 30 is the same as that of the auxiliary transmission section 22, the positioning units 30, the main transmission section 21, the auxiliary transmission section 22 and the auxiliary transmission section 23 are all positioned at the same horizontal plane, the positioning units 30 are positioning plates of rectangular structures, a through hole 31 of rectangular structures is arranged at one side of the positioning units 30 away from the auxiliary transmission section 22, the packaging units 40 penetrate through the through hole 31, the through hole 31 is of a structure with a single-side opening, a detachable edge 32 is arranged at the side edge of the through hole 31, the detachable edge 32 is hinged with the positioning units 30, so that the through hole 31 is detachably fixed, the packaging units 40 are conveniently and fixedly arranged on the positioning units 30, the width of the positioning units 30 is larger than the width of the packaging units 40, and the positioning units 30 are in clearance fit with the packaging units 40, so that the packaging units 40 can move up and down along the thickness direction of the positioning units 30, that is along the height direction of the packaging units 40.
Further, the packaging units 40 are disposed on the sides of all the positioning units 30 far from the auxiliary transmission section 22, the packaging units 40 penetrate through the positioning units 30 and are vertically disposed in the thickness direction, and the packaging units 40 are packaging boxes 41, as shown in fig. 4, the number of the packaging boxes 41 is the same as that of the positioning units 30. The length direction of the packing box 41 is provided with a plurality of parallel placing grooves 42, and the width of the placing grooves 42 is matched with the length of the silicon wafer. The height of the placing grooves 42 is the same, a plurality of silicon wafers can be placed in the placing grooves 42, the depth of the placing grooves 42 is larger than half of the diameter or the side length of the silicon wafers and smaller than 4/5 of the diameter or the side length of the silicon wafers, the width of the placing grooves 42 is smaller than the width of the positioning units 30, the lower end faces of the placing grooves 42 and the upper end faces of the positioning units 30 are arranged at the same height, and the silicon wafers can be placed in the placing grooves 42 conveniently. In the blanking and loading process, dust-free paper can be placed on the lower end face of the placing groove 42 for placing the silicon wafer. The packing box 41 with the structure can be provided with a plurality of placing grooves 42, and each blanking device is provided with three packing boxes 41, so that the number of packed silicon wafers is increased, and the finished product quantity of the silicon wafer package is improved.
Further, the operation unit 50 is a manipulator which is telescopically arranged, as shown in fig. 3, a manipulator is arranged at each packing box 41, one end of the manipulator is connected with a motor arranged in the fixing table 10, and the other end of the manipulator is connected with the packing box 41. Specifically, the manipulator includes a horizontal frame 51 and an adjustable frame 52 that are arranged horizontally, an inclined support frame 53 is arranged on the horizontal frame 51 and the adjustable frame 52, the support frame 53 is hinged with the horizontal frame 51 and the adjustable frame 52, the support frame 53 not only can fix the horizontal frame 51 and the adjustable frame 52 to improve the strength of the horizontal frame 51 and the adjustable frame 52, but also can enable the adjustable frame 52 to move up and down along the vertical direction. The adjustable frame 52 is fixed on a side surface of the packing box 41 far away from the placement groove 42, the adjustable frame 52 can drive the packing box 41 to vertically move downwards along the length direction, i.e. the height direction, of the packing box 41, and the adjustable frame 52 can be a spring control structure, an air cylinder control structure, a sliding control structure or the like, and is not limited in particular. The initial material collection is carried out, the lowest layer of the placing grooves 42 in the packaging box 41 and the positioning unit 30 are arranged at the same position, the silicon wafer is filled with the lowest layer of the placing grooves 42, after the silicon wafer is filled, the adjustable frame 52 drives the packaging box 41 to vertically move downwards, the next-to-last layer of the placing grooves 42 and the positioning unit 30 are arranged at the same position, and so on. When the uppermost layer of the placing groove 42 is filled with the silicon wafer, the package box 41 is stopped to receive the silicon wafer, the detachable edge 32 is detached to separate the package box 41 from the positioning unit 30, the adjustable frame 52 is detached to separate the operation unit 50 from the package box 41, and the package box 41 filled with the silicon wafer is taken out.
As shown in fig. 1, the connection unit 60 is disposed on the central axis of the stationary table 10, the connection unit 60 is disposed perpendicular to the transmission unit 20 and directly below the connection position of the auxiliary transmission section 22 and the auxiliary transmission section 23, and the connection unit 60 is connected to the transmission unit 20 and the stationary table 10, respectively. The connection unit 60 is of a cylindrical shaft structure, but may be of other structures, and is not particularly limited herein.
The automatic discharging device designed by the invention is especially suitable for conveying large-size silicon wafers, can automatically sort the silicon wafers for discharging and collecting, is provided with a plurality of uniformly distributed packaging boxes for collecting the silicon wafers, and can directly feed qualified silicon wafers into the placing grooves in the packaging boxes without manual collecting operation of personnel; the whole packaging box can automatically and vertically move up and down under the control of the manipulator, and the placing groove filled with the silicon wafer moves down under the control of the manipulator; after the single-side packaging box is fully filled with the silicon wafer, the silicon wafer can be fed and collected to the packaging box on the other side along the automatic transmission unit, the linkage is flexible, the control is easy, the structure is simple, the silicon wafer feeding device is suitable for the silicon wafers with various sizes and shapes, the stability is good, the control of the silicon wafer circulation direction is easy to change, and other fragment risks can not be generated.
A control method of an automatic silicon wafer inspection blanking device comprises the blanking device, and specifically comprises the following steps:
Step one: the lowermost layer of placement grooves 42 of the packing boxes 41 in all the packing units 40 are disposed in horizontal alignment with the upper end surfaces of the positioning units 30.
Step two: the silicon chip that the level set up moves to along the main transmission section 21 in the transfer unit 20 from the unloading export of inspection, the silicon chip moves to auxiliary transmission section 23 forward through main transmission section 21 level, when reaching the one end that auxiliary transmission section 23 kept away from main transmission section 21, stop, the system control is located auxiliary transmission section 22 on auxiliary transmission section 23 right side when operating, other auxiliary transmission section 22 stop operation at this moment, the silicon chip then moves along auxiliary transmission section 22 on right side, reach in the standing groove 42 of the lower floor in the packing carton 41 on right side after locating unit 30, until the standing groove 42 of the lower floor is full of the silicon chip, in this embodiment, can place 100 silicon chips in one standing groove 42.
Step three: after the lowest layer of the placing grooves 42 is filled with 100 silicon wafers, a manipulator in the right side operation unit 50 drives the packing box 41 to vertically move downwards, and the placing groove 42 of the penultimate layer is horizontally aligned with the upper end surface of the positioning unit 30; step two is repeated and the wafer is filled with the penultimate layer of placement slots 42.
Step four: the manipulator in the right operation unit 50 drives the packing box 41 to vertically move downwards, the placement groove 42 of the third last layer is horizontally aligned with the upper end surface of the positioning unit 30, and the second and third steps are repeated until the right packing box 41 is filled with silicon chips.
Step five: after the right packing box 41 is filled with silicon wafers, the silicon wafers coming out from the tested discharging outlet sequentially pass through the main conveying section 21 and the auxiliary conveying section 23, when the silicon wafers reach one end of the auxiliary conveying section 23 far away from the main conveying section 21, the system stays, when the system controls the coaxial auxiliary conveying section 22 positioned in the auxiliary conveying section 23 to operate, at the moment, the other auxiliary conveying sections 22 stop operating, the silicon wafers rotate by 90 degrees and turn to horizontally linearly move, namely move along the coaxial auxiliary conveying section 22, then pass through the positioning unit 30 and reach the lowest layer of placing grooves 42 in the coaxial packing box 41 until 100 silicon wafers are fully placed in the lowest layer of placing grooves 42, and the next layer of placing grooves 42 are circularly collected until all the placing grooves 42 are fully filled with the silicon wafers.
Step six: after the coaxial packing box 41 is filled with silicon wafers, the silicon wafers pass through the auxiliary transmission section 23 again, stay for 1-3 seconds, rotate 90 degrees and turn to the left side to move by the auxiliary transmission section 22, at the moment, the other auxiliary transmission sections 22 stop moving, then pass through the positioning unit 30 and reach the lowest layer of the placing grooves 42 in the left packing box 41 until 100 silicon wafers are fully filled in the lowest layer of the placing grooves 42, and the next layer of the placing grooves 42 are circularly collected until all the placing grooves 42 are fully filled with silicon wafers.
The control method of the blanking device provided by the invention has the advantages of high automation degree, reasonable structural design, good controllability and high working efficiency, not only ensures the stability of silicon wafer placement, but also can improve the collection quantity of silicon wafers, and can ensure the quality of the silicon wafers.
The foregoing detailed description of the embodiments of the invention has been presented only to illustrate the preferred embodiments of the invention and should not be taken as limiting the scope of the invention. All equivalent changes and modifications within the scope of the present invention are intended to be covered by the present invention.
Claims (8)
1. The automatic blanking device for silicon wafer inspection is characterized by comprising a fixed table, wherein a transmission unit, a packaging unit and a positioning unit are arranged above the fixed table, an operation unit matched with the packaging unit is arranged on the side surface of the fixed table, one end of the transmission unit is connected with an outlet for silicon wafer inspection, and the other end of the transmission unit is connected with the positioning unit; the packaging unit is arranged at one end, far away from the transmission unit, of the positioning unit in a penetrating manner, and the opening direction of the packaging unit is arranged towards one side, close to the transmission unit; one end of the operation unit is connected with the fixed table, the other end of the operation unit is connected with the packaging unit, and the operation unit can enable the packaging unit to vertically move up and down;
The transmission unit comprises a main transmission section, a plurality of auxiliary transmission sections and auxiliary transmission sections respectively connected with the main transmission section and the auxiliary transmission sections, wherein the main transmission section and the auxiliary transmission sections are coaxially arranged, and the auxiliary transmission sections are uniformly distributed along one end, far away from the main transmission section, of the auxiliary transmission sections;
The packaging units are vertically arranged in the thickness direction of the positioning units, and the number of the packaging units is the same as that of the positioning units; a plurality of parallel placing grooves are formed in the length direction of the packaging unit, and the width of each placing groove is matched with the length of the silicon wafer;
the connecting unit is perpendicular to the transmission unit and is connected with the transmission unit and the fixed table respectively.
2. The automatic silicon wafer inspection and blanking device according to claim 1, wherein three auxiliary transmission sections are provided, and included angles between the auxiliary transmission sections and between the auxiliary transmission sections are 90 degrees.
3. The automatic silicon wafer inspection and blanking device according to claim 2, wherein the auxiliary transmission section and the auxiliary transmission section are both located inside the fixed table, and the main transmission section is located outside the fixed table.
4. The automatic silicon wafer inspection and blanking device according to claim 3, wherein the positioning units are respectively arranged at one end of the auxiliary transmission section far away from the auxiliary transmission section and positioned at the outer side of the fixed table, and the main transmission section, the auxiliary transmission section and the positioning units are all positioned on the same horizontal plane.
5. The automatic silicon wafer inspection discharging device according to any one of claims 1 to 4, wherein the width of the placing groove is smaller than the width of the positioning unit, and the lower end surface of the placing groove and the upper end surface of the positioning unit are arranged at the same height.
6. The automatic silicon wafer inspection and blanking device according to claim 5, wherein the operation units are mechanical arms which are arranged in a telescopic manner, each packaging unit is provided with the mechanical arm, one end of each mechanical arm is connected with a motor arranged in the fixed table, and the other end of each mechanical arm is connected with the packaging unit.
7. A control method of an automatic silicon wafer inspection blanking device, characterized by comprising the blanking device of any one of claims 1-6, wherein horizontally arranged silicon wafers are conveyed to any packaging unit penetrating through the positioning unit along the conveying unit, and each time a stack of silicon wafers is filled, the packaging unit is driven to vertically move downwards by the operation unit; and continuing to convey the silicon chip to the packaging unit through the conveying unit until the packaging unit is filled with the silicon chip.
8. The method according to claim 7, wherein after the packing unit is filled with the silicon wafer on one side, the silicon wafer is rotated by 90 ° or 180 ° along the transfer unit and transferred into another packing unit until the packing unit is filled with the silicon wafer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911301663.6A CN112977949B (en) | 2019-12-17 | 2019-12-17 | Automatic blanking device for silicon wafer inspection and control method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911301663.6A CN112977949B (en) | 2019-12-17 | 2019-12-17 | Automatic blanking device for silicon wafer inspection and control method thereof |
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| Publication Number | Publication Date |
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| CN112977949A CN112977949A (en) | 2021-06-18 |
| CN112977949B true CN112977949B (en) | 2024-08-02 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN211365099U (en) * | 2019-12-17 | 2020-08-28 | 内蒙古中环光伏材料有限公司 | Automatic unloader of silicon chip inspection |
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| ES2675796T5 (en) * | 2011-03-16 | 2023-04-21 | Cama1 S P A | Machine and method for packing articles in cardboard boxes |
| CN209023225U (en) * | 2018-09-30 | 2019-06-25 | 厦门依码信息科技有限公司 | Stip cigarette packing device |
| CN110092036A (en) * | 2019-05-31 | 2019-08-06 | 广东荣诚食品有限公司 | A kind of moon cake packaging production line |
| TWM586709U (en) * | 2019-08-09 | 2019-11-21 | 張哲維 | Material sorting and preparation device dedicated to flexible paper materials such as household paper |
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Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN211365099U (en) * | 2019-12-17 | 2020-08-28 | 内蒙古中环光伏材料有限公司 | Automatic unloader of silicon chip inspection |
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