CN113473807A - Integral two-phase flow heat dissipation device based on capillary force driving - Google Patents

Integral two-phase flow heat dissipation device based on capillary force driving Download PDF

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Publication number
CN113473807A
CN113473807A CN202110764191.9A CN202110764191A CN113473807A CN 113473807 A CN113473807 A CN 113473807A CN 202110764191 A CN202110764191 A CN 202110764191A CN 113473807 A CN113473807 A CN 113473807A
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China
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heat dissipation
phase flow
cold plate
capillary
capillary force
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CN202110764191.9A
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Chinese (zh)
Inventor
高广涛
洪大良
程斌
王冬祥
马寅飞
付娟
彭伟
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CETC 38 Research Institute
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CETC 38 Research Institute
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20327—Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The invention provides an integral two-phase flow heat dissipation device based on capillary force driving, which comprises a two-phase flow cold plate and heat dissipation fins, wherein the heat dissipation fins are integrally installed at a condensation end of the two-phase flow cold plate, an evaporation end of the two-phase flow cold plate is provided with electronic equipment, a capillary flow passage for connecting the condensation end and the evaporation end is arranged in the two-phase flow cold plate, and a liquid heat dissipation working medium can flow from the condensation end to the evaporation end along the capillary flow passage. The invention has the advantages that: a heat dissipation working medium pipeline and a secondary heat exchange system do not need to be arranged outside, the integration level is high, the risk of damage to electronic equipment caused by system leakage can be avoided, and the safety is good; the occupied space is small, and the installation is convenient; the heat dissipation working medium flows from the evaporation end to the condensation end of the two-phase flow cold plate through a thermosiphon effect, and gradually flows back to the evaporation end under the action of capillary force after condensation and liquefaction, so that the circulation flow of the heat dissipation working medium is realized, power equipment such as a working medium pump and the like is not required to be added, and the reliability of the heat dissipation device is improved.

Description

Integral two-phase flow heat dissipation device based on capillary force driving
Technical Field
The invention relates to the technical field of heat dissipation, in particular to an integral two-phase flow heat dissipation device based on capillary force driving.
Background
With the continuous evolution of battlefield requirements, large military electronic integrated equipment including radars increasingly highlight the technical requirements of light integration, flexibility, unmanned/few-people operation and the like. Correspondingly, the development of a heat dissipation technology for electronic equipment, which is light, efficient, highly integrated, safe, reliable and environmentally-friendly, is required. The heat dissipation technologies commonly used in the electronic devices at present mainly include an air-cooled heat dissipation technology, a liquid-cooled heat dissipation technology and a two-phase flow heat dissipation technology. The air-cooled heat dissipation structure is simple, the reliability is high, but the system integration level is low, and the environmental adaptability is poor; the liquid cooling heat radiation structure has high integration level and good environmental adaptability, but needs to use power equipment such as a pump and the like, and has low reliability, large equipment size and high weight. Therefore, the air cooling and liquid cooling heat dissipation technologies cannot completely meet the comprehensive requirements of light weight, high efficiency, high integration, safety, reliability and strong environmental adaptability of the heat dissipation technology of the electronic equipment.
The two-phase flow heat dissipation device commonly used at present mainly adopts a split structure, for example, the invention patent application with the publication number of CN112885798A discloses an integrated phase change heat transfer element liquid cooling heat dissipation module for a server, namely, a two-phase flow evaporator and a condenser are independent modules and are connected through a pipeline. The split type two-phase flow heat dissipation device is flexible in installation and arrangement, but low in system integration level and large in required installation space. The conditions such as working medium leakage and the like are probably caused because of the connection of independent pipelines, and in addition, the circulation of liquid cooling heat dissipation working media is realized by a water pump, so that the reliability is low.
Disclosure of Invention
The invention aims to provide an integral two-phase flow heat dissipation device which is light, efficient, highly integrated, safe, reliable and strong in environmental adaptability.
The invention solves the technical problems through the following technical scheme: an integral two-phase flow heat dissipation device based on capillary force driving comprises a two-phase flow cold plate and heat dissipation fins, wherein the heat dissipation fins are arranged at a condensation end of the two-phase flow cold plate, an evaporation end of the two-phase flow cold plate is used for installing electronic equipment, a capillary flow passage for connecting the condensation end and the evaporation end is arranged in the two-phase flow cold plate, and liquid heat dissipation working media can flow from the condensation end to the evaporation end of the two-phase flow cold plate along the capillary flow passage under the driving of capillary force.
According to the invention, the electronic equipment and the radiating fins are both arranged on the two-phase flow cold plate, a radiating working medium pipeline and a secondary heat exchange system are not required to be arranged outside, the integration level is high, the risk of damage to the electronic equipment caused by leakage of the radiating working medium can be avoided, and the safety is good; during installation, only the two-phase flow cold plate needs to be put down, and space does not need to be reserved for the pipeline and the secondary heat exchange system independently, so that the occupied space is small, and the installation is convenient; when the heat dissipation working medium in the two-phase flow cold plate is heated and evaporated, the heat dissipation working medium automatically flows from the evaporation end to the condensation end of the two-phase flow cold plate due to the thermosiphon effect, and then gradually flows back to the evaporation end of the two-phase flow cold plate under the action of capillary force generated by the capillary flow channel after being subjected to heat dissipation, condensation and liquefaction by the heat dissipation fins, so that the heat dissipation working medium circularly flows, a working medium pump and other power equipment are not required to be additionally arranged, the reliability of the heat dissipation device is improved, and the high reliability requirement under a special scene is met.
Preferably, the cold plate is integrally formed and made of aluminum alloy or copper alloy.
Preferably, the wall surface of the capillary flow passage adopts a combined structure of any one or more of a wire mesh core, sintered powder and a groove.
Preferably, the heat dissipation working medium in the capillary flow channel is one of ammonia, R134a, acetone, ethanol and the like.
Preferably, the working temperature range of the heat dissipation working medium is-60 ℃ to 120 ℃.
Preferably, the heat dissipation fins and the two-phase flow cold plate are integrally processed and formed, or are independently processed and formed and then fixedly installed at the condensation end of the two-phase flow cold plate.
Preferably, the heat dissipation fin is made of aluminum alloy or copper alloy.
Preferably, the heat dissipation fin is arranged on at least one surface of the condensation end of the two-phase flow cold plate.
Preferably, the working medium in the capillary flow channel is in a gas-liquid saturated state.
Preferably, the radiating fin area can be additionally provided with a radiating fan.
The integral two-phase flow heat dissipation device based on capillary force driving provided by the invention has the advantages that: the electronic equipment and the radiating fins are arranged on the two-phase flow cold plate, a radiating working medium pipeline and a secondary heat exchange system are not required to be arranged outside, the integration level is high, the risk of damage to the electronic equipment caused by leakage of the radiating working medium can be avoided, and the safety is good; during installation, only the two-phase flow cold plate needs to be put down, and space does not need to be reserved for the pipeline and the secondary heat exchange system independently, so that the occupied space is small, and the installation is convenient; when the heat dissipation working medium in the two-phase flow cold plate is heated and evaporated, the heat dissipation working medium automatically flows from the evaporation end to the condensation end of the two-phase flow cold plate due to the thermosiphon effect, and then flows back to the evaporation end gradually under the action of capillary force generated by the capillary flow channel after being subjected to heat dissipation, condensation and liquefaction by the heat dissipation fins, so that the heat dissipation working medium circularly flows, power equipment such as a working medium pump and the like is not required to be added, the reliability of the heat dissipation device is improved, and the high reliability requirement under a special scene is met.
The heat exchange is carried out by utilizing the gas-liquid phase change of the working medium with low boiling point, the heat dissipation working medium is in a gas-liquid saturated state in the capillary flow channel, the heat transfer resistance is almost zero, compared with the air cooling and liquid cooling heat exchange capacity, the integral temperature difference of the two-phase flow cold plate can be controlled within 8 ℃, and the heat dissipation performance is good; compared with the conventional liquid cooling heat dissipation device, the device has the advantages that the flow of the heat dissipation working medium required by the device is greatly reduced, the size and the weight of the device can be obviously reduced, and the thickness of the two-phase flow cold plate is reduced; the air cooling redundancy design can be realized through the cooling fan, and the cooling efficiency is improved; the radiating fins and the electronic equipment mounting area are not affected with each other, the electronic equipment mounting area can be sealed independently, and the environmental adaptability of the device is improved.
Drawings
Fig. 1 is a schematic view of an integrated two-phase flow heat sink based on capillary force driving according to example 1 of the present invention;
fig. 2 is a schematic cross-sectional view of a two-phase flow cold plate of an integrated two-phase flow heat sink based on capillary force driving according to example 1 of the present invention;
FIG. 3 is a schematic view of an integrated two-phase flow heat sink based on capillary force driving according to example 2 of the present invention;
fig. 4 is a schematic cross-sectional view of a two-phase flow cold plate of an integrated two-phase flow heat sink based on capillary force driving according to example 2 of the present invention.
Detailed Description
To make the objects, technical solutions and advantages of the present invention more apparent, the technical solutions of the present invention are described below in detail and completely with reference to the accompanying drawings, and it is apparent that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example 1
As shown in fig. 1, the present embodiment provides an integral two-phase flow heat dissipation device based on capillary force driving, including a two-phase flow cold plate 1 and heat dissipation fins 2, where the heat dissipation fins 2 are installed at a condensation end of the two-phase flow cold plate 1, and an evaporation end of the two-phase flow cold plate 1 is used for installing an electronic device 4, and with reference to fig. 2, a capillary flow channel 3 connecting the condensation end and the evaporation end is provided in the two-phase flow cold plate 1, and a liquid heat dissipation working medium can flow from the condensation end to the evaporation end along the capillary flow channel 3 under the driving of capillary force.
In the embodiment, the electronic equipment and the radiating fins are both arranged on the two-phase flow cold plate 1, a radiating working medium pipeline and a secondary heat exchange system are not required to be arranged outside, the integration level is high, the risk of damage to the electronic equipment caused by leakage of the radiating working medium can be avoided, and the safety is good; during installation, only the two-phase flow cold plate 1 needs to be put down, and space does not need to be reserved for a pipeline and a secondary heat exchange system independently, so that the occupied space is small, and the installation is convenient; when the heat dissipation working medium in the two-phase flow cold plate 1 is heated and evaporated, the heat dissipation working medium automatically flows from the evaporation end to the condensation end of the two-phase flow cold plate 1 due to the thermosiphon effect, and then flows back to the evaporation end gradually under the action of capillary force generated by the capillary flow channel 3 after being subjected to heat dissipation, condensation and liquefaction by the heat dissipation fins 2, so that the heat dissipation working medium circularly flows, a working medium pump and other power equipment are not required to be added, the reliability of the heat dissipation device is improved, and the high reliability requirement under a special scene is met.
When aiming at large-scale electronic equipment systems such as radars and the like, the size of the two-phase flow cold plate 1 can be increased according to needs, so that electronic equipment needing heat dissipation can be arranged on the same two-phase flow cold plate 1, and the integral heat dissipation of a radar system level is realized.
The two-phase flow cold plate 1 is integrally formed and manufactured, the structure is reliable, the leakage of a heat dissipation working medium cannot occur, the two-phase flow cold plate 1 is made of materials with excellent strength and heat conductivity, such as aluminum alloy or copper alloy, the wall surface of the capillary flow passage 3 is manufactured by adopting a combined structure of any one or more of a wire mesh core, sintered powder and a groove, and the liquid heat dissipation working medium is driven by the capillary force generated by the capillary flow passage 3 to flow to the evaporation end of the two-phase flow cold plate 1 through the structural design.
The heat dissipation working medium in the capillary flow channel 3 is selected from one of ammonia, R134a, acetone, ethanol and the like, the working dimension range of the heat dissipation working medium is-60-120 ℃, in the embodiment, heat exchange is performed by utilizing gas-liquid phase change of a low-boiling-point liquid working medium, the heat dissipation working medium is in a gas-liquid saturation state in the capillary flow channel 3, the heat transfer resistance is almost zero, compared with air cooling and liquid cooling, the heat exchange capacity is greatly improved, the integral temperature difference of the two-phase flow cooling plate 1 can be controlled within 8 ℃, and the heat dissipation performance is good.
Because the heat dissipation working medium mainly carries out the heat transfer through the gas-liquid phase transition in this embodiment, heat exchange efficiency is high, and the required heat dissipation working medium flow of the device reduces by a wide margin, can show the size and the weight that reduce the device, and the thickness of cold drawing 1 that this embodiment provided is generally no longer than 30 mm.
The heat dissipation fins 2 and the two-phase flow cold plate 1 are integrally formed, or are independently formed and then fixedly installed at the condensation end of the two-phase flow cold plate 1, and can be fixedly connected with the cold plate 1 in a welding, screwing, clamping and other modes and keep good contact through thermal interface materials such as a heat conduction gasket and the like, so that the heat exchange efficiency is improved.
The heat dissipation fins 2 may be disposed only on one side of the condensation end of the two-phase flow cold plate 1, or may be disposed on both surfaces of the condensation end of the two-phase flow cold plate 1, and similarly, the electronic device 4 may also be disposed on one surface or both surfaces of the evaporation end of the two-phase flow cold plate 1 as needed. The capillary force generated by the capillary flow channel 3 can overcome the gravity of the liquid heat dissipation working medium and drive the liquid heat dissipation working medium upwards, so that the relative heights of the heat dissipation fins 2 and the electronic equipment 4 can be adjusted according to scene adaptability; the heat dissipation fins 2 are made of aluminum alloy or copper alloy, and can adopt flat, zigzag or porous fin structures and the like.
The working principle of the heat dissipation device provided by the embodiment is as follows:
when the electronic equipment 4 works, heat is conducted to the evaporation end of the two-phase flow cold plate 1, a heat dissipation working medium in the capillary flow channel 3 absorbs heat and evaporates after being heated, the density difference of gas-liquid working medium generates a thermosiphon effect, the gaseous heat dissipation working medium is diffused to the condensation end of the two-phase flow cold plate 1 along the capillary flow channel 3, the heat of the heat dissipation working medium is conducted to the heat dissipation fins 2, the heat dissipation fins 2 dissipate heat in a natural air cooling or external cooling fan 5 mode, so that the high-temperature heat dissipation working medium is condensed into liquid, the liquid heat dissipation working medium is acted by capillary force in the capillary flow channel 3, and returns to the evaporation end of the two-phase flow cold plate 1 again to cool the electronic equipment 4 through the combined action of the capillary force or the capillary force and gravity, the internal circulation of the heat dissipation working medium is realized, power equipment such as a pump is not needed in the whole process, and the reliability is high.
Example 2
Referring to fig. 3, in this embodiment, on the basis of embodiment 1, at least one heat dissipation fan 5 is additionally installed on the heat dissipation fins 2, and forced air cooling is performed by the heat dissipation fan 5 to transfer heat to the external environment, thereby improving heat exchange efficiency. Based on the radiating fins 2 and the radiating fan 5, the redundant design of heat radiation is realized, and the use requirement under high load is met; and radiator fan 5 dismouting change is convenient, when radiator fan 5 broke down, and accessible radiating fin 2 continues the heat dissipation in the short time to new radiator fan 5 of quick replacement can not influence the reliability of system because of the electron device that introduces.
The examples are given solely for the purpose of illustrating the invention and are not to be construed as limiting thereof; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.

Claims (10)

1.一种基于毛细力驱动的整体式两相流散热装置，其特征在于：包括两相流冷板和散热翅片，所述散热翅片安装在两相流冷板的冷凝端，两相流冷板的蒸发端安装有电子设备，两相流冷板内设置有连接冷凝端和蒸发端的毛细流道，液态的散热工质能够沿毛细流道从冷凝端流向蒸发端。1. an integral two-phase flow cooling device driven by capillary force, is characterized in that: comprise two-phase flow cold plate and cooling fin, and described cooling fin is installed on the condensation end of two-phase flow cold plate, two-phase flow cooling The evaporating end of the flow cold plate is equipped with electronic equipment, and the two-phase flow cold plate is provided with a capillary flow channel connecting the condensing end and the evaporating end. 2.根据权利要求1所述的一种基于毛细力驱动的整体式两相流散热装置，其特征在于：所述两相流冷板一体成型，材料为铝合金或铜合金。2 . The integrated two-phase flow cooling device driven by capillary force according to claim 1 , wherein the two-phase flow cold plate is integrally formed, and the material is aluminum alloy or copper alloy. 3 . 3.根据权利要求1所述的一种基于毛细力驱动的整体式两相流散热装置，其特征在于：所述毛细流道的壁面采用丝网芯、烧结粉末、沟槽中的任意一种或多种的组合结构。3. An integral two-phase flow heat dissipation device driven by capillary force according to claim 1, wherein the wall surface of the capillary flow channel adopts any one of wire mesh core, sintered powder, and groove. or a combination of multiple structures. 4.根据权利要求1或3所述的一种基于毛细力驱动的整体式两相流散热装置，其特征在于：所述毛细流道内的散热工质为氨、R134a、丙酮、乙醇等中的一种。4. A capillary-driven integral two-phase flow cooling device according to claim 1 or 3, characterized in that: the cooling medium in the capillary flow channel is ammonia, R134a, acetone, ethanol, etc. A sort of. 5.根据权利要求1或3所述的一种基于毛细力驱动的整体式两相流散热装置，其特征在于：所述散热工质的工作温度范围为-60℃～120℃。5 . The integrated two-phase flow heat dissipation device driven by capillary force according to claim 1 or 3 , wherein the working temperature of the heat dissipation medium is -60°C to 120°C. 6 . 6.根据权利要求1所述的一种基于毛细力驱动的整体式两相流散热装置，其特征在于：所述散热翅片与两相流冷板一体加工成型，或独立加工成型后固定安装在两相流冷板冷凝端。6. An integral two-phase flow cooling device driven by capillary force according to claim 1, characterized in that: the cooling fins and the two-phase flow cold plate are integrally processed and formed, or are separately processed and formed and then fixed and installed. At the condenser end of the two-phase flow cold plate. 7.根据权利要求1所述的一种基于毛细力驱动的整体式两相流散热装置，其特征在于：所述散热翅片使用铝合金或铜合金制作。7 . The integrated two-phase flow heat dissipation device driven by capillary force according to claim 1 , wherein the heat dissipation fins are made of aluminum alloy or copper alloy. 8 . 8.根据权利要求1所述的一种基于毛细力驱动的整体式两相流散热装置，其特征在于：所述散热翅片设置于两相流冷板冷凝端的至少一面。8 . The integrated two-phase flow heat dissipation device driven by capillary force according to claim 1 , wherein the heat dissipation fins are arranged on at least one side of the condensation end of the two-phase flow cold plate. 9 . 9.根据权利要求1所述的一种基于毛细力驱动的整体式两相流散热装置，其特征在于：电子设备可以根据需要设置于冷板两相流冷板蒸发端的一面或两面上。9 . The capillary-driven integral two-phase flow cooling device according to claim 1 , wherein the electronic equipment can be arranged on one or both sides of the evaporation end of the two-phase flow cold plate of the cold plate as required. 10 . 10.根据权利要求1所述的一种基于毛细力驱动的整体式两相流散热装置，其特征在于：所述散热翅片上安装有散热风扇。10 . The integrated two-phase flow heat dissipation device driven by capillary force according to claim 1 , wherein a heat dissipation fan is installed on the heat dissipation fins. 11 .
CN202110764191.9A 2021-07-06 2021-07-06 Integral two-phase flow heat dissipation device based on capillary force driving Pending CN113473807A (en)

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Application publication date: 20211001