CN113773505A - 室温下可固化的有机硅橡胶组合物及其用途以及修复电子设备的方法 - Google Patents
室温下可固化的有机硅橡胶组合物及其用途以及修复电子设备的方法 Download PDFInfo
- Publication number
- CN113773505A CN113773505A CN202111199371.3A CN202111199371A CN113773505A CN 113773505 A CN113773505 A CN 113773505A CN 202111199371 A CN202111199371 A CN 202111199371A CN 113773505 A CN113773505 A CN 113773505A
- Authority
- CN
- China
- Prior art keywords
- silicone rubber
- component
- room
- curable silicone
- rubber composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/06—Preparatory processes
- C08G77/08—Preparatory processes characterised by the catalysts used
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/541—Silicon-containing compounds containing oxygen
- C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
- C08K5/5419—Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/541—Silicon-containing compounds containing oxygen
- C08K5/5435—Silicon-containing compounds containing oxygen containing oxygen in a ring
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/56—Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond
- C08K5/57—Organo-tin compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
- C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/14—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/14—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
- C09K3/1006—Materials in mouldable or extrudable form for sealing or packing joints or covers characterised by the chemical nature of one of its constituents
- C09K3/1018—Macromolecular compounds having one or more carbon-to-silicon linkages
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/48—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
- C08G77/50—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms by carbon linkages
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P20/00—Technologies relating to chemical industry
- Y02P20/50—Improvements relating to the production of bulk chemicals
- Y02P20/582—Recycling of unreacted starting or intermediate materials
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013-272669 | 2013-12-27 | ||
| JP2013272669 | 2013-12-27 | ||
| CN201480070411.6A CN105849201A (zh) | 2013-12-27 | 2014-12-25 | 室温下可固化的有机硅橡胶组合物及其用途以及修复电子设备的方法 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201480070411.6A Division CN105849201A (zh) | 2013-12-27 | 2014-12-25 | 室温下可固化的有机硅橡胶组合物及其用途以及修复电子设备的方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113773505A true CN113773505A (zh) | 2021-12-10 |
Family
ID=53478014
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111199371.3A Pending CN113773505A (zh) | 2013-12-27 | 2014-12-25 | 室温下可固化的有机硅橡胶组合物及其用途以及修复电子设备的方法 |
| CN201480070411.6A Pending CN105849201A (zh) | 2013-12-27 | 2014-12-25 | 室温下可固化的有机硅橡胶组合物及其用途以及修复电子设备的方法 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201480070411.6A Pending CN105849201A (zh) | 2013-12-27 | 2014-12-25 | 室温下可固化的有机硅橡胶组合物及其用途以及修复电子设备的方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US10066138B2 (2) |
| EP (1) | EP3087143B1 (2) |
| JP (1) | JP6574771B2 (2) |
| KR (2) | KR102224557B1 (2) |
| CN (2) | CN113773505A (2) |
| TW (1) | TWI671360B (2) |
| WO (1) | WO2015098118A1 (2) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102465009B1 (ko) * | 2016-08-19 | 2022-11-09 | 듀폰 도레이 스페셜티 머티리얼즈 가부시키가이샤 | 전기/전자 부품을 보호하기 위한 실온 경화성 유기폴리실록산 조성물 |
| EP3583155B1 (en) * | 2017-02-20 | 2024-05-08 | Dow Silicones Corporation | Room-temperature-curable silicone composition and electric/electronic apparatus |
| KR20190013091A (ko) | 2017-07-31 | 2019-02-11 | 다우 실리콘즈 코포레이션 | 이중 경화성 수지 조성물, 그로부터 형성된 경화물, 및 그러한 경화물을 포함하는 전자 장치 |
| CN111699214A (zh) * | 2018-02-22 | 2020-09-22 | 汉高知识产权控股有限责任公司 | 可湿固化的有机硅聚合物及其用途 |
| TWI794401B (zh) * | 2018-03-21 | 2023-03-01 | 美商陶氏有機矽公司 | 可室溫固化有機聚矽氧烷組成物及電氣/電子設備 |
| TWI816787B (zh) * | 2018-06-06 | 2023-10-01 | 美商陶氏有機矽公司 | 可濕氣固化有機聚矽氧烷組成物及電氣/電子設備 |
| WO2020226076A1 (ja) * | 2019-05-09 | 2020-11-12 | 信越化学工業株式会社 | 室温硬化性オルガノポリシロキサン組成物、シリコーンゴム及び物品 |
| CN111437202A (zh) * | 2020-03-23 | 2020-07-24 | 点铂医疗科技(常州)有限公司 | 一种纤维增强聚合物义齿垫片材料及其制备方法 |
| JP2023156097A (ja) * | 2022-04-12 | 2023-10-24 | 東洋インキScホールディングス株式会社 | 蓄電デバイスならびにそれに用いられるバインダー、水分散体、樹脂組成物およびセパレータ |
| JPWO2024210000A1 (2) * | 2023-04-06 | 2024-10-10 |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0240163A2 (en) * | 1986-03-03 | 1987-10-07 | Dow Corning Corporation | Moisture-cured one-part silicone sealant |
| US4898910A (en) * | 1988-09-26 | 1990-02-06 | Dow Corning Corporation | Modulus control in silicone sealant |
| US5053442A (en) * | 1990-01-16 | 1991-10-01 | Dow Corning Corporation | Low modulus silicone sealants |
| US5948854A (en) * | 1997-09-25 | 1999-09-07 | Dow Corning S.A. | Alkoxy-functional RTV compositions with increased green strength and increased storage stability |
| CN102304323A (zh) * | 2011-07-22 | 2012-01-04 | 绵阳惠利电子材料有限公司 | 一种可室温固化的苯基硅树脂敷形涂料 |
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| BE623601A (2) * | 1961-10-16 | 1900-01-01 | ||
| JPS5541702A (en) | 1978-09-18 | 1980-03-24 | Hitachi Ltd | Glass film coating method for semiconductor |
| US4871827A (en) | 1986-03-03 | 1989-10-03 | Dow Corning Corporation | Method of improving shelf life of silicone elastomeric sealant |
| US4687829A (en) * | 1986-03-03 | 1987-08-18 | Dow Corning Corporation | Method of adjusting physical properties in silicone elastomeric sealant |
| US4888404A (en) * | 1986-03-03 | 1989-12-19 | Dow Corning Corporation | Method of improving shelf life of silicone elastomeric sealant |
| JPH07113086B2 (ja) * | 1988-06-02 | 1995-12-06 | 東レ・ダウコーニング・シリコーン株式会社 | 室温硬化性オルガノポリシロキサン組成物 |
| GB8902183D0 (en) * | 1989-02-01 | 1989-03-22 | Perennator Gmbh | Elastomer-forming compositions |
| US4962174A (en) * | 1990-01-18 | 1990-10-09 | Dow Corning Corporation | Preparation of alkoxysilethylene endblocked polydiorganosiloxane |
| US5281455A (en) * | 1991-08-22 | 1994-01-25 | Dow Corning Corporation | Laminate article comprising moisture-curable silicone pressure sensitive adhesive and release liner |
| US5210156A (en) * | 1991-08-22 | 1993-05-11 | Dow Corning Corporation | Stable, moisture-curable silicone pressure sensitive adhesives |
| US5208300A (en) * | 1991-08-22 | 1993-05-04 | Dow Corning Corporation | Solution-stable, moisture-curable silicone pressure sensitive adhesives |
| US5302671A (en) * | 1993-06-11 | 1994-04-12 | Dow Corning Corporation | Moisture-curable compositions containing aminoalkoxy-functional silicone |
| JPH07113083A (ja) | 1993-10-15 | 1995-05-02 | Nippon Steel Chem Co Ltd | コ−クス製造方法およびコ−クス炉の炉蓋 |
| US5340899A (en) | 1993-11-22 | 1994-08-23 | Dow Corning Corporation | Method for the preparation of polydimethylsiloxanes having low reactivity endgroups and high reactivity endgroups wherein the polydimethylsiloxanes contain ethylene chain linkages |
| ES2287938T3 (es) * | 1995-06-08 | 2007-12-16 | Dow Corning S.A. | Metodo para sellar juntas con composiciones de organosiloxano curables por humedad. |
| US5840794A (en) * | 1997-01-10 | 1998-11-24 | Dow Corning Corporation | Alkoxy functional sealants with rapid development of green strength |
| US6132664A (en) * | 1997-12-23 | 2000-10-17 | Dow Corning Corporation | Method of forming a seal in a confined configuration with an alkoxy-functional RTV composition |
| JP4494543B2 (ja) * | 1998-11-20 | 2010-06-30 | 東レ・ダウコーニング株式会社 | 室温硬化性シリコーンゴム組成物 |
| US6235832B1 (en) * | 1998-12-21 | 2001-05-22 | Dow Corning Corporation | RTV silicone compositions with rapid development of green strength |
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| JP2003049072A (ja) | 2001-05-30 | 2003-02-21 | Dow Corning Toray Silicone Co Ltd | 室温硬化性シリコーンゴム組成物 |
| US7271233B2 (en) * | 2001-05-30 | 2007-09-18 | Dow Corning Toray Silicone Co., Ltd. | Room-temperature-curable silicone rubber composition |
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| JP4088764B2 (ja) * | 2002-07-01 | 2008-05-21 | 信越化学工業株式会社 | 室温硬化性オルガノポリシロキサン組成物 |
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| JP4811562B2 (ja) | 2005-05-13 | 2011-11-09 | 信越化学工業株式会社 | 室温硬化性オルガノポリシロキサン組成物 |
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-
2014
- 2014-12-25 US US15/106,538 patent/US10066138B2/en active Active
- 2014-12-25 KR KR1020187005498A patent/KR102224557B1/ko not_active Expired - Fee Related
- 2014-12-25 KR KR1020167020234A patent/KR20160103069A/ko not_active Ceased
- 2014-12-25 CN CN202111199371.3A patent/CN113773505A/zh active Pending
- 2014-12-25 EP EP14873670.5A patent/EP3087143B1/en active Active
- 2014-12-25 CN CN201480070411.6A patent/CN105849201A/zh active Pending
- 2014-12-25 WO PCT/JP2014/006473 patent/WO2015098118A1/en not_active Ceased
- 2014-12-25 JP JP2016535257A patent/JP6574771B2/ja active Active
- 2014-12-27 TW TW103145954A patent/TWI671360B/zh not_active IP Right Cessation
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0240163A2 (en) * | 1986-03-03 | 1987-10-07 | Dow Corning Corporation | Moisture-cured one-part silicone sealant |
| US4898910A (en) * | 1988-09-26 | 1990-02-06 | Dow Corning Corporation | Modulus control in silicone sealant |
| US5053442A (en) * | 1990-01-16 | 1991-10-01 | Dow Corning Corporation | Low modulus silicone sealants |
| US5948854A (en) * | 1997-09-25 | 1999-09-07 | Dow Corning S.A. | Alkoxy-functional RTV compositions with increased green strength and increased storage stability |
| CN102304323A (zh) * | 2011-07-22 | 2012-01-04 | 绵阳惠利电子材料有限公司 | 一种可室温固化的苯基硅树脂敷形涂料 |
Non-Patent Citations (1)
| Title |
|---|
| 李金林等, 山东科学技术出版社 * |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2017500394A (ja) | 2017-01-05 |
| WO2015098118A1 (en) | 2015-07-02 |
| JP6574771B2 (ja) | 2019-09-11 |
| EP3087143A4 (en) | 2017-05-03 |
| KR20180024031A (ko) | 2018-03-07 |
| TW201533166A (zh) | 2015-09-01 |
| EP3087143B1 (en) | 2021-03-31 |
| US20170037287A1 (en) | 2017-02-09 |
| KR102224557B1 (ko) | 2021-03-09 |
| US10066138B2 (en) | 2018-09-04 |
| EP3087143A1 (en) | 2016-11-02 |
| CN105849201A (zh) | 2016-08-10 |
| TWI671360B (zh) | 2019-09-11 |
| KR20160103069A (ko) | 2016-08-31 |
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Application publication date: 20211210 |