CN1141861C - 器件组装方法及其组装装置 - Google Patents

器件组装方法及其组装装置 Download PDF

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Publication number
CN1141861C
CN1141861C CNB97180172XA CN97180172A CN1141861C CN 1141861 C CN1141861 C CN 1141861C CN B97180172X A CNB97180172X A CN B97180172XA CN 97180172 A CN97180172 A CN 97180172A CN 1141861 C CN1141861 C CN 1141861C
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CN
China
Prior art keywords
nozzle
assembly
device assembly
assembled
absence
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CNB97180172XA
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English (en)
Chinese (zh)
Other versions
CN1238900A (zh
Inventor
ζ���ԣ
味村好裕
吉田典晃
壁下朗
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Publication of CN1238900A publication Critical patent/CN1238900A/zh
Application granted granted Critical
Publication of CN1141861C publication Critical patent/CN1141861C/zh
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0478—Simultaneously mounting of different components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H05K13/0409—Sucking devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0452—Mounting machines or lines comprising a plurality of tools for guiding different components to the same mounting place
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Automatic Assembly (AREA)
CNB97180172XA 1996-11-29 1997-12-01 器件组装方法及其组装装置 Expired - Lifetime CN1141861C (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP31998596 1996-11-29
JP319985/1996 1996-11-29
JP319985/96 1996-11-29

Publications (2)

Publication Number Publication Date
CN1238900A CN1238900A (zh) 1999-12-15
CN1141861C true CN1141861C (zh) 2004-03-10

Family

ID=18116465

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB97180172XA Expired - Lifetime CN1141861C (zh) 1996-11-29 1997-12-01 器件组装方法及其组装装置

Country Status (6)

Country Link
US (1) US6466837B1 (de)
EP (2) EP1631139B1 (de)
JP (1) JP3516456B2 (de)
CN (1) CN1141861C (de)
DE (2) DE69735584T2 (de)
WO (1) WO1998024292A1 (de)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6606790B2 (en) * 2000-06-21 2003-08-19 Matsushita Electric Industrial Co., Ltd. Component mounter and mounting method
JP4313031B2 (ja) * 2002-12-13 2009-08-12 パナソニック株式会社 ツール交換装置及びツール
CN100566534C (zh) * 2003-01-17 2009-12-02 富士机械制造株式会社 对电路基板作业机及其构成要件的提供方法
TW200419640A (en) * 2003-02-25 2004-10-01 Matsushita Electric Industrial Co Ltd Electronic component placement machine and electronic component placement method
JP4490236B2 (ja) * 2004-11-08 2010-06-23 ヤマハ発動機株式会社 ノズル交換ユニットおよび同ユニットを備えた表面実装機
US8328498B2 (en) * 2007-01-25 2012-12-11 Panasonic Corporation Component feeding unit and method, and component mounting apparatus and method
CN101714502B (zh) * 2009-10-28 2013-01-02 崇贸科技股份有限公司 集成电路芯片的取放装置
US9270130B2 (en) * 2013-10-31 2016-02-23 Honda Motor Co., Ltd. Method and system to mount a portable electronic device to wirelessly charge
CN107634457A (zh) * 2017-10-13 2018-01-26 江阴多高自动化科技有限公司 一种便于安装部件的具有减振功能的电器柜
CN109693012B (zh) * 2017-10-24 2020-12-18 泰科电子(上海)有限公司 定位装置
CN111725699B (zh) * 2020-06-05 2021-06-08 哈工大机器人南昌智能制造研究院 一种激光Bar条芯片光电性能检测方法
CN111707849B (zh) * 2020-08-18 2020-11-17 江西铭德半导体科技有限公司 一种器件固定装置及半导体激光器测试设备

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1985003405A1 (en) 1984-01-23 1985-08-01 Dyna/Pert - Precima Limited Pick-up head for handling electrical components
WO1985003404A1 (en) 1984-01-23 1985-08-01 Dyna/Pert - Precima Limited Head for handling electrical components
EP0253228B1 (de) * 1986-07-04 1994-09-28 Matsushita Electric Industrial Co., Ltd. Anordnung zum Auswechseln eines Bestückungskopfes für eine Maschine zum Bestücken von Bauteilen
GB8702618D0 (en) * 1987-02-05 1987-03-11 Dynapert Precima Ltd Suction pick-up apparatus
US5253414A (en) * 1992-01-21 1993-10-19 Emhart Inc. Tool bank for surface mount machine
JP2554437B2 (ja) * 1992-08-07 1996-11-13 ヤマハ発動機株式会社 部品装着方法及び同装置
JP2764000B2 (ja) * 1993-12-24 1998-06-11 ジューキ株式会社 部品実装装置
JP3295529B2 (ja) * 1994-05-06 2002-06-24 松下電器産業株式会社 Ｉｃ部品実装方法及び装置
JP2865195B2 (ja) * 1995-04-07 1999-03-08 豊和工業株式会社 マシニングセンタにおける工具交換方法及び装置
US6088911A (en) * 1995-12-28 2000-07-18 Fuji Machine Mfg. Co., Ltd. Electronic component transferring apparatus
JP3477321B2 (ja) * 1996-07-25 2003-12-10 株式会社日立ハイテクインスツルメンツ 電子部品装着装置

Also Published As

Publication number Publication date
EP1631139A1 (de) 2006-03-01
EP1631139A8 (de) 2006-04-26
JP3516456B2 (ja) 2004-04-05
EP1011301A1 (de) 2000-06-21
DE69735584D1 (de) 2006-05-18
EP1011301A4 (de) 2001-07-25
DE69737896T2 (de) 2007-10-18
CN1238900A (zh) 1999-12-15
US6466837B1 (en) 2002-10-15
DE69735584T2 (de) 2006-08-24
EP1011301B1 (de) 2006-03-29
WO1998024292A1 (en) 1998-06-04
DE69737896D1 (de) 2007-08-16
EP1631139B1 (de) 2007-07-04

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