CN114199057A - Temperature-uniforming plate device and production method thereof - Google Patents

Temperature-uniforming plate device and production method thereof Download PDF

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Publication number
CN114199057A
CN114199057A CN202111586793.6A CN202111586793A CN114199057A CN 114199057 A CN114199057 A CN 114199057A CN 202111586793 A CN202111586793 A CN 202111586793A CN 114199057 A CN114199057 A CN 114199057A
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shell
heat
copper
column
powder
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林琼榕
陈海强
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Special Energy Xiamen Superconducting Technology Co ltd
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Special Energy Xiamen Superconducting Technology Co ltd
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure

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  • Life Sciences & Earth Sciences (AREA)
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  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

本发明公开了一种均温板装置及其生产方法，其中，均温板装置包括：外壳组件，包括第一壳体和第二壳体，第一壳体和第二壳体相连接以围设形成用于容纳传热介质的容置腔，第一壳体的内侧具有吸热层，第二壳体的内侧具有与吸热层相对布置的放热层；导热柱，设置于容置腔内，导热柱的一端穿过吸热层并固定连接第一壳体，导热柱的另一端穿过放热层并固定连接第二壳体，导热柱的侧壁设置有多个毛细槽。通过上述结构，导热柱可以将第一壳体的热量快速传导至第二壳体，且导热柱上的毛细槽可利用毛细作用促使冷凝后的传热介质进行回流，促使传热介质加快循环流动，使得热量由第一壳体快速传导至第二壳体，使得均温板装置具有良好的导热效果。

Figure 202111586793

The invention discloses a thermostatic plate device and a production method thereof, wherein the thermostatic plate device comprises: a shell assembly, including a first shell and a second shell, the first shell and the second shell are connected to enclose A accommodating cavity for accommodating the heat transfer medium is formed, the inner side of the first shell has a heat absorbing layer, and the inner side of the second shell has a heat releasing layer arranged opposite to the heat absorbing layer; the heat conduction column is arranged in the accommodating cavity Inside, one end of the heat-conducting column passes through the heat-absorbing layer and is fixedly connected to the first shell, the other end of the heat-conducting column passes through the heat-releasing layer and is fixedly connected to the second shell, and the side wall of the heat-conducting column is provided with a plurality of capillary grooves. Through the above structure, the heat transfer column can quickly conduct the heat of the first shell to the second shell, and the capillary groove on the heat transfer column can use the capillary action to promote the condensed heat transfer medium to flow back, and promote the heat transfer medium to accelerate the circulation flow , so that the heat is rapidly conducted from the first shell to the second shell, so that the vapor chamber device has a good heat conduction effect.

Figure 202111586793

Description

Temperature-uniforming plate device and production method thereof
Technical Field
The invention relates to the technical field of heat dissipation devices, in particular to a temperature-uniforming plate device and a production method thereof.
Background
The temperature equalizing plate is widely applied to the heat dissipation field of electronic equipment at present, the whole thickness of the temperature equalizing plate is small, the temperature equalizing plate is convenient to install on a product with limited height, and the temperature equalizing plate achieves the purpose of effective heat transfer by absorbing and releasing latent heat by utilizing the phase change process of a heat transfer medium. Generally, a shell made of copper is mostly adopted for a temperature equalizing plate, a heat transfer medium, a heat absorption side and a heat release side which are formed by powder sintering are arranged on the inner side of the temperature equalizing plate, the heat transfer medium absorbs heat on the heat absorption side and is subjected to phase change evaporation, heat is released on the heat release side and is condensed, and the condensed heat transfer medium flows back to the heat absorption side. Generally, a copper powder column is arranged between the heat absorption side and the heat release side, and the copper powder column plays a role in heat conduction and is convenient for the backflow of a heat transfer medium. However, the copper powder column needs to be sintered and molded separately and then is installed and fixed in the shell, the size of the copper powder column is very small, and the sintering and molding need very high temperature, so that the sintering and processing of the copper powder column are time-consuming and labor-consuming, and a structure with consistent compact effect is difficult to form, the distribution density and the size of micropores in the copper powder column are uneven, the yield and the heat conduction effect of the copper powder column are poor, the heat transfer medium is not favorable to flow back along the copper powder column, and the condition that the performance of the temperature equalizing plate adopting the copper powder column is unstable exists.
Disclosure of Invention
The invention aims to provide a temperature-uniforming plate device which can optimize the heat conduction effect.
The invention also provides a production method of the temperature-uniforming plate device.
According to a first aspect of the present invention, there is provided a vapor chamber device comprising: the shell assembly comprises a first shell and a second shell, wherein the first shell and the second shell are connected to enclose an accommodating cavity for accommodating a heat transfer medium, the inner side of the first shell is provided with a heat absorption layer, and the inner side of the second shell is provided with a heat release layer arranged opposite to the heat absorption layer; the heat-conducting column is arranged in the accommodating cavity, one end of the heat-conducting column penetrates through the heat-absorbing layer and is fixedly connected with the first shell, the other end of the heat-conducting column penetrates through the heat-releasing layer and is fixedly connected with the second shell, the side wall of the heat-conducting column is provided with a plurality of capillary grooves, the capillary grooves are arranged around the axis of the heat-conducting column, and the capillary grooves extend to the two ends of the heat-conducting column.
According to the temperature-uniforming plate device, the width of the capillary groove is set to be W1, the W1 is more than or equal to 0.04mm and less than or equal to 0.6mm, the depth is set to be H1, and the H1 is more than or equal to 0.04mm and less than or equal to 0.8 mm.
According to the temperature equalization plate device, the heat absorption layer and the heat release layer are both arranged to be sintered powder layers with pores, and the porosity of the heat absorption layer and the porosity of the heat release layer are 50% -95%.
According to a second aspect of the present invention, there is provided a method for producing the above vapor chamber device, comprising the steps of:
s100, preparing materials:
preparing a copper plate raw material, processing the copper plate raw material to form a first shell and a second shell, and reserving filling ports on the same side of the first shell and the second shell;
preparing a heat conduction column;
s200, powder filling and sintering:
placing the first shell and the second shell into a mold, wherein a powder filling gap is formed between the inner side of the first shell and the mold, a powder filling gap is also formed between the inner side of the second shell and the mold, filling copper powder into the powder filling gap, vibrating the mold to enable the filled copper powder to form a fixed shape through vibration for supporting, then taking down the mold, and sintering the first shell and the second shell for the first time to enable the copper powder to be sintered to form a heat absorption layer and a heat release layer;
the die is provided with a boss positioned in the powder filling gap, the position of the boss corresponds to the mounting hole, and copper powder is filled on the peripheral side of the boss;
s300, installing a heat conduction column:
inserting the heat-conducting columns into the mounting holes in the heat-absorbing layer, and then placing the second shell on the first shell so that the heat-conducting columns are inserted into the mounting holes in the heat-releasing layer; the first shell and the second shell are extruded through first extrusion equipment, so that the side edges of the first shell and the second shell are pressed and attached, and the first shell and the second shell are also pressed and attached to the end parts of the heat conducting columns; then, sintering the first shell and the second shell for the second time, so that the side edges of the first shell and the second shell are fixedly connected to form a shell assembly, and the heat conducting columns are fixedly connected with the first shell and the second shell respectively;
when the second sintering is carried out, the first shell and the second shell are extruded by the first extrusion equipment or the second extrusion equipment; s400, liquid filling:
after the shell component and the heat-conducting column are cooled to normal temperature, filling heat-conducting medium into the inner side of the shell component through the filling port, wherein the liquid filling rate of the heat-conducting medium is 25% -50%;
s500, vacuumizing and sealing;
air within the housing assembly is drawn through the fill port and the fill port is then closed.
According to the production method, in S100, the step of "preparing a heat conduction column" includes:
casting and up-drawing: putting the copper material into a casting furnace for smelting, wherein the smelting temperature is 1000-1600 ℃, after the copper material is completely molten, cooling and crystallizing the molten metal by an up-drawing machine, the up-drawing speed is 90-150mm/min, and cooling a shaping mold of the up-drawing machine by cooling water, wherein the water inlet temperature of the cooling water is lower than 25 ℃, the water outlet temperature of the cooling water is lower than 70 ℃, the flow rate of the cooling water is 30-200L/min, so as to form a copper rod, and the diameter of the copper rod is 45 +/-0.8 mm;
cogging: stretching the copper rod to reduce the diameter of the copper rod to 41mm to 43mm, wherein the stretching speed is 20-50 mm/min;
cold rolling: carrying out cold rolling processing on the copper rod at the rolling speed of 3-7m/min to form a copper rod with the diameter of 34-36 mm;
cogging and rough drawing: carrying out primary rough drawing processing on the copper bar, reducing the diameter of the copper bar to 18-21 mm, and drawing at a speed of 20-80 mm/min; carrying out secondary rough drawing processing on the copper bar, reducing the diameter of the copper bar to be half of the diameter of the copper bar subjected to the primary rough drawing processing, and drawing at the speed of 20-80 mm/min; carrying out rough drawing processing on the copper bar for the third time, reducing the diameter of the copper bar to 4.5 mm-5 mm, and drawing at a speed of 20-80mm/min to form a copper bar;
annealing: keeping the temperature of the copper bar at 790-820 ℃ for 4.5-5.5 h, and annealing;
finish drawing of a finished product: and cooling the annealed copper bar to below 200 ℃, then stretching the copper bar to reduce the diameter of the copper bar to be the same as that of the heat-conducting column, processing a capillary groove on the side wall of the copper bar, and finally cutting the copper bar into sections to form the heat-conducting column.
The scheme has at least one of the following beneficial effects:
the structure compactness of heat conduction post is better, can have good heat conduction, and the heat conduction post can be with the heat quick conduction of first casing to the second casing, and the usable capillary action of the capillary groove on the heat conduction post makes the heat transfer medium after the condensation flow back, makes the heat transfer medium accelerate the circulation flow for the heat is conducted to the second casing by first casing quick, makes the samming board device have good heat conduction effect.
Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Drawings
The invention is further described below with reference to the accompanying drawings and examples;
FIG. 1 is a block diagram of an embodiment of a vapor plate apparatus;
FIG. 2 is a cross-sectional view of an embodiment of a vapor plate device;
FIG. 3 is an exploded view of an embodiment of a vapor plate device;
FIG. 4 is a schematic structural view of a heat-conducting column;
FIG. 5 is a block flow diagram of a method of producing a vapor chamber device.
Detailed Description
Reference will now be made in detail to the present preferred embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to like elements throughout.
In the description of the present invention, it should be understood that the orientation or positional relationship referred to in the description of the orientation, such as the upper, lower, front, rear, left, right, etc., is based on the orientation or positional relationship shown in the drawings, and is only for convenience of description and simplification of description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.
In the description of the present invention, greater than, less than, exceeding, etc. are understood as excluding the present numbers, and the above, below, inside, etc. are understood as including the present numbers. If the first and second are described for the purpose of distinguishing technical features, they are not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.
In the description of the present invention, unless otherwise explicitly limited, terms such as arrangement, installation, connection and the like should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above terms in the present invention in combination with the specific contents of the technical solutions.
Referring to fig. 1 to 4, a vapor chamber device includes a housing assembly 10 and a heat conducting column 30, the housing assembly 10 includes a first housing 11 and a second housing 12, the first housing 11 and the second housing 12 are connected to enclose a containing cavity 13, an inner side of the first housing 11 has a heat absorbing layer 21, and an inner side of the second housing 12 has a heat releasing layer 22 disposed opposite to the heat absorbing layer 21. The heat conduction post 30 is arranged in the accommodating cavity 13, one end of the heat conduction post 30 penetrates through the heat absorption layer 21 and is fixedly connected with the first shell 11, the other end of the heat conduction post 30 penetrates through the heat release layer 22 and is fixedly connected with the second shell 12, the side wall of the heat conduction post 30 is provided with a plurality of capillary grooves 31, the capillary grooves 31 are arranged around the axis of the heat conduction post 30, and each capillary groove 31 extends to two ends of the heat conduction post 30. The first housing 11, the second housing 12 and the heat conducting pillar 30 may be made of copper, that is, the heat conducting pillar 30 is a copper pillar, and the accommodating cavity 13 accommodates a heat transfer medium.
When the heat-absorbing layer 21 is installed and used, the first shell 11 is attached to a heat source and conducts absorbed heat to the heat-absorbing layer 21, the heat is uniformly distributed by the heat-absorbing layer 21, the heat-transferring medium is subjected to phase change evaporation after absorbing heat, steam flows to the heat-releasing layer 22, the heat is dissipated through the heat-releasing layer 22 and the second shell 12, and the heat-transferring medium is condensed and then flows back to the heat-absorbing layer 21. The heat conducting column 30 can directly conduct the heat of the first housing 11 to the second housing 12, and the capillary groove 31 on the heat conducting column 30 can promote the condensed heat transfer medium to flow back by capillary action, so as to accelerate the heat transfer medium to circulate and conduct heat. The structure compactness of heat conduction post 30 is better, can have good heat conduction effect, makes the heat conduct to second casing 12 by first casing 11 fast for the samming board device has good heat conduction effect, and heat conduction post 30's structural strength is great, can carry out good support to shell subassembly 10, avoids shell subassembly 10 to inwards cave in.
The heat conduction columns 30 are provided in plural and arranged in a rectangular array to optimize the heat conduction effect and the supporting effect. Of course, the heat-conducting pillars 30 may also be arranged in an annular array.
Specifically, the width of the capillary groove 31 is set to be W1, W1 is more than or equal to 0.04mm and less than or equal to 0.6mm, the depth is set to be H1, and H1 is more than or equal to 0.8mm, so that a good capillary effect is achieved.
The heat absorbing layer 21 and the heat releasing layer 22 are each provided as a sintered powder layer having pores, and the porosity of the heat absorbing layer 21 and the heat releasing layer 22 is 50% to 95%. That is, the heat absorbing layer 21 and the heat releasing layer 22 are formed by powder sintering and have pores therein to increase a contact area with the heat transfer medium, facilitate heat exchange, and facilitate the flow of the heat transfer medium therein.
The invention provides a production method of the temperature equalization plate device, which comprises the following steps with reference to fig. 5:
s100, preparing materials: preparing a copper plate raw material, processing the copper plate raw material to form a first shell 11 and a second shell 12, and reserving filling ports on the same side of the first shell 11 and the second shell 12; preparing a heat conduction column 30;
s200, powder filling and sintering:
placing the first shell 11 and the second shell 12 into a mold, wherein a powder filling gap is formed between the inner side of the first shell 11 and the mold, a powder filling gap is also formed between the inner side of the second shell 12 and the mold, filling copper powder into the powder filling gap, vibrating the mold to enable the filled copper powder to form a fixed shape through vibration for supporting, then taking down the mold, and sintering the first shell 11 and the second shell 12 for the first time to enable the copper powder to be sintered to form the heat absorption layer 21 and the heat release layer 22;
the die is provided with a boss positioned in the powder filling gap, the position of the boss corresponds to the mounting hole, and copper powder is filled on the peripheral side of the boss;
s300, installing a heat conduction column:
inserting the heat conductive pillars 30 into the mounting holes 23 of the heat absorbing layer 21, and then placing the second housing 12 on the first housing 11 such that the heat conductive pillars 30 are inserted into the mounting holes 23 of the heat releasing layer 22; the first shell 11 and the second shell 12 are extruded by a first extruding device, so that the side edges of the first shell 11 and the second shell 12 are pressed and attached, and the first shell 11 and the second shell 12 are also pressed and attached to the end part of the heat conducting column 30; then, sintering the first shell 11 and the second shell 12 for the second time, so that the side edges of the first shell 11 and the second shell 12 are fixedly connected to form the shell assembly 10, and the heat conduction columns 30 are fixedly connected with the first shell 11 and the second shell 12 respectively; s400, liquid filling:
after the shell assembly 10 and the heat conducting column 30 are cooled to normal temperature, heat transfer medium is filled into the inner side of the shell assembly 10 through the filling port, the liquid filling rate of the heat transfer medium is 25% -50%, namely the volume of the liquid heat transfer medium is 25% -50% of the volume (including the pores in the heat absorbing layer 21 and the heat releasing layer 22) in the accommodating cavity 13;
s500, vacuumizing and sealing;
air within the housing assembly 10 is drawn through the fill port and the fill port is then closed.
Wherein, in S100, a filling opening is reserved on the same side of the first housing 11 and the second housing 12, and when the housing assembly (10) is formed by processing, the reserved filling opening of the first housing 11 and the second housing 12 is located on the same side of the housing assembly (10). In S200, a reserved powder filling hole is formed in the die and is communicated with the powder filling gap, when copper powder is filled, air flow is mixed with the copper powder through equipment such as a powder pump, the copper powder enters the powder filling gap through the powder filling hole under the action of air flow pressure, the air flows out of the die after being filtered, the copper powder is reserved in the powder filling gap and is filled on the periphery of the boss, and the heat absorption layer 21 and the heat release layer 22 which are formed through sintering are provided with mounting holes 23 corresponding to the heat conduction columns 30.
In S300, the first pressing device presses the outer sides of the first housing 11 and the second housing 12, and the force application direction of the first pressing device is parallel to the axial direction of the heat conduction column 30, wherein the outer edges of the first housing 11 and the second housing 12 are pressed to be closely attached to each other, and the positions of the outer sides of the first housing 11 and the second housing 12 corresponding to the heat conduction column 30 are also pressed to make the first housing 11 and the second housing 12 closely attached to the end of the heat conduction column 30. The temperature of the first sintering and the second sintering are both set to be 900-950 ℃, the heat absorption layer 21 is fixedly connected with the first shell 11 through sintering after the first sintering, and the heat release layer 22 is fixedly connected with the second shell 12 through sintering; after the second sintering, the heat conducting column 30 is fixedly connected with the heat absorbing layer 21 and the heat releasing layer 22 through sintering, so that the heat absorbing and releasing effect of the heat conducting column 30 is better, and the heat conducting column is more beneficial to the backflow of a heat transfer medium through capillary action. When the second sintering is performed, the first casing 11 and the second casing 12 are pressed by the above-mentioned first pressing device, and the first casing 11 and the second casing 12 are pressed to be closely attached, so that the formed housing assembly 10 has good sealing performance and structural strength.
Of course, when the second sintering is performed, a second pressing device may be separately provided to press the first and second cases 11 and 12.
In S500, air inside the housing assembly 10 is drawn out by a vacuum-drawing device, and the air flows out through the filling port. After taking out the air, strike first casing 11 and second casing 12 through the cutter body, the position of striking is located fills notes mouth department for fill notes mouth and take place to warp, fill and annotate the mouth and carry out preliminary closure, thereby carry out preliminary sealing to shell subassembly 10, then weld filling mouth department through welding set, in order to carry out complete closure to filling the mouth, thoroughly seal shell subassembly 10.
In S100, the step of "preparing the heat conduction column 30" includes:
casting and up-drawing: putting a copper material into a casting furnace for smelting, wherein the smelting temperature is 1000-1600 ℃, after the copper material is completely molten, cooling and crystallizing molten metal by an up-drawing machine, the up-drawing speed is 90-150mm/min, and cooling a shaping mold of the up-drawing machine by cooling water, wherein the water inlet temperature of the cooling water is lower than 25 ℃, the water outlet temperature of the cooling water is lower than 70 ℃, the flow rate of the cooling water is 30-200L/min, so that a copper rod can be formed by the step, and the diameter of the copper rod is 45 +/-0.8 mm;
cogging: stretching the copper rod to reduce the diameter of the copper rod to 41mm to 43mm, wherein the stretching speed is 20-50 mm/min;
cold rolling: carrying out cold rolling processing on the copper rod at the rolling speed of 3-7m/min to form a copper rod with the diameter of 34-36 mm;
cogging and rough drawing: carrying out primary rough drawing processing on the copper bar, reducing the diameter of the copper bar to 18-21 mm, and drawing at a speed of 20-80 mm/min; carrying out secondary rough drawing processing on the copper bar, reducing the diameter of the copper bar to be half of the diameter of the copper bar subjected to the primary rough drawing processing, and drawing at the speed of 20-80 mm/min; carrying out rough drawing processing on the copper bar for the third time, wherein the diameter of the copper bar is reduced to 4.5 mm-5 mm, and the drawing speed is 20-80mm/min, so as to form a copper bar, namely the diameter of the copper bar after the first rough drawing processing is A1, the diameter of the copper bar after the second rough drawing processing is 0.5A1, and the diameter of the copper bar after the third rough drawing processing is 4.5 mm-5 mm;
annealing: keeping the temperature of the copper bar at 790-820 ℃ for 4.5-5.5 h, and annealing;
finish drawing of a finished product: and cooling the annealed copper strip to below 200 ℃, then stretching the copper strip to reduce the diameter of the copper strip to be the same as that of the heat-conducting column 30, processing capillary grooves 31 on the side wall of the copper strip, and finally cutting the copper strip into sections to form the heat-conducting column 30.
In the step of "machining the capillary groove 31 on the side wall of the copper bar", the capillary groove 31 may be machined in a manner of cutting by a cutter, or the capillary groove 31 may be machined in a manner of rolling.
The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge of those skilled in the art without departing from the gist of the present invention.

Claims (5)

1.一种均温板装置，其特征在于，包括：1. A uniform temperature plate device, characterized in that, comprising: 外壳组件，包括第一壳体和第二壳体，所述第一壳体和第二壳体相连接以围设形成用于容纳传热介质的容置腔，所述第一壳体的内侧具有吸热层，所述第二壳体的内侧具有与吸热层相对布置的放热层；a housing assembly, comprising a first shell and a second shell, the first shell and the second shell are connected to enclose a accommodating cavity for accommodating the heat transfer medium, the inner side of the first shell There is a heat absorbing layer, and the inner side of the second shell has a heat releasing layer arranged opposite to the heat absorbing layer; 导热柱，设置于容置腔内，所述导热柱的一端穿过吸热层并固定连接第一壳体，所述导热柱的另一端穿过放热层并固定连接第二壳体，所述导热柱的侧壁设置有多个毛细槽，多个所述毛细槽绕导热柱的轴线布置，且各所述毛细槽均延伸至导热柱的两端。The heat conduction column is arranged in the accommodating cavity, one end of the heat conduction column passes through the heat absorbing layer and is fixedly connected to the first shell, and the other end of the heat conduction column passes through the heat release layer and is fixedly connected to the second shell, so The side wall of the heat-conducting column is provided with a plurality of capillary grooves, the plurality of capillary grooves are arranged around the axis of the heat-conducting column, and each of the capillary grooves extends to both ends of the heat-conducting column. 2.根据权利要求1所述的一种均温板装置，其特征在于，所述毛细槽的宽度设置为W1，0.04mm≤W1≤0.6mm，深度设置为H1，0.04mm≤H1≤0.8mm。2 . The temperature equalizing plate device according to claim 1 , wherein the width of the capillary groove is set to W1, 0.04mm≤W1≤0.6mm, and the depth is set to H1, 0.04mm≤H1≤0.8mm . 3.根据权利要求2所述的一种均温板装置，其特征在于，所述吸热层和放热层均设置为具有孔隙的烧结粉层，且所述吸热层和放热层的孔隙率为50％至95％。3 . The vapor chamber device according to claim 2 , wherein the heat absorption layer and the heat release layer are both set as sintered powder layers with pores, and the heat absorption layer and the heat release layer have sintered powder layers. 4 . The porosity is 50% to 95%. 4.如权利要求3所述的均温板装置的生产方法，其特征在于，包括如下步骤：4. the production method of the vapor chamber device as claimed in claim 3, is characterized in that, comprises the steps: S100、备料：S100, material preparation: 准备铜板原料，将铜板原料加工形成第一壳体和第二壳体，在第一壳体和第二壳体的同一侧预留填注口；Prepare copper plate raw materials, process the copper plate raw materials into a first shell and a second shell, and reserve a filling port on the same side of the first shell and the second shell; 准备导热柱；Prepare the thermal column; S200、填粉烧结：S200, powder filling and sintering: 将第一壳体和第二壳体放入模具，第一壳体的内侧与模具之间具有填粉间隙，第二壳体的内侧与模具之间也具有填粉间隙，将铜粉填注于填粉间隙中，然后将模具进行振动，使得填注的铜粉通过震动形成固定的形状进行支撑，然后将模具取下并将第一壳体和第二壳体进行第一次烧结，使得铜粉烧结形成吸热层和放热层；Put the first shell and the second shell into the mold, there is a powder filling gap between the inner side of the first shell and the mold, and there is a powder filling gap between the inner side of the second shell and the mold, and the copper powder is filled In the powder filling gap, the mold is then vibrated, so that the filled copper powder is supported by a fixed shape through vibration, and then the mold is removed and the first shell and the second shell are sintered for the first time, so that the The copper powder is sintered to form an endothermic layer and an exothermic layer; 其中，模具中具有位于填粉间隙中的凸台，凸台的位置与安装孔相对应，铜粉填注在凸台的周侧；Among them, the mold has a boss located in the powder filling gap, the position of the boss corresponds to the installation hole, and the copper powder is filled on the peripheral side of the boss; S300、安装导热柱：S300, install the heat conduction column: 将导热柱插入吸热层上的安装孔，然后将第二壳体放置于第一壳体上，使得导热柱插入放热层上的安装孔；通过第一挤压设备对第一壳体和第二壳体进行挤压，以使第一壳体和第二壳体的侧缘受压贴设，且第一壳体和第二壳体也受压而贴设于导热柱的端部；然后将第一壳体和第二壳体进行第二次烧结，使得第一壳体和第二壳体的侧缘固定连接以形成外壳组件，且导热柱分别与第一壳体和第二壳体固定连接；Insert the heat-conducting column into the mounting hole on the heat-absorbing layer, and then place the second shell on the first shell, so that the heat-conducting column is inserted into the mounting hole on the heat-releasing layer; The second shell is extruded, so that the side edges of the first shell and the second shell are pressed and attached, and the first shell and the second shell are also pressed and attached to the end of the heat-conducting column; Then the first shell and the second shell are sintered for the second time, so that the side edges of the first shell and the second shell are fixedly connected to form the shell assembly, and the heat conduction columns are respectively connected with the first shell and the second shell body fixed connection; 其中，在进行第二次烧结时，通过所述第一挤压设备或者一第二挤压设备对第一壳体和第二壳体进行挤压；Wherein, during the second sintering, the first shell and the second shell are extruded by the first extrusion equipment or a second extrusion equipment; S400、液体填注：S400, liquid filling: 待外壳组件和导热柱冷却至常温后，通过填注口向外壳组件内侧填注传热介质，传热介质的充液率为25％-50％；After the shell assembly and the heat conduction column are cooled to normal temperature, the heat transfer medium is filled into the inside of the shell assembly through the filling port, and the filling rate of the heat transfer medium is 25%-50%; S500、抽真空和密封；S500, vacuuming and sealing; 通过填注口抽出外壳组件内的空气，然后对填注口进行闭合。Air is drawn out of the housing assembly through the filler port, and the filler port is then closed. 5.根据权利要求4所述的生产方法，其特征在于，在S100中，“准备导热柱”步骤包括：5. The production method according to claim 4, characterized in that, in S100, the step of "preparing the thermal conductive column" comprises: 熔铸上引：将铜材放入熔铸炉进行熔炼，熔炼温度为1000℃至1600℃，待铜材完全熔化后，通过上引机对金属液进行冷却结晶，上引速度为90-150mm/min，并通过冷却水对上引机的定型模具进行冷却，冷却水的进水温度低于25℃，冷却水的出水温度低于70℃，冷却水的流量为30-200L/min，以形成铜杆，铜杆的直径为45±0.8mm；Smelting and casting: Put the copper material into the melting and casting furnace for smelting, the melting temperature is 1000 ℃ to 1600 ℃, after the copper material is completely melted, the molten metal is cooled and crystallized by the upward drawing machine, and the upward drawing speed is 90-150mm/min , and cool the setting mold of the upper lead machine through cooling water, the inlet temperature of the cooling water is lower than 25 °C, the outlet temperature of the cooling water is lower than 70 °C, and the flow rate of the cooling water is 30-200L/min to form copper Rod, the diameter of the copper rod is 45±0.8mm; 开坯：对铜杆进行拉伸加工，将其直径减少为41mm至43mm，拉伸的速度为20-50mm/min；Billeting: The copper rod is stretched to reduce its diameter to 41mm to 43mm, and the stretching speed is 20-50mm/min; 冷轧：将铜杆进行冷轧加工，轧制速度为3-7m/min，形成铜棒，且铜棒的直径为34mm至36mm；Cold rolling: the copper rod is cold-rolled at a rolling speed of 3-7m/min to form a copper rod, and the diameter of the copper rod is 34mm to 36mm; 开坯粗拉：将铜棒第一次粗拉加工，将其直径减少为18mm至21mm，拉伸的速度为20-80mm/min；将铜棒第二次粗拉加工，将其直径减少为第一次粗拉加工后的直径的一半，拉伸的速度为20-80mm/min；将铜棒第三次粗拉加工，将其直径减少为4.5mm至5mm，拉伸的速度为20-80mm/min，以形成铜条；Rough drawing: Rough drawing the copper rod for the first time, reducing its diameter to 18mm to 21mm, and the drawing speed is 20-80mm/min; rough drawing the copper rod for the second time, reducing its diameter to Half of the diameter after the first rough drawing process, the drawing speed is 20-80mm/min; the copper rod is rough drawn for the third time to reduce its diameter to 4.5mm to 5mm, and the drawing speed is 20- 80mm/min to form copper bars; 退火：将铜条在790℃至820℃的环境中保温4.5h至5.5h，进行退火加工；Annealing: keep the copper bars in the environment of 790℃ to 820℃ for 4.5h to 5.5h, and then carry out annealing processing; 成品精拉：将退火后的铜条冷却至200℃以下，然后将铜条拉伸加工，将其直径减少为与导热柱的直径相同，在铜条的侧壁加工毛细槽，最后将铜条裁切成段，以形成导热柱。Finished product fine drawing: Cool the annealed copper strip to below 200°C, then stretch the copper strip to reduce its diameter to the same as the diameter of the thermal conductive column, process capillary grooves on the side wall of the copper strip, and finally cut the copper strip Cut into sections to form thermally conductive pillars.
CN202111586793.6A 2021-12-23 2021-12-23 Temperature-uniforming plate device and production method thereof Pending CN114199057A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20240060724A1 (en) * 2022-08-18 2024-02-22 Taiwan Microloops Corp. Vapor chamber and supporting column securement structure thereof

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070163755A1 (en) * 2003-12-16 2007-07-19 Hyun-Tae Kim Flat plate heat transfer device and method for manufacturing the same
CN107509368A (en) * 2017-09-08 2017-12-22 广东智科精创科技股份有限公司 A kind of uniform-temperature radiator and samming plate producing process
CN108393370A (en) * 2018-01-23 2018-08-14 江西广信新材料股份有限公司 A kind of battery plus-negative plate leading-out terminal copper bar material production technology
CN112802810A (en) * 2019-11-13 2021-05-14 华为技术有限公司 Temperature-uniforming plate and manufacturing method thereof
CN113437034A (en) * 2021-08-25 2021-09-24 中兴通讯股份有限公司 Temperature equalization plate and electronic equipment

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070163755A1 (en) * 2003-12-16 2007-07-19 Hyun-Tae Kim Flat plate heat transfer device and method for manufacturing the same
CN107509368A (en) * 2017-09-08 2017-12-22 广东智科精创科技股份有限公司 A kind of uniform-temperature radiator and samming plate producing process
CN108393370A (en) * 2018-01-23 2018-08-14 江西广信新材料股份有限公司 A kind of battery plus-negative plate leading-out terminal copper bar material production technology
CN112802810A (en) * 2019-11-13 2021-05-14 华为技术有限公司 Temperature-uniforming plate and manufacturing method thereof
CN113437034A (en) * 2021-08-25 2021-09-24 中兴通讯股份有限公司 Temperature equalization plate and electronic equipment

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20240060724A1 (en) * 2022-08-18 2024-02-22 Taiwan Microloops Corp. Vapor chamber and supporting column securement structure thereof

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