CN115225746A - Electronic equipment - Google Patents

Abstract

The present application provides an electronic device, which includes a middle frame, a circuit board, a bracket and a first speaker unit, the circuit board includes a mounting surface, and the bracket includes an escape groove; the escape groove extends along the thickness direction of the support The bracket is recessed, the first speaker unit is positioned on the mounting surface and is electrically connected to the circuit board, the circuit board and the bracket are stacked and mounted on the middle frame, and the electronic In the thickness direction of the device, the first speaker unit is accommodated in the escape groove.

Description

Electronic equipment

technical field

The present application relates to the technical field of communication devices, and in particular, to an electronic device.

Background technique

With the continuous development of science and technology, electronic devices such as mobile phones are widely used in people's daily life and work, and have become indispensable daily necessities for people. In the current electronic equipment, the speaker module and the camera module occupy a lot of space inside the mobile phone, especially the speaker module needs a certain space in thickness, and a through slot needs to be opened on the circuit board to avoid it, which will occupy the space of the circuit board , affecting the device layout and use of the circuit board; if the circuit board is avoided, the overall thickness of the electronic device will be increased.

SUMMARY OF THE INVENTION

The present application provides an electronic device, which can reduce the space occupied by a speaker module on a circuit board and avoid increasing the thickness of the electronic device.

An electronic device provided by an embodiment of the present application includes a middle frame, a circuit board, a bracket, and a first speaker unit, the circuit board includes a mounting surface, and the bracket includes an escape groove; the escape groove is along the thickness direction of the support is recessed into the bracket, the first speaker unit is positioned on the mounting surface and is electrically connected to the circuit board, the circuit board and the bracket are stacked and mounted on the middle frame, and the first speaker unit is positioned on the mounting surface and electrically connected to the circuit board. In the thickness direction of the electronic device, the first speaker unit is accommodated in the escape groove.

In the electronic device of the embodiment of the present application, the first speaker unit is installed on the surface of the circuit board, and the space in the thickness direction is provided for the first speaker unit by setting an escape groove on the bracket, which can avoid opening holes on the circuit board and increase the circuit The use area of the board is reduced, and the space of the decorative part of the camera module is used to accommodate the bracket, which can avoid increasing the thickness space of the electronic device.

In an embodiment, the electronic device includes a second speaker unit and a sound outlet slot, the middle frame includes a mounting slot, and the circuit board includes an escape hole, and the escape hole penetrates through the thickness direction of the circuit board. In the circuit board, the installation groove penetrates through the middle frame along the thickness direction of the middle frame, the second speaker unit passes through the avoidance hole, and covers the opening of the installation groove, and the installation groove is formed The front sound cavity of the second speaker unit, and the sound outlet slot communicates the front sound cavity of the second speaker unit with the outside of the electronic device.

In one embodiment, the volume of the second speaker unit is smaller than the volume of the first speaker unit. In the external playback scenario, due to the small size of the second speaker unit, the volume of the front sound cavity is night, the second speaker can be used as a tweeter unit, and the first speaker can be used as a woofer unit to improve the stereo effect.

In one embodiment, the first speaker unit is a tweeter unit or a full-frequency unit, and the second speaker unit is a full-frequency unit. In this embodiment, there are multiple speaker units, which can achieve multi-audio effects, and the sound outlet slot can be used as a gap for sound output during a call. The sound will diffuse outward and become sound leakage, which affects the privacy of the call. For this problem, the first speaker unit emits a sound wave with the opposite phase to the sound outlet through the speaker hole to offset the sound leakage from the sound outlet and improve the privacy of the call. sex.

In an embodiment, the middle frame is provided with an end frame and a speaker hole arranged on the end frame, the escape groove includes a groove bottom wall, and a functional groove is recessed on the groove bottom wall, and the The first speaker unit covers the functional slot, so that the functional slot forms a front sound cavity of the first speaker, and the speaker hole communicates with the front sound cavity of the first speaker unit and the outside of the middle frame .

In one embodiment, the middle frame includes a protrusion, the protrusion is provided with a communication groove, the communication groove extends along the thickness direction of the middle frame, and the communication groove communicates with the speaker hole, The bracket includes a sound-through hole, and the sound-through hole communicates with the front sound cavity of the first speaker unit and the communication groove. This embodiment has a simple structure and is easy to manufacture, and the first speaker unit transmits the sound to the outside of the electronic device through the sound passage hole, the communication slot and the speaker hole.

In one embodiment, the bracket includes a bracket body and a boss, the bracket body includes a first surface and a second surface disposed away from the first surface, and the boss is located on the second surface, the escape groove is recessed on the first surface;

A mounting protrusion is also protruded on the first surface, the sound hole includes a first sound hole, a second sound hole and a third sound hole that are connected in sequence, and the first sound hole is along the length of the bracket The direction runs through the groove side wall of the functional groove, the second sound hole is provided inside the boss and the installation protrusion and extends along the thickness direction of the bracket, and the third sound hole penetrates the installation A protrusion, the protrusion is butted with the installation protrusion, and the third sound hole is opposite to and communicated with the communication groove. The bracket uses its own thickness and the mounting protrusion to set the sound-passing hole, effectively utilizes part of the structure, and can save the bracket area.

In one embodiment, an extension portion extends along the width direction of the bracket at one end of the mounting protrusion, the extension portion is located at the end of the mounting protrusion away from the escape groove, and the third sound hole is provided by the bracket. the end of the mounting protrusion extends to the extension part and extends along the length direction of the extension part;

The communicating groove is recessed into the convex block from the upper surface of the convex block, the opening of the communicating groove is located on the surface of the convex block, and the communicating groove extends along the width direction of the middle frame, so The speaker hole penetrates one side wall of the communication groove.

In one embodiment, the protruding block includes a first inclined surface, and the first inclined surface is inclined away from the end frame, and the speaker hole penetrates the bottom wall of the communication groove and communicates with the communication groove;

The installation protrusion is provided with an extension portion, the extension portion is located at one end of the installation protrusion away from the escape groove, the extension portion includes a second inclined surface, and the second inclined surface faces away from the installation protrusion and Compared with the inclination of the first surface of the bracket, the third sound hole penetrates the second inclined surface, the first inclined surface and the second inclined surface are butted, and the third sound hole is connected with the communication groove relative and connected. In this embodiment, by setting the first slope on the bump, the volume of the bump is reduced, the area of the notch on the circuit board is prevented from being too large, and the area of the circuit board is saved.

In one embodiment, the middle frame includes a middle plate and the end frame connected to the middle plate, the middle plate includes a first surface and a second surface disposed away from the first surface, the protruding block is protrudingly arranged on the first surface of the middle plate and is connected with the end frame;

The communication groove includes a first communication groove and a second communication groove communicated with the first communication groove, an opening of the first communication groove is located on the surface of the convex block facing away from the middle plate, the first communication groove is The other opening of a communication groove is located on a groove side wall of the second communication groove; the opening of the second communication groove is located on the second surface of the middle plate.

In an embodiment, the first communication slot includes a first slot side wall, the first slot side wall is inclined compared to the opening of the first communication slot, and part of the speaker holes penetrate through the first slot side wall;

The second communication groove is formed by the depression of the second surface into the middle plate. The second communication groove includes a groove bottom wall and a sub-groove, and the sub-groove is formed by the groove bottom wall being sunken into the middle plate. , the sub-slot includes two inclined side walls and a bottom wall connecting the two inclined side walls, another part of the speaker hole penetrates the bottom wall, and the other opening of the first communication groove is located in a on the inclined side wall and toward the speaker hole. In this embodiment, by providing communication grooves on both sides of the middle frame, that is, providing special-shaped communication grooves, the volume of the bumps can be reduced, thereby reducing the area of the gaps opened for the bumps on the circuit board, thereby saving energy area of the circuit board.

In an embodiment, an opening of the third sound hole is located on the second inclined surface, the third sound hole includes a hole wall, and the extension direction of the hole wall is the same as the extension direction of the third sound hole. At the intersection, an opening of the second sound hole penetrates the hole wall and communicates with the third sound hole. In this embodiment, the cross-sectional area of the third sound hole is larger than the cross-sectional area of the second sound hole, and the third sound hole is used to communicate with the communication groove, so as to communicate with the speaker hole, which can improve the sound emission effect.

In one embodiment, the electronic device includes a camera module and a decorative part, the decorative part includes a receiving groove, and the circuit board further includes an installation avoidance hole, and the installation avoidance hole penetrates along the thickness direction of the circuit board. In the circuit board, the installation avoidance hole is spaced apart from the first speaker unit;

The camera module passes through the installation avoidance hole, the decorative piece is mounted on the middle frame, and the camera module and the bump of the bracket are accommodated in the accommodating groove. In this embodiment, the space of the decorative element for accommodating the camera module is used to accommodate the bracket for accommodating the first speaker unit, so as to avoid increasing the thickness of the electronic device.

In an embodiment, the electronic device includes a screen, the middle frame includes a middle plate, an end frame connected to the middle frame, and a sound outlet, the middle plate includes a first surface and a back surface from the first surface. The sound outlet groove is recessed on the second surface, and the sound outlet groove includes a slot recessed on the inner side of the end frame and a connection area that communicates with the installation groove. , the screen is mounted on the second surface and covers the connection area, and the screen and the gap form the sound outlet gap. The sound outlet is arranged on one side of the display screen to facilitate the user to listen to the sound.

Description of drawings

In order to illustrate the technical solutions of the embodiments of the present application more clearly, the accompanying drawings required to be used in the embodiments of the present application will be described below.

1 is a schematic structural diagram of an electronic device provided by an embodiment of the present application;

Fig. 2 is the structural representation of the electronic device shown in Fig. 1 under another angle;

Fig. 3 is an angular exploded structural schematic diagram of the electronic device shown in Fig. 2;

Fig. 4 is a schematic diagram of an angular exploded structure of the electronic device shown in Fig. 1;

Fig. 5 is the structural representation of the middle frame of the electronic device shown in Fig. 3;

Fig. 6 is the structural representation of the middle frame shown in Fig. 4 under another angle;

FIG. 7 is a schematic cross-sectional view of the middle frame shown in FIG. 5 at an angle;

Figure 8 is a schematic cross-sectional view at an angle shown in Figure 6;

Fig. 9 is the structural representation of the circuit board in the electronic device shown in Fig. 3;

Fig. 10 is a schematic view of the partial structure assembly of the electronic equipment shown in Fig. 3;

Fig. 11 is the structural representation of the bracket in the electronic device shown in Fig. 3;

Figure 12 is a schematic structural diagram of the bracket shown in Figure 11 at another angle;

Figure 13 is a schematic plan view of the bracket shown in Figure 12;

14 is a partial structural cross-sectional view of the electronic device shown in FIG. 2 from an angle;

15 is a partial structural cross-sectional view of the electronic device shown in FIG. 2 from another angle;

FIG. 16 is a schematic cross-sectional structure diagram of the electronic device shown in FIG. 1 at an angle;

17 is a schematic cross-sectional structure diagram of the electronic device shown in FIG. 1 from another angle;

18 is a schematic diagram of an exploded structure of an electronic device provided by the second embodiment of the present application;

FIG. 19 is a schematic structural diagram of the bracket of the electronic device shown in FIG. 18 from another angle;

FIG. 20 is a schematic assembly diagram of a partial structure of an electronic device provided by the second embodiment of the present application;

21 is a schematic cross-sectional view of the electronic device shown in FIG. 17 after assembly;

22 is a schematic diagram of an exploded structure of an electronic device provided by a third embodiment of the present application;

Figure 23 is a schematic structural diagram of the bracket of the electronic device shown in Figure 22 from an angle;

FIG. 24 is a schematic structural diagram of the bracket of the electronic device shown in FIG. 22 from another angle;

FIG. 25 is a schematic assembly diagram of a partial structure of an electronic device provided by the third embodiment of the present application;

FIG. 26 is a schematic cross-sectional view at an angle of the electronic device shown in FIG. 25 after being assembled.

Detailed ways

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application.

Please refer to FIGS. 1 to 2 . FIG. 1 is a schematic structural diagram of an electronic device 1000 provided by an embodiment of the present application, and FIG. 2 is a structural schematic diagram of the electronic device 1000 shown in FIG. 1 from another angle.

The electronic device 1000 may be an electronic product such as a mobile phone, a tablet computer, a notebook computer, a car device, a smart watch, a smart bracelet, a POS machine (point of sales terminal, point of sale terminal). The embodiments of the present application are described by taking the electronic device 1000 as a mobile phone as an example. For convenience of description, the width direction of the electronic device 1000 is defined as the X-axis direction, the length direction of the electronic device 1000 is defined as the Y-axis direction, the thickness direction of the electronic device 1000 is defined as the Z-axis direction, the X-axis direction, the Y-axis direction and the Z-axis direction The directions are perpendicular to each other. It should be noted that the orientation terms such as "top", "bottom", "upper", "down", "left" and "right" involved in this application are described with reference to the orientation shown in FIG. 1 . , take the positive direction of the Y-axis as "top", take the negative direction of the Y-axis as the "bottom", take the positive direction of the Z-axis as "up", take the negative direction of the Z-axis as "down", and take the positive direction of the X-axis as "bottom" The direction is "right", and the negative direction toward the X-axis is "left", which does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as affecting the present application. limits.

Please refer to FIG. 3 and FIG. 4 , FIG. 3 is a schematic view of an angular exploded structure of the electronic device 1000 shown in FIG. 2 , and FIG. 4 is a schematic view of an angular exploded structure of the electronic device 1000 shown in FIG. 1 . The electronic device 1000 includes a casing 10 , a screen 20 , a circuit board 30 , a bracket 40 , a processor (not shown), a camera module, a speaker module (not shown), a power module (not shown), and decorative parts 70. The screen 20 is installed on one side of the casing 10 . The circuit board 30 , the bracket 40 , the processor, the camera module, the speaker module and the power module are all mounted on the inner side of the casing 10 . The processor can be mounted on the circuit board 30 and is electrically connected to the circuit board 30 . The processor may be a CPU (central processing unit, central processing unit) of the electronic device 1000 . The decorative element 70 is installed on the other side of the casing 10 and covers the bracket 40 .

The speaker module is located on the top of the electronic device 1000 and is used as the top speaker module of the electronic device 1000 . The speaker module includes a second speaker unit 63 and a first speaker unit 62 . The second speaker unit 63 may be a high frequency unit, and may be used as an earpiece of the electronic device 1000 . The second speaker unit 63 can receive the audio signal sent by the processor through the circuit board 30, and vibrate and emit sound according to the audio signal. The first speaker unit 62 is electrically connected with the circuit board 30 to realize electrical connection with the processor. The first speaker unit 62 may be a full-frequency unit, and may be used as a speaker of the electronic device 1000, or may be a low-frequency unit to enhance the stereo effect. The first speaker unit 62 can receive the audio signal sent by the processor through the circuit board 30, and vibrate and emit sound according to the audio signal. In other embodiments, the second speaker unit 63 and the first speaker unit 62 can both be full-frequency units, and the speaker module can realize three-channel sound, which helps to improve the sound quality of the speaker module. The electronic device 1000 is further provided with a speaker hole 80 and a sound outlet slot 90. The speaker hole 80 and the sound outlet slot 90 in this embodiment are located at the top of the electronic device. In other embodiments, the second speaker unit 63 may be omitted. After the omission, the sound output of the first speaker unit 62 may be through the speaker hole 80 and the sound outlet slot 90, or the speaker hole 80 or the sound outlet slot. 90.

In this embodiment, the housing 10 includes a middle frame 11 and a rear cover 18 , and the rear cover 18 is installed on one side of the middle frame 11 . The back cover 18 may be a battery cover of the electronic device 1000 . The rear cover 18 is provided with an installation hole 181 , and the installation hole 181 is located at the top of the rear cover 18 and penetrates through the rear cover 18 . That is, the mounting hole 181 penetrates the rear cover 18 in the thickness direction (the Z-axis direction in the figure) of the rear cover 18 . The mounting hole 181 is a square hole. In other embodiments, the mounting holes 181 may also be circular holes or holes of other shapes. The speaker hole 80 is located at one end of the middle frame 11 . In this embodiment, the screen 20 may be a display screen such as an LCD (liquid crystal display, liquid crystal display) or an OLED (organic light-emitting diode, organic light-emitting diode display), and is used to display information such as images or text. The screen 20 is mounted on the other side of the middle frame 11 , that is, the screen 20 is mounted on the side of the middle frame 11 away from the back cover 18 . The sound exit slot 90 is located at the top of the screen 20 .

The decorative piece 70 is in the shape of a rectangular cover. The decoration piece 70 is provided with a receiving groove 71 and a mounting edge 72 , and the mounting edge 72 is the outer periphery of the decoration piece 70 . The decorative piece 70 is mounted on the mounting hole 181 of the rear cover 18 , the mounting edge 72 is fixedly clamped with the periphery of the mounting hole 181 , and the decorative piece 70 protrudes from the outer surface of the rear cover 18 . The opening of the receiving groove 71 is located on one side of the decorative element 70 . The accommodating groove 71 is recessed from the upper surface of the decorative member 70 to the lower surface (not shown) in the direction (the negative Z-axis direction in the figure). The shape of the receiving groove 71 is adapted to the shape of the bracket 40 . The decorative element 70 may also be provided with a camera hole (not shown), and the opening of the camera hole is located on the bottom wall of the receiving groove 71 . The imaging hole is recessed from the bottom wall of the receiving groove 71 toward the lower surface of the decorative element 70 and penetrates through the lower surface of the decorative element 70 . The external light can enter the receiving groove 71 of the decorative element 70 through the camera hole.

4 , 5 and 6 , FIG. 5 is a schematic structural diagram of the middle frame 11 of the electronic device 1000 shown in FIG. 3 , and FIG. 6 is a structural schematic diagram of the middle frame 11 shown in FIG. 4 from another angle.

The middle frame 11 includes a middle plate 111 , two end frames 112 and two side frames (not shown). The middle frame 111 includes a first surface 1110 and a second surface 1111 disposed away from the first surface 1110 . The two end frames 112 and the two side frames are connected at the first place and are both connected to the sides of the middle plate 111 . The two end frames 112 and the two side frames surround the circumference of the middle plate 111 and form a receiving groove 113 with the middle plate 111 . . The first surface 1110 is the groove bottom surface of the accommodating groove 113 . The middle plate 111 in this embodiment is a rectangular plate, and the two end frames 112 located at the ends of the middle plate 111 can be regarded as the top and bottom shells of the electronic device, and are usually used for setting speaker holes and connector sockets. The side frames located on the opposite sides of the middle plate can be regarded as two side shells of the electronic device, which can be provided with volume keys, power on/off keys, etc., which are also the parts held by the user's hand. In this embodiment, the end frame 112 at the top is provided with a speaker hole 80 for matching with the speaker module.

In this embodiment, the middle frame 11 further includes a protrusion 114 . The protrusion 114 is protruded from the groove bottom surface (first surface 1110 ) of the receiving groove 113 and extends toward the opening direction of the receiving groove 113 (the negative Z-axis direction shown in the figure). Specifically, the protruding block 114 is rectangular, the protruding block 114 is located at the top of the receiving groove 113 , and the protruding block 114 is connected to the inner side surface of the end frame 112 . Wherein, the height of the bump 114 is smaller than the depth of the accommodating groove 113 . Illustratively, the bumps 114 are square. In other embodiments, the bumps 114 may also be circular or other shapes.

Please refer to FIG. 5 and FIG. 6 together, the middle frame 11 is further provided with a communication slot 115 , an installation slot 117 and a sound outlet slot 118 . Both the sound outlet slot 118 and the installation slot 117 are located at the top of the middle frame 11 . The installation groove 117 penetrates through the first surface and the second surface of the middle plate 111 along the thickness direction of the middle frame 11 . The sound outlet 118 includes a slit 1181 and a connecting area 1182. The slit 1181 extends along the end frame 112 (X-axis direction), specifically, is recessed on the inner side of the end frame 112 and penetrates through the upper surface of the end frame 112. That is, it faces the same plane as the first surface 1110 . The sound outlet groove 118 is partially recessed on the second surface 1111 of the middle plate 111 (recessed in the direction from the second surface of the middle plate 111 to the first surface (the negative direction of the Z axis in the figure)), and the connection area 1182 is located at the end of the installation groove 117. side and communicate with the installation groove 117 .

Please refer to FIGS. 6 , 7 and 8 together. FIG. 7 is a schematic cross-sectional view of the middle frame 11 shown in FIG. 5 at an angle; FIG. 8 is a cross-sectional schematic view of the middle frame 11 shown in FIG. 6 at an angle. The communication groove 115 penetrates through the bump 114 and the second surface 1111 of the middle plate 111 and communicates with the speaker hole 80 . One opening of the communication groove 115 is located on the upper surface (not shown) of the bump 114 , and the other opening is located on the second surface 1111 . Specifically, the communication groove 115 includes a first communication groove 115 a and a second communication groove 115 b . The opening of the first communication groove 115 a is located on the upper surface of the protrusion 114 and communicates with the accommodating groove 113 . The first communication slot 115a includes a first slot side wall 1150, the first slot side wall 1150 is connected to the end frame 112, the first slot side wall 1150 is inclined relative to the opening of the first communication slot 115a, and part of the speaker hole 80 penetrates through the first slot 115a. A groove side wall 1150 communicates with the first communication groove 115a.

The opening of the second communication groove 115b is located on the second surface 1111 , the second communication groove 115b is spaced from the mounting groove 117 in the X-axis direction, and is spaced from the sound outlet groove 118 in the Y-axis direction. The second communication groove 115b includes a groove bottom wall 1152 and a sub-groove 1153. The second communication groove 115b is formed by the second surface 1111 recessed into the middle plate 111. The opening of the second communication groove 115b faces away from the accommodating groove 113 and is located on the second surface of the middle plate 111. Second surface. The groove bottom wall 1152 is parallel to the second surface 1111 . The sub-slot 1153 is formed by the recess of the bottom wall 1152 of the slot into the middle plate 111 (specifically, the recess is recessed into the protrusion 114 ), and the sub-slot 1153 communicates with part of the speaker holes 80 . Actually, the first communication groove 115a is within the projection range of the second communication groove 115b.

Specifically, the sub-slot 1153 includes two inclined side walls 1154 and a bottom wall 1155 connected with the inclined side walls 1154 , and the speaker hole 80 penetrates the bottom wall 1155 and communicates with the sub-slot 1153 . The first communication groove 115a passes through one of the inclined side walls 1154 and communicates with the sub-groove 1153 , that is, the other opening of the first communication groove 115 a is located on the inclined side wall 1154 and faces the bottom wall 1155 . The sub-slot 1153 is an inclined slot, which is recessed from the middle plate 111 to the convex block 114, and the bottom wall 1155 can be a part of the end frame 112 or a part of the convex block. It can be understood that the first communication groove 115a penetrates part of the groove side wall of the second communication groove 115b. The area of the second communication groove 115b is larger, which is convenient for the processing of the first communication groove 115a, and the size of the first communication groove 115a can also be reduced, thereby reducing the size of the bump and the size of the notch on the circuit board 30. , thereby increasing the actual usable area of the circuit board.

Please refer to FIGS. 9 and 10 . FIG. 9 is a schematic structural diagram of the circuit board 30 in the electronic device 1000 shown in FIG. 3 , which includes a speaker module. FIG. 10 is a schematic assembly diagram of a part of the structure of the electronic device 1000 shown in FIG. 3 .

The circuit board 30 may be a main board of the electronic device 1000 . The circuit board 30 includes a mounting surface 31 . The mounting surface 31 is provided with a first mounting area 311 and a second mounting area 312 adjacent to the first mounting area 311 . The circuit board 30 is further provided with avoidance holes 32 , a plurality of installation avoidance holes 33 and notches 34 . The avoidance hole 32 , the plurality of installation avoidance holes 33 (two or more) and the notch 34 penetrate through the circuit board 30 along the thickness direction (Z-axis direction) of the circuit board 30 , that is, pass through the mounting surface 31 and face away from the mounting surface 31 . s surface.

The avoidance hole 32 , the installation avoidance hole 33 and the notch 34 are arranged at intervals; the avoidance hole 32 and the notch 34 are located on the top of the circuit board 30 and penetrate through the top surface of the circuit board 30 (not shown). The notch 34 is located on the side of the escape hole 32 . The plurality of installation avoidance holes 33 are located in the first installation area 311 of the circuit board 30 , and the notches 34 and the avoidance holes 32 are located above the first installation area 311 . It should be noted that the part of the circuit board 30 located between the avoidance hole 32 and the installation avoidance hole 33 is generally used to route lines such as radio frequency signal lines and control lines, and the distance between the avoidance hole 32 and the installation avoidance hole 33 can be convenient. Lines such as radio frequency signal lines and control lines are arranged to ensure the reliability of the use of the circuit board 30 .

Please refer to FIG. 10 , the circuit board 30 , the camera module (not shown) and the speaker module are all installed in the accommodating slot 113 of the middle frame 11 . Specifically, the circuit board 30 is mounted on the bottom wall of the receiving groove 113 (not marked in the figure). The notches 34 of the circuit board 30 avoid the bumps 114 of the middle frame 11 . The camera module is installed on the bottom wall of the accommodating groove 113 and penetrates through the plurality of installation avoidance holes 33 of the circuit board 30 . The camera module is electrically connected to the circuit board 30 to realize electrical connection with the processor. The camera module can receive the information collection signal sent by the processor through the circuit board 30, and collect the light outside the electronic device 1000 to form corresponding image data.

The second speaker unit 63 of the speaker module is located on the top of the electronic device 1000 , and the second speaker unit 63 is installed in the installation slot 117 . Specifically, the second speaker unit 63 passes through the installation avoidance hole 33 of the circuit board 30 and is electrically connected to the circuit board 30 to realize electrical connection with the processor. Wherein, the second speaker unit 63 can be a high frequency unit, and can be used as an earpiece of the electronic device 1000 . The second speaker unit 63 can receive the audio signal sent by the processor through the circuit board 30, and vibrate and emit sound according to the audio signal.

The first speaker unit 62 is mounted on the second mounting area 312 of the circuit board 30 , that is, on the mounting surface 31 , and is electrically connected to the circuit board 30 to achieve electrical connection with the processor. Along the X-axis direction, the first speaker unit 62 is spaced apart from the camera module. In this embodiment, the first speaker unit 62 is directly disposed on the mounting surface 31 of the circuit board 30 , and there is no need to provide an escape hole penetrating the circuit board on the circuit board 30 , which can save the space of the circuit board 30 . The first speaker unit 62 can be a full-frequency unit, and can be used as a speaker of the electronic device 1000; of course, it can also be used as a bass unit. The first speaker unit 62 can receive the audio signal sent by the processor through the circuit board 30, and vibrate and emit sound according to the audio signal. At this time, the first speaker unit 62 and the second speaker unit 63 can cooperate to produce sound, which can reduce the power consumption of the speaker module and help prolong the battery life of the electronic device 1000 .

In addition, the electronic device 1000 may further include another speaker module (not shown), and the other speaker module is located at the bottom of the electronic device 1000 and used as a bottom speaker module of the electronic device 1000 . At this time, the electronic device 1000 can use the top speaker module and the bottom speaker module to produce sound at the same time, so as to realize the "dual speaker" sound mode of the electronic device 1000 , which helps to improve the sound quality of the electronic device 1000 .

Please refer to FIGS. 11 and 12 , FIG. 11 is a schematic structural diagram of the bracket 40 in the electronic device 1000 shown in FIG. 3 , FIG. 12 is a schematic structural diagram of the bracket 40 shown in FIG. 11 from another angle, and FIG. 13 is the schematic diagram of FIG. 12 . A schematic diagram of the plane structure of the bracket 40 .

In this embodiment, the bracket 40 includes a bracket body 41 , a boss 42 , an assembly slot 43 , an escape slot 45 , an installation protrusion 46 and a sound hole 47 , and the boss 42 and the installation protrusion 46 are fixedly connected to the bracket body 41 . The bracket body 41 is adapted to the shape of the accommodating groove 113 (as shown in FIG. 4 ) of the middle frame 11 . The bracket body 41 includes a first surface 411 and a second surface 412 disposed away from the first surface 411 .

The boss 42 is fixedly connected to the second surface 412 of the bracket body 41 . The boss 42 protrudes from the second surface 412 of the bracket body 41 in a direction away from the second surface 412 (the positive direction of the Z axis in the figure). The mounting groove 43 passes through the bosses 42 on the first surface 411 and the second surface 412 , that is, the mounting groove 43 is a through groove, and its two openings are located on the side of the first surface 411 and the boss 42 facing away from the second surface 412 respectively. . The shape of the assembling groove 43 is adapted to the shape of the camera module.

The avoidance groove 45 is recessed on the first surface 411 , along the Z-axis direction, the avoidance groove 45 is recessed from the first surface 411 to the second surface 412 ; along the X-axis direction, the avoidance groove 45 is spaced from the assembly groove 43 . The shape of the escape groove 45 is adapted to the shape of the first speaker unit 62 for accommodating the first speaker unit 62 . A functional groove 451 is recessed on the groove bottom wall 450 of the escape groove 45 parallel to the first surface 411 .

The mounting protrusion 46 is protruded on the first surface 411 of the bracket body 41 . In the Y direction, the mounting protrusion 46 is disposed adjacent to the escape groove 45 ; along the Z axis direction, the mounting protrusion 46 partially overlaps with the boss 42 . The included angle θ between the lengthwise extending direction of the mounting protrusion 46 and the Y-axis direction is greater than or equal to 0 degrees and less than 90 degrees.

14 and 15 together, FIG. 14 is a partial structural cross-sectional view of the electronic device 1000 shown in FIG. 2 from an angle, and FIG. 15 is a partial structural cross-sectional view of the electronic device 1000 shown in FIG. 2 from another angle.

The sound hole 47 includes a first sound hole 471 , a second sound hole 472 and a third sound hole 473 . The first sound hole 471 , the second sound hole 472 and the third sound hole 473 are connected in sequence along the extending direction of the sound hole 47 . . A first sound hole 471 is provided on the side groove wall (not shown) adjacent to the functional groove 451 and the mounting protrusion 46 , and the extension direction of the first sound hole 471 is parallel to the Y-axis direction. After the second sound hole 472 extends along the Z-axis in the boss 42 to the inside of the mounting boss 46, it extends along the extending direction of the mounting boss 46 inside the mounting boss 46; it can be understood that the second sound hole 472 is through The stepped holes passing through the boss 42 and the mounting boss 46 extend along the Z-axis as a whole. The second sound hole 472 only needs to communicate with the first sound hole 471 and the third sound hole 473 , and its path is not limited. The third sound hole 473 penetrates the outer surface of the mounting protrusion 46 along the Z-axis direction, and is located at the end of the mounting protrusion 46 away from the escape groove 45 ; the extending direction of the third sound hole 473 is parallel to the Z-axis direction. In some other embodiments, each part of the sound-through hole 47 may also adopt other structures, and the present application does not specifically limit the structure of the sound-through hole 47 . The first sound hole 471 , the second sound hole 472 and the third sound hole 473 may be round holes, square holes, or through-slot structures, and their shapes are not limited.

In one embodiment, the front sound cavity of the first speaker unit 62, that is, the functional slot 451, may be in the shape of an hourglass, that is, some parts of the side wall of the slot in the Z-axis direction are relatively close, and the functional slot in the Z-axis direction is relatively close. The cross-section of the part of the area between the opening and the bottom wall of the groove 451 is smaller than the area of the opening and the area of the bottom wall of the groove. It can be understood that the functional groove 451 is partially narrowed inside the groove. Alternatively, the cross-sectional area of a part of the second sound hole 472 in the sound output direction is smaller than the area of the opening connecting the first sound hole 471 and the third sound hole 473, which can be understood as the sound output direction of the second sound hole 472 Some areas are narrowed. In this way, the high frequency performance of the first speaker unit 62 can be improved. It can be understood that the sound output channel of the first speaker unit 62 is not limited to having a narrowed area at the position of the second sound hole, and the first sound hole 471 and the third sound hole 473 may also have narrow areas.

The bracket 40 is installed in the accommodating groove 113 of the middle frame 11 . Specifically, the bracket 40 is mounted on the surface of the circuit board 30 away from the middle frame 11 (ie, the mounting surface 31 of the circuit board 30 ). The bracket 40 can be mounted on the circuit board 30 by fasteners such as screws. The bracket 40 covers the second speaker unit 63 . The camera module passes through the assembly groove 43 , and the first speaker unit 62 is installed in the escape groove 45 and covers the first sound hole 471 . In addition, the second surface 412 of the bracket body 41 can be flush with the surface of the middle frame 11 to facilitate subsequent assembly of the rear cover 18 and the middle frame 11 .

Please refer to FIGS. 15 , 16 and 17 , FIG. 16 is a schematic cross-sectional structure diagram of the electronic device 1000 shown in FIG. 1 from an angle, and FIG. 17 is a cross-sectional structure schematic diagram of the electronic device 1000 shown in FIG. 1 from another angle.

The decorative element 70 is installed on the surface of the bracket 40 away from the middle frame 11 and covers the bracket 40 and the camera module. Wherein, the bracket 40 , the camera module and the decorative element 70 all pass through the installation hole 181 of the rear cover 18 . Specifically, the receiving groove 71 of the decorative element 70 receives the boss 42 of the bracket 40 . In addition, the camera hole of the decorative element 70 is disposed opposite to the camera module. The camera module can collect the light outside the electronic device 1000 through the camera hole, and form corresponding image data, so as to realize the camera.

The screen is mounted on the other side of the middle frame 11, and seals the mounting groove 117 and the second communicating groove 115b of the communicating groove 115. The mounting groove 117 forms the front sound cavity 63a of the second speaker unit 63, the second loudspeaker in this embodiment. The volume of the unit 63 is smaller than that of the first speaker unit 62, and the volume of the front sound cavity 63a of the second speaker unit 63 is correspondingly reduced, and the second speaker unit 63 can be used as a tweeter unit in an external playback scenario. The screen 20 and the gap 1181 of the sound outlet 118 form a sound outlet 90 , and the sound outlet 90 communicates with the front sound cavity 63 a of the second speaker unit 63 through the connection area 1182 of the sound outlet 118 . The sound emitted by the second speaker unit 63 during operation can be transmitted from the front sound cavity 63a to the outside of the electronic device 1000 through part of the sound outlet slot 118 and the sound outlet slit 90, that is, it can be understood that the sound emitted by the second speaker unit 63 during operation is sequentially The sound is transmitted to the outside of the electronic device 1000 through the installation slot 117 and the sound outlet slot 118 of the middle frame 11 to realize the sound of the second speaker unit 63 . The sound outlet slot is formed by the sound outlet slot of the middle frame and the screen 20, and the sound outlet slot can also be formed by a slot on the screen 20 and the middle frame.

The third sound hole 473 of the sound through hole 47 is opposite to and communicated with the communication groove 115 of the protruding block 114 , and the sound through hole 47 communicates with the speaker hole 80 through the communication groove 115 . The functional groove 451 in the escape groove 45 of the bracket 40 forms the front sound cavity 62a of the first speaker unit 62 and is sealed by the rear cover 18 or the decorative part. The first sound hole 471 of the sound passage hole 47 communicates with the front sound cavity 62 a of the first speaker unit 62 . The sound emitted by the first speaker unit 62 during operation can be transmitted from the front sound cavity 62a to the outside of the electronic device 1000 through the sound hole 47, that is, it can pass through the sound hole 47 of the bracket 40, the communication groove 115 of the middle frame 11 and The speaker hole 80 transmits the sound to the outside of the electronic device 1000 to realize the sound of the first speaker unit 62 . It can be understood that the sound through hole 47 , the communication slot 115 and the speaker hole 80 communicate with the speaker channel of the first speaker unit 62 .

The sound exit slit 90 can be used as a sound exit slit during a call. Since the human ear cannot be completely sealed with the sound exit slit, the sound from the sound exit slit will diffuse outward and become sound leakage, which affects the privacy of the call. For this problem, the front sound cavity 62a of the first speaker unit 62 can emit sound waves opposite to the phase of the sound outlet slot 90 through the top speaker hole 80, so as to offset the sound leakage of the sound outlet slot and improve the privacy of the call.

The electronic device 1000 further includes a first adhesive layer, a second adhesive layer, and a third adhesive layer and a fourth adhesive layer. The first adhesive layer is bonded between the first speaker unit 62 and the bracket 40 . Specifically, the upper surface (not shown) of the first adhesive layer is bonded to the first speaker unit 62 , and the lower surface (not shown) of the first adhesive layer is bonded to the bottom wall of the escape groove 45 of the bracket 40 . The first adhesive layer is provided with a through hole (not shown), and the through hole penetrates the first adhesive layer along the thickness direction of the first adhesive layer to ensure that the first adhesive layer will not hinder the first speaker unit 62 's voice. The second adhesive layer connects the sealing communication groove 115 and the third sound hole 473 between the protrusion 114 of the middle frame and the mounting protrusion 46 .

In some other embodiments, the first speaker unit 62 may not be mounted on the circuit board 30 but mounted on the bracket 40 through the first adhesive layer. At this time, along the Z-axis direction, the first speaker unit 62 and the circuit board 30 are spaced apart, and the electronic components of the electronic device 1000 can be mounted on the circuit board 30 and located between the first speaker unit 62 and the circuit board 30 to improve the The space utilization rate inside the electronic device 1000 improves the integration degree of the electronic device 1000 .

The third adhesive layer 100c is bonded between the screen 20 and the middle plate 111 of the middle frame 11, surrounding the installation groove 117 and the sound outlet groove 118, and the fourth adhesive layer (not shown) is bonded to the second speaker unit 63 and the middle The plate 111 is installed between the grooves 117 and ensures that the sound of the second speaker unit 63 will not be hindered.

Please refer to FIGS. 18 and 19 , FIG. 18 is a schematic diagram of an exploded structure of the electronic device 1000 provided by the second embodiment of the present application, and FIG. 19 is a schematic diagram of the structure of the bracket of the electronic device 1000 shown in FIG. 18 from another angle.

The difference between the electronic device 1000 shown in this embodiment and the electronic device 1000 shown in the above-mentioned embodiments is that the communication groove 115 of the middle frame 11 is a groove recessed on the surface of the bump 114 , and does not penetrate through the middle plate 111 . The acoustic hole 80 penetrates the end frame 112 and the side wall of the communication groove 115 , and actually the end frame 112 is the groove side wall of the communication groove 115 . It can be understood that the communication groove 115 has a groove bottom wall, and the groove side wall in the Y direction is not an inclined plane, and can be a plane perpendicular or substantially perpendicular to the middle plate 111 .

The mounting protrusion 46 of the bracket 40 further includes an extension portion 461 , and the extension portion 461 is formed to extend along the X-axis direction for one end of the mounting protrusion 46 away from the escape groove 45 . The third sound hole 473 of the sound hole 47 is opened on the extension part 461 , the opening of the sound hole 47 is located on the upper surface of the mounting protrusion 46 (the same direction as the first surface 411 ), and the hole wall of the third sound hole 473 is perpendicular or substantially perpendicular to the plane of the bracket body 41 . It can be understood that the length of the third sound hole 473 along the X direction is greater than the length of the third sound hole 473 described in the first embodiment. Both the extension portion 461 and the third sound hole 473 satisfy the length of the protrusion 114 and the length of the communication groove 115 . In this embodiment, the areas of the communication groove 115 and the third sound hole 473 are increased, which is more conducive to the release of sound.

Please refer to FIG. 20 and FIG. 21 . FIG. 20 is a schematic assembly diagram of a part of the structure of the electronic device 1000 provided by the second embodiment of the present application. FIG. 21 is a schematic cross-sectional view of the electronic device 1000 shown in FIG. 17 after assembly.

The circuit board 30 and the speaker module are both installed in the accommodating slot 113 of the middle frame 11 . The circuit board 30 is mounted on the bottom wall (not shown) of the accommodating slot 113 . The notches 34 of the circuit board 30 avoid the bumps 114 of the middle frame 11 . The first speaker unit 62 is located on the mounting surface 31 of the circuit board 30 , and the bracket is mounted on the accommodating slot 113 . Specifically, the bracket 40 is mounted on the surface of the circuit board 30 facing away from the middle frame 11 . The second speaker unit 63 is installed in the installation slot 117 , and the bracket 40 covers the second speaker unit 63 . The first speaker unit 62 is installed in the escape groove 45 and covers the first sound hole 471 . The decorative element 70 is installed on the surface of the bracket 40 away from the middle frame 11 and covers the bracket 40 . The mounting groove 117 forms the front sound cavity 63 a of the second speaker unit 63 . The sound outlet slot 90 communicates with the front sound cavity 63 a of the second speaker unit 63 through the sound outlet slot 118 . The third sound hole 473 of the sound hole 47 is opposite to and communicated with the communication groove 115 of the convex block 114. The hole wall of the third sound hole 473 is aligned with the groove side wall of the communication groove 115 in the Z direction, and the sound hole 47 passes through the communication groove. 115 communicates with the speaker hole 80 . The communication groove 115 in this embodiment has a simple structure. The sound through hole 47 , the communication slot 115 and the speaker hole 80 communicate with the speaker channel of the first speaker unit 62 .

Please refer to FIGS. 22 and 23. FIG. 22 is a schematic diagram of an exploded structure of the electronic device 1000 provided by the third embodiment of the present application, and FIG. 23 is a schematic diagram of the structure of the bracket of the electronic device 1000 shown in FIG. FIG. 22 is a schematic structural diagram of the bracket of the electronic device 1000 from another angle.

The difference between the electronic device 1000 shown in this embodiment and the electronic device 1000 shown in the above embodiments is that the bump 114 of the middle frame 11 includes a first inclined surface 1141 , and the first inclined surface 1141 faces away from the end frame and is opposite to the middle frame 11 . The first surfaces 1110 of the plates 111 are connected and form an included angle, and the included angle is greater than 90 degrees and less than 180 degrees. The communication groove 115 is recessed on the first inclined surface 1141 and communicated with the speaker hole 80 . The mounting protrusion 46 of the bracket 40 includes a main body 461 and an extension portion 462 , the extension portion 462 includes a second inclined surface 463 , and the third sound hole 473 is provided on the second inclined surface 463 . The main body 461 is inclined at the same angle as the mounting protrusion 46 of the first embodiment.

Specifically, the communication groove 115 is formed by a first inclined surface 1141 recessed toward the end frame 112, and a first inclined surface 1141 recessed toward the Y direction. The bottom wall of the communication slot 115 is the inner side of the end frame 112 facing the accommodating slot 113 , and the speaker hole 80 penetrates through the bottom wall of the communication slot 115 and communicates with the communication slot 115 .

In this embodiment, the extension portion 462 is located at the end of the mounting protrusion 46 away from the escape groove 45 . The extending portion 462 includes a second inclined surface 463 , a resisting surface 464 and a connecting surface 465 . The abutting surface 464 connects the second inclined surface 463 and the connecting surface 465 . The second inclined surface 463 is located at the end of the bracket body 41 and connected to the end surface (connecting the first surface 411 and the second surface 412 ), and the second inclined surface 463 faces away from the first surface 411 . The connection surface 465 faces the first surface 411 for assembling with the circuit board 30 . The connecting surface 465 is used to abut against the bottom wall of the receiving groove 113 .

The second inclined surface 463 is provided with a third sound hole 473 of the sound hole 47, one opening of the third sound hole is located on the second inclined surface 463, and the other opening communicates with the second sound hole 472; in fact, the third sound hole 473 The area of the two openings is different, the area of the opening communicating with the second sound hole 472 is smaller, and the area of the opening opposite to the speaker hole 80 is larger, which is more conducive to sound playback. A part of the second sound hole 472 extends along the length direction of the body 461 and communicates with the third sound hole 473 ; the other part of the second sound hole 472 extends into the boss 42 along the Z-axis and extends in the direction of the escape groove 45 , It communicates with the first sound hole 471 . In fact, the second sound hole 472 is a stepped hole passing through the boss 42 and the mounting boss 46 , and the entirety thereof extends along the Z-axis direction.

Please refer to FIG. 25 and FIG. 26 , FIG. 25 is a schematic diagram of partial structure assembly of the electronic device 1000 provided by the third embodiment of the present application; FIG. 26 is a schematic cross-sectional view of an angle after the electronic device 1000 shown in FIG.

The circuit board 30 and the speaker module are both installed in the accommodating slot 113 of the middle frame 11 . The circuit board 30 is mounted on the bottom wall (not shown) of the accommodating slot 113 . The notch 34 of the circuit board 30 avoids the bump 114 of the middle frame 11, and the communication groove 115 is located above the circuit board. The first speaker unit 62 is located on the mounting surface 31 of the circuit board 30 , and the bracket 40 is mounted on the accommodating slot 113 . Specifically, the bracket 40 is mounted on the surface of the circuit board 30 away from the middle frame 11 . The second inclined surface 463 of the mounting protrusion 46 of the bracket 40 is parallel to the first inclined surface 1141 of the protrusion 114 of the middle frame 11 , and the third sound hole 473 of the sound passage hole 47 communicates with the speaker hole 80 through the communication groove 115 . The abutting surface 464 of the extension portion 462 abuts against the middle board 111 , and the connecting surface 465 abuts against the end of the circuit board 30 provided with the notch. The second speaker unit 63 is installed in the mounting slot 117 , and the bracket 40 covers the first speaker unit 62 and the second speaker unit 63 . The first speaker unit 62 is installed in the escape groove 45 and covers the first sound hole 471 . The decorative element 70 is installed on the surface of the bracket 40 away from the middle frame 11 and covers the bracket 40 .

It should be noted that the periphery of the sound transmission part in any of the above embodiments, including the periphery of the groove and the hole, is sealed and connected by a sealing colloid, so as to ensure the sealing performance and prevent sound leakage. The rear cavity of the first speaker unit 62 in any of the above embodiments is formed by the sealing portion of the circuit board, the rear cover 18 and the middle frame 11 . The rear cavity of the second speaker is formed by the sealing portion of the rear cover 18 and the middle frame 11 , which will not be described again.

The above description is only a specific embodiment of the present application, but the protection scope of the present application is not limited to this. Covered within the protection scope of the present application; the embodiments of the present application and the features in the embodiments may be combined with each other under the condition of no conflict. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims (14)

1. An electronic device, comprising a middle frame, a circuit board, a bracket and a first speaker unit, the circuit board comprising a mounting surface, and the bracket comprising an escape groove; the escape groove is along the thickness of the support The direction is recessed into the bracket, the first speaker unit is positioned on the installation surface and is electrically connected to the circuit board, the circuit board and the bracket are stacked and mounted on the middle frame. In the thickness direction of the electronic device, the first speaker unit is accommodated in the escape groove. 2 . The electronic device according to claim 1 , wherein the electronic device comprises a second speaker unit and a sound outlet slot, the middle frame comprises a mounting slot, and the circuit board comprises an escape hole, the escape hole The circuit board is penetrated along the thickness direction of the circuit board, the installation groove is penetrated through the middle frame along the thickness direction of the middle frame, and the second speaker unit is penetrated through the avoidance hole and covers the The opening of the installation slot, the installation slot forms the front sound cavity of the second speaker unit, and the sound outlet slot communicates the front sound cavity of the second speaker unit with the outside of the electronic device. 3 . The electronic device according to claim 2 , wherein the volume of the second speaker unit is smaller than the volume of the first speaker unit. 4 . 4 . The electronic device according to claim 3 , wherein the first speaker unit is a tweeter unit or a full-frequency unit, and the second speaker unit is a full-frequency unit. 5 . 5. The electronic device according to any one of claims 1-4, wherein the middle frame is provided with an end frame and a speaker hole provided on the end frame, and the escape groove comprises a groove bottom A functional slot is recessed on the bottom wall of the slot, and the first speaker unit covers the functional slot, so that the functional slot forms the front sound cavity of the first speaker, and the speaker hole communicates with the The front sound cavity of the first speaker unit and the outside of the middle frame. 6 . The electronic device according to claim 5 , wherein the middle frame comprises a bump, the bump is provided with a communication groove, and the communication groove extends along the thickness direction of the middle frame, and the The communication groove communicates with the speaker hole, the bracket includes a sound transmission hole, and the sound transmission hole communicates with the front sound cavity of the first speaker unit and the communication groove. 7 . The electronic device according to claim 6 , wherein the bracket comprises a bracket body and a boss, and the bracket body includes a first surface and a second surface disposed away from the first surface, the The boss is located on the second surface, and the escape groove is recessed on the first surface; A mounting protrusion is also protruded on the first surface, the sound hole includes a first sound hole, a second sound hole and a third sound hole that are connected in sequence, and the first sound hole is along the length of the bracket The direction runs through the groove side wall of the functional groove, the second sound hole is provided inside the boss and the installation protrusion and extends along the thickness direction of the bracket, and the third sound hole penetrates the installation A protrusion, the protrusion is butted with the installation protrusion, and the third sound hole is opposite to and communicated with the communication groove. 8 . The electronic device according to claim 7 , wherein an extension portion extends along the width direction of the bracket at one end of the mounting protrusion, and the extension portion is located at a position where the mounting protrusion is away from the escape groove. 9 . one end, the third sound hole extends from the end of the mounting protrusion to the extension part, and extends along the length direction of the extension part; The communicating groove is recessed into the convex block from the upper surface of the convex block, the opening of the communicating groove is located on the surface of the convex block, and the communicating groove extends along the width direction of the middle frame, so The speaker hole penetrates one side wall of the communication groove. 9 . The electronic device according to claim 7 , wherein the protruding block comprises a first inclined surface, the first inclined surface is disposed obliquely away from the end frame, and the speaker hole penetrates the groove of the communication groove. 10 . The bottom wall is communicated with the communication groove; The installation protrusion is provided with an extension portion, the extension portion is located at one end of the installation protrusion away from the escape groove, the extension portion includes a second inclined surface, and the second inclined surface faces away from the installation protrusion and Compared with the inclination of the first surface of the bracket, the third sound hole penetrates the second inclined surface, the first inclined surface and the second inclined surface are butted, and the third sound hole is connected with the communication groove relative and connected. 10 . The electronic device according to claim 7 , wherein the middle frame comprises a middle plate and the end frame connected to the middle plate, the middle plate comprises a first surface and a second surface connected to the first surface. a second surface with a surface facing away from the second surface, the protrusions are protrudingly arranged on the first surface of the middle plate and are connected with the end frame; The communication groove includes a first communication groove and a second communication groove communicated with the first communication groove, an opening of the first communication groove is located on the surface of the convex block facing away from the middle plate, the first communication groove is The other opening of a communication groove is located on a groove side wall of the second communication groove; the opening of the second communication groove is located on the second surface of the middle plate. 11. The electronic device according to claim 10, wherein the first communication groove comprises a first groove side wall, and the first groove side wall is inclined relative to the opening of the first communication groove, and a part of the first groove side wall is inclined. the speaker hole penetrates the side wall of the first slot; The second communication groove is formed by the depression of the second surface into the middle plate. The second communication groove includes a groove bottom wall and a sub-groove, and the sub-groove is formed by the groove bottom wall being sunken into the middle plate. , the sub-slot includes two inclined side walls and a bottom wall connecting the two inclined side walls, another part of the speaker hole penetrates the bottom wall, and the other opening of the first communication groove is located in a on the inclined side wall and toward the speaker hole. 12 . The electronic device according to claim 9 , wherein an opening of the third sound hole is located on the second inclined surface, the third sound hole comprises a hole wall, and an extension direction of the hole wall is 12 . Crossing the extending direction of the third sound hole, an opening of the second sound hole penetrates the hole wall and communicates with the third sound hole. 13 . The electronic device according to claim 7 , wherein the electronic device comprises a camera module and a decorative part, the decorative part comprises a receiving groove, the circuit board further comprises an installation avoidance hole, the installation avoidance The hole penetrates the circuit board along the thickness direction of the circuit board, and the installation avoidance hole is spaced from the first speaker unit; The camera module passes through the installation avoidance hole, the decorative piece is mounted on the middle frame, and the camera module and the bump of the bracket are accommodated in the accommodating groove. 14. The electronic device according to claim 2, wherein the electronic device comprises a screen, the middle frame comprises a middle plate, an end frame connected to the middle frame, and a sound outlet, the middle plate includes a first a surface and a second surface opposite to the first surface, the sound outlet groove is recessed on the second surface, and the sound outlet groove includes a slot recessed on the inner side surface of the end frame and a connection area communicated with the installation groove, the screen is mounted on the second surface and covers the connection area, and the screen and the gap form the sound outlet gap.

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