CN115437221A - Photoetching machine lamp chamber device - Google Patents
Photoetching machine lamp chamber device Download PDFInfo
- Publication number
- CN115437221A CN115437221A CN202110610011.1A CN202110610011A CN115437221A CN 115437221 A CN115437221 A CN 115437221A CN 202110610011 A CN202110610011 A CN 202110610011A CN 115437221 A CN115437221 A CN 115437221A
- Authority
- CN
- China
- Prior art keywords
- heat dissipation
- dissipation cover
- chamber
- air
- lamp
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001259 photo etching Methods 0.000 title abstract 3
- 230000017525 heat dissipation Effects 0.000 claims abstract description 143
- 238000001816 cooling Methods 0.000 claims abstract description 107
- 238000001459 lithography Methods 0.000 claims description 31
- 238000001514 detection method Methods 0.000 claims description 3
- 238000012544 monitoring process Methods 0.000 claims description 3
- 230000002708 enhancing effect Effects 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 4
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 36
- 229910052753 mercury Inorganic materials 0.000 description 35
- 230000009286 beneficial effect Effects 0.000 description 15
- 238000010586 diagram Methods 0.000 description 15
- 238000009413 insulation Methods 0.000 description 10
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 6
- 239000004810 polytetrafluoroethylene Substances 0.000 description 6
- 230000003287 optical effect Effects 0.000 description 5
- 238000005253 cladding Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- -1 polytetrafluoroethylene Polymers 0.000 description 3
- 229940058401 polytetrafluoroethylene Drugs 0.000 description 3
- 238000009826 distribution Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000013021 overheating Methods 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 1
- 239000011358 absorbing material Substances 0.000 description 1
- 238000004378 air conditioning Methods 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
- G03F7/70883—Environment aspects, e.g. pressure of beam-path gas, temperature of optical system
- G03F7/70891—Temperature
Landscapes
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Atmospheric Sciences (AREA)
- Toxicology (AREA)
- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
Description
技术领域technical field
本发明涉及光刻机技术领域,尤其涉及一种光刻机灯室装置。The invention relates to the technical field of lithography machines, in particular to a lamp chamber device of a lithography machine.
背景技术Background technique
在半导体制造领域中,为了提高曝光产率和制造效率,常常需要使用数千瓦甚至更高功率的汞灯作为光源。光刻机等光学设备上通常会设置有灯室,以用于安置汞灯。汞灯的发热量高,为了保证曝光光源运行稳定,需要对灯室内部环境进行冷却。目前,业内应用在光刻机等光学设备上的灯室主要采用风冷或风冷加水冷的冷却方式。但是水冷加风冷冷却的系统,结构复杂且内部水头较多,易发生漏液等问题。In the field of semiconductor manufacturing, in order to improve exposure yield and manufacturing efficiency, it is often necessary to use a mercury lamp with a power of several thousand watts or even higher as a light source. Optical equipment such as a photolithography machine is usually provided with a lamp chamber for accommodating a mercury lamp. The mercury lamp has a high calorific value. In order to ensure the stable operation of the exposure light source, the internal environment of the lamp chamber needs to be cooled. At present, the lamphouses used in optical equipment such as lithography machines in the industry mainly adopt air cooling or air cooling plus water cooling. However, the water-cooled and air-cooled cooling system has a complex structure and a large internal water head, which is prone to problems such as liquid leakage.
此外,随着光刻精度的不断提高,光刻机对使用环境的要求越来越苛刻,光刻机各分系统的散热量必须要严控,灯室外部罩壳容易出现局部温度过高的问题。In addition, with the continuous improvement of lithography precision, the requirements for the operating environment of lithography machines are becoming more and more stringent. The heat dissipation of each sub-system of the lithography machine must be strictly controlled, and the outer shell of the lamp room is prone to local overheating. question.
此外,汞灯对温度稳定性有较高的要求,温度稳定性差会导致汞灯的发光稳定性差。同时,灯室采用风冷,冷却效果有限,而且有大量冷却风吹到汞灯灯泡表面,也会使汞灯运行不稳定。另外,光刻胶曝光时产生的升华物等异物混入冷却风从灯室外部导进入到灯室内部,并会与紫外线发生反应等并附着在反射镜的反射面等上。In addition, mercury lamps have high requirements on temperature stability, and poor temperature stability will lead to poor luminescence stability of mercury lamps. At the same time, the lamp house is air-cooled, so the cooling effect is limited, and a large amount of cooling wind blows to the surface of the mercury lamp bulb, which will also make the mercury lamp run unstable. In addition, foreign matters such as sublimated substances generated during exposure of the photoresist are mixed with the cooling air and introduced into the interior of the lamp chamber from the outside of the lamp chamber, react with ultraviolet rays, etc., and adhere to the reflective surface of the reflector.
因此,一种能够散热效果更好,能够减少异物附着在反射镜的反射面的光刻机灯室装置为业内所追求。Therefore, a lithography machine lamp chamber device capable of better heat dissipation and reducing foreign matters adhering to the reflective surface of the reflector is pursued in the industry.
发明内容Contents of the invention
本发明的目的在于提供一种光刻机灯室装置,具有更好的散热效果,能够减少异物附着在反射镜。The purpose of the present invention is to provide a light chamber device for a lithography machine, which has a better heat dissipation effect and can reduce the foreign matters attached to the reflector.
为了达到上述目的,本发明提供了一种光刻机灯室装置,包括:In order to achieve the above object, the present invention provides a lithography machine lamp chamber device, comprising:
灯室外壳,设置有第一进风口、出风口和出光口;The housing of the lamp house is provided with a first air inlet, an air outlet and a light outlet;
散热罩,位于所述灯室外壳内,所述散热罩具有开口端,所述开口端与所述出光口重合,所述散热罩的外壁与所述灯室外壳的内壁之间形成第一腔室,所述散热罩内部为第二腔室,所述散热罩还设置有第二进风口;The heat dissipation cover is located in the outer shell of the lamp chamber, the heat dissipation cover has an open end, the open end coincides with the light outlet, and a first cavity is formed between the outer wall of the heat dissipation cover and the inner wall of the lamp house shell chamber, the interior of the heat dissipation cover is a second chamber, and the heat dissipation cover is also provided with a second air inlet;
光源组件,位于所述第二腔室,包括光源和反射镜,所述反射镜将所述光源发出的光线反射后由所述出光口射出;The light source assembly is located in the second chamber and includes a light source and a reflector, the reflector reflects the light emitted by the light source and emits it through the light outlet;
所述第一腔室及所述第二腔室彼此连通,通过所述第一进风口和第二进风口分别向所述第一腔室和所述第二腔室吹入冷却风,所述第一腔室内的冷却风流经所述散热罩的外表面后从所述出风口流出,所述第二腔室的冷却风流入所述第一腔室后从所述出风口流出。The first chamber and the second chamber are communicated with each other, and cooling air is respectively blown into the first chamber and the second chamber through the first air inlet and the second air inlet, and the The cooling air in the first chamber flows through the outer surface of the heat dissipation cover and then flows out from the air outlet, and the cooling air in the second chamber flows into the first chamber and then flows out from the air outlet.
可选的,所述第二腔室的冷却风用于冷却所述散热罩和所述光源。Optionally, the cooling air in the second chamber is used to cool the heat dissipation cover and the light source.
可选的,通过所述第一进风口向所述第一腔室吹入的冷却风和通过所述第二进风口向所述第二腔室吹入的冷却风的参数均可被分别设置,所述参数包括温度、流量和/或类型。。Optionally, the parameters of the cooling air blown into the first chamber through the first air inlet and the cooling air blown into the second chamber through the second air inlet can be set separately , the parameters include temperature, flow and/or type. .
可选的,所述光源具有泡壳及分别位于泡壳两端的阳极和阴极,所述阳极较所述阴极更靠近所述出光口,所述散热罩包括:Optionally, the light source has a bulb and an anode and a cathode respectively located at both ends of the bulb, the anode is closer to the light outlet than the cathode, and the heat dissipation cover includes:
上散热罩,包裹所述光源的阳极及所述泡壳与所述出光口之间的光路;The upper heat dissipation cover wraps the anode of the light source and the light path between the bulb and the light outlet;
反射镜散热罩,包裹所述椭球反射镜;A heat dissipation cover for the reflector, wrapping the ellipsoidal reflector;
下散热罩,包裹所述光源的阴极;The lower heat dissipation cover wraps the cathode of the light source;
所述椭球反射镜散热罩与所述上散热罩的连接处具有缝隙,以使所述第一腔室及所述第二腔室彼此连通。There is a gap at the junction of the heat dissipation cover of the ellipsoidal reflector and the upper heat dissipation cover, so that the first chamber and the second chamber communicate with each other.
可选的,所述上散热罩的形状为多级凸台状。Optionally, the shape of the upper heat dissipation cover is a multi-stage boss shape.
可选的,所述第一进风口处设置有分流箱,所述分流箱上开设有多个分流出口。Optionally, a splitter box is provided at the first air inlet, and a plurality of splitter outlets are opened on the splitter box.
可选的,所述分流出口处均设置有调向板。Optionally, diverting plates are provided at the diversion outlets.
可选的,所述灯室外壳内设置有若干导流板。Optionally, several deflectors are arranged in the housing of the lamp house.
可选的,所述散热罩外表面设置有若干肋片,用于强化对流散热效率。Optionally, several fins are provided on the outer surface of the heat dissipation cover to enhance convection heat dissipation efficiency.
可选的,所述第一出风口与所述进风口相对设置,且所述出风口的高度及所述进风口的高度均与所述椭球反射镜的高度齐平。Optionally, the first air outlet is arranged opposite to the air inlet, and the heights of the air outlet and the air inlet are both flush with the height of the ellipsoidal reflector.
可选的,所述第一进风口处还设置有过滤器。Optionally, a filter is also provided at the first air inlet.
可选的,所述灯室外壳的内表面上设置有隔热板。Optionally, a heat insulation board is provided on the inner surface of the housing of the light chamber.
可选的,还包括流量控制系统,所述流量控制系统包括:Optionally, a flow control system is also included, and the flow control system includes:
检测器,用于实时监控所述第一腔室和所述第二腔室的温度、气压和/或所述冷却风的流量;a detector for real-time monitoring of the temperature, air pressure and/or flow of the cooling air in the first chamber and the second chamber;
自动蝶阀,用于根据所述检测器的检测结果调整所述冷却风的流量。The automatic butterfly valve is used to adjust the flow of the cooling air according to the detection result of the detector.
在本发明提供的光刻机灯室装置中,光刻机灯室装置包括灯室外壳、散热罩和光源组件。其中,所述灯室外壳设置有第一进风口、出风口和出光口。所述散热罩的外壁与所述灯室外壳的内壁之间形成第一腔室,所述散热罩内部为第二腔室,所述散热罩还设置有第二进风口。所述光源组件位于所述第二腔室,包括光源和椭球反射镜。在本发明中,通过第一进风口向第一腔室和吹入冷却风。所述第一腔室内的散热罩降温,通过第二进风口向所述第二腔室吹入冷却风,用于给所述散热罩内的光源组件降温。所述第一腔室和所述第二腔室彼此连通,所述第二腔室的冷却风会流入所述第一腔室后从所述出风口流出,使得所述光刻机灯室装置具有更好的散热效果。In the lamp chamber device of the lithography machine provided by the present invention, the lamp chamber device of the lithography machine includes a lamp chamber housing, a heat dissipation cover and a light source assembly. Wherein, the housing of the lamp house is provided with a first air inlet, an air outlet and a light outlet. A first chamber is formed between the outer wall of the heat dissipation cover and the inner wall of the housing of the lamp chamber, the inside of the heat dissipation cover is a second chamber, and the heat dissipation cover is also provided with a second air inlet. The light source assembly is located in the second chamber and includes a light source and an ellipsoid reflector. In the present invention, cooling air is blown into the first chamber through the first air inlet. The heat dissipation cover in the first chamber cools down, and cooling air is blown into the second chamber through the second air inlet for cooling the light source components in the heat dissipation cover. The first chamber and the second chamber communicate with each other, and the cooling air in the second chamber flows into the first chamber and then flows out from the air outlet, so that the lamp chamber device of the lithography machine Has a better heat dissipation effect.
此外,第一进风口向第一腔室吹入的冷却风的类型与通过第二进风口向第二腔室吹入的冷却风的类型不同,并且第二腔室的气压大于第一腔室的气压。能够防止散热罩外部的冷却风进入所述第二腔体,避免第二腔体内的冷却风的气体流形发生变化,防止光源表面周围的温度出现波动,继而影响光源的寿命周期和发光的稳定性。而且还能够防止光源和椭球反射镜受到污染。In addition, the type of cooling air blown into the first chamber by the first air inlet is different from the type of cooling air blown into the second chamber through the second air inlet, and the air pressure of the second chamber is greater than that of the first chamber air pressure. It can prevent the cooling air outside the heat dissipation cover from entering the second cavity, avoid the change of the gas manifold of the cooling air in the second cavity, prevent the temperature fluctuation around the surface of the light source, and then affect the life cycle of the light source and the stability of light emission sex. It also protects the light source and ellipsoidal mirror from contamination.
此外,第一进风口处设置有分流箱,所述分流箱上开设有多个分流出口。用于将冷却风分成多个风路,使得冷却风与散热罩有更多的接触面积,有利于冷却所述散热罩。此外,所述分流出口处均设置有调向板。通过所述调向板可以调节分流出口的朝向,可以让更多的冷却风流向散热罩中温度较高区域,以避免所述散热罩局部温度过高,进而造成所述散热罩变形或损坏。In addition, a splitter box is provided at the first air inlet, and a plurality of splitter outlets are opened on the splitter box. The cooling air is divided into multiple air paths, so that the cooling air has more contact area with the heat dissipation cover, which is beneficial to cooling the heat dissipation cover. In addition, redirection plates are provided at the split outlets. The direction of the diversion outlet can be adjusted by the redirecting plate, so that more cooling air can flow to the higher temperature area in the heat dissipation cover, so as to avoid the local temperature of the heat dissipation cover from being too high, thereby causing deformation or damage of the heat dissipation cover.
此外,灯室外壳内设置有若干导流板。所述导流板用于约束冷却风流动的方向。使得所述冷却风能够环绕所述散热罩的外周流动后,再从出风口流出,有利于所述冷却风与所述散热罩的外周充分接触,以带走更多的热量。In addition, several deflectors are arranged in the housing of the lamp chamber. The deflectors are used to restrict the flow direction of the cooling air. After the cooling air can flow around the outer periphery of the heat dissipation cover, it flows out from the air outlet, which is beneficial for the cooling air to fully contact the outer periphery of the heat dissipation cover to take away more heat.
附图说明Description of drawings
图1为本发明实施例一中的光刻机灯室装置的结构示意图;FIG. 1 is a schematic structural view of a lamp chamber device of a lithography machine in Embodiment 1 of the present invention;
图2为本发明实施例一中的分流箱的示意图;2 is a schematic diagram of a splitter box in Embodiment 1 of the present invention;
图3为本发明实施例一中的出风口的结构示意图;Fig. 3 is a schematic structural diagram of an air outlet in Embodiment 1 of the present invention;
图4为本发明实施例一中的N向视野中的示意图;Fig. 4 is a schematic diagram of the field of view in the N direction in Embodiment 1 of the present invention;
图5为本发明实施例二中的光刻机灯室装置的结构示意图;FIG. 5 is a schematic structural view of the lamp chamber device of the lithography machine in Embodiment 2 of the present invention;
图6为本发明实施例二中的反射镜散热罩的示意图;FIG. 6 is a schematic diagram of a reflector cooling cover in Embodiment 2 of the present invention;
图7为本发明实施例三中的光刻机灯室装置的第一种结构示意图;7 is a schematic diagram of the first structure of the lamp chamber device of the lithography machine in Embodiment 3 of the present invention;
图8为本发明实施例三中的光刻机灯室装置的第二种结构示意图;FIG. 8 is a second structural schematic diagram of the lamp chamber device of the lithography machine in Embodiment 3 of the present invention;
其中,附图标记如下:Wherein, the reference signs are as follows:
100-散热罩;110-下散热罩;120-反射镜散热罩;121-肋片;130-上散热罩;131-导流板、140-缝隙;100-heat dissipation cover; 110-lower heat dissipation cover; 120-mirror heat dissipation cover; 121-fin; 130-upper heat dissipation cover; 131-deflector, 140-slit;
200-灯室外壳;210-第一进风口;220-出风口;221-开口包壳;230-出光口;240-隔热板;250-分流箱;251-分流出口;252-导向板;200-lamp housing shell; 210-first air inlet; 220-air outlet; 221-opening cladding; 230-light outlet; 240-heat insulation board;
300-椭球反射镜;300-ellipsoid reflector;
400-汞灯;400 - mercury lamp;
500-反射镜;500 - reflector;
600-隔热垫;600-heat insulation pad;
700-隔热垫圈;700-insulation gasket;
A-第二冷却风;A- the second cooling air;
B-第一冷却风。B - the first cooling wind.
具体实施方式detailed description
下面将结合示意图对本发明的具体实施方式进行更详细的描述。根据下列描述,本发明的优点和特征将更清楚。需说明的是,附图均采用非常简化的形式且均使用非精准的比例,仅用以方便、明晰地辅助说明本发明实施例的目的。The specific implementation manner of the present invention will be described in more detail below with reference to schematic diagrams. The advantages and features of the present invention will be more apparent from the following description. It should be noted that all the drawings are in a very simplified form and use imprecise scales, and are only used to facilitate and clearly assist the purpose of illustrating the embodiments of the present invention.
图1为本实施例中的光刻机灯室装置的结构示意图。如图1所示,所述光刻机灯室装置,包括灯室外壳200、光源组件和散热罩100。其中,所述光源组件至少包括光源和椭球反射镜300。在本实施例中,所述光源的功率为2500W至8000W,优选的,所述光源为汞灯400。FIG. 1 is a schematic structural diagram of a lamp chamber device of a photolithography machine in this embodiment. As shown in FIG. 1 , the lamp chamber device of the lithography machine includes a
灯室外壳200设置有第一进风口210、出风口220和出光口230。所述第一进风口210和出风口220分布设置在所述灯室外壳200的两侧,所述出光口230设置在所述灯室外壳200的顶部。应知道,作为光源的汞灯400在异常情况下可能会破碎,若汞灯400内部的汞蒸气逸散到外部环境中,则会对光刻机灯室装置周围的操作人员造成伤害,而所述灯室外壳200可以用于控制汞蒸汽泄露。The
继续参照图1,散热罩100位于灯室外壳200内,所述散热罩100具有开口端,所述开口端与灯室外壳200上的出光口230重合,所述散热罩100的外壁与所述灯室外壳200的内壁之间形成第一腔室,所述散热罩100内部为第二腔室,光源和椭球反射镜300位于所述第二腔室。所述椭球反射镜300将所述光源发出的光线反射后由所述出光口230射出。由于汞灯400发光中紫外光成分占有相当的比例,为保护操作人员的安全,需要避免光泄露。而所述散热罩100能够有效控制所述汞灯400的光泄露,同时,位于所述散热罩100外的所述灯室外壳200能够进一步控制所述汞灯400的光泄漏。此外,散热罩100能够集中受热面,也有利于保证汞灯400的稳定性。Continuing to refer to FIG. 1 , the
散热罩100还设置有第二进风口(图中未示出),通过第二进风口(图中未示出)向所述第二腔室吹入冷却风,用于给所述散热罩100内的汞灯400及椭球反射镜300降温。所述汞灯400具有泡壳及分别位于泡壳两端的阳极和阴极,所述阳极较所述阴极更靠近所述出风口220。通常第二进风口(图中未示出)的位置对应汞灯400的两极,以及椭球反射镜300的背面设置。如此,冷却风从第二进风口(图中未示出)进入所述第二腔室时,便会吹向所述汞灯400的阳极、阴极和所述椭球反射镜300的背面,以带走所述汞灯400和所述椭球反射镜300表面的热量,对所述汞灯400和所述椭球反射镜300起到冷却的作用。更优的,所述汞灯400的两极存在集中的冷却风以降低所述汞灯400表面的温度,所述椭球反射镜300和所述射镜散热罩100之间存在单独的冷却风以降低所述椭球反射镜300的温度。如此,冷却风的流量和温度可以根据所述汞灯400和椭球反射镜300的实际温度进行精细化调整。The
通过第一进风口210向第一腔室吹入冷却风。所述第一腔室内的冷却风流经所述散热罩100的外表面后从所述出风口220流出,如此,所述冷却风便能够将所述散热罩100的外表面的热量带走,进而起到冷却所述散热罩100的作用。Cooling air is blown into the first chamber through the
此外,第一腔室及第二腔室彼此连通,所述第二腔室的冷却风会流入所述第一腔室后从所述出风口220流出。如此,所述冷却风便能够将所述散热罩100内的热量带走。In addition, the first chamber and the second chamber communicate with each other, and the cooling air in the second chamber flows into the first chamber and then flows out from the
进一步的,通过所述第一进风口210向所述第一腔室吹入的冷却风和通过所述第二进风口(图中未示出)向所述第二腔室吹入的冷却风的参数均可被分别设置,所述参数包括温度、流量和类型,或者,所述参数为温度、流量和类型中的一种,在此不做过多限制。Further, the cooling air blown into the first chamber through the
作为一种示范性的实施方式,通过所述第一进风口210向所述第一腔室吹入的冷却风为第一冷却风B。通过所述第二进风口(图中未示出)向所述第二腔室吹入的冷却风的为第二冷却风A。As an exemplary implementation, the cooling air blown into the first chamber through the
进一步的,第二腔室的气压大于第一腔室的气压。如此,使得所述第二腔室内的第二冷却风A能够流向所述第一腔室,以使第二腔室内的热量被带走。应知道,散热罩100外部的第一冷却风B进入所述第二腔体,将会导致所述第二腔体内的第二冷却风A的气体流形发生变化,这会导致汞灯400表面周围的温度出现波动,继而影响所述汞灯400的寿命周期和发光的稳定性,这是我们不希望的。所述第二腔室的气压大于所述第一腔室的气压,能够使得散热罩100外部的第一冷却风B难以进入第二腔体。这有利于增加所述汞灯400的寿命周期和发光的稳定性。Further, the air pressure of the second chamber is greater than the air pressure of the first chamber. In this way, the second cooling air A in the second chamber can flow to the first chamber, so that the heat in the second chamber can be taken away. It should be known that the first cooling air B outside the
可选的,所述第一进风口210和第二进口处还设置有过滤器。通过所述过滤器对第一冷却风B和第二冷却风A进行过滤,如此,有利于更一步的去除冷却风中的微粒,进一步防止冷却风对汞灯400、椭球反射镜300及光刻机内部光学元件的造成污染。Optionally, filters are also provided at the
可选的,第一冷却风B为空调机组送入的洁净空气。第二冷却风A为厂区公用系统送入的洁净压缩空气。应知道,洁净压缩空气具有更好的洁净度,能够减少冷却风对光源组及光刻机内部光学元件的污染。应知道,洁净压缩空气的具有较大的流量,能够使得第二腔室的压力大于所述第一腔室。在另一种实施方式中,所述洁净压缩空气的气源设置有调节阀,通过所述调节阀调整所述洁净压缩空气的流量,进而调节所述第二腔室与所述第一腔室的气体压力差。Optionally, the first cooling air B is clean air sent in by the air conditioning unit. The second cooling air A is the clean compressed air sent by the public system of the factory area. It should be known that clean compressed air has better cleanliness and can reduce the pollution of the cooling air to the light source group and the optical components inside the lithography machine. It should be known that the clean compressed air has a larger flow rate, which can make the pressure of the second chamber greater than that of the first chamber. In another embodiment, the air source of the clean compressed air is provided with a regulating valve, and the flow rate of the clean compressed air is adjusted through the regulating valve, thereby adjusting the second chamber and the first chamber. gas pressure difference.
可选的,散热罩100包括上散热罩130、反射镜散热罩120和下散热罩110。其中,所述上散热罩130包裹汞灯400的阳极及所述泡壳与所述出光口230之间的光路。所述反射镜散热罩120包裹所述椭球反射镜300。所述下散热罩110包裹所述汞灯400的阴极。应知道,由所述上散热罩130、所述反射镜散热罩120和所述下散热罩110组成的所述散热罩100,是为了方便所述散热罩100的拆装以更换汞灯400。Optionally, the
可选的,反射镜散热罩120与上散热罩130的连接处具有缝隙140,以使第一腔室及第二腔室彼此连通。由此,所述第二腔室内的第二冷却风A经所述缝隙140流入所述第一腔室。应知道,所述缝隙140设置在所述反射镜散热罩120与所述上散热罩130的连接处,有利于增加所述第二冷却风A的流阻,有利于维持所述第二冷却风A在所述第二腔室内的流形,有利于减少汞灯400表面周围的温度波动。Optionally, there is a
进一步的,第一进风口210与进风口220相对设置,分别设置在所述灯室外壳200的两侧,优选的,所述出风口220的高度及所述第一进风口210的高度均与所述椭球反射镜300的高度齐平。应知道,汞灯400工作时,反射镜散热罩120的温度最高,第一冷却风B流经上散热罩130或下散热罩110后,气体温度仍然会低于所述反射镜散热罩120附近区域的温度。将所述出风口220设置于所述反射镜散热罩120附近的位置,流经所述上散热罩130或下散热罩110后的第一冷却风B到达所述反射镜散热罩120附近区域时仍可起到散热作用,即可以提高散热效率。Further, the
此外,流经反射镜散热罩120后的第一冷却风B具有较高的温度,其流经其它部件时会对其它部件起到加热的作用。所述出风口220设置于所述反射镜散热罩120附近的位置,如此,流经所述反射镜散热罩120后的第一冷却风B可以直接进入出风口220,便避免了上述问题。In addition, the first cooling air B flowing through the
图2为本实施例中的分流箱的示意图。如图1和图2所示,第一进风口210处设置有分流箱250,所述分流箱250上开设有多个分流出口251。用于将所述第一冷却风B分成多个风路。如此,第一冷却风B能够与散热罩100有更多的接触面积,有利于冷却所述散热罩100。Fig. 2 is a schematic diagram of the splitter box in this embodiment. As shown in FIG. 1 and FIG. 2 , a
进一步的,所述分流出口251处均设置有调向板。通过所述调向板可以调节分流出口251的朝向,应知道,通常散热罩100上的温度分布不是均匀的,存在局部区域温度较高的情形。所述分流出口251处设置调向板252,能够对第一冷却风B进行导向。可以让更多的第一冷却风B流向温度较高区域,以避免所述散热罩100局部温度过高,进而造成所述散热罩100变形或损坏。Further, the
作为举例说明,反射镜散热罩120的温度通常会高于上散热罩130或下散热罩110,我们可以通过调整分流出口251处均设置有调向板252,让更多的所述分流出口251朝向所述反射镜散热罩120,如此,让更多的第一冷却风B流向所述反射镜散热罩120,以使所述反射镜散热罩120温度下降至跟所述上散热罩130或下散热罩110相同的温度。As an example, the temperature of the reflector
图3为本实施例中的出风口的结构示意图,图4为本实施例中的N向视野中的示意图。如图3和图4所示,出风口220通过与灯室外壳200出设置有一个开口包壳221,开口包壳221和灯室外壳200通过螺栓固定。其中,在开口包壳221和灯室外壳200之间设置有隔热垫600。如此,可以避免开口包壳221将热量传递给所述灯室外壳200,导致灯室外壳200的外表面升高。进一步的,在螺栓与开口包壳221之间还设置有隔热垫圈700,以避免开口包壳221将热量传递给螺栓。FIG. 3 is a schematic structural diagram of an air outlet in this embodiment, and FIG. 4 is a schematic diagram of a field of view in the N direction in this embodiment. As shown in FIG. 3 and FIG. 4 , the
进一步的,分流箱250和出风口220与灯室外壳200的连接处设置有隔热垫600。更优的,所述散热罩100与所述灯室外壳200的连接处也设置有隔热垫600。Further, a
应知道,灯室外壳200内部的散热罩100、分流箱250、第一进风口210和出风口220与所述灯室外壳200的连接处设置有隔热垫600。能够避免所述散热罩100、分流箱250、第一进风口210和出风口220将热量传递至灯室外壳200的外表面。进而导致灯室外壳200的外表面的温度过高。应知道,控制所述灯室外壳200的外表面的温度低于一定的数值,如50℃,是为了减少光刻机灯室装置工作时逸散的热量对周围的其他设备造成的热干扰。It should be known that
进一步的,隔热垫600的材料为聚四氟乙烯。(Poly tetra fluoroethylene,简写为PTFE)。聚四氟乙烯是一种以四氟乙烯作为单体聚合制得的高分子聚合物。聚四氟乙烯的外观为白色蜡状,且半透明。聚四氟乙烯的耐热、耐寒性优良,可在-180~260℃长期使用。Further, the material of the
可选的,灯室外壳200的内表面上设置有隔热板240。如此,能够进一步的降低导致灯室外壳200的外表面的温度。更优的,所述隔热板240的表面进行磨光处理。有利于反射光线,以减轻所述隔热板240本身的温度压力。Optionally, a
进一步的,隔热板240的材料为氧化铝合金。Further, the material of the
可选的,散热罩100的内表面采用吸光材料制成。如此,减少由于光线反射所导致的不可控的热量分散,有利于减少汞灯400表面周围的温度波动。Optionally, the inner surface of the
可选的,散热罩100的外表面采用反光材料制成。增加辐射散热的比例,有利于减轻所述散热罩100本身的温度压力。Optionally, the outer surface of the
进一步的,散热罩100的外表面进行了粗化处理。增加辐射散热的比例,有利于减轻所述散热罩100本身的温度压力。Further, the outer surface of the
此外,光刻机灯室装置还包括流量控制系统,所述流量控制系统包括检测器和自动蝶阀。其中,所述检测器用于实时监控所述第一腔室和所述第二腔室的温度、气压和/或所述冷却风的流量。所述自动蝶阀用于根据所述检测器的检测结果调整所述冷却风的流量。In addition, the light chamber device of the lithography machine also includes a flow control system, and the flow control system includes a detector and an automatic butterfly valve. Wherein, the detector is used for real-time monitoring of the temperature, air pressure and/or flow of the cooling air in the first chamber and the second chamber. The automatic butterfly valve is used to adjust the flow of the cooling air according to the detection result of the detector.
进一步的,所述检测器包括压力检测器、温度检测器和风速计。分别用于检测第一腔室和所述第二腔室的温度、气压和所述冷却风的流量。Further, the detectors include pressure detectors, temperature detectors and anemometers. They are respectively used to detect the temperature and air pressure of the first chamber and the second chamber and the flow rate of the cooling air.
实施例二Embodiment two
本实施例提供的光刻机灯室装置,与实施例一中相同的部分在此不再叙述,以下仅针对不同点进行描述。In the lamp chamber device of the lithography machine provided in this embodiment, the parts that are the same as those in the first embodiment will not be described here, and only the differences will be described below.
图5为本实施例中的光刻机灯室装置的结构示意图。如图5所示,本实施例与实施例一的区别在于:灯室外壳200内设置有若干导流板131。所述导流板131用于约束第一冷却风B流动的方向。使得所述第一冷却风B能够环绕所述散热罩100的外周流动后,再从出风口220流出。如此,有利于所述第一冷却风B与所述散热罩100的外周充分接触,以带走更多的热量。FIG. 5 is a schematic structural diagram of the lamp chamber device of the lithography machine in this embodiment. As shown in FIG. 5 , the difference between the present embodiment and the first embodiment is that a plurality of
图6为本实施例中的反射镜散热罩的示意图。如图6所示,反射镜散热罩120外表面设置有若干肋片121,所述肋片121的长度方向与所述冷却风的流动方向一致。应知道,散热罩100中的上散热罩130和下散热罩110也可以设置肋片121。所述散热罩100外表面根据第一冷却风B流动的方向增加肋片121的设计,强化对流散热效率,有利于减轻所述散热罩100本身的温度压力。FIG. 6 is a schematic diagram of the reflector cooling cover in this embodiment. As shown in FIG. 6 , a plurality of
实施例三Embodiment three
本实施例提供的光刻机灯室装置,与实施例一和实施例二中相同的部分在此不再叙述,以下仅针对不同点进行描述。For the lamp chamber device of a lithography machine provided in this embodiment, the parts that are the same as those in Embodiment 1 and Embodiment 2 will not be described here, and only the differences will be described below.
在实施例一和实施例二中,出光口230设置在所述灯室外壳200的顶部,上散热罩130沿光路的轮廓设置,上散热罩130呈锥筒状。本实施例与实施一和实施例二的区别在于,上散热罩130和反射镜散热罩120的形状不相同。In Embodiment 1 and Embodiment 2, the
图7为本实施例中的光刻机灯室装置的第一种结构示意图。如图7所示,在本实施例的一种实施方式中,上散热罩130的为多级凸台状,所述散热罩100由多个直径依次渐变的圆管构成,其中,与所述出光口230重合的圆管直径最小,与所述反射镜散热罩120重合的圆管直径最大。如此,上散热罩130包裹光路的轮廓。在该实施方式中,反射镜散热罩120为圆柱状。FIG. 7 is a schematic diagram of the first structure of the lamp chamber device of the lithography machine in this embodiment. As shown in FIG. 7 , in an implementation of this embodiment, the upper
图8为本发明实施例三中的光刻机灯室装置的第二种结构示意图。如图8所示,在本实施例的另一种实施方式中,所述第二腔体内还设置有反光镜500,用于改变光路的方向,出光口230设置在所述灯室外壳200的一个侧面。上散热罩130沿着光路的轮廓设置。FIG. 8 is a schematic diagram of the second structure of the lamp chamber device of the lithography machine in the third embodiment of the present invention. As shown in FIG. 8 , in another implementation of this embodiment, a
综上所述,在本发明实施例中提供了一种光刻机灯室装置中,此外,第一进风口处设置有分流箱,所述分流箱上开设有多个分流出口。用于将冷却风分成多个风路,使得冷却风与散热罩有更多的接触面积,有利于冷却所述散热罩。此外,所述分流出口处均设置有调向板。通过所述调向板可以调节分流出口的朝向,可以让更多的冷却风流向散热罩中温度较高区域,以避免所述散热罩局部温度过高,进而造成所述散热罩变形或损坏。此外,灯室外壳内设置有若干导流板。所述导流板用于约束冷却风流动的方向。使得所述冷却风能够环绕所述散热罩的外周流动后,再从出风口流出,有利于所述冷却风与所述散热罩的外周充分接触,以带走更多的热量。To sum up, in the embodiments of the present invention, there is provided a light chamber device for a lithography machine. In addition, a splitter box is provided at the first air inlet, and a plurality of splitter outlets are opened on the splitter box. The cooling air is divided into multiple air paths, so that the cooling air has more contact area with the heat dissipation cover, which is beneficial to cooling the heat dissipation cover. In addition, redirection plates are provided at the split outlets. The direction of the diversion outlet can be adjusted by the redirecting plate, so that more cooling air can flow to the higher temperature area in the heat dissipation cover, so as to avoid the local temperature of the heat dissipation cover from being too high, thereby causing deformation or damage of the heat dissipation cover. In addition, several deflectors are arranged in the housing of the lamp house. The deflectors are used to restrict the flow direction of the cooling air. After the cooling air can flow around the outer periphery of the heat dissipation cover, it flows out from the air outlet, which is beneficial for the cooling air to fully contact the outer periphery of the heat dissipation cover to take away more heat.
上述仅为本发明的优选实施例而已,并不对本发明起到任何限制作用。任何所属技术领域的技术人员,在不脱离本发明的技术方案的范围内,对本发明揭露的技术方案和技术内容做任何形式的等同替换或修改等变动,均属未脱离本发明的技术方案的内容,仍属于本发明的保护范围之内。The foregoing are only preferred embodiments of the present invention, and do not limit the present invention in any way. Any person skilled in the technical field, within the scope of the technical solution of the present invention, makes any form of equivalent replacement or modification to the technical solution and technical content disclosed in the present invention, which does not depart from the technical solution of the present invention. The content still belongs to the protection scope of the present invention.
Claims (13)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110610011.1A CN115437221A (en) | 2021-06-01 | 2021-06-01 | Photoetching machine lamp chamber device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110610011.1A CN115437221A (en) | 2021-06-01 | 2021-06-01 | Photoetching machine lamp chamber device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115437221A true CN115437221A (en) | 2022-12-06 |
Family
ID=84271737
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110610011.1A Pending CN115437221A (en) | 2021-06-01 | 2021-06-01 | Photoetching machine lamp chamber device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115437221A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN121657380A (en) * | 2026-02-03 | 2026-03-13 | 智慧星空(上海)工程技术有限公司 | Lamp chamber with heat dissipation system and photolithography equipment |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6224248B1 (en) * | 1998-05-15 | 2001-05-01 | Canon Kabushiki Kaisha | Light-source device and exposure apparatus |
| JP2006133286A (en) * | 2004-11-02 | 2006-05-25 | Mitsubishi Electric Corp | Light source device and projection display device using the same |
| WO2010067597A1 (en) * | 2008-12-12 | 2010-06-17 | 株式会社ニコン | Light source apparatus, exposure apparatus and device manufacturing method |
| CN103836596A (en) * | 2012-11-22 | 2014-06-04 | 上海微电子装备有限公司 | High-power mercury lamp lamphouse device |
-
2021
- 2021-06-01 CN CN202110610011.1A patent/CN115437221A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6224248B1 (en) * | 1998-05-15 | 2001-05-01 | Canon Kabushiki Kaisha | Light-source device and exposure apparatus |
| JP2006133286A (en) * | 2004-11-02 | 2006-05-25 | Mitsubishi Electric Corp | Light source device and projection display device using the same |
| WO2010067597A1 (en) * | 2008-12-12 | 2010-06-17 | 株式会社ニコン | Light source apparatus, exposure apparatus and device manufacturing method |
| CN103836596A (en) * | 2012-11-22 | 2014-06-04 | 上海微电子装备有限公司 | High-power mercury lamp lamphouse device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN121657380A (en) * | 2026-02-03 | 2026-03-13 | 智慧星空(上海)工程技术有限公司 | Lamp chamber with heat dissipation system and photolithography equipment |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS60186829A (en) | Light source device | |
| CN104315476B (en) | Stage lighting cooling system and stage lighting using the same and its cooling method | |
| CN105953145A (en) | Efficient heat-dissipation waterproof stage lamp | |
| US7988301B2 (en) | Heat transfer apparatus | |
| CN204201834U (en) | Stage lamp cooling system and apply the stage lighting of this system | |
| US11978620B2 (en) | Swirler for laser-sustained plasma light source with reverse vortex flow | |
| CN115437221A (en) | Photoetching machine lamp chamber device | |
| WO2025001378A1 (en) | Light head with auxiliary heat dissipation and stage light fixture having same | |
| CN106594589A (en) | Spiral air guiding device and stage lamp cooling system provided with same | |
| CN100547482C (en) | Lamp unit and projection display device | |
| CN223857580U (en) | A lamp chamber heat dissipation structure and photolithography equipment | |
| WO2017092464A1 (en) | Thermal system for stage light source module | |
| WO2025236877A1 (en) | Cooling apparatus and radiation apparatus | |
| CN206386769U (en) | Helical wind-guiding device and the stage lighting cooling system provided with the helical wind-guiding device | |
| CN212510778U (en) | Gas discharge lamp heat dissipation structure with uniform heat dissipation | |
| JP3674574B2 (en) | Short arc type discharge lamp | |
| CN205227241U (en) | Stage lighting source module calorifics system | |
| JP7581012B2 (en) | Light source device, lighting device, exposure device, irradiation device, and method for manufacturing article | |
| CN223926751U (en) | A heat dissipation structure for a projector and a projector | |
| CN218154122U (en) | Heat dissipation lamp box of spot lamp for surface detection of photoetching mask base plate | |
| TW202323969A (en) | Optical engine device with heat dissipation function and projector thereof | |
| KR100346569B1 (en) | Apparatus for rapid thermal process | |
| CN110630937A (en) | lamps | |
| CN220707100U (en) | Lamp with quick-detachable light source | |
| CN110805884A (en) | Heat dissipation device suitable for fluorescent color wheel and light source sealed cavity |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |