CN115683083A - Optical fiber ring packaging device and packaging method without free pigtails - Google Patents

Abstract

The invention discloses an optical fiber ring packaging device without free pigtails and a packaging method. The receiving part, at least part of the pigtails are fixedly arranged in the receiving part, and the bottom plate and the ends of the pigtails jointly form an interface for docking with an integrated optical chip. The invention can effectively avoid the disadvantages caused by freely exposed pigtails, improve the qualification rate of the optical fiber ring manufacturing, and improve the optical performance and test efficiency of the optical fiber ring.

Description

Optical fiber ring packaging device and packaging method without free pigtails

technical field

The invention relates to the technical field of optical fiber ring packaging, in particular to an optical fiber ring packaging device and packaging method without free pigtails.

Background technique

The fiber optic ring is the core component of the fiber optic angle sensor (also known as the fiber optic gyroscope), and its quality directly determines the accuracy of the fiber optic gyroscope. Therefore, when the fiber is wound into a fiber optic ring, it must be cured and packaged.

The packaging technology of the existing miniature optical fiber ring: the optical fiber ring is packaged in an independent package and drags two free exposed pigtails each 200-300mm long, and then a glass fiber array connector is specially made at the end of the free exposed pigtails. Exposed pigtails bring the following disadvantages:

1. The two pigtails between the optical fiber ring packaging device and the special optical fiber array interface are bare optical fibers. These two pigtails do not have any protection measures. During the process of grinding the angle of the special optical fiber array interface, the stress concentration of the exposed pigtails and the optical fiber are prone to occur. Serious product scrapping problems such as damage and fiber breakage greatly reduce the pass rate of product manufacturing;

2. The state of the two pigtails between the optical fiber ring packaging device and the special fiber array interface is free. The placement and state of these two pigtails directly affect the optical performance of the overall optical fiber ring. However, in the production process and customer applications It is difficult to ensure a completely consistent placement and state of the pigtails, which greatly reduces the optical performance of the overall fiber optic ring;

3. It is not convenient to test by dragging two pigtails between the optical fiber ring packaging device and the special optical fiber array interface. It is easy to introduce interference caused by exposed pigtails during the test, resulting in unreliable and untrustworthy test data. Repeated tests are required to eliminate interference, which greatly reduces improved testing efficiency;

4. Two pigtails are dragged between the optical fiber ring packaging device and the special optical fiber array interface, resulting in a relatively large overall volume, which is not conducive to the development trend of the overall miniaturization and miniaturization of the optical fiber ring;

5. Due to dragging two bare and free pigtails, it is very unfavorable for mechanized and automated mass production of optical fiber rings with high pass rate and good consistency.

Contents of the invention

Aiming at the deficiencies of the prior art, the present invention provides an optical fiber ring packaging device and a packaging method without free pigtails. The optical fiber ring packaging device and packaging method can effectively avoid the disadvantages caused by free and exposed pigtails, and improve the The qualification rate of the fiber ring manufacturing improves the optical performance and testing efficiency of the fiber ring.

The present invention is realized through the following technical solutions:

An optical fiber ring packaging device without free pigtails, comprising a base plate and an optical fiber ring, the optical fiber ring is fixed on the base plate, the optical fiber ring includes pigtails, and an accommodation portion is opened on the base plate, at least part of the pigtails Fixedly arranged in the accommodating portion, the bottom plate and the end of the pigtail together form an interface for docking with an integrated optical chip.

Further, the length of the pigtail is 5-15mm, and the pigtail includes an uncoated part and a coated part, the uncoated part is fixedly arranged in the accommodating part, and the coated part One end of the layer portion is connected to the uncoated layer portion, and the other end is connected to the main body portion of the optical fiber ring.

Further, the coated portion is disposed under the main body of the optical fiber ring, and both the coated portion and the main body are disposed in the groove of the bottom plate.

Further, the non-coating layer part is bonded in the containing part by glue.

Further, the uncoated portion is a bare fiber with the coating removed.

Further, the interface is provided with a cutout, and the angle between the cutout surface and the original side surface is 3-30 degrees.

Further, the accommodating portion is in a “W” shape, and the accommodating portion includes a pair of limiting slots communicating with each other, and the two pigtails are respectively accommodated in the limiting slots.

Further, the angle formed by the normal of the receiving part and the axis of the bottom plate is in the range of 0-90 degrees.

Further, the bottom plate is one of quartz glass, silicon wafer, aluminum oxide wafer, silicon nitride wafer and metal.

Further, the groove communicates with the receiving portion.

Further, the optical fiber ring packaging device further includes a cover plate, the cover plate is bonded to the accommodation part, and the end of the pigtail is arranged between the cover plate and the accommodation part.

Further, there is a gap between the pigtail and the cover, and the vertical distance between the pigtail and the cover is 0.002-0.008mm.

Further, at least one positioning groove is further arranged on the bottom plate, and the positioning groove is arranged on both sides of the accommodating part.

Further, the optical fiber ring packaging device also includes at least one positioning optical fiber, the positioning optical fiber is fixedly arranged in the positioning groove, and the tail of the positioning optical fiber is fixed between the positioning groove and the cover plate and connected to the positioning groove direct contact with the cover.

A packaging method for an optical fiber ring packaging device without free pigtails, comprising the following steps:

Fix the fiber optic ring on the base plate;

Place the two pigtails of the fiber optic ring in the housing;

Rotate the pigtail until its panda eye matches the packaging angle;

A part of the pigtail is fixed in the accommodating part by glue, and the bottom plate and the end of the pigtail jointly form an interface for docking the integrated optical chip.

Further, the step: fixing the optical fiber ring on the base plate specifically includes the following steps:

Place the main part of the fiber optic ring in the groove of the bottom plate;

Rotate the main body of the fiber optic ring so that the two exposed pigtails are close to the receiving part;

Glue the part of the fiber ring except the pigtail into the groove of the bottom plate.

Further, the step: placing the two pigtails of the optical fiber ring in the accommodation part includes the following steps:

Place the positioning fiber in the positioning groove, and place the two pigtails of the fiber ring in the housing;

Press the cover plate on the receiving part to ensure that the positioning optical fiber is in direct contact with the cover plate, and there is a gap between the pigtail and the cover plate.

Further, the following step is also included: grinding the interface to form a cutout suitable for the integrated optical chip.

Compared with the prior art, the present invention has the advantages of:

1. By setting up a housing part on the base plate, at least part of the pigtails are fixedly arranged in the housing part, and the ends of the base plate and the pigtails together form an interface for docking with an integrated optical chip, and two freely exposed tails are avoided by setting the interface fiber, which avoids serious product scrapping problems such as stress concentration of exposed pigtails, fiber damage and fiber breakage in the process of grinding the special fiber array interface angle, and greatly improves the pass rate of product manufacturing; secondly, it is convenient for testing, 3- The 10mm long pigtails are all packaged with glue, and there is no interference with the placement of exposed optical fibers, which greatly improves the optical performance and test efficiency of the fiber ring; secondly, the overall structure of the fiber ring packaging device is compact, which greatly facilitates mechanization and automation Mass production of optical fiber rings with high pass rate and good consistency; secondly, the optical fiber ring packaging device is better and more conveniently connected to integrated optical chips such as lithium niobate thin films through the interface, improving the convenience of customers; Secondly, the optical fiber ring packaging device improves the integration of the miniature optical fiber ring packaging, reduces the volume of the overall optical fiber ring packaging device, and meets the miniaturization and miniaturization of the overall optical fiber ring product; the optical fiber ring packaging device greatly improves the packaging technology content of the miniature optical fiber ring .

Description of drawings

Fig. 1 is a schematic structural view of an optical fiber ring packaging device without free pigtails in the first embodiment;

Fig. 2 is an enlarged view of part A in Fig. 1;

Fig. 3 is a front view of an optical fiber ring packaging device without free pigtails of the first embodiment;

Fig. 4 is an enlarged view of part B in Fig. 3;

Fig. 5 is the top view of the 90-degree type optical fiber ring packaging device without free pigtail;

Fig. 6 is the structural representation of the optical fiber ring encapsulation device of 45 degree type without free pigtail;

Fig. 7 is a schematic structural view of a 0-degree optical fiber ring packaging device without free pigtails;

Fig. 8 is a schematic structural view of an optical fiber ring packaging device without free pigtails in the second embodiment;

Fig. 9 is an enlarged view of part C in Fig. 8;

Fig. 10 is a front view of an optical fiber ring packaging device without free pigtails of the second embodiment;

Figure 11 is an enlarged view of part D in Figure 10;

Fig. 12 is the top view of the 90-degree fiber ring packaging device without free pigtails of the second embodiment;

Fig. 13 is the top view of the 45-degree fiber ring packaging device without free pigtails of the second embodiment;

Fig. 14 is the interface of four kinds of incisions in different directions of the present invention;

15 is an exploded view of an optical fiber ring packaging device without free pigtails in the third embodiment;

Fig. 16 is a partial structural schematic diagram of an optical fiber ring packaging device with different stress axis placement angles;

Fig. 17 is a schematic diagram of a partial structure of an optical fiber ring packaging device according to a fourth embodiment.

1. Bottom plate; 10. Accommodating part; 100. Edge; 101. Limiting groove; 103. Normal line; 104. Spacer part; 11. Positioning groove; 12. Upper plane; 13. Groove; 130. Deep groove; 14 , axis; 15, bump; 2, optical fiber ring; 20, pigtail; 200, uncoated part; 201, coated part; 202, end; 21, main body; 3, cover plate; 30 , incision; 31, mating groove; 4, positioning optical fiber; 40, tail; 5, interface; 6, gap; 7, stress axis; 70, direction axis.

Detailed ways

The following is a further non-limiting detailed description of the technical solution of the invention in combination with preferred embodiments and accompanying drawings. In describing the present invention, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", " Back", "Left", "Right", "Vertical", "Horizontal", "Top", "Bottom", "Inner", "Outer", "Clockwise", "Counterclockwise", "Axial", The orientation or positional relationship indicated by "radial direction", "circumferential direction", etc. is based on the orientation or positional relationship shown in the drawings. In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be interpreted as indicating or implying relative importance or implicitly specifying the quantity of indicated technical features. Thus, the features defined as "first" and "second" may explicitly or implicitly include at least one of these features. In the description of the present invention, "plurality" means at least two, such as two, three, etc., unless otherwise specifically defined. The embodiments described below by referring to the figures are exemplary and are intended to explain the present invention and should not be construed as limiting the present invention.

As shown in Figures 1-5, a fiber optic ring packaging device without free pigtails according to the first embodiment of the present invention includes: a base plate 1 and an optical fiber ring 2, the optical fiber ring 2 is fixed on the base plate 1, and the optical fiber ring 2 includes Pigtail 20, base plate 1 is provided with accommodating portion 10, at least part of pigtail 20 is fixedly arranged in accommodating portion 10, base plate 1 and end 202 of pigtail 20 form interface 5 for docking integrated optical chip together, set interface 5 In order to better and more conveniently interface with integrated optical chips such as lithium niobate thin films.

Specifically, the bottom plate 1 includes a bump 15, the edge 100 of the receiving portion 10 is located above the bump 15, the end 202 of the pigtail 20 is arranged in the receiving portion 10 above the bump 15, and the end of the bump 15 and the pigtail 20 The parts 202 jointly form the interface 5 for docking the integrated optical chip, and the bottom plate 1 is selected from one of quartz glass, silicon wafer, aluminum oxide wafer, silicon nitride wafer and metal.

The bottom plate 1 is also provided with a groove 13 for accommodating the main body portion 21 of the optical fiber ring 2 , and the groove 13 communicates with the accommodating portion 10 . Wherein, the main body 21 of the optical fiber ring 2 is bonded in the groove 13 by glue, and part of the pigtails 20 is bonded in the accommodating portion 10 by glue.

The angle a formed by the normal line 103 of the receiving portion 10 and the axis 14 of the bottom plate 1 ranges from 0 to 90 degrees, and the included angle a is preferably 90°, 60°, 45°. In order to shorten the original two pigtails 20 of 200-300mm to 5-15mm, the interface 5 is directly integrated on the side of the bottom plate 1, and there are multiple angle integration methods. Figures 5-7 provide the included angle a of 90 degrees respectively , 45 degrees and 0 degrees of integrated angle design, the pigtails 20 are respectively bonded in the receiving parts 10 of different angles.

The accommodating part 10 is "W" shaped, and the accommodating part 10 includes a pair of limiting grooves 101 which communicate with each other. The depth h of the limiting groove 101 is 0.075-0.45mm, the inscribed circle diameter d is 0.05-0.3mm, and the opening angle X of the bottom is 60 degrees, and in this embodiment, there is a spacer 104 between the two limiting grooves 101 , the distance L between the spacer 104 and the upper plane 12 of the bottom plate 1 is 0.025-0.25 mm. The structure of the receiving part 10 can also be two independent V-shaped grooves, the depth of the V-shaped grooves is consistent with the structure of the limiting groove 101, the full depth h is 0.075-0.45mm, and the diameter d of the inscribed circle is 0.05-0.3mm , the bottom opening angle X is 60 degrees. The distance between the two V-shaped grooves is not limited, and the distance between the two V-grooves only needs to correspond to the matching integrated optical chip.

The pigtail 20 includes an uncoated layer part 200 and a coated layer part 201, the uncoated layer part 200 is fixedly arranged in the housing part 10, and one end of the coated layer part 201 is connected to the uncoated layer part 200, and the other end is connected to The main body part 21 of the optical fiber ring 2, the tail fiber 20 is 5-15mm long, specifically, the uncoated layer part 200 is bonded in the housing part 10 by glue, and the uncoated layer part 200 is a bare fiber with the coating layer removed. Guarantee the positional accuracy of the fiber.

Referring to Fig. 16, when the uncoated part 200 of the pigtail 20 is fixed in the housing part 10, the direction of its stress axis 7 is fixed, and the same pigtail 20 has two stress axes 7, and the two stress axes 7 form The direction axis 70 forms an angle Y with the upper plane of the bottom plate 1, and the angle Y is preferably 0 degrees or 90 degrees, and can also be 45 degrees or 135 degrees, and the specific angle is not limited.

A notch 30 is provided on the interface 5, referring to FIG. 14 , the angle and direction of the notch 30 are not limited, as long as it can be adapted to the integrated optical chip.

Aiming at the optical fiber ring packaging device without free pigtails in the above real-time example, the present invention also discloses a packaging method for an optical fiber ring packaging device without free pigtails, comprising the following steps:

S1: Fix the fiber ring 2 on the bottom plate 1.

Step S1 specifically includes the following steps:

S10: placing the main body 21 of the optical fiber ring 2 in the groove 13 of the bottom plate 1;

S11 : Rotate the main body 21 of the fiber optic ring 2 to make the two exposed pigtails 20 approach the receiving portion 10 .

Specifically, rotating the main body portion 21 of the fiber optic ring 2 makes the coated portion 201 of the pigtail 20 approach the receiving portion 10 .

S12: Glue the part of the optical fiber ring 2 except the pigtail 20 into the groove 13 of the bottom plate 1 .

S2: Place the two pigtails 20 of the optical fiber ring 2 in the accommodating part 10 .

Specifically, the two pigtails 20 are respectively placed in a pair of communicating limiting grooves 101 .

S3: Rotate the pigtail 20 until its panda eye meets the packaging angle.

Specifically, when rotating, it can be observed according to the end face detector until the panda eyes meet the package angle. The end face detector belongs to existing equipment, and will not be described here.

S4: Fix part of the pigtail 20 in the receiving part 10 by glue, and the bottom plate 1 and the end 202 of the pigtail 20 together form the interface 5 for docking with the integrated optical chip.

S5: Grinding the interface 5 to form a cutout 30 suitable for the integrated optical chip.

During installation, place the main body 21 of the optical fiber ring 2 in the groove 13 of the base plate 1, rotate to a suitable position and fix it with glue; place the two pigtails 20 of the optical fiber ring 2 in the housing part 10; rotate the pigtails 20 to Its panda eyes conform to the packaging angle; part of the pigtail 20 is fixed in the receiving part 10 by glue, and the bottom plate 1 and the end 202 of the pigtail 20 together form the interface 5 for docking the integrated optical chip.

As shown in Figures 8-14, a fiber optic ring packaging device without free pigtails in the second embodiment of the present invention adds a cover plate 3, a positioning optical fiber 4 and a positioning groove 11 on the basis of the above embodiment, specifically including Base plate 1, optical fiber ring 2, cover plate 3 and at least one positioning optical fiber 4, optical fiber ring 2 is fixed on the base plate 1, optical fiber ring 2 includes pigtail 20, cover plate 3 is fixedly arranged on the base plate 1, and pigtail 20 is close to the cover plate 3 is set and bonded between the bottom plate 1 and the cover plate 3 by glue, the positioning optical fiber 4 is set on both sides of the pigtail 20 and kept parallel to the pigtail 20, the materials of the bottom plate 1 and the cover plate 3 are quartz glass, silicon wafer , aluminum oxide sheet, silicon nitride sheet and metal. The cover plate 3 is a flat plate structure, and the cover plate 3 , the base plate 1 and the pigtail 20 between the cover plate 3 and the base plate 1 form an interface 5 for docking an integrated optical chip.

Specifically, the base plate 1 includes a bump 15, and the cover plate 3 is bonded to the bump 15, wherein the cover plate 3, the bump 15, and the pigtail 20 between the cover plate 3 and the bump 15 form the above-mentioned interface 5, the interface 5 is used for docking the integrated optical chip.

The bottom plate 1 is provided with a receiving part 10, a groove 13 and at least one positioning groove 11. The specific structure of the receiving part 10 is the same as that of Embodiment 1. The receiving part 10 includes a pair of communicating limiting grooves 101. The bottom opening angle is 60 degrees. In this embodiment, two positioning grooves 11 are provided, and the two positioning grooves 11 are respectively arranged on both sides of the housing part 10. The cover plate 3 is fixedly arranged on the housing part 10 and the positioning groove 11, and the cover plate 3 is glued with glue. Connected to the accommodating portion 10 and the positioning groove 11, at least part of the pigtail 20 is fixedly arranged in the accommodating portion 10 and the end 202 of the pigtail 20 is arranged between the cover plate 3 and the accommodating portion 10, the cover plate 3, the bottom plate 1 and the The ends 202 of the pigtails 20 together form the interface 5 for docking with the integrated optical chip. Specifically, the pigtail 20 is bonded in the housing portion 10 by glue, the cover plate 3 is glued on the edge 100 of the housing portion 10 to cover part of the pigtail 20, and the groove 13 is used to accommodate the main body portion 21 of the optical fiber ring 2, And the groove 13 communicates with the accommodating part 10 , the positioning optical fiber 4 is fixed in the positioning groove 11 by glue and the tail 40 of the positioning optical fiber 4 is fixed between the positioning groove 11 and the cover plate 3 and directly contacts with the cover plate 3 .

The angle a formed by the normal line 103 of the receiving portion 10 and the axis 14 of the bottom plate 1 ranges from 0 to 90 degrees, and the included angle a is preferably 90°, 60°, 45°. Referring to Figure 12 and Figure 13, in order to shorten the original 200-300mm two pigtails 20 to 5-15mm, the interface 5 is directly integrated on the side of the bottom plate 1, and the integration has multiple angles. This embodiment provides an included angle a The integrated angles of 90 degrees and 45 degrees are respectively designed, and the pigtails 20 are bonded in the receiving parts 10 of 90 degrees and 45 degrees respectively.

The positioning groove 11 is in the shape of a "V" and the depth and inscribed circle diameter of the positioning groove 11 are the same as those of the limiting groove 101 . The positioning optical fiber 4 is fixedly arranged in the positioning groove 11, and the tail portion 40 of the positioning optical fiber 4 is fixedly arranged between the cover plate 3 and the positioning groove 11 and is in direct contact with the cover plate 3. Specifically, the positioning optical fiber 4 is also fixed in the positioning groove 11 with glue. slot 11 , and the tail portion 40 of the positioning optical fiber 4 is bonded between the cover plate 3 and the positioning slot 11 by glue and is in direct contact with the cover plate 3 .

The diameter of the positioning fiber 4 is slightly larger than the diameter of the pigtail 20. In this embodiment, when the diameter of the pigtail 20 is 0.135 mm, the diameter of the positioning fiber 4 is selected to be 0.138-0.140 mm. When the cover plate 3 is covered, the positioning optical fiber 4 is in direct contact with the cover plate 3, and there is a gap 6 between the pigtail 20 and the cover plate 3, and the distance between the gap 6 is the vertical distance k between the pigtail 20 and the cover plate 3 It is 0.002-0.008mm, so that when the cover plate 3 is covered, the pigtail 20 can rotate relatively.

A notch 30 is provided on the interface 5. Referring to FIG. 14 , the angle b between the notch surface and the original side surface is 3-30 degrees. According to the matching requirements, you can choose a horizontal 8° cut, a horizontal 8° cut, a vertical 8° cut, and a vertical 8° cut. The angle b of the cut can also be any other degree without limitation. The purpose of setting the cut 30 It prevents reflected light from entering the fiber. The interface 5 in the first real-time example also needs to be provided with the notch 30 to prevent reflected light from entering the optical fiber.

Aiming at the optical fiber ring packaging device without free pigtails in the above real-time example, the present invention also discloses a packaging method for an optical fiber ring packaging device without free pigtails, comprising the following steps:

S1: Fix the fiber ring 2 on the bottom plate 1.

Step S1 specifically includes the following steps:

S10: placing the main body 21 of the optical fiber ring 2 in the groove 13 of the bottom plate 1;

S11 : Rotate the main body 21 of the fiber optic ring 2 to make the two exposed pigtails 20 approach the receiving portion 10 .

Specifically, rotating the main body portion 21 of the fiber optic ring 2 makes the coated portion 201 of the pigtail 20 approach the receiving portion 10 .

S12: Glue the part of the optical fiber ring 2 except the pigtail 20 into the groove 13 of the bottom plate 1 .

S2: Place the two pigtails 20 of the optical fiber ring 2 in the accommodating part 10 .

Specifically, the two pigtails 20 are respectively placed in a pair of communicating limiting grooves 101 .

Step S2 specifically includes the following steps:

S20: placing the positioning optical fiber 4 in the positioning groove 11, and placing the two pigtails 20 of the optical fiber ring 2 in the accommodating part 10;

S21: Press the cover plate 3 on the accommodating portion 10 to ensure direct contact between the positioning optical fiber 4 and the cover plate 3 , and there is a gap 6 between the pigtail 20 and the cover plate 3 .

Specifically, the depth of the limiting groove 101 and the diameter of its inscribed circle are the same as those of the positioning groove 11, and the diameter of the positioning optical fiber 4 needs to be slightly larger than the diameter of the pigtail 20 to ensure that when the cover plate 3 is pressed on the receiving portion 10, the positioning of the optical fiber 4 is in direct contact with the cover plate 3, and there is a gap 6 between the pigtail 20 and the cover plate 3. For example, when the diameter of the pigtail 20 is 0.135 mm, a positioning fiber 4 with a diameter of 0.138-0.140 mm should be selected. This is for the convenience of rotating the pigtail 20 later.

S3: Rotate the pigtail 20 until its panda eye meets the packaging angle.

S4: Fix part of the pigtail 20 in the receiving part 10 by glue, and the bottom plate 1 and the end 202 of the pigtail 20 together form the interface 5 for docking with the integrated optical chip.

Specifically, the bottom plate 1 and the cover plate 3 and the positioning optical fiber 4 and the pigtail 20 between the bottom plate 1 and the cover plate 3 are fixed by glue bonding; The pigtail 20 forms an interface 5 for docking an integrated optical chip.

S5: Grinding the interface 5 to form a cutout 30 suitable for the integrated optical chip.

Referring to Figure 14, the angle b formed between the cut surface of the cut 30 and the original side is 3-30 degrees, and you can choose a horizontal 8° cut, a horizontal 8° cut, a vertical 8° cut and a vertical bottom according to the matching requirements. For an 8° incision, the included angle b of the incision can also be any other degree without limitation.

The present invention also discloses a fiber optic gyroscope, which includes the above fiber ring packaging device and an integrated optical chip, and the fiber ring packaging device is clamped to the integrated optical chip through its interface 5 .

When installing, first place the optical fiber ring 2 in the groove 13 of the base plate 1, rotate the optical fiber ring 2 so that the coated portion 201 of the optical fiber ring 2 is close to the receiving portion 10, and pass the main body 21 of the optical fiber ring 2 through the glue. Bonded in the groove 13; then the positioning optical fiber 4 is placed in the positioning groove 11; then the two pigtails 20 of the optical fiber ring 2 are respectively placed in a pair of interconnected limiting grooves 101, and the cover plate 3 is pressed on the On the bump 15 of the partial housing part 10, rotate the pigtail 20 until its panda eye conforms to the packaging angle, and glue the pigtail 20, the cover plate 3 and the positioning optical fiber 4 in sequence through glue; finally package the miniature optical fiber ring covered with the cover plate 3 The device carries out a special interface angle and grinds out a cutout 30.

The present invention also provides a third embodiment. Referring to FIG. 15 , compared with the first embodiment, the pigtail 20 has a different way of outputting the fiber, and the coated part 201 is arranged below the main part 21 of the optical fiber ring 2, and the flat plate 1 A groove 13 is provided, and the coating layer part 201 and the main body part 21 are both arranged in the groove 13. Further, a deep groove 130 is arranged in the groove 13, and the coating layer part 201 is arranged in the deep groove 130. The coated portion 201 is pressed by the main body portion 21 to ensure that the pigtail 20 is not disturbed by the outside.

The present invention also provides a fourth embodiment. Referring to FIG. 17, compared with the second embodiment, the opening angle X of the bottom of the limiting groove 101 is 90 degrees, and the cover plate 3 is provided with a matching groove 31. The matching groove 31 is The V-groove, whose opening angle Q is 90 degrees, is reversely buckled on the optical fiber.

The miniature optical fiber ring packaging device provided by the present invention has the following advantages:

1. The optical fiber ring packaging device avoids two free exposed pigtails by directly integrating the special optical fiber interface, avoiding the stress concentration of the exposed pigtails, fiber damage and fiber breakage in the process of grinding the angle of the special optical fiber array interface. The problem of product scrapping has greatly improved the pass rate of product manufacturing.

2. The optical fiber ring packaging device directly integrates a special optical fiber array interface for easy testing. The 3-10mm long pigtails are packaged with glue, and there is no interference with the placement of exposed optical fibers, which greatly improves the optical performance and testing of the optical fiber ring. efficiency.

3. The overall structure of the optical fiber ring packaging device is compact, which greatly facilitates mechanized and automated mass production of optical fiber rings with high pass rate and good consistency.

4. The optical fiber ring packaging device can better and more conveniently connect with integrated optical chips such as lithium niobate thin film through the interface, which improves the convenience of customers.

5. The optical fiber ring packaging device improves the integration of the miniature optical fiber ring packaging, reduces the volume of the overall optical fiber ring packaging device, and satisfies the miniaturization and miniaturization of the overall optical fiber ring product.

6. The optical fiber ring packaging device has greatly improved the packaging technology content of the miniature optical fiber ring.

The above-mentioned embodiments only express several implementation modes of the present invention, and the description thereof is relatively specific and detailed, but should not be construed as limiting the patent scope of the present invention. It should be pointed out that those skilled in the art can make several modifications and improvements without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent for the present invention should be based on the appended claims.

Claims (18)

1. An optical fiber ring packaging device without free pigtail, is characterized in that, comprises base plate (1) and optical fiber ring (2), and described optical fiber ring (2) is fixed on the described base plate (1), and described optical fiber The ring (2) includes pigtails (20), the base plate (1) is provided with a housing portion (10), at least part of the pigtails (20) is fixedly arranged in the housing portion (10), and the base plate (1 ) and the end (202) of the pigtail (20) jointly form an interface (5) for docking an integrated optical chip. 2. The optical fiber ring packaging device according to claim 1, characterized in that, the pigtail (20) is 5-15mm long, and the pigtail (20) includes an uncoated part (200) and a coated A coating part (201), the non-coating layer part (200) is fixedly arranged in the accommodating part (10), and one end of the coating layer part (201) is connected to the non-coating layer part (200) ), the other end is connected to the main body (21) of the optical fiber ring (2). 3. The optical fiber ring packaging device according to claim 2, characterized in that, the coated portion (201) is arranged below the main body portion (21) of the optical fiber ring (2), and the coated Both the coating part (201) and the main part (21) are arranged in the groove (13) of the bottom plate (1). 4. The optical fiber ring packaging device according to claim 2, characterized in that, the non-coating layer part (200) is bonded in the accommodating part (10) by glue. 5. The optical fiber ring packaging device according to claim 2, characterized in that, the uncoated part (200) is a bare fiber from which the coating layer has been removed. 6. The optical fiber ring packaging device according to claim 1, characterized in that, the interface (5) is provided with a notch (30), and the angle (b) formed between the notch surface and the original side is 3-30 Spend. 7. The optical fiber ring packaging device according to claim 1, characterized in that, the accommodating portion (10) is in a “W” shape, and the accommodating portion (10) includes a pair of communicating limiting grooves (101 ), the two pigtails (20) are accommodated in the limiting slots (101) respectively. 8. The optical fiber ring packaging device according to claim 1, characterized in that, the angle range formed by the normal line (103) of the housing part (10) and the axis (14) of the bottom plate (1) is 0-90 degrees. 9. The optical fiber ring packaging device according to claim 1, characterized in that, the bottom plate (1) is one of quartz glass, silicon wafer, aluminum oxide wafer, silicon nitride wafer and metal. 10. The optical fiber ring packaging device according to claim 3, characterized in that, the groove (13) communicates with the accommodating portion (10). 11. The optical fiber ring packaging device according to claim 1, characterized in that, the optical fiber ring packaging device further comprises a cover plate (3), and the cover plate (3) is bonded to the accommodating portion (10) , the end portion (202) of the pigtail (20) is arranged between the cover plate (3) and the receiving portion (10). 12. The optical fiber ring packaging device according to claim 11, characterized in that there is a gap (6) between the pigtail (20) and the cover plate (3), and the pigtail (20) and the The vertical distance (k) between the cover plates (3) is 0.002-0.008mm. 13. The optical fiber ring packaging device according to claim 11, characterized in that, at least one positioning groove (11) is further provided on the bottom plate (1), and the positioning groove (11) is provided in the accommodating part ( 10) Both sides. 14. The optical fiber ring packaging device according to claim 13, characterized in that, the optical fiber ring packaging device further comprises at least one positioning optical fiber (4), and the positioning optical fiber (4) is fixedly arranged in the positioning groove (11 ), and the tail portion (40) of the positioning optical fiber (4) is fixed between the positioning groove (11) and the cover plate (3) and is in direct contact with the cover plate (3). 15. A method for packaging an optical fiber ring packaging device without free pigtails, comprising the following steps: Fix the optical fiber ring (2) on the bottom plate (1); placing the two pigtails (20) of the optical fiber ring (2) in the accommodation part (10); Rotate pigtail (20) to its panda eye to meet the packaging angle; A part of the pigtail (20) is fixed in the accommodating portion (10) by glue, and the bottom plate (1) and the end (202) of the pigtail (20) jointly form an interface (5) for docking an integrated optical chip. 16. The packaging method of the miniature optical fiber ring packaging device according to claim 15, characterized in that, said step: fixing the optical fiber ring (2) on the base plate (1), specifically comprises the following steps: placing the main body (21) of the optical fiber ring (2) in the groove (13) of the bottom plate (1); Rotating the main body (21) of the optical fiber ring (2) to make the two exposed pigtails (20) close to the receiving portion (10); The part of the optical fiber ring (2) other than the pigtail (20) is bonded in the groove (13) of the bottom plate (1) by glue. 17. The packaging method of the miniature optical fiber ring packaging device according to claim 15, characterized in that, the step: placing the two pigtails (20) of the optical fiber ring (2) in the accommodating portion (10), comprising the following step: placing the positioning optical fiber (4) in the positioning groove (11), and placing the two pigtails (20) of the optical fiber ring (2) in the accommodation part (10); Press the cover plate (3) on the accommodating portion (10) to ensure direct contact between the positioning optical fiber (4) and the cover plate (3), and there is a gap (6) between the pigtail (20) and the cover plate (3). 18. The packaging method of the miniature optical fiber ring packaging device according to claim 15, further comprising the following step: grinding the interface (5) to form a cutout (30) suitable for an integrated optical chip.

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