CN115698178A - 无卤素的极低损耗树脂组合物 - Google Patents

无卤素的极低损耗树脂组合物 Download PDF

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Publication number
CN115698178A
CN115698178A CN202080101485.7A CN202080101485A CN115698178A CN 115698178 A CN115698178 A CN 115698178A CN 202080101485 A CN202080101485 A CN 202080101485A CN 115698178 A CN115698178 A CN 115698178A
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叶思宇
E·王
E·鲍
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Blue Cube Intellectual Property Co ltd
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Blue Cube Intellectual Property Co ltd
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    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F9/00—Compounds containing elements of Groups 5 or 15 of the Periodic Table
    • C07F9/02—Phosphorus compounds
    • C07F9/06—Phosphorus compounds without P—C bonds
    • C07F9/08—Esters of oxyacids of phosphorus
    • C07F9/09—Esters of phosphoric acids
    • C07F9/093—Polyol derivatives esterified at least twice by phosphoric acid groups
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F9/00—Compounds containing elements of Groups 5 or 15 of the Periodic Table
    • C07F9/02—Phosphorus compounds
    • C07F9/547—Heterocyclic compounds, e.g. containing phosphorus as a ring hetero atom
    • C07F9/6564—Heterocyclic compounds, e.g. containing phosphorus as a ring hetero atom having phosphorus atoms, with or without nitrogen, oxygen, sulfur, selenium or tellurium atoms, as ring hetero atoms
    • C07F9/6571—Heterocyclic compounds, e.g. containing phosphorus as a ring hetero atom having phosphorus atoms, with or without nitrogen, oxygen, sulfur, selenium or tellurium atoms, as ring hetero atoms having phosphorus and oxygen atoms as the only ring hetero atoms
    • C07F9/657163—Heterocyclic compounds, e.g. containing phosphorus as a ring hetero atom having phosphorus atoms, with or without nitrogen, oxygen, sulfur, selenium or tellurium atoms, as ring hetero atoms having phosphorus and oxygen atoms as the only ring hetero atoms the ring phosphorus atom being bound to at least one carbon atom
    • C07F9/657172—Heterocyclic compounds, e.g. containing phosphorus as a ring hetero atom having phosphorus atoms, with or without nitrogen, oxygen, sulfur, selenium or tellurium atoms, as ring hetero atoms having phosphorus and oxygen atoms as the only ring hetero atoms the ring phosphorus atom being bound to at least one carbon atom the ring phosphorus atom and one oxygen atom being part of a (thio)phosphinic acid ester: (X = O, S)
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/06—Polymers provided for in subclass C08G
    • C08F290/062—Polyethers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G79/00—Macromolecular compounds obtained by reactions forming a linkage containing atoms other than silicon, sulfur, nitrogen, oxygen, and carbon with or without the latter elements in the main chain of the macromolecule
    • C08G79/02—Macromolecular compounds obtained by reactions forming a linkage containing atoms other than silicon, sulfur, nitrogen, oxygen, and carbon with or without the latter elements in the main chain of the macromolecule a linkage containing phosphorus
    • C08G79/04—Phosphorus linked to oxygen or to oxygen and carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/14—Peroxides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C08L71/12—Polyphenylene oxides
    • C08L71/126—Polyphenylene oxides modified by chemical after-treatment
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L85/00—Compositions of macromolecular compounds obtained by reactions forming a linkage in the main chain of the macromolecule containing atoms other than silicon, sulfur, nitrogen, oxygen and carbon; Compositions of derivatives of such polymers
    • C08L85/02—Compositions of macromolecular compounds obtained by reactions forming a linkage in the main chain of the macromolecule containing atoms other than silicon, sulfur, nitrogen, oxygen and carbon; Compositions of derivatives of such polymers containing phosphorus
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D4/00—Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; Coating compositions, based on monomers of macromolecular compounds of groups C09D183/00 - C09D183/16
    • C09D4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09D159/00 - C09D187/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Molecular Biology (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • General Chemical & Material Sciences (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
CN202080101485.7A 2020-05-29 2020-05-29 无卤素的极低损耗树脂组合物 Pending CN115698178A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2020/093361 WO2021237696A1 (fr) 2020-05-29 2020-05-29 Composition de résine à très faible perte sans halogène

Publications (1)

Publication Number Publication Date
CN115698178A true CN115698178A (zh) 2023-02-03

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CN202080101485.7A Pending CN115698178A (zh) 2020-05-29 2020-05-29 无卤素的极低损耗树脂组合物

Country Status (3)

Country Link
CN (1) CN115698178A (fr)
TW (2) TWI887423B (fr)
WO (1) WO2021237696A1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7397227B1 (ja) * 2023-02-07 2023-12-12 四国化成工業株式会社 リン化合物、その合成方法およびその利用
WO2024171871A1 (fr) * 2023-02-14 2024-08-22 日鉄ケミカル＆マテリアル株式会社 Composé de (méth)acryloyle contenant du phosphore, composé de vinyle et benzyle contenant du phosphore, procédés de production associés, composition de résine ignifuge et carte stratifiée pour carte de circuit électronique la contenant

Citations (12)

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CN1122347A (zh) * 1994-06-30 1996-05-15 通用电气公司 聚苯醚树脂组合物
CN1960997A (zh) * 2004-05-28 2007-05-09 陶氏环球技术公司 可用于制造无卤素抗引燃聚合物的含磷化合物
CN101589109A (zh) * 2007-01-17 2009-11-25 沙伯基础创新塑料知识产权有限公司 阻燃聚(亚芳基醚)组合物及制品
US20110160366A1 (en) * 2009-12-31 2011-06-30 Cheil Industries Inc. Novel Phosphonate Based Compound and Flameproof Thermoplastic Resin Composition Including the Same
CN102276837A (zh) * 2011-08-19 2011-12-14 慧智科技（中国）有限公司 无卤含磷的阻燃聚酰亚胺树脂组合物及其制备方法
CN104774476A (zh) * 2015-03-10 2015-07-15 广东生益科技股份有限公司 含磷阻燃组合物以及使用它的含磷聚苯醚树脂组合物、预浸料和层压板
US20160053179A1 (en) * 2013-04-01 2016-02-25 Adeka Corporation Flame retardant composition, flame retardant fiber treated with flame retardant composition, and method for increasing amount of flame retardant component adhered onto fibers using said composition
CN107531992A (zh) * 2015-04-30 2018-01-02 日立化成株式会社 热固性树脂组合物、预浸料、层叠板和多层印刷线路板
US20180208765A1 (en) * 2017-01-20 2018-07-26 Taiwan Union Technology Corporation Resin Composition, and Prepreg, Metal-Clad Laminate, and Printed Circuit Board Using the Same
WO2019112920A1 (fr) * 2017-12-06 2019-06-13 Icl-Ip America Inc. Composé additif polysiloxane contenant du phosphore pour résines thermodurcissables, composition ignifuge comprenant celui-ci, et articles fabriqués à partir de celui-ci
CN110938234A (zh) * 2018-09-25 2020-03-31 中山台光电子材料有限公司 阻燃性化合物、其制造方法、树脂组合物及其制品
US20210214547A1 (en) * 2018-06-01 2021-07-15 Mitsubishi Gas Chemical Company, Inc. Resin Composition, Prepreg, Metal Foil-Clad Laminate, Resin Sheet, and Printed Wiring Board

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* Cited by examiner, † Cited by third party
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CN106609032B (zh) * 2015-10-22 2018-11-27 广东生益科技股份有限公司 一种聚苯醚树脂组合物以及含有它的预浸料、层压板和印制电路板
CN110655536B (zh) * 2018-06-28 2022-03-01 台光电子材料(昆山)有限公司 一种含磷化合物、含磷阻燃剂及其制备方法与制品

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1122347A (zh) * 1994-06-30 1996-05-15 通用电气公司 聚苯醚树脂组合物
CN1960997A (zh) * 2004-05-28 2007-05-09 陶氏环球技术公司 可用于制造无卤素抗引燃聚合物的含磷化合物
CN101589109A (zh) * 2007-01-17 2009-11-25 沙伯基础创新塑料知识产权有限公司 阻燃聚(亚芳基醚)组合物及制品
US20110160366A1 (en) * 2009-12-31 2011-06-30 Cheil Industries Inc. Novel Phosphonate Based Compound and Flameproof Thermoplastic Resin Composition Including the Same
CN102276837A (zh) * 2011-08-19 2011-12-14 慧智科技（中国）有限公司 无卤含磷的阻燃聚酰亚胺树脂组合物及其制备方法
US20160053179A1 (en) * 2013-04-01 2016-02-25 Adeka Corporation Flame retardant composition, flame retardant fiber treated with flame retardant composition, and method for increasing amount of flame retardant component adhered onto fibers using said composition
CN104774476A (zh) * 2015-03-10 2015-07-15 广东生益科技股份有限公司 含磷阻燃组合物以及使用它的含磷聚苯醚树脂组合物、预浸料和层压板
CN107531992A (zh) * 2015-04-30 2018-01-02 日立化成株式会社 热固性树脂组合物、预浸料、层叠板和多层印刷线路板
US20180208765A1 (en) * 2017-01-20 2018-07-26 Taiwan Union Technology Corporation Resin Composition, and Prepreg, Metal-Clad Laminate, and Printed Circuit Board Using the Same
WO2019112920A1 (fr) * 2017-12-06 2019-06-13 Icl-Ip America Inc. Composé additif polysiloxane contenant du phosphore pour résines thermodurcissables, composition ignifuge comprenant celui-ci, et articles fabriqués à partir de celui-ci
US20210214547A1 (en) * 2018-06-01 2021-07-15 Mitsubishi Gas Chemical Company, Inc. Resin Composition, Prepreg, Metal Foil-Clad Laminate, Resin Sheet, and Printed Wiring Board
CN110938234A (zh) * 2018-09-25 2020-03-31 中山台光电子材料有限公司 阻燃性化合物、其制造方法、树脂组合物及其制品

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TW202534123A (zh) 2025-09-01
TW202206537A (zh) 2022-02-16
WO2021237696A1 (fr) 2021-12-02
TWI887423B (zh) 2025-06-21

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