CN116653381A - A kind of dipping slurry, flat base card and decorative board and its preparation method and application - Google Patents

Abstract

The invention discloses a soaking slurry, a flat base card and a decorative plate, and a preparation method and application thereof, wherein the planar base card is obtained by uniformly matching the soaking slurry of a carrier base material; the carrier base material includes a semi-wet method carrier Substrate and dry carrier substrate, semi-wet carrier substrate adopts 1.0-1.4 denier, 25mm-51mm PET short fiber raw material, hot gloss calendering at 60-150°C on the front side, and hot gloss calendering at 60-150°C on the back side Obtained, the dry method carrier substrate is obtained by drying the semi-wet method carrier substrate; the grammage of the plane base is 100g/㎡～300g/㎡, and the grammage of the carrier substrate is 50g/㎡～150g/㎡, in mass percentage , the solid content of the soaking slurry is 40%-60%, based on the solid content of 100%, the soaking slurry includes the following raw materials: dispersant solid content 0.2%-5%, inorganic powder solid content 2%-80%, latex solid content Content 5%-50%, starch solid content 10%-80%, water-repellent agent solid content 0.4%-8%, waterproof agent or anti-sticking waterproof agent solid content 0.2%-2%, dry film antifungal agent solid content 0.1 %‑2%, lubricant solid content 0.2%‑2%.

Description

A kind of dipping slurry, flat base card and decorative board and its preparation method and application

technical field

The disclosure relates to the technical field of decorative boards, in particular to a dipping slurry, a flat base card, a decorative board and a preparation method and application thereof.

Background technique

At present, in the market of decorative boards such as home improvement, home furnishing, and whole house customization, the widely used wooden board cores are oak boards, rubber boards, pine boards, LVTT boards, fir boards, ecological boards, multi-layer boards, etc. These wooden board cores should be Processing into decorative boards requires the following board core veneering processes: sanding, putty powder, polishing, gluing, pasting. Technical veneer or pasting. Encrypted board (MDF), hot pasting. Melamine paper, a total of up to 6 Only one process can complete the core veneer to complete the production of decorative panels. Moreover, after the processing of the decorative board is completed, the staff needs to check it twice to prevent substandard products, which shows that the process is complicated and inefficient. For example, in the fifth process of pasting the technical veneer or the encrypted board, in order to make the surface of the wooden core smooth, the technical veneer will be pasted, and then the technical veneer will be hot-pressed with a hot press to make the technical veneer and the wooden core together. , to solve the rough surface of the wooden board core, but because the temperature of the hot press machine will be as high as 150-160°C during the hot pressing process, it will cause the technical veneer to be coked or carbonized when exposed to high temperature; or in the fifth process, use a dense board , because the encrypted board contains a lot of glue, although pasting the encrypted board will make the surface smooth and improve the smoothness, but the formaldehyde content will be greatly increased; another example is the thermal paste in the last process. Melamine paper, because of its direct contact with the environment, will release A large amount of formaldehyde is harmful to people's health. Moreover, the decorative panels completed through the above process are prone to cracking in harsh environments, such as extremely cold places, with high scrap rates, unstable product quality, and unsightly products. Therefore, the production cost of decorative panels in the existing market has always been high. No more. The above-mentioned situation has not been resolved and needs to be improved urgently.

Contents of the invention

The disclosure provides a dipping slurry, a flat base card and a decorative board, a preparation method and an application thereof, so as to solve at least one of the technical problems existing in the prior art.

According to the first aspect of the present disclosure, there is provided a soaking slurry for preparing a planar base card, in terms of mass percentage, the solid content in the soaking slurry is 40%-60%, and the solid content is 100% , the soaking slurry includes the following raw materials: dispersant solid content 0.2%-5%, inorganic powder solid content 2%-80%, latex solid content 5%-50%, starch solid content 10%-80%, anti The solid content of water agent is 0.4%-8%, the solid content of waterproofing agent or anti-sticking waterproofing agent is 0.2%-2%, the solid content of dry film antifungal agent is 0.1%-2%, and the solid content of lubricant is 0.2%-2%.

In a possible embodiment, the soaking slurry also includes the following raw materials: 0.5%-10% solid content of urea, 0.1%-2% solid content of additives, 0.1%-1% solid content of rheological agent, defoaming Agent solid content 0.1%-3%.

In a possible implementation manner, the viscosity of the soaking slurry is 20mpa.s-200mpa.s, and the pH value is controlled at 5-10.

In one possible embodiment, the dispersant includes sodium polyacrylate dispersant and/or acrylate dispersant;

Inorganic powder includes dry powder and/or water grinding, dry powder includes one or more combinations of microsilica powder, silicon micropowder, silicon dioxide, heavy calcium carbonate and light calcium carbonate, and water grinding includes heavy calcium carbonate water grinding One or more combinations of slurry, light calcium carbonate water refining pulp and talcum powder; the particle size of the inorganic powder is 0.1 micron to 25 micron;

The latex comprises one or more combinations of acrylic polymer emulsion, butadiene polymer emulsion, styrene polymer emulsion and butadiene-styrene polymer emulsion;

Starches include one or more combinations of corn, cassava, wheat, potato, soybean and potato raw starch, modified starch and oxidized starch;

Water repellents include one or more combinations of glyoxal water repellents, potassium zirconium carbonate water repellents, zirconium carbonate amine water repellents and PAPU water repellents;

The waterproofing agent includes fluorocarbon and/or hyperbranched polymer, and the anti-adhesive waterproofing agent includes a composite emulsion of liquid paraffin and polydimethylsiloxane;

The dry film antifungal agent is obtained by compounding zinc pyrithione and zinc oxide;

The lubricant is sodium stearate lubricant;

Urea is a chemical nitrogen fertilizer urea;

The additive is AMP-95 additive;

Rheological agents include sodium polyacrylate rheological agents;

The defoamer is one or more combinations of ether defoamers, fatty alcohol defoamers, silicon defoamers and enzyme defoamers.

According to the second aspect of the present disclosure, there is provided a flat base card, which is prepared by uniformly matching the carrier substrate with the soaking slurry described in the first aspect, and drying; wherein, the carrier substrate includes semi-wet method carrier base material and dry method carrier base material, the semi-wet method carrier base material is prepared by using 1.0 denier-1.4 denier, 25mm-51mm PET short fiber raw material, and through the front 60-150 ℃ hot gloss calendering, the back It is obtained by hot gloss calendering at 60-150°C, and the dry method carrier substrate is obtained by drying the semi-wet method carrier substrate;

The grammage of the plane base material is 100g/㎡˜300g/㎡, and the grammage of the carrier substrate after drying is 50g/㎡˜150g/㎡.

In a possible implementation manner, the grammage of the solid content of the soaking slurry loaded on the carrier substrate is 50 g/㎡˜150 g/㎡.

In a possible implementation manner, the viscosity of the soaking slurry is 20mpa.s-200mpa.s, and the pH value of the slurry is controlled at 5-10.

In one possible embodiment, the semi-wet carrier base material is obtained by passing the PET staple fiber raw material through a bale opener, a pre-opener, a large warehouse mixing machine, a fine opener, a finishing box, and a roller-type double carding machine. It is prepared by machine or roller type three-carding machine forming, spunlace, hot gloss calendering and dehydration at 60°C-150°C on the front side, and hot gloss calendering at 60°C-150°C on the back side and dehydration.

According to the third aspect of the present disclosure, a method for preparing a planar base card is provided. The carrier substrate is divided into two times or one time to uniformly match the dipping slurry, and the metering, drying, calendering or non-calendering are controlled. Roll up to get.

According to a fourth aspect of the present disclosure, an application of the above-mentioned planar base card in preparing a decorative board is provided.

According to a fifth aspect of the present disclosure, a decorative board is provided, including a wooden board core, adhesive film paper, surface paper, wear-resistant paper, hot-melt adhesive film or hot-melt adhesive omentum that are sequentially attached to the surface of the wooden board core , and the planar base card described in any one of claims 5-8.

In a possible embodiment, the material used for the wooden board core is one of oak boards, rubber boards, pine boards, LVTT boards, fir boards, ecological boards and multi-layer boards; the film paper, surface paper , Wear-resistant paper, hot-melt adhesive film or hot-melt adhesive omentum weight is 20 grams/㎡～200 grams/㎡.

In a possible embodiment, the adhesive film paper and surface paper are prepared by using melamine resin, urea resin and paper, and the wear-resistant paper is prepared by melamine resin, aluminum oxide and paper; the Hot melt adhesive films or hot melt adhesive webs include TPU, EVA, PES, PA, PO and EAA.

Finally, the present disclosure also provides a method for preparing the decorative board, including the following steps: step

1: Sand the surface of the wooden board core with an 80-150 mesh abrasive belt; Step 2: Stick film paper, surface paper, wear-resistant paper, hot-melt adhesive film or hot-melt adhesive omentum on the surface of the wooden board core; 3: Heat paste the flat base card.

In a possible embodiment, the wooden board core in the step 1) adopts one of oak boards, rubber wood boards, pine boards, LVTT boards, fir boards, ecological boards and multi-layer boards; in the step 2, Adhesive paper, surface paper, wear-resistant paper, hot-melt adhesive film or hot-melt adhesive omentum weighs 20g/㎡～200g/㎡; when using adhesive film, surface paper or wear-resistant paper in step 2) , the conditions for hot-sticking the flat base card in step 3) are: the hot-pressing temperature is 100-170° C.; The base card conditions are: the hot pressing temperature is 100-150°C;

The method comprises the following steps: step 1: sanding the surface of the wooden board core with an 80-150 mesh abrasive belt; step 2: compounding a hot melt adhesive film or a hot melt adhesive omentum with a plane base card and pasting it on the wooden board core Surface; step 3: use a heat press to heat press the flat base card at a temperature of 100-150°C.

This application completely changes and simplifies the traditional complex process, and solves the technical problem that people have been eager to solve but cannot solve. Therefore, this application provides a flat base card, which only needs three board cores to cooperate with the plane base card. The veneer process can complete the production of decorative boards, and greatly reduce the formaldehyde content, and under some harsh conditions, such as in -20 ° C environment, the decorative boards of the present application will not crack, and the frost resistance ability is improved. Cards can also withstand high temperatures of 260°C.

Compared with the prior art, the present application has the following advantages: 1: The preparation process of the decorative plate of the present application is simple, and only three core veneering processes are required to complete the processing of the decorative plate, which greatly improves the production efficiency;

2: The decorative panels of this application can withstand harsh environments, such as not cracking at -20°C, and can withstand high temperatures as high as 260°C. It can be seen that the quality stability of the decorative panels of this application is much higher than that of existing decorative panels;

3: The surface of the decorative plate of this application is relatively flat, and more delicate, comfortable and beautiful;

4: The overall formaldehyde content of the decorative panels of this application is greatly reduced, which is more environmentally friendly;

5: The planar base card of this application can withstand high temperatures up to 260°C without coking or carbonization.

It should be understood that what is described in this section is not intended to identify key or important features of the embodiments of the present disclosure, nor is it intended to limit the scope of the present disclosure. Other features of the present disclosure will be readily understood through the following description.

Description of drawings

The above and other objects, features and advantages of exemplary embodiments of the present disclosure will become readily understood by reading the following detailed description with reference to the accompanying drawings. In the drawings, several embodiments of the present disclosure are shown by way of illustration and not limitation, in which:

In the drawings, the same or corresponding reference numerals denote the same or corresponding parts.

Fig. 1 shows a schematic structural view of a decorative board according to an embodiment of the present disclosure.

Labels in the figure: 1-wooden board core, 2-adhesive paper, 3-plane base card.

Detailed ways

In order to make the purpose, features, and advantages of the present disclosure more obvious and understandable, the technical solutions in the embodiments of the present disclosure will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present disclosure. Obviously, the described The embodiments are only some of the embodiments of the present disclosure, but not all of them. Based on the embodiments in the present disclosure, all other embodiments obtained by those skilled in the art without making creative efforts belong to the protection scope of the present disclosure.

First of all, before describing the technical solution of this application, the terms involved in this application are explained. In the process of compounding the slurry, because some raw materials are solid and some are liquid, in order to unify the measurement, in this application We call the solid content or slurry remaining after drying the soaking slurry.

In the first aspect, the present disclosure provides a plane base card, which can be used in the core veneer of decorative boards such as home decoration, home furnishing, and whole house customization. By using the plane base card of this application, the traditional The complex process greatly improves the production efficiency, and completely solves the shortcomings brought about by the process in the traditional board core veneer. The decorative plate finished by veneering through the flat base card can greatly reduce the release of formaldehyde, and the product stability is greatly improved. .

The planar base card is made of 1.0 denier (1.11 dtex)-1.4 denier (1.56 dtex), 25mm-51mm PET staple fiber through spunlace, and is dehydrated by hot gloss calendering at 60°C-150°C on the front side , The back side is hot-gloss calendered at 60°C-150°C and dehydrated to prepare polyester (PET) spunlace non-woven fabric as the carrier substrate.

The carrier substrate has two different modes to choose from, which are semi-wet carrier substrate and dry carrier substrate. The semi-wet method carrier substrate or dry method carrier substrate is uniformly matched with the dipping slurry through the dipping equipment, measured, dried, and then calendered by a calender (or not calendered), and finally a flat substrate is obtained. Card.

Wherein, when preparing the planar base card, the solid content of the slurry used is 40%-60%, the viscosity of the slurry needs to be controlled at 20mpa.s-200mpa.s, and the pH value of the slurry is controlled at 5-10.

The grammage of the plane base is 100g/㎡～300g/㎡, and the solid content of the impregnation slurry loaded on the carrier substrate is 50g/㎡～150g/㎡; material, its gram weight requirement is: after drying, the gram weight is 50g/㎡～150g/㎡.

The semi-wet carrier substrate is specifically prepared by the following method: 1.0 denier (1.11 decitex)-1.4 denier (1.56 decitex), 25mm-51mm PET staple fiber (ie: polyester. Staple fiber) is passed through a bag opener, pre-opened Cotton machine, large warehouse mixing, fine opener, finishing cotton box, roller type, double carding machine forming (roller type, triple carding machine can also be used) forming, spunlace, front side, hot gloss pressing at 60°C-150°C Lighting and dehydration, hot gloss calendering and dehydration at 60°C-150°C on the back side, to prepare semi-wet carrier substrates; among them, the steps from the unpacking machine to the spunlace can be prepared by existing known processes.

The dry method carrier substrate is obtained by further drying on the basis of the semi-wet method carrier substrate.

Regardless of whether it is a semi-wet carrier substrate or a dry method carrier substrate, after drying and curing, their weight is 50g/㎡～150g/㎡.

In one embodiment, the semi-wet method carrier substrate or the dry method carrier substrate can be immersed in the dipping slurry twice or once, and the dipping slurry and the semi-wet method carrier substrate are mixed by using existing dipping equipment. Or dry-process carrier substrates are evenly matched, controlled metering, drying, calender molding (or not calendering), winding to finally prepare a flat base card.

In the second aspect, the application provides the soaking slurry for preparing the above-mentioned flat base card, which is obtained by dispersing agent, inorganic powder, latex, starch, water repellent, water repellant or anti-sticking water repellent, dry film anti-mildew These basic formulation raw materials such as agent and lubricant are compounded to obtain a dipping slurry, wherein the solid content of the dipping slurry is required to be 40%-60%, which is used to prepare a flat base card.

Based on the solid content contained in the soaking slurry as 100%, in terms of mass percentage, it includes the following raw materials: dispersant solid content 0.2%-5%, inorganic powder solid content 2%-80%, latex solid content 5% -50%, starch solid content 10%-80%, water-repellent agent solid content 0.4%-8%, waterproof agent solid content or anti-sticking waterproof agent solid content 0.2%-2%, dry film antifungal agent solid content 0.1% -2%, lubricant solid content 0.2% to 2%.

Wherein, the dispersant includes sodium polyacrylate dispersant and/or acrylate dispersant; the dispersant plays a role of improving the dispersion of the powder in the dipping slurry.

Inorganic powder particle size fineness is 0.1 micron to 25 microns, inorganic powder includes dry powder and/or water grinding slurry, dry powder includes microsilica powder, silicon micropowder (quartz powder), silicon dioxide, heavy calcium carbonate and light carbonic acid One or more combinations of calcium, water refining includes one or more combinations of heavy calcium carbonate water refining, light calcium carbonate water refining and talcum powder; Improve overall whiteness, improve opacity, and play a filling role.

The latex includes one or more combinations of acrylic polymer emulsion, butadiene polymer emulsion, styrene polymer emulsion, and butadiene-styrene polymer emulsion; the latex plays a role of bonding and water resistance.

Starch includes one or more combinations of corn, cassava, wheat, potato, soybean and potato raw starch, modified starch and oxidized starch; starch can play a role in adhesion and film-forming properties.

The water repellant includes one or more combinations of glyoxal water repellent, potassium zirconium carbonate water repellent, zirconium carbonate amine water repellent, PAPU water repellent (polyamide polyurea resin water repellent); water repellent The role of the agent is to reduce the moisture regain of the prepared planar base card.

Water repellent (water repellent) comprises fluorocarbon compound water repellent, superbranched polymer water repellent; Anti-adhesion waterproof agent is the compound emulsion that comprises liquid paraffin and polydimethylsiloxane; The effect of water repellant is to make preparation The flat base card plays a waterproof function.

The dry film antifungal agent is resistant to high temperature after drying, and the dry film antifungal agent is obtained by compounding pyrithione zinc and zinc oxide; the dry film antifungal agent is used to make the prepared planar base card capable of inhibiting mold growth.

The lubricant is sodium stearate. The role of the lubricant is to improve the flow properties of the slurry.

In one embodiment, the soaking slurry also includes the following raw materials: 0.5%-10% solid content of urea, 0.1%-2% solid content of additives, 0.1%-1% solid content of rheological agent, 0.1%-1% solid content of defoaming agent, Content 0.1%-3%.

Urea is usually a chemical nitrogen fertilizer urea. The role of urea is to reduce and stabilize the viscosity of the slurry.

The auxiliary agent is AMP-95; the rheological agent includes sodium polyacrylate rheological agent. Additives are used to stabilize the pH of the soaking slurry; rheological agents are used to adjust the leveling of the soaking slurry.

The defoamer is ether defoamer, fatty alcohol defoamer, silicon defoamer, enzyme defoamer, preferably silicon defoamer and ether defoamer. The defoaming agent is used to eliminate foam and reduce surface tension when various raw materials are mixed with dipping slurry.

The viscosity of the soaking slurry obtained by compounding the above raw materials is controlled at 20mpa.s～200mpa.s (if the viscosity of the soaking slurry obtained by the initial compounding is too high, it can be diluted with water to adjust); the pH value of the slurry is controlled at 5～10 (the pH of the slurry It can be adjusted by existing known techniques; and the auxiliary agent AMP-95 in the present application also plays a role in adjusting the pH value).

In the third aspect, the present disclosure provides a brand-new decorative board. Using the planar base card prepared in the first aspect above in the decorative board can not only reduce the formaldehyde content, but also has a simple process and improved production efficiency. The prepared decorative board Good quality stability.

As shown in Figure 1, a kind of decorative board comprises wooden board core 1, and the adhesive film paper 2 that is attached on the wooden board core surface (also can use surface layer paper, wear-resistant paper, hot-melt adhesive film or hot-melt adhesive omentum instead), and the plane base card 3 that is pasted on the surface of the adhesive film paper.

In one embodiment, the material used for the wooden board core is one of oak boards, rubber wood boards, pine boards, LVTT boards, fir boards, ecological boards and multi-layer boards.

In one embodiment, the weight of the adhesive film paper, surface layer paper, wear-resistant paper, hot-melt adhesive film or hot-melt adhesive omentum is 20 g/㎡˜200 g/㎡.

In one embodiment, the adhesive film paper and surface paper are prepared from melamine resin, urea resin and paper, and the wear-resistant paper is prepared from melamine resin, aluminum oxide and paper; hot-melt adhesive film or hot-melt adhesive The raw material of the omentum is one of TPU (polyurethane), EVA (polyethylene-polyvinyl acetate copolymer), PES, PA, PO and EAA.

In a fourth aspect, the present disclosure provides a method for preparing the above-mentioned decorative board, including the following steps: Step 1: Sanding the surface of the wooden board core with an 80-150 mesh abrasive belt; Step 2: Sticking an adhesive film on the surface of the wooden board core , surface paper, wear-resistant paper, hot-melt adhesive film or hot-melt adhesive omentum; Step 3: Hot paste the flat base card.

Wherein, when adhesive film paper, surface layer paper or wear-resistant paper is used in step 2), the conditions for hot-sticking the flat base card in step 3) are: the hot-pressing temperature is 100-170°C; when hot-pressing is used in step 2), In the case of a melt adhesive film or a hot melt adhesive net, the conditions for hot pasting the flat base card in step 3) are: the hot pressing temperature is 100-150°C. Among them, specifically, the film paper, surface paper or wear-resistant paper is laid on the sanded wooden board core, the plane base card is laid on the film paper, surface paper or wear-resistant paper, and the plane base card is laid on the surface paper or wear-resistant paper with a hot press machine. Card hot pressing, the temperature is 100-170 ℃.

Hot-melt adhesive film or hot-melt adhesive omentum is laid on the sanded wooden board core, and the flat base card is laid on the hot-melt adhesive film or hot-melt adhesive omentum, and the flat base card is hot-pressed with a hot press, and the temperature 100-150°C.

In one embodiment, the preparation method of the decorative board can also go through the following steps, including the following steps: Step 1: sand the surface of the wooden board core with an 80-150 mesh abrasive belt; Step 2: put the hot melt adhesive film or heat The melt-adhesive omentum is compounded with the planar base card and pasted on the surface of the wooden board core; Step 3: Use a hot press to heat press the planar base card at a temperature of 100-150°C.

The wooden core after sanding sometimes has some uneven surfaces. Adhesive paper, surface paper, wear-resistant paper, hot-melt adhesive film or hot-melt adhesive film has the same function as gluing, and it is pasted on the wooden core. There is still an uneven surface, but the flat base card will fill the concave holes and accommodate the protrusions after thermal bonding, so that the surface of the prepared decorative board is smooth and the flatness is improved.

In the decorative boards prepared in this application, the impregnation slurry and the carrier substrate required for the preparation of the planar base card, because the carrier substrate is prepared by PET short fibers, PET short fibers can withstand high temperatures up to 260 ° C, and the carrier substrate is loaded In the slurry, the minimum temperature of the starch cannot be lower than -20°C, because if it is lower than -20°C, its original physical properties will be changed, so the slurry loaded on the carrier substrate is limited by the starch content. Flat base cards can withstand -20°C minimum. Therefore, the decorative plate prepared by using the flat base card of the present application can withstand a high temperature of 260°C without coking or carbonization, and can withstand -20°C without cracking.

In one embodiment, the wooden board core in said step 1) adopts one of oak board, rubber wood board, pine board, LVTT board, fir board, ecological board and multi-layer board; in said step 2, Adhesive paper, surface paper, wear-resistant paper, hot-melt adhesive film or hot-melt adhesive omentum weighs 20g/㎡～200g/㎡.

Unless otherwise stated, the raw materials used in this application are all from commercially available products.

Example 1

1: Preparation of semi-wet carrier substrate:

The 1.0 denier 38mm PET staple fiber is formed through bale opener, pre-opener, large warehouse mixing, fine opener, finishing cotton box, roller type double carding machine, spunlace, hot gloss calendering at 60°C on the front side and dehydration , The back is obtained by hot gloss calendering at 60°C and dehydration. The weight of the semi-wet carrier substrate after drying is 50g/㎡.

2: Preparation of soaking slurry:

In terms of mass percentage, by adding the following raw materials: sodium polyacrylate dispersant, micro silica fume, acrylic polymer emulsion, corn starch, glyoxal water repellent, fluorocarbon water repellent, dry film antifungal agent and stearic acid The sodium lubricant is compounded to obtain the soaking slurry, so that the solid content of the soaking slurry is 40%; wherein, based on the solid content of 100%, the solid content of sodium polyacrylate dispersant is 1.2%, the solid content of microsilica powder is 80%, and the acrylic acid polymerization 5% solid content of emulsion, 10% solid content of corn starch, 0.4% solid content of glyoxal water repellent agent, 2% solid content of fluorocarbon water repellent agent, 0.4% solid content of dry film antifungal agent and sodium stearate lubrication The solid content of the agent is 1%; the fineness of the particle size of the microsilica powder is 0.1 micron; the pH of the soaking slurry is 5, and the viscosity of the soaking slurry is 20mpa.s.

3: Preparation of Planar Base Cards:

The immersion slurry is evenly matched with the semi-wet carrier substrate through the immersion equipment, and the metering, drying, calender calender molding, and winding are controlled to obtain a flat base card. After the flat base card is dried, the flat base card The grammage is 100g/㎡, the grammage of the carrier substrate is 50g/㎡, and the slurry loaded on the carrier substrate is 50g/㎡.

4: The specific application of the flat base card, the preparation of a decorative board:

Step 1): Sand the oak board with an 80-mesh abrasive belt;

Step 2): Paste the TPU hot-melt adhesive film on the surface of the oak board, the weight of the TPU hot-melt adhesive film is 20g/㎡;

Step 3): Paste the flat base card on the surface of the TPU hot-melt adhesive film, press the flat base card with a hot press at a temperature of 120°C, and bond the flat base card with the oak wood through the bonding function of the TPU hot-melt adhesive film. The boards are reinforced together.

The decorative board prepared in Example 1 of the present application, the flat base card and the TPU hot-melt adhesive film do not contain formaldehyde, and the source of formaldehyde release is greatly reduced.

In addition, the decorative board prepared in Example 1 was subjected to performance tests, including cold cycle test and high-temperature thermal cycle test. The test results showed that the decorative board prepared in Example 1 could not crack at -20°C, and the decorative board could withstand 260 °C. ℃ high temperature, no coking, no carbonization.

In addition, because the planar base card of the present application can fill the depressions and accommodating protrusions on the surface of the wooden board core, the plane base card is hot-pressed on the wooden board core with a hot press, so that the surface of the prepared decorative board is relatively smooth.

Example 2

1: Preparation of dry carrier substrate:

The 1.4 denier 25mm PET staple fiber is formed through bale opener, pre-opener, big warehouse mixing, fine opener, finishing cotton box, roller type double carding machine, spunlace, hot gloss calendering at 150°C on the front side and dehydration , The back is obtained by hot gloss calendering at 150°C, dehydration and drying. Among them, the dry method carrier substrate has a grammage of 150g/㎡ after drying.

2: Preparation of soaking slurry:

In terms of mass percentage, including the following raw materials: urea, acrylate dispersant, heavy calcium carbonate dry powder, butadiene polymer emulsion, tapioca starch, potassium zirconium carbonate water repellent, ultra-branched polymer water repellent, dry film anti-mildew Agent, sodium stearate lubricant, AMP-95 auxiliary agent, sodium polyacrylate rheological agent and ether defoamer are compounded to obtain the soaking slurry, so that the solid content in the soaking slurry is 60%; wherein the solid content is Based on 100%, the solid content of urea is 0.5%, the solid content of acrylate dispersant is 5%, the solid content of heavy calcium carbonate dry powder is 37%, the solid content of butadiene polymer emulsion is 30%, the solid content of tapioca starch is 15%, potassium zirconium carbonate 8% solid content of water repellent, 0.2% solid content of overspend polymer waterproof agent, 0.1% solid content of dry film antifungal agent, 0.2% solid content of sodium stearate lubricant, 1% solid content of AMP-95 additive, poly The solid content of sodium acrylate rheology agent is 1% and the solid content of ether defoamer is 2%, wherein the particle size of ground calcium carbonate dry powder is 1 micron; the pH of the soaking slurry is 10, and the viscosity of the soaking slurry is 200mpa.s .

3: Preparation of Planar Base Cards:

The immersion slurry is evenly matched with the dry-process carrier substrate through the immersion equipment, and the metering, drying, calender calender molding, and winding are controlled to obtain a flat base card. After the flat base card is dried and solidified, the flat base card The grammage is 300g/㎡, and the slurry loaded on the carrier substrate is 150g/㎡.

4: The specific application of the flat base card, that is, the preparation of a decorative board:

Step 1): Sanding the pine board with a 150-mesh abrasive belt;

Step 2): Paste the adhesive film on the surface of the pine board, the weight of the adhesive film is 200g/㎡;

Step 3): Paste the plane base card on the surface of the film paper, heat press the plane base card with a hot press at a temperature of 170°C, and reinforce the plane base card and the pine board through the bonding function of the film paper .

The decorative board prepared by Example 2 of the present application does not contain formaldehyde in the flat base card. Although the adhesive film contains formaldehyde, compared with the existing decorative board, the source of formaldehyde release is greatly reduced; and the flat base card of the present application Reinforced with pine boards, the adhesive film is firmly locked inside, and does not come into direct contact with the atmospheric environment, which greatly reduces the amount of formaldehyde released.

In addition, the decorative board prepared in Example 2 was subjected to performance tests, including a cold cycle test and a high temperature resistance heat cycle test. The test results show that the decorative board prepared in Example 2 does not crack at -20°C, and the high temperature thermal cycle test shows that the decorative board can withstand a high temperature of 260°C.

Because the planar base card of the present application can fill the depressions and accommodating protrusions on the surface of the wooden board core, when the planar base card is hot-pressed on the pine board with a hot press, the surface of the prepared decorative board is relatively smooth.

Example 3

1: Preparation of dry carrier substrate:

The 1.2 denier 51mm PET staple fiber is formed through bale opener, pre-opener, large warehouse mixing, fine opener, finishing cotton box, roller type double carding machine, spunlace, front 100°C hot gloss calendering and dehydration , The back is obtained by hot gloss calendering at 150°C, dehydration and drying. Among them, the weight of the dry method carrier substrate is 100g/㎡ after drying and curing.

2: Preparation of soaking slurry:

In terms of mass percentage, including the following raw materials: urea, acrylate dispersant, ground calcium carbonate water slurry, styrene polymer emulsion, potato starch, zirconium carbonate amine water repellent, composite emulsion anti-sticking and waterproofing agent, dry film anti-corrosion agent Mildew agent, sodium stearate lubricant, AMP-95 auxiliary agent, sodium polyacrylate rheological agent and silicon type defoamer are compounded to obtain the soaking slurry, so that the solid content in the soaking slurry is 50%; Based on 100%, the solid content of urea is 5%, the solid content of acrylate dispersant is 3%, the solid content of heavy calcium carbonate water refining is 10%, the solid content of styrene polymer emulsion is 20%, the solid content of potato starch is 53%, zirconium carbonate ammonium 4% solid content of anti-water agent, 0.5% solid content of composite emulsion anti-sticking and waterproof agent, 1% solid content of dry film antifungal agent, 1% solid content of sodium stearate lubricant, 0.5% solid content of AMP-95 additive, The solid content of sodium polyacrylate rheological agent is 0.5%, the solid content of silicon defoamer is 1.5%, the particle size and fineness of ground calcium carbonate water grinding slurry are 5 microns; the pH of the soaking slurry is 7, and the viscosity of the soaking slurry is 100mpa. s (if the viscosity is high, it can be adjusted with water to make the final slurry viscosity 100mpa.s).

3: Preparation of Planar Base Cards:

Immerse the dry-process carrier substrate in the dipping slurry once, and uniformly match the dipping slurry and the dry-process carrier substrate through the dipping equipment, and control the metering, drying, calender calendering, and winding to obtain a flat substrate. Cards, wherein after the flat base card is dried and solidified, the grammage of the plane base card is 200g/㎡, and the slurry loaded on the carrier substrate is 100g/㎡.

4: The specific application of the flat base card, that is, the preparation of a decorative board:

Step 1): Sanding the rubber wood board with a 100-mesh abrasive belt;

Step 2): Paste the wear-resistant paper on the surface of the rubber wood board, the weight of the wear-resistant paper is 110g/㎡;

Step 3): Paste the flat base card on the surface of the wear-resistant paper, press the flat base card with a hot press at a temperature of 140°C, and reinforce the flat base card and the rubber wood board through the bonding function of the wear-resistant paper .

The decorative board prepared by Example 3 of the present application does not contain formaldehyde in the flat base card. Although the wear-resistant paper contains formaldehyde, compared with the existing decorative board, the source of formaldehyde release is greatly reduced; and the flat base card of the present application Reinforced with rubber wood boards, the wear-resistant paper is firmly locked inside, and does not directly contact with the atmospheric environment, so that the formaldehyde emission is greatly reduced.

In addition, the decorative board prepared in Example 3 was subjected to performance tests, including a cold cycle test and a high temperature resistance heat cycle test. The test results show that the decorative plate prepared in Example 3 does not crack at -20°C, and the decorative plate can withstand a high temperature of 260°C without coking or carbonization.

Moreover, according to the above description, because the planar base card of the present application can fill the depressions and accommodating protrusions on the surface of the wooden board core-rubber wood board, when the plane base card is hot-pressed on the wooden board core with a hot press, the prepared decoration The surface of the board is relatively flat.

Example 4

1: Preparation of semi-wet carrier substrate:

The 1.1-denier 45mm PET staple fiber is formed through bale opener, pre-opener, large warehouse mixing, fine opener, finishing box, roller type double carding machine, spunlace, front 90°C hot gloss calendering and dehydration , The back is obtained by hot gloss calendering at 150°C, dehydration and drying. Among them, the weight of the semi-wet carrier substrate after drying and curing is 75g/㎡.

2: Preparation of soaking slurry:

In terms of mass percentage, including the following raw materials: urea, sodium polyacrylate dispersant, heavy calcium carbonate water slurry and talcum powder, butadiene-styrene polymer emulsion, potato starch, PAPU water repellent, composite emulsion repellent Sticky water repellent, dry film antifungal agent, sodium stearate lubricant, AMP-95 additive, sodium polyacrylate rheology agent and ether defoamer are compounded to obtain the soaking slurry, so that the solid content in the soaking slurry is 45%; of which, based on the solid content of 100%, the solid content of urea is 10%, the solid content of sodium polyacrylate dispersant is 0.2%, the total solid content of heavy calcium carbonate water slurry and talcum powder is 2%, butadiene-styrene The solid content of polymer emulsion is 50%, the solid content of potato starch is 25.6%, the solid content of PAPU water repellent agent is 1%, the solid content of compound emulsion anti-adhesive and waterproof agent is 1.2%, the dry film antifungal agent is 2%, sodium stearate lubrication 2% solid content of additive, 2% solid content of AMP-95 additive, 1.0% solid content of sodium polyacrylate rheological agent and 3% solid content of ether defoamer; the pH of the slurry is 10, and the viscosity of the slurry is 50mpa.s; The particle size and fineness of heavy calcium carbonate water slurry and talcum powder are both 10 microns.

3: Preparation of planar base cards:

The immersion slurry and the semi-wet carrier substrate are evenly matched by the dipping equipment, and the metering, drying, and winding are controlled to obtain a flat base card. After the flat base card is dried and solidified, the planar base card has a grammage of 175g/ ㎡, the slurry loaded on the carrier substrate is 100g/㎡.

4: The specific application of the flat base card, that is, the preparation of a decorative board:

Step 1): Sand the ecological board with a 150-mesh abrasive belt,

Step 2): Paste the PA hot-melt adhesive film on the surface of the ecological board. The weight of the PA hot-melt adhesive film is 40g/㎡;

Step 3): Paste the planar base card on the surface of the PA hot-melt adhesive film, heat press the planar base card with a hot press at a temperature of 150°C, and press the planar base card through the bonding function of the PA hot-melt adhesive film Reinforced with ecological panels.

The decorative board prepared in Example 4 of the present application, the flat base card and the PA hot-melt adhesive film do not contain formaldehyde, and the source of formaldehyde release is greatly reduced.

In addition, the decorative board prepared in Example 4 was subjected to a performance test, including a cold cycle test and a high temperature resistance heat cycle test. The test results show that the decorative plate prepared in Example 4 does not crack at -20°C, and the decorative plate can withstand a high temperature of 260°C without coking or carbonization.

Moreover, according to the above description, because the planar base card of the present application can fill the depressions and accommodating protrusions on the surface of the wooden board core-ecological board, when the plane base card is hot-pressed on the wooden board core with a hot press, the prepared decoration The surface of the board is relatively flat.

Example 5

1: Preparation of semi-wet carrier substrate:

The 1.3 denier 38mm PET staple fiber is formed through bale opener, pre-opener, large warehouse mixing, fine opener, finishing cotton box, roller type double carding machine, spunlace, hot gloss calendering at 150°C on the front side and dehydration , The back is obtained by hot gloss calendering at 150°C, dehydration and drying. Among them, the semi-wet method carrier substrate has a grammage of 125g/㎡ after drying and curing.

2: Preparation of soaking slurry:

In terms of mass percentage, including the following raw materials: urea, acrylate dispersant, silicon dioxide, acrylic polymer emulsion, tapioca starch, zirconium carbonate ammonium water repellent, fluorocarbon water repellent, dry film antifungal agent, stearic acid Sodium lubricant, AMP-95 auxiliary agent, sodium polyacrylate rheological agent and fatty alcohol defoamer are compounded to obtain the soaking slurry, so that the solid content in the soaking slurry is 55%; taking the solid content as 100%, urea Solid content of plain 3.5%, solid content of acrylate dispersant 2%, solid content of silica 3.3%, solid content of acrylic polymer emulsion 10%, solid content of tapioca starch 80%, solid content of zirconium carbonate amine water resistant agent 0.4%, fluorine The solid content of carbon waterproofing agent is 0.2%, the solid content of dry film antifungal agent is 0.1%, the solid content of sodium stearate lubricant is 0.2%, the solid content of AMP-95 additive is 0.1%, the solid content of sodium polyacrylate rheological agent is 0.1%, and The fatty alcohol defoamer has a solid content of 0.1%; the pH of the slurry is 7, the viscosity of the soaking slurry is 150mpa.s, and the fineness of the silicon dioxide particles is 25 microns.

3: Preparation of Planar Base Cards:

The soaking slurry is evenly matched with the semi-wet carrier base material by the dipping equipment, and the metering, drying and winding are controlled to obtain a flat base card. After the flat base card is dried and solidified, the planar base card has a grammage of 250g/ ㎡, the slurry loaded on the carrier substrate is 125g/㎡.

4: The specific application of the flat base card, that is, the preparation of a decorative board:

Step 1): Sand the LVTT board with a 150-mesh abrasive belt;

Step 2): Paste the surface paper on the surface of the LVTT board, the weight of the surface paper is 150g/㎡;

Step 3): Paste the flat base card on the surface of the surface paper (it can also be replaced with film paper), and press the plane base card with a hot press at a temperature of 160°C. After the bonding function of the surface paper, the plane base card Cards are reinforced with LVTT.

The decorative board prepared by Example 5 of the present application does not contain formaldehyde in the flat base card. Although the surface paper contains formaldehyde, compared with the existing decorative board, the source of formaldehyde release is greatly reduced; and the flat base card of the present application is compatible with The LVTT boards are strengthened together, and the surface paper is firmly locked in, without direct contact with the atmospheric environment, so that the amount of formaldehyde released is greatly reduced.

In addition, the decorative board prepared in Example 5 was subjected to a performance test, including a cold cycle test and a high temperature resistance heat cycle test. The test results show that the decorative board prepared in Example 5 can not be cracked or degummed at -20°C, and the decorative board can withstand a high temperature of 260°C without coking or carbonization.

In addition, because the planar base card of the present application can fill the depressions and accommodating protrusions on the surface of the wooden board core-LVTT board, when the plane base card is hot-pressed on the wooden board core with a hot press, the surface of the prepared decorative board is relatively smooth .

Example 6

1: Preparation of dry carrier substrate:

The 1.0 denier 25mm PET staple fiber is formed through bale opener, pre-opener, large warehouse mixing, fine opener, finishing cotton box, roller type double carding machine, spunlace, hot gloss calendering at 150°C on the front side and dehydration , The back is obtained by hot gloss calendering at 150°C, dehydration and drying. Among them, the dry method carrier substrate has a grammage of 50g/㎡ after drying.

2: Preparation of soaking slurry:

In terms of mass percentage, including the following raw materials: urea, sodium polyacrylate dispersant, silicon micropowder, butadiene polymer emulsion, corn starch, glyoxal water repellent, fluorocarbon water repellent, dry film antifungal agent, Sodium stearate lubricant, AMP-95 auxiliary agent, sodium polyacrylate rheological agent and ether defoamer are compounded to obtain the soaking slurry, so that the solid content in the soaking slurry is 40%; wherein the solid content is 100% Calculated, the solid content of urea is 1.6%, the solid content of sodium polyacrylate dispersant is 2.2%, the solid content of silicon micropowder is 80%, the solid content of butadiene polymer emulsion is 5%, the solid content of corn starch is 10%, and the glyoxal water resistant agent 0.4% solid content, 0.2% solid content of fluorocarbon water repellent, 0.1% solid content of dry film antifungal agent, 0.2% solid content of sodium stearate lubricant, 0.1% solid content of AMP-95 additive, rheology of sodium polyacrylate The solid content of the agent is 0.1% and the solid content of the ether defoamer is 0.1%, wherein the particle size fineness of the silicon micropowder is 0.1 micron; the pH of the soaking slurry is 5, and the viscosity of the soaking slurry is 20mpa.s.

3: Preparation of Planar Base Cards:

The immersion slurry is evenly matched with the dry-process carrier substrate through the immersion equipment, and the metering, drying, calender calender molding, and winding are controlled to obtain a flat base card. After the flat base card is dried and solidified, the flat base card The grammage is 100g/㎡, and the slurry loaded on the carrier substrate is 50g/㎡.

4: The specific application of the flat base card, that is, the preparation of a decorative board:

Step 1): Sanding the fir board with a 150-mesh abrasive belt;

Step 2): Paste the EAA hot-melt adhesive film on the surface of the fir board, the weight of the EAA hot-melt adhesive film is 20g/㎡;

Step 3): Paste the flat base card on the surface of the EAA hot-melt adhesive film, press the flat base card with a hot press at a temperature of 120°C, and bond the flat base card with the fir wood through the bonding function of the EAA hot-melt adhesive film. The boards are reinforced together.

The decorative board prepared in Example 6 of the present application, the flat base card and the EAA hot-melt adhesive film do not contain formaldehyde, and compared with the existing decorative board, the source of formaldehyde release is greatly reduced.

In addition, the decorative board prepared in Example 6 was subjected to performance tests, including a cold cycle test and a high temperature resistance heat cycle test. The test results show that the decorative board prepared in Example 6 does not crack at -20°C, and the high temperature thermal cycle test shows that the decorative board can withstand a high temperature of 260°C.

Because the plane base card of the present application can fill the depressions and accommodate protrusions on the surface of the wooden board core, when the plane base card is hot-pressed on the fir board with a hot press, the surface of the prepared decorative board is relatively smooth.

Finally, compared with Example 1, the application also provides the performance comparison of the comparative examples prepared by different components and parameters, as follows:

It should be understood that the above description is only a specific embodiment of the present disclosure, but the scope of protection of the present disclosure is not limited thereto. Any skilled person in the technical field can easily think of changes or changes within the technical scope of the present disclosure. Any replacement should be covered within the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be determined by the protection scope of the claims.

Claims (15)

1. A slurry for use in preparing a planar base card, comprising: the solid content of the slurry is 40-60% in mass percent, and the slurry comprises the following raw materials in 100% in mass percent: 0.2% -5% of dispersant solid content, 2% -80% of inorganic powder solid content, 5% -50% of latex solid content, 10% -80% of starch solid content, 0.4% -8% of water repellent agent solid content, 0.2% -2% of waterproofing agent or anti-sticking waterproofing agent solid content, 0.1% -2% of dry film mildew preventive solid content and 0.2% -2% of lubricant solid content.

2. The slurry for leaching according to claim 1, wherein: the slurry soaking slurry also comprises the following raw materials: urea solid content 0.5-10%, assistant solid content 0.1-2%, rheologic agent solid content 0.1-1%, defoaming agent solid content 0.1-3%.

3. The slurry according to claim 1 or 2, characterized in that: the viscosity of the slurry is 20 mpa.s-200 mpa.s, and the pH value is controlled between 5 and 10.

4. A leach slurry according to claim 1 or 2 or 3, characterized in that: the dispersant comprises sodium polyacrylate dispersant and/or acrylate dispersant;

the inorganic powder comprises dry powder and/or water-milled pulp, the dry powder comprises one or more of micro silicon powder, silicon micropowder, silicon dioxide, heavy calcium carbonate and light calcium carbonate, and the water-milled pulp comprises one or more of heavy calcium carbonate water-milled pulp, light calcium carbonate water-milled pulp and talcum powder; the fineness of the particle size of the inorganic powder is 0.1-25 microns;

the latex comprises one or more combinations of an acrylic polymer emulsion, a butadiene polymer emulsion, a styrene polymer emulsion, and a butadiene-styrene polymer emulsion;

the starch comprises one or more of corn, tapioca, wheat, potato, soybean and potato raw starch, modified starch and oxidized starch;

The water repellent agent comprises one or more of glyoxal water repellent agent, zirconium potassium carbonate water repellent agent, zirconium amine carbonate water repellent agent and PAPU water repellent agent;

the waterproof agent comprises fluorocarbon and/or hyperbranched polymer, and the anti-sticking waterproof agent comprises a composite emulsion of liquid paraffin and polydimethylsiloxane;

the dry film mildew preventive is prepared by compounding zinc pyrithione and zinc oxide;

the lubricant is sodium stearate lubricant;

the urea is chemical nitrogenous fertilizer urea;

the auxiliary agent is AMP-95 auxiliary agent;

the rheological agent comprises sodium polyacrylate rheological agent;

the defoaming agent is one or a combination of more of ether defoaming agent, fatty alcohol defoaming agent, silicon defoaming agent and enzyme defoaming agent.

5. A planar base card, characterized in that: the composite material is prepared by uniformly matching a carrier substrate with the slurry of the slurry dipping in any one of claims 1 to 4 and drying; the carrier base material comprises a semi-wet carrier base material and a dry carrier base material, wherein the semi-wet carrier base material is prepared by adopting a PET (polyethylene terephthalate) staple fiber raw material with the denier of 1.0-1.4 and the denier of 25-51 mm, and is obtained by carrying out hot-gloss calendering at the front side of 60-150 ℃ and hot-gloss calendering at the back side of 60-150 ℃, and the dry carrier base material is obtained by drying the semi-wet carrier base material;

The gram weight of the plane base card is 100 g/square meter to 300 g/square meter, and the gram weight of the carrier base material after being dried is 50 g/square meter to 150 g/square meter.

6. A planar base card as set forth in claim 5, wherein: the solid content gram weight of the slurry of the dipping slurry loaded on the carrier substrate is 50 g/square meter to 150 g/square meter.

7. A planar base card as set forth in claim 5, wherein: the viscosity of the slurry is 20 mpa.s-200 mpa.s, and the pH value of the slurry is controlled to be 5-10.

8. A planar base card as set forth in claim 5, wherein: the semi-wet carrier base material is prepared by molding PET short fiber raw materials through a bale opener, a pre-opener, a large bin mixer, a fine opener, a last cotton box, a roller type double-carding machine or a roller type three-carding machine, hydroentangling, hot-glossy calendering and dehydration at the temperature of a front side of 60-150 ℃ and hot-glossy calendering and dehydration at the temperature of a back side of 60-150 ℃.

9. A method for manufacturing a planar base card according to any one of claims 5 to 8, characterized in that: the carrier base material is evenly matched with the slurry of the dipping slurry for two times or once, and the carrier base material is obtained by controlling metering, drying, calendaring molding by a calendaring machine or non-calendaring rolling and rolling.

10. Use of the planar base card of any one of claims 5-8 in the manufacture of a decorative sheet material.

11. A dalle, characterized in that: comprising a wood board core, and adhesive film paper, surface paper, wear-resistant paper, hot melt adhesive film or hot melt adhesive net film, and the planar base card of any one of claims 5-8, which are sequentially adhered on the surface of the wood board core.

12. A decorative panel according to claim 11, wherein: the wood board core adopts the material as follows: one of oak board, rubber wood board, pine board, fir board, LVTT board, ecological board and multilayer board; the gram weight of the adhesive film paper, the surface paper, the wear-resistant paper, the hot melt adhesive film or the hot melt adhesive net film is 20-200 grams per square meter.

13. A decorative panel according to claim 11 or 12, wherein: the adhesive film paper and the surface paper are prepared from melamine resin, urea-formaldehyde resin and paper, and the wear-resistant paper is prepared from melamine resin, aluminum oxide and paper; the hot melt adhesive film or film comprises TPU, EVA, PES, PA, PO and EAA.

14. The method for producing a decorative sheet material according to any one of claims 11 to 13, characterized in that: the method comprises the following steps: step 1: sanding the surface of the wood board core by using an abrasive belt with 80-150 meshes; step 2: sticking adhesive film paper, surface paper, wear-resistant paper, hot melt adhesive film or hot melt adhesive net film on the surface of the wooden board core; step 3: and (5) thermally attaching the planar base card.

15. The method of manufacturing according to claim 14, wherein: the wooden board core in the step 1) adopts one of a oak board, a rubber wood board, a pine board, a LVTT board, a fir board, an ecological board and a multilayer board; in the step 2, the weight of the bond paper, the surface paper, the wear-resistant paper, the hot melt adhesive film or the hot melt adhesive net film is 20-200 g/square meter; when the adhesive film paper, the surface paper or the wear-resistant paper is adopted in the step 2), the conditions for thermally attaching the plane base card in the step 3) are as follows: the hot pressing temperature is 100-170 ℃; when the hot melt adhesive film or the hot melt adhesive net film is adopted in the step 2), the hot sticking plane base card condition in the step 3) is as follows: the hot pressing temperature is 100-150 ℃;

the method comprises the following steps: step 1: sanding the surface of the wood board core by using an abrasive belt with 80-150 meshes; step 2: compounding the hot melt adhesive film or the hot melt adhesive net film with the plane base card and attaching the hot melt adhesive film or the hot melt adhesive net film to the surface of the wood board core; step 3: and hot-pressing the planar base card by a hot press at 100-150 ℃.