CN116709727A - A drive motor controller partitioned liquid cooling plate - Google Patents
A drive motor controller partitioned liquid cooling plate Download PDFInfo
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- CN116709727A CN116709727A CN202310566410.1A CN202310566410A CN116709727A CN 116709727 A CN116709727 A CN 116709727A CN 202310566410 A CN202310566410 A CN 202310566410A CN 116709727 A CN116709727 A CN 116709727A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20254—Cold plates transferring heat from heat source to coolant
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20281—Thermal management, e.g. liquid flow control
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02T—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
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Abstract
The utility model provides a driving motor controller subregion liquid cooling board, includes the controller shell, the controller shell inboard is equipped with the radiating base plate, seal through the sealing washer between radiating base plate and the controller shell and form the liquid cooling board runner, the up end of radiating base plate is equipped with the IGBT module, the lower terminal surface of radiating base plate is equipped with the heat dissipation post that corresponds with the IGBT module, the heat dissipation post is located the liquid cooling board runner, the liquid cooling board runner includes two runner areas, corresponds with two IGBT half-bridges of IGBT module respectively, is first runner area, second runner area from runner import to runner export respectively; the parameters of the liquid cooling plate flow channel meet the relation formula:
Description
Technical Field
The application relates to the technical field of motor controllers, in particular to a partition liquid cooling plate of a driving motor controller.
Background
Under the background of global energy structure upgrading and transformation, the new energy automobile industry has entered into a fast-developing "fast lane", and along with the forward development of electric drive of new energy automobiles in the directions of high integration, high torque density, high power density and high safety level, the heat loss of a motor controller and an electronic power device is greatly increased, higher requirements are put forward on heat dissipation, and the heat dissipation quality directly influences the safe and reliable operation of the motor controller, so that the performance of a driving motor and the performance and efficiency of the whole automobile are influenced. When the controller is in a peak operating state, its temperature will rise rapidly, once outside the safe temperature range of the controller, leading to reduced stability or failure of the controller electronics and even burning out of critical components.
At present, the problem of the liquid cooling plate of the motor controller in the prior art is that cooling liquid enters the liquid cooling plate flow channel from the liquid cooling plate inlet, and the cooling liquid continuously absorbs heat in the flowing process from the liquid cooling plate inlet to the liquid cooling plate outlet, so that the temperature of the cooling liquid is continuously increased. The temperature of the cooling liquid close to the inlet area of the liquid cooling plate flow channel is low, the heat dissipation effect of the corresponding IGBT (i.e. insulated gate bipolar transistor) half-bridge is good, and the temperature of the IGBT half-bridge is low; the temperature of the cooling liquid near the outlet area of the liquid cooling plate flow channel is high, the heat dissipation effect of the corresponding IGBT half-bridge is poor, the temperature rise of the IGBT half-bridge is easy to exceed the standard, and the IGBT module is easy to fail or burn; meanwhile, the temperature distribution of the radiating substrate is uneven, the temperature difference is large, larger periodic thermal stress can be generated by the IGBT module in the operation process, and the safe and stable operation of the electronic device is affected seriously.
However, the runner structure of the existing controller liquid cooling plate is designed by experience, repeated tests and die change are needed, the test period is long, the design efficiency is low, and the product development cost and the development period are increased. The lack of a structural design method of a controller liquid cooling plate flow channel is unreasonable in structural design, uneven cooling of the liquid cooling plate is easy to occur, and the local temperature rise of the IGBT module exceeds the standard, so that a power device is invalid or burnt out; meanwhile, the temperature distribution of the radiating substrate is uneven, the IGBT module can generate larger periodic thermal stress in the operation process, and the normal operation of the electronic device is affected when serious.
Disclosure of Invention
The application aims to overcome the defects in the prior art, provides a partition liquid cooling plate of a driving motor controller, and solves the technical problems of long design period and long die changing period of a design method of a liquid cooling plate flow channel structure in the prior art.
The purpose of the application is realized in the following way:
the utility model provides a driving motor controller subregion liquid cooling board, includes the controller shell, the controller shell inboard is equipped with the radiating base plate, seal through the sealing washer between radiating base plate and the controller shell and form the liquid cooling board runner, be equipped with on the controller shell with the runner import and the runner export of liquid cooling board runner intercommunication, the up end of radiating base plate is equipped with the IGBT module, the lower terminal surface of radiating base plate is equipped with the heat dissipation post that corresponds with the IGBT module, the heat dissipation post is located the liquid cooling board runner, the liquid cooling board runner includes two runner regions, corresponds with two IGBT half-bridges of IGBT module respectively, is first runner region, second runner region from runner import to runner export respectively;
wherein the length of the IGBT half-bridge is L, the width of the IGBT half-bridge is B, the height of the heat dissipation column is h, and the diameter of the heat dissipation column in the first flow passage area is d 1 The column spacing between the heat dissipation columns of the first flow channel area is s 1 The row spacing between the heat dissipation columns of the first flow channel area is c 1 The diameter of the heat dissipation column of the second flow passage area is d 2 The column spacing between the heat dissipation columns of the second flow passage area is s 2 And the row spacing between the heat dissipation columns of the second flow channel area is c 2 The relation between the two formulas is as follows:
further, the liquid cooling plate flow channel comprises three flow channel regions which respectively correspond to the three IGBT half-bridges of the IGBT module, and a first flow channel region, a second flow channel region and a third flow channel region are respectively arranged from a flow channel inlet to a flow channel outlet of the liquid cooling plate flow channel;
wherein the length of the IGBT half-bridge is L, the width of the IGBT half-bridge is B, the height of the heat dissipation column is h, and the diameter of the heat dissipation column in the first flow passage area is d 1 The column spacing between the heat dissipation columns of the first flow channel area is s 1 The row spacing between the heat dissipation columns of the first flow channel area is c 1 The diameter of the heat dissipation column of the second flow passage area is d 2 The column spacing between the heat dissipation columns of the second flow passage area is s 2 The row spacing between the heat dissipation columns of the second flow passage area is c 2 The diameter of the heat dissipation column of the third flow passage area is d 3 The column spacing between the heat dissipation columns of the third flow passage area is s 3 The row spacing between the heat dissipation columns of the third flow passage area is c 3 The relation between the two formulas is as follows:
and/or->
Further, the length of the liquid cooling plate flow channel is l, (B is n-10) mm is less than or equal to l is less than or equal to (B is n+10) mm; and/or the width of the liquid cooling plate flow channel is b, (L-5) mm is less than or equal to b is less than or equal to (L+5) mm;
wherein B is the width of the IGBT half-bridge, L is the length of the IGBT half-bridge, and n is the number of the IGBT half-bridges.
Further, the heat dissipation columns are cylindrical, and the arrangement mode of the heat dissipation columns is fork row.
Further, the height h of the heat dissipation column is more than or equal to 3mm and less than or equal to 10mm.
Further, the heat dissipation columns are divided into three areas, namely, the heat dissipation columns of a first flow passage area corresponding to a first IGBT half-bridge of the IGBT module, the heat dissipation columns of a second flow passage area corresponding to a second IGBT half-bridge of the IGBT module and the heat dissipation columns of a third flow passage area corresponding to a third IGBT half-bridge of the IGBT module from a flow passage inlet to a flow passage outlet of the liquid cooling plate flow passage;
the diameter of the heat dissipation column of the first flow passage area is d 1 ，1mm≤d 1 Less than or equal to 5mm; the heat dissipation columns of the first flow channel region are arranged at intervals along a first preset direction, and the column spacing between two adjacent heat dissipation columns is s 1 ，1mm≤s 1 -d 1 The heat dissipation columns in the first flow channel area are arranged at intervals along the second preset direction, and the row spacing between two adjacent rows of heat dissipation columns is c 1 ，1mm≤c 1 -d 1 ≤5mm；
The diameter of the heat dissipation column of the second flow passage area is d 2 ，1mm≤d 2 Less than or equal to 5mm; the heat dissipation columns of the second flow channel region are arranged at intervals along the first preset direction, and the column spacing between two adjacent heat dissipation columns is s 2 ，1mm≤s 2 -d 2 The heat dissipation columns in the second flow channel area are arranged at intervals along the second preset direction, and the row spacing between two adjacent rows of heat dissipation columns is c 2 ，1mm≤c 2 -d 2 ≤5mm；
The diameter of the heat dissipation column of the third flow passage area is d 3 ，1mm≤d 3 Less than or equal to 5mm; the heat dissipation columns of the third flow passage area are arranged at intervals along the first preset direction, and the column spacing between two adjacent heat dissipation columns is s 3 ，1mm≤s 3 -d 3 The heat dissipation columns of the third flow passage area are arranged at intervals along the second preset direction, and the row spacing between two adjacent rows of heat dissipation columns is c 3 ，1mm≤c 3 -d 3 ≤5mm。
Further, the heat dissipation columns of the first flow channel region are arranged at intervals along a first preset direction, and the number of the heat dissipation columns in each row is thatThe heat dissipation columns of the first flow channel region are arranged at intervals along a second preset direction, and the row number of the heat dissipation columns is that
The heat dissipation columns of the second flow channel area are arranged at intervals along the first preset direction, and each row of heat dissipation columns is distributedThe number of the heat columns isThe heat dissipation columns of the second flow channel area are arranged at intervals along a second preset direction, and the row number of the heat dissipation columns is +.>
The heat dissipation columns of the third flow passage area are arranged at intervals along the first preset direction, and the number of each row of heat dissipation columns is thatThe heat dissipation columns of the third flow passage area are arranged at intervals along a second preset direction, and the row number of the heat dissipation columns is +.>Wherein the symbol []Representing an integer.
Further, a groove for forming a liquid cooling plate runner is formed in the inner side of the controller shell, a runner inlet and a runner outlet of the liquid cooling plate runner are respectively formed in two sides of the bottom of the groove, and a sealing groove matched with the sealing ring is formed in the controller shell and close to the groove.
Further, the heat dissipation substrate is made of copper or silicon carbide aluminum materials, and the heat dissipation column is made of aluminum or aluminum alloy or copper materials.
Further, the controller housing is made of aluminum or aluminum alloy materials.
Compared with the prior art, the partition liquid cooling plate for the driving motor controller has the beneficial effects that for the liquid cooling plate for the driving motor controller, the relation between the specific parameter size and the arrangement position of the heat dissipation columns in the liquid cooling plate flow channel can be conveniently obtained through the calculation formula related to the structural parameters and the arrangement parameters of the heat dissipation columns in the liquid cooling plate flow channel, and the calculation formula is obtained according to the external forced convection heat transfer rule, so that the liquid cooling plate can select and calculate the specific size and the arrangement position of the heat dissipation columns in the flow channel on the basis of ensuring the temperature uniformity and the heat dissipation performance, the design process of the liquid cooling plate flow channel structure for the driving motor controller is simplified, and the design period and the die change period of the liquid cooling plate flow channel for the driving motor controller are greatly reduced. Therefore, by the technical scheme provided by the application, the technical problems of long design and die changing period of a design method of the liquid cooling plate flow channel structure of the driving motor controller in the prior art can be solved.
Drawings
The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this specification, illustrate embodiments of the application and together with the description serve to explain the application.
FIG. 1 is a schematic diagram of a liquid cooling plate structure of a partition of a driving motor controller;
FIG. 2 is a schematic view of the outside structure of the controller housing;
FIG. 3 is a sectional view of a drive motor controller zone liquid cooling plate;
FIG. 4 is a side view of a drive motor controller zone liquid cooling plate;
fig. 5 is a schematic structural diagram of an IGBT module on a heat dissipating substrate;
fig. 6 is a schematic structural diagram of a heat dissipation post on a heat dissipation substrate.
Reference numerals: the IGBT module 1, the first IGBT half-bridge 11, the second IGBT half-bridge 12, the third IGBT half-bridge 13, the controller housing 2, the heat dissipation substrate 3, the liquid cooling plate runner 4, the first runner area 41, the second runner area 42, the second runner area 43, the runner inlet 44, the runner outlet 45, the heat dissipation post 5 and the sealing ring 6.
Detailed Description
It should be noted that, without conflict, the embodiments of the present application and features of the embodiments may be combined with each other. The application will be described in detail below with reference to the drawings in connection with embodiments.
Referring to fig. 1 to 6, a partition liquid cooling plate of a driving motor controller comprises a controller housing 2, a heat dissipation substrate 3 is arranged on the inner side of the controller housing 2, a liquid cooling plate runner 4 is formed by sealing between the heat dissipation substrate 3 and the controller housing 2 through a sealing ring 6, a runner inlet 44 and a runner outlet 45 which are communicated with the liquid cooling plate runner 4 are arranged on the controller housing 2, a groove for forming the liquid cooling plate runner 4 is arranged on the inner side of the controller housing 2, a runner inlet 44 and a runner outlet 45 of the liquid cooling plate runner 4 are respectively arranged on two sides of the groove bottom of the groove, a sealing groove matched with the sealing ring 6 is arranged on the controller housing 2 and is close to the groove, and the sealing ring 6 is positioned in the sealing groove to seal a gap between the controller housing 2 and the heat dissipation substrate 3. The upper end face of the heat dissipation substrate 3 is provided with an IGBT module, the lower end face of the heat dissipation substrate 3 is provided with a heat dissipation column 5 corresponding to the IGBT module 1, the heat dissipation column 5 is positioned in the liquid cooling plate flow channel 4, and a small gap can be reserved between the heat dissipation column 5 and the bottom of the groove of the controller shell 2. The liquid cooling plate runner 4 comprises two runner areas which respectively correspond to the two IGBT half-bridges of the IGBT module 1, and a first runner area 41 and a second runner area 42 are respectively arranged from a runner inlet 44 to a runner outlet 45;
wherein the length of the IGBT half-bridge is L, the width of the IGBT half-bridge is B, the height of the heat dissipation column is h, and the diameter of the heat dissipation column in the first flow passage area is d 1 The column spacing between the heat dissipation columns of the first flow channel area is s 1 The row spacing between the heat dissipation columns of the first flow channel area is c 1 The diameter of the heat dissipation column of the second flow passage area is d 2 The column spacing between the heat dissipation columns of the second flow passage area is s 2 And the row spacing between the heat dissipation columns of the second flow channel area is c 2 The relation between the two formulas is as follows:
preferably, the liquid cooling plate runner 4 includes three runner areas corresponding to three IGBT half-bridges of the IGBT module 1, and the first runner area 41, the second runner area 42, and the third runner area 43 are respectively from the runner inlet 44 to the runner outlet 45 of the liquid cooling plate runner 4;
wherein the length of the IGBT half-bridge is L, and the IGBT half-bridgeThe width is B, the height of the heat dissipation column is h, and the diameter of the heat dissipation column in the first flow passage area is d 1 The column spacing between the heat dissipation columns of the first flow channel area is s 1 The row spacing between the heat dissipation columns of the first flow channel area is c 1 The diameter of the heat dissipation column of the second flow passage area is d 2 The column spacing between the heat dissipation columns of the second flow passage area is s 2 The row spacing between the heat dissipation columns of the second flow passage area is c 2 The diameter of the heat dissipation column of the third flow passage area is d 3 The column spacing between the heat dissipation columns of the third flow passage area is s 3 The row spacing between the heat dissipation columns of the third flow passage area is c 3 The relation between the two formulas is as follows:
and/or->
It should be noted that, the liquid cooling plate flow channel 4 of this embodiment is a cooling liquid flow channel, and the main function of the partition liquid cooling plate of the driving motor controller is to dissipate heat for the IGBT module 1, and through the cooling liquid flowing through the liquid cooling plate flow channel 4, the heat loss of the IGBT module 1 is taken away, the temperature rise of the IGBT module 1 is reduced, the IGBT module is operated in a safe temperature range, and the reliability of the stable operation of the controller is ensured.
By adopting the driving motor controller partition liquid cooling plate provided by the embodiment, the relation among a plurality of specific parameter sizes of the driving motor controller partition liquid cooling plate runner structure can be obtained according to the relation and the rule of forced convection heat transfer outside the fluid horizontal tube bundles in the heat dissipation process, and the relation is based on the influence rule of the diameter of the heat dissipation columns 5 of the driving motor controller partition liquid cooling plate, the column spacing between the heat dissipation columns 5 and the row spacing between the heat dissipation columns 5 on the heat dissipation performance of the driving motor controller partition liquid cooling plate and the temperature distribution of the heat dissipation substrate 3, so that the uniformity of the temperature distribution of the heat dissipation substrate 3 is improved, the risk of exceeding the standard of the local temperature rise of the IGBT module 1 is reduced, the periodic thermal stress of the IGBT module is reduced, and the reliability of stable operation of the driving motor controller is improved.
By adopting the driving motor controller partition liquid cooling plate provided by the embodiment, the relation between the specific parameter size and the arrangement position of the cooling column 5 of the driving motor controller partition liquid cooling plate flow passage structure can be conveniently obtained through the calculation formula of the parameters related to the liquid cooling plate flow passage structure, so that the design process of the driving motor controller liquid cooling plate flow passage structure is simplified, and the design period and the test period of the driving motor controller liquid cooling plate flow passage structure are greatly reduced. Therefore, the partition liquid cooling plate of the driving motor controller can solve the technical problems of long design period and test period of a liquid cooling plate design method of the driving motor controller in the prior art.
Specifically, the length of the liquid cooling plate flow channel 4 is l, (B x n-10) mm is less than or equal to l (B x n+10) mm; and/or the width of the liquid cooling plate flow channel 4 is b, (L-5) mm is less than or equal to b and less than or equal to (L+5) mm;
wherein B is the width of the IGBT half-bridge, L is the length of the IGBT half-bridge, and n is the number of the IGBT half-bridges. The number n=3 of IGBT half-bridges in this embodiment is a common number of IGBT half-bridges for driving a motor controller IGBT module in the electric automobile industry. The length and the width of the liquid cooling plate flow channel 4 respectively meet the two relational expressions, so that the defect of insufficient heat dissipation capability or poor temperature uniformity of the heat dissipation substrate 3 caused by too small length and width of the liquid cooling plate flow channel 4 can be prevented, and the increase of material cost and volume caused by oversized partition liquid cooling plate structure of the driving motor controller can be prevented.
Specifically, the heat dissipation columns 5 are cylindrical, and the arrangement mode of the heat dissipation columns 5 is a fork row. The heat dissipation columns are arranged at intervals along a first preset direction, and the heat dissipation columns are arranged at intervals along a second preset direction. Therefore, the turbulence disturbance intensity of the cooling liquid in the liquid cooling plate flow channel 3 can be improved, the forced convection heat transfer performance is further enhanced, the heat dissipation capacity of the controller liquid cooling plate is improved, and the temperature rise of the IGBT module is reduced. The first preset direction in this embodiment is the width direction of the liquid-cooling plate flow channel 4, and the second preset direction is the length direction of the liquid-cooling plate flow channel 4.
Specifically, the height h of the heat dissipation column (5) is more than or equal to 3mm and less than or equal to 10mm, so that a good heat dissipation effect can be obtained.
Specifically, the heat dissipation columns 5 are divided into three areas, namely, a heat dissipation column of a first flow channel area corresponding to the first IGBT half-bridge 11 of the IGBT module 1, a heat dissipation column of a second flow channel area corresponding to the second IGBT half-bridge 12 of the IGBT module 1, and a heat dissipation column of a third flow channel area corresponding to the third IGBT half-bridge 13 of the IGBT module 1 from the flow channel inlet 44 to the flow channel outlet 45 of the liquid cooling plate flow channel 4; from a runner inlet 44 to a runner outlet 45 of the liquid cooling plate runner 4, the cooling liquid continuously absorbs the heat loss of the IGBT module 1 in the flowing process, the temperature of the cooling liquid continuously rises, and the heat dissipation capacity of the cooling liquid gradually weakens; the liquid cooling plate flow channel 4 is divided into a first flow channel region 41, a second flow channel region 42 and a third flow channel region 43, so that different heat dissipation column structure parameters and arrangement positions are designed in different flow channel regions according to the temperature change rule of the cooling liquid, the heat dissipation uniformity of the liquid cooling plate can be ensured, and the power device failure or damage caused by the exceeding of the temperature rise of the third IGBT half-bridge 13 is prevented.
The diameter of the heat dissipation column of the first flow passage area is d 1 ，1mm≤d 1 Less than or equal to 5mm; the heat dissipation columns of the first flow channel region are arranged at intervals along a first preset direction, and the column spacing between two adjacent heat dissipation columns is s 1 ，1mm≤s 1 -d 1 The heat dissipation columns in the first flow channel area are arranged at intervals along the second preset direction, and the row spacing between two adjacent rows of heat dissipation columns is c 1 ，1mm≤c 1 -d 1 ≤5mm；
The diameter of the heat dissipation column of the second flow passage area is d 2 ，1mm≤d 2 Less than or equal to 5mm; the heat dissipation columns of the second flow channel region are arranged at intervals along the first preset direction, and the column spacing between two adjacent heat dissipation columns is s 2 ，1mm≤s 2 -d 2 The heat dissipation columns in the second flow channel area are arranged at intervals along the second preset direction, and the row spacing between two adjacent rows of heat dissipation columns is c 2 ，1mm≤c 2 -d 2 ≤5mm；
The saidThe diameter of the heat dissipation column of the third flow passage area is d 3 ，1mm≤d 3 Less than or equal to 5mm; the heat dissipation columns of the third flow passage area are arranged at intervals along the first preset direction, and the column spacing between two adjacent heat dissipation columns is s 3 ，1mm≤s 3 -d 3 The heat dissipation columns of the third flow passage area are arranged at intervals along the second preset direction, and the row spacing between two adjacent rows of heat dissipation columns is c 3 ，1mm≤c 3 -d 3 ≤5mm。
According to the process feasibility, when the diameter of the heat dissipation post 5 is smaller than 1mm, the processing difficulty of the heat dissipation post of the heat dissipation substrate is obviously increased; when the diameter of the heat dissipation column 5 is larger than 5mm, a larger vortex area is generated behind the heat dissipation column 5, so that the convection heat transfer performance of the liquid cooling plate is obviously reduced. The column spacing between two adjacent heat dissipation columns 5 in the first flow channel region 41, the column spacing between two adjacent heat dissipation columns 5 in the second flow channel region 42 and the column spacing between two adjacent heat dissipation columns 5 in the third flow channel region 43 respectively satisfy the three relational expressions, so that the flow channel of the liquid cooling plate can satisfy the requirement of flow resistance loss, and the forced convection heat transfer performance of the liquid cooling plate is ensured; when the size of the flow channel between two adjacent heat dissipation columns is smaller than 1mm, the flow resistance loss in the liquid cooling plate flow channel can be obviously increased due to the fact that the flow channel is too narrow and the flow channel sectional area is too small, so that the flow speed is too high; when the size of the flow channel between two adjacent heat dissipation columns is larger than 5mm, the flow velocity is too small due to the too large sectional area of the fluid flow channel, so that the forced convection heat transfer performance in the liquid cooling plate flow channel is obviously reduced. The row spacing between two adjacent rows of heat dissipation columns 5 in the first flow channel region 41, the row spacing between two adjacent rows of heat dissipation columns 5 in the second flow channel region 42 and the row spacing between two adjacent rows of heat dissipation columns 5 in the third flow channel region 43 respectively satisfy the three relational expressions, so that the liquid cooling plate flow channel can satisfy the requirement of flow resistance loss, and the forced convection heat transfer total area of the heat dissipation columns 5 in the liquid cooling plate flow channel 4 is ensured, so as to satisfy the heat dissipation capacity requirement of the liquid cooling plate.
Specifically, the heat dissipation columns in the first flow channel region are arranged at intervals along a first preset direction, and the number of each row of heat dissipation columns is thatThe heat dissipation columns of the first flow channel region are arranged at intervals along a second preset direction, and the row number of the heat dissipation columns is that
The heat dissipation columns of the second flow channel area are arranged at intervals along the first preset direction, and the number of each row of heat dissipation columns is thatThe heat dissipation columns of the second flow channel area are arranged at intervals along a second preset direction, and the row number of the heat dissipation columns is +.>
The heat dissipation columns of the third flow passage area are arranged at intervals along the first preset direction, and the number of each row of heat dissipation columns is thatThe heat dissipation columns of the third flow passage area are arranged at intervals along a second preset direction, and the row number of the heat dissipation columns is +.>Wherein the symbol []Representing an integer.
Specifically, the heat dissipation substrate 3 is made of copper or silicon carbide, and the heat dissipation post 5 is made of aluminum, aluminum alloy, or copper. The controller housing 2 is made of metal materials such as aluminum or aluminum alloy. The heat dissipation substrate 3, the heat dissipation column 5 and the controller housing 2 are made of high heat conduction materials, so that the heat conduction effect can be conveniently improved, the heat transfer capacity of the IGBT module 1 to the heat dissipation substrate 3 and the heat dissipation column 5 is improved, the heat dissipation performance of the partition liquid cooling plate of the driving motor controller is improved, the temperature rise of the IGBT module 1 is reduced, and the temperature rise reliability of the controller is improved. The heat dissipation substrate 3 and the controller housing 2 are connected in a conventional manner such as bolts, welding and the like, and the heat dissipation substrate 3 and the heat dissipation column 5 are connected in a conventional manner such as welding, integrated forming and the like.
The IGBT module is mounted on the upper end surface of the heat dissipating substrate 3, and is composed of 3 IGBT half-bridges, where the IGBT is a main heat source. The difference of the highest temperature rise of the adjacent IGBT half-bridges in the embodiment is less than or equal to 2 ℃.
The heat productivity phi of a single IGBT half-bridge, an IGBT module is composed of n IGBT half-bridges, and q is as follows m For the mass flow rate of the cooling liquid, c is the specific heat capacity of the cooling liquid, the cooling liquid flows through the liquid cooling plate flow channel to absorb the heat loss of the IGBT, the temperature of the cooling liquid is gradually increased, and the temperature difference delta t between the cooling liquid inlet and the cooling liquid outlet is formed:
the contact area between the wall surface of the liquid cooling plate flow channel and the cooling liquid is A, the convection heat transfer coefficient h' between the wall surface of the liquid cooling plate flow channel and the cooling liquid is t, and the average temperature of the wall surface of the liquid cooling plate flow channel is t Board board The average temperature of the cooling liquid is t Liquid and its preparation method Forced convection heat transfer quantity phi between liquid cooling plate flow channel wall surface and cooling liquid Convection current ：
Φ Convection current ＝h'A(t Board board -t Liquid and its preparation method )；
The Nu number of the convective heat transfer of the single-phase fluid in the liquid cooling plate flow channel is influenced by the flowing Reynolds number Re and the Planet number Pr of the cooling liquid:
Nu＝f(Re,Pr)；
the heat conductivity coefficient of the cooling liquid is lambda, the diameter of the heat dissipation column is d, and the convection heat transfer coefficient h' between the wall surface of the liquid cooling plate flow channel and the cooling liquid;
h'＝Nuλ/d；
in the cooling and radiating process of the liquid cooling plate, the heat flow in the heat transfer process meets the relation:
Φ＝Φ convection current 。
The above five formulas are all conventional theoretical formulas, and a person skilled in the art can understand the specific meaning and calculation mode thereof.
According to the heat transfer rule in the cooling and radiating process of the liquid cooling plate, through theoretical derivation, numerical simulation and experimental verification, the influence rule of the diameter of the cooling columns of the liquid cooling plate, the spacing of the rows of the cooling columns and the spacing of the rows of the cooling columns on the temperature distribution of the cooling substrate is found, the flow channel structure design method of the partition liquid cooling plate of the driving motor controller is obtained, the flow channel structure of the liquid cooling plate of the controller is rapidly designed, the design efficiency of the liquid cooling plate of the controller is improved, the test and the number of times of mould changing are reduced, the development cost of the liquid cooling plate of the driving motor controller is reduced, the uniform heat radiation performance of the liquid cooling plate is improved, the local temperature rise of an IGBT module is prevented from being too high, the thermal stress of the IGBT module is reduced, and the safety and the reliability of long-term stable operation of the driving motor controller are improved.
The partition liquid cooling plate of the driving motor controller realizes the following technical effects: the design method of the partition liquid cooling plate runner structure of the driving motor controller improves the design efficiency of the partition liquid cooling plate runner structure of the driving motor controller, reduces the test times and the die change times, shortens the development period, reduces the development cost and the test cost, reduces the risk of excessively high local temperature rise of the IGBT module, improves the temperature uniformity of the liquid cooling substrate, reduces the periodic thermal stress of the IGBT module in the operation process, meets the Wen Shengan rule requirement of a power device in the driving motor controller, and improves the long-term stable operation reliability of the driving motor controller.
It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of exemplary embodiments according to the present application. As used herein, the singular forms also are intended to include the plural forms unless the context clearly indicates otherwise, and furthermore, it is to be understood that the terms "comprises" and/or "comprising" when used in this specification are taken to specify the presence of stated features, steps, operations, devices, components, and/or combinations thereof.
The relative positions, numerical expressions and numerical values of the components and steps set forth in these embodiments do not limit the scope of the present application unless specifically stated otherwise. Meanwhile, it should be understood that the sizes of the respective parts shown in the drawings are not drawn in actual scale for convenience of description. Techniques, methods, and apparatus known to one of ordinary skill in the relevant art may not be discussed in detail, but should be considered part of the specification where appropriate. In all examples shown and discussed herein, any specific values should be construed as merely illustrative, and not a limitation. Thus, other examples of the exemplary embodiments may have different values. It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further discussion thereof is necessary in subsequent figures.
In the description of the present application, it should be understood that the azimuth or positional relationships indicated by the azimuth terms such as "front, rear, upper, lower, left, right", "lateral, vertical, horizontal", and "top, bottom", etc., are generally based on the azimuth or positional relationships shown in the drawings, merely to facilitate description of the present application and simplify the description, and these azimuth terms do not indicate and imply that the apparatus or elements referred to must have a specific azimuth or be constructed and operated in a specific azimuth, and thus should not be construed as limiting the scope of protection of the present application; the orientation word "inner and outer" refers to inner and outer relative to the contour of the respective component itself.
Spatially relative terms, such as "above … …," "above … …," "upper surface," "upper end face," and the like, may be used herein for ease of description to describe one device or feature's spatial location relative to another device or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as "above" or "over" other devices or structures would then be oriented "below" or "beneath" the other devices or structures. Thus, the exemplary term "above … …" may include both orientations of "above … …" and "below … …". The device may also be positioned in other different ways (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.
In addition, the terms "first", "second", etc. are used to define the components, and are only for convenience of distinguishing the corresponding components, and the terms have no special meaning unless otherwise stated, and therefore should not be construed as limiting the scope of the present application.
The foregoing description of the preferred embodiment of the present application has been presented for purposes of illustration and not of limitation, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included in the protection scope of the present application.
Claims (10)
1. The utility model provides a driving motor controller subregion liquid cooling board which characterized in that: the intelligent controller comprises a controller housing (2), a heat dissipation substrate (3) is arranged on the inner side of the controller housing (2), a liquid cooling plate runner (4) is formed by sealing between the heat dissipation substrate (3) and the controller housing (2) through a sealing ring (6), a runner inlet (44) and a runner outlet (45) which are communicated with the liquid cooling plate runner (4) are arranged on the controller housing (2), an IGBT module is arranged on the upper end face of the heat dissipation substrate (3), a heat dissipation column (5) corresponding to the IGBT module (1) is arranged on the lower end face of the heat dissipation substrate (3), the heat dissipation column (5) is located in the liquid cooling plate runner (4), the liquid cooling plate runner (4) comprises two runner areas which respectively correspond to two IGBT half-bridges of the IGBT module (1), and a first runner area (41) and a second runner area (42) are respectively arranged from the runner inlet (44) to the runner outlet (45).
Wherein the length of the IGBT half-bridge is L, the width of the IGBT half-bridge is B, the height of the heat dissipation column is h, and the diameter of the heat dissipation column in the first flow passage area is d 1 The column spacing between the heat dissipation columns of the first flow channel area is s 1 The row spacing between the heat dissipation columns of the first flow channel area is c 1 The diameter of the heat dissipation column of the second flow passage area is d 2 Between the heat dissipation columns of the second flow passage areaThe column spacing is s 2 And the row spacing between the heat dissipation columns of the second flow channel area is c 2 The relation between the two formulas is as follows:
2. the drive motor controller partition liquid cooling plate according to claim 1, wherein: the liquid cooling plate flow channel (4) comprises three flow channel regions which respectively correspond to three IGBT half-bridges of the IGBT module (1), and a first flow channel region (41), a second flow channel region (42) and a third flow channel region (43) are respectively arranged from a flow channel inlet (44) to a flow channel outlet (45) of the liquid cooling plate flow channel (4);
wherein the length of the IGBT half-bridge is L, the width of the IGBT half-bridge is B, the height of the heat dissipation column is h, and the diameter of the heat dissipation column in the first flow passage area is d 1 The column spacing between the heat dissipation columns of the first flow channel area is s 1 The row spacing between the heat dissipation columns of the first flow channel area is c 1 The diameter of the heat dissipation column of the second flow passage area is d 2 The column spacing between the heat dissipation columns of the second flow passage area is s 2 The row spacing between the heat dissipation columns of the second flow passage area is c 2 The diameter of the heat dissipation column of the third flow passage area is d 3 The column spacing between the heat dissipation columns of the third flow passage area is s 3 The row spacing between the heat dissipation columns of the third flow passage area is c 3 The relation between the two formulas is as follows:
and/or->
3. The drive motor controller partition liquid cooling plate according to claim 1 or 2, wherein:
the length of the liquid cooling plate flow channel (4) is l, (B is n-10) mm less than or equal to l less than or equal to (B is n+10) mm; and/or the width of the liquid cooling plate flow channel (4) is b, (L-5) mm is less than or equal to b and less than or equal to (L+5) mm;
wherein B is the width of the IGBT half-bridge, L is the length of the IGBT half-bridge, and n is the number of the IGBT half-bridges.
4. The drive motor controller partition liquid cooling plate according to claim 1 or 2, wherein: the heat dissipation columns (5) are cylindrical, and the arrangement mode of the heat dissipation columns (5) is fork row.
5. The drive motor controller partition liquid cooling plate according to claim 1 or 2, wherein: the height h of the heat dissipation column (5) is more than or equal to 3mm and less than or equal to 10mm.
6. The drive motor controller partition liquid cooling plate according to claim 2, wherein: the heat dissipation column (5) is divided into three areas, namely a heat dissipation column of a first flow channel area corresponding to a first IGBT half-bridge (11) of the IGBT module (1), a heat dissipation column of a second flow channel area corresponding to a second IGBT half-bridge (12) of the IGBT module (1) and a heat dissipation column of a third flow channel area corresponding to a third IGBT half-bridge (13) of the IGBT module (1) from a flow channel inlet (44) to a flow channel outlet (45) of the liquid cooling plate flow channel (4);
the diameter of the heat dissipation column of the first flow passage area is d 1 ，1mm≤d 1 Less than or equal to 5mm; the heat dissipation columns of the first flow channel region are arranged at intervals along a first preset direction, and the column spacing between two adjacent heat dissipation columns is s 1 ，1mm≤s 1 -d 1 The heat dissipation columns in the first flow channel area are arranged at intervals along the second preset direction, and the row spacing between two adjacent rows of heat dissipation columns is c 1 ，1mm≤c 1 -d 1 ≤5mm；
The diameter of the heat dissipation column of the second flow passage area is d 2 ，1mm≤d 2 Less than or equal to 5mm; the heat dissipation columns of the second flow channel region are arranged at intervals along the first preset direction, and the column spacing between two adjacent heat dissipation columns is s 2 ，1mm≤s 2 -d 2 The heat dissipation columns in the second flow channel area are arranged at intervals along the second preset direction, and the row spacing between two adjacent rows of heat dissipation columns is c 2 ，1mm≤c 2 -d 2 ≤5mm；
The diameter of the heat dissipation column of the third flow passage area is d 3 ，1mm≤d 3 Less than or equal to 5mm; the heat dissipation columns of the third flow passage area are arranged at intervals along the first preset direction, and the column spacing between two adjacent heat dissipation columns is s 3 ，1mm≤s 3 -d 3 The heat dissipation columns of the third flow passage area are arranged at intervals along the second preset direction, and the row spacing between two adjacent rows of heat dissipation columns is c 3 ，1mm≤c 3 -d 3 ≤5mm。
7. The drive motor controller partition liquid cooling plate according to claim 1, wherein: the heat dissipation columns of the first flow channel area are arranged at intervals along a first preset direction, and the number of each row of heat dissipation columns is thatThe heat dissipation columns of the first flow channel area are arranged at intervals along a second preset direction, and the row number of the heat dissipation columns is +.>
The heat dissipation columns of the second flow channel area are arranged at intervals along the first preset direction, and the number of each row of heat dissipation columns is thatThe heat dissipation columns of the second flow channel area are arranged at intervals along a second preset direction, and the row number of the heat dissipation columns is +.>
The heat dissipation columns of the third flow passage area are arranged at intervals along the first preset direction, and the number of each row of heat dissipation columns is thatThe heat dissipation columns of the third flow passage area are arranged at intervals along a second preset direction, and the row number of the heat dissipation columns is +.>Wherein the symbol []Representing an integer.
8. The drive motor controller partition liquid cooling plate according to claim 1, wherein: the controller is characterized in that a groove for forming the liquid cooling plate runner (4) is formed in the inner side of the controller shell (2), a runner inlet (44) and a runner outlet (45) of the liquid cooling plate runner (4) are respectively formed in two sides of the bottom of the groove, and a sealing groove matched with the sealing ring (6) is formed in the controller shell (2) close to the groove.
9. The drive motor controller partition liquid cooling plate according to claim 1, wherein: the heat dissipation substrate (3) is made of copper or silicon aluminum carbide materials, and the heat dissipation column (5) is made of aluminum or aluminum alloy or copper materials.
10. The drive motor controller partition liquid cooling plate according to claim 1, wherein: the controller shell (2) is made of aluminum or aluminum alloy materials.
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| CN202310566410.1A CN116709727B (en) | 2023-05-19 | 2023-05-19 | A partitioned liquid cooling plate for a drive motor controller |
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| CN202310566410.1A CN116709727B (en) | 2023-05-19 | 2023-05-19 | A partitioned liquid cooling plate for a drive motor controller |
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| CN116709727B CN116709727B (en) | 2025-11-04 |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN116723671A (en) * | 2023-05-19 | 2023-09-08 | 重庆青山工业有限责任公司 | Drive motor controller liquid cooling plate |
| CN116744637A (en) * | 2023-05-19 | 2023-09-12 | 重庆青山工业有限责任公司 | Drive motor controller uniform temperature liquid cooling plate |
| EP4583650A1 (en) * | 2024-01-05 | 2025-07-09 | Jing-Jin Electric Technologies Co., Ltd | Liquid cooling plate and motor controller |
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| CN113035805A (en) * | 2021-03-04 | 2021-06-25 | 阳光电源股份有限公司 | Liquid cooling plate and power module |
| CN115547957A (en) * | 2022-10-25 | 2022-12-30 | 蜂巢传动系统(江苏)有限公司保定研发分公司 | Liquid-cooled heat dissipation structure of power module heat dissipation substrate and power module |
| CN116130438A (en) * | 2022-12-27 | 2023-05-16 | 广东东勤科技有限公司 | Liquid cooling plate and electronic equipment |
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| US20160307821A1 (en) * | 2014-06-19 | 2016-10-20 | Fuji Electric Co., Ltd. | Cooler and cooler fixing method |
| CN113035805A (en) * | 2021-03-04 | 2021-06-25 | 阳光电源股份有限公司 | Liquid cooling plate and power module |
| CN115547957A (en) * | 2022-10-25 | 2022-12-30 | 蜂巢传动系统(江苏)有限公司保定研发分公司 | Liquid-cooled heat dissipation structure of power module heat dissipation substrate and power module |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN116723671A (en) * | 2023-05-19 | 2023-09-08 | 重庆青山工业有限责任公司 | Drive motor controller liquid cooling plate |
| CN116744637A (en) * | 2023-05-19 | 2023-09-12 | 重庆青山工业有限责任公司 | Drive motor controller uniform temperature liquid cooling plate |
| CN116723671B (en) * | 2023-05-19 | 2025-11-04 | 重庆青山工业有限责任公司 | liquid cooling plate for drive motor controller |
| CN116744637B (en) * | 2023-05-19 | 2026-04-17 | 重庆青山工业有限责任公司 | Drive motor controller temperature-controlled liquid cooling plate |
| EP4583650A1 (en) * | 2024-01-05 | 2025-07-09 | Jing-Jin Electric Technologies Co., Ltd | Liquid cooling plate and motor controller |
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| CN116709727B (en) | 2025-11-04 |
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