CN116815260A - Plating process of metal packaging shell of radio frequency interference filter - Google Patents
Plating process of metal packaging shell of radio frequency interference filter Download PDFInfo
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- CN116815260A CN116815260A CN202310210503.0A CN202310210503A CN116815260A CN 116815260 A CN116815260 A CN 116815260A CN 202310210503 A CN202310210503 A CN 202310210503A CN 116815260 A CN116815260 A CN 116815260A
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- gold layer
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
- C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/34—Pretreatment of metallic surfaces to be electroplated
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0247—Electrical details of casings, e.g. terminals, passages for cables or wiring
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/06—Hermetically-sealed casings
- H05K5/069—Other details of the casing, e.g. wall structure, passage for a connector, a cable, a shaft
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The application discloses a plating process of a metal packaging shell of a radio frequency interference filter, which comprises the following steps: s1, electroplating a nickel layer on the outer wall of the shell, the inner wall of the blind hole and the lead; s2, electroplating a first gold layer on the nickel layer, wherein the thickness of the first gold layer is 0.01-0.05 um; s3, electroplating a second gold layer on the first gold layer, wherein the thickness of the second gold layer is 0.09-0.15 um; s4, electroplating a third gold layer on the outer side wall of the shell and the lead wire positioned outside the blind hole, wherein the third gold layer is deposited on the second gold layer, and the thickness of the third gold layer is 0.2-0.6 um; s5, electroplating a gold layer IV on the lead wire positioned outside the blind hole, wherein the gold layer IV is deposited on the gold layer III, and the thickness of the gold layer IV is 2.5-4.2. 4.2 um. The gold layer is electroplated in multiple steps, so that the thickness of the gold layer electroplated at each part better meets the requirement, and the thickness fluctuation is smaller.
Description
Technical Field
The application relates to the technical field of plating processes of metal packaging shells, in particular to a plating process of a metal packaging shell of a radio frequency interference filter.
Background
The radio frequency interference filter comprises a metal packaging shell and a filter element arranged in the metal packaging shell, wherein the metal packaging shell plays roles of circuit support, electric signal transmission, heat dissipation, sealing, chemical protection and the like. As shown in fig. 1, the metal packaging shell comprises a shell body 1, a lead wire 2 and a substrate, wherein a sealing hole 11 is formed in the shell body 1, the lead wire 2 is arranged in the sealing hole 11 through a glass insulator 3, and blind holes 12 are formed in the inner side wall of the sealing hole 11 and the lower surface of the glass insulator 3.
In order to better meet performance requirements, firstly electroplating nickel layers on the shell and the lead, and then electroplating gold layers, wherein the thicknesses of the nickel layers and the gold layers have strict requirements, as shown in fig. 1, A2 and A3 are any three points of a lead designated area positioned outside the blind hole 12, the point A1 is any point on the end face of the lead at the open end of the shell, the point A2 is any point on the outer wall of the lead at the open end of the shell, the point A3 is any point on the outer wall of the lead at the open end of the glass insulator, the thicknesses of the nickel layers of A1, A2 and A3 are less than or equal to 3 [ mu ] m and less than or equal to (A1+A2+A3)/3 and less than or equal to 5 [ mu ] m, and the thicknesses of the gold layers are less than or equal to 2.8 [ mu ] m; b1, B2 and B3 are any three points on the outer side wall of the shell, the thickness of a nickel layer of the B1, B2 and B3 is less than or equal to 3 mu m (B1+B2+B3)/3 is less than or equal to 5 mu m, and the thickness of a gold layer is less than or equal to 0.3 mu m (B1+B2+B3)/3 is less than or equal to 0.8 mu m; c1, C2 and C3 are any three points on the inner side wall of the blind hole, the thickness of a nickel layer of the C1, C2 and C3 is less than or equal to 3 [ mu ] m (C1+C2+C3)/3 is less than or equal to 5 [ mu ] m, and the thickness of a gold layer is less than or equal to 0.1 [ mu ] m (A1+A2+A3)/3 is less than or equal to 0.2 [ mu ] m; d1, D2, D3 are the arbitrary three points on the lead wire outer wall that is located in the blind hole, and D1, D2, D3's nickel layer thickness should satisfy 3 [ mu ] m and be less than or equal to (D1+D2+D3)/3 and be less than or equal to 5 [ mu ] m, and gold layer thickness should satisfy 0.1 [ mu ] m and be less than or equal to (D1+D2+D3)/3 and be less than or equal to 0.2 [ mu ] m.
At present, the technology for plating nickel and gold on the metal packaging shell of the radio frequency interference filter comprises the following steps: firstly, a barrel plating mode is adopted to enable a nickel layer with the thickness of 3-5 um to be deposited on the shell and the lead, then, a barrel plating mode is adopted again to enable a gold layer with the thickness of 0.3-0.8 um to be deposited on the shell and the lead, and finally, a hanging plating mode is adopted to enable the lead positioned outside the blind hole to be plated with the gold layer, so that the thickness of the gold layer positioned on the lead positioned outside the shell is 2.8-5 um. However, by adopting the plating process, the thickness of the gold layer on the inner wall of the blind hole exceeds the requirement, so that the cost is increased, in addition, because the gold layer plated on the shell adopts a one-time plating mode, the shell and the lead wire need to stay in the plating bath for about 20 minutes, and the circulation of the gold plating solution in the blind hole is extremely uneven due to long-time stay, so that the thickness fluctuation of the gold layer on the inner wall of the blind hole is large and extremely uneven, and the heat dissipation performance of the metal packaging shell is influenced.
Disclosure of Invention
In order to solve at least one of the above technical problems, a plating process is developed in which the thickness of a gold layer plated on the inner wall of a blind hole can better meet the requirements, and the thickness fluctuation of the gold layer plated on the inner wall of the blind hole is small.
The application provides a plating process of a metal packaging shell of a radio frequency interference filter, which comprises the following steps:
s1, electroplating a nickel layer on the outer wall of the shell, the inner wall of the blind hole and the lead;
s2, electroplating a first gold layer on the nickel layer, wherein the thickness of the first gold layer is 0.01-0.05 um;
s3, electroplating a second gold layer on the first gold layer, wherein the thickness of the second gold layer is 0.09-0.15 um;
s4, electroplating a third gold layer on the outer wall of the shell and the lead wire positioned outside the blind hole, wherein the third gold layer is deposited on the second gold layer, and the thickness of the third gold layer is 0.2-0.6 um;
s5, electroplating a gold layer IV on the lead wire positioned outside the blind hole, wherein the gold layer IV is deposited on the gold layer III, and the thickness of the gold layer IV is 2.5-4.2. 4.2 um.
By adopting the technical scheme, the thicknesses of the gold layer on the inner wall of the blind hole and the gold layer on the lead wire in the blind hole are the same, and the gold layer on the outer wall of the shell is composed of the first gold layer to the third gold layer, and the gold layer on the lead wire outside the blind hole is composed of the first gold layer to the fourth gold layer, so that the thickness of the gold layer electroplated on each part can better meet the requirement; because the gold layer adopts electroplating in multiple steps, the residence time of the shell and the lead in the electroplating solution is shorter each time the gold layer is electroplated, so that the fluctuation of the thickness of the gold layer deposited on the inner wall of the blind hole, the outer wall of the shell and the lead is smaller and more uniform.
Optionally, the step S1 is preceded by a step of decontaminating and degreasing the shell and the lead, and performing chemical polishing treatment.
Through adopting above-mentioned technical scheme, can remove the oxide layer on casing surface and lead wire surface well to avoid appearing the bubble on casing surface, black spot and abnormal appearance such as abnormal color that lead to because of the oxide layer in the electroplating process.
Optionally, in step S1, a nickel layer is electroplated on the outer wall of the housing, the inner wall of the blind hole and the lead in a horizontal barrel plating manner, and the thickness of the nickel layer is 3-5 um.
Optionally, in step S2, the first gold plating layer is formed by horizontal barrel plating, the shell with the deposited nickel layer and the lead are integrally placed in a roller containing gold plating solution, and the roller rotates for 0.5-1 min at a rotation speed of 5-15 rpm, so that the first gold layer is deposited on the nickel layer.
Through adopting above-mentioned technical scheme, the time that casing and lead wire stayed in the gilding solution is shorter, and far lower than current dwell time can avoid the inhomogeneous problem of electroplating solution circulation in the blind hole to the thickness fluctuation of gold layer one on the lead wire in the blind hole inner wall and the blind hole is less.
Optionally, in step S3, the second gold electroplating layer is formed by horizontal barrel plating, the housing with the first gold layer deposited thereon and the lead are integrally placed in a roller containing gold plating solution, and the roller rotates at a speed of 5-15 rpm for 1-2 minutes, so that the second gold layer is deposited on the first gold layer.
By adopting the technical scheme, the sum of the thicknesses of the first gold layer and the second gold layer can better meet the requirements of the inner wall of the blind hole and the thickness of the electroplated gold layer on the lead positioned in the blind hole.
Optionally, step S4 further includes sealing the inner wall of the blind hole and the lead wire located in the blind hole before the third gold plating layer.
By adopting the technical scheme, the thickness of the inner wall of the blind hole and the thickness of the gold layer electroplated on the lead wire positioned in the blind hole are satisfied, so that the two parts are sealed, and the two parts can be prevented from continuously depositing redundant gold layers in the subsequent gold plating process.
Optionally, seal the processing with sealing fixture, sealing fixture is made by the teflon, be provided with the connecting hole on the sealing fixture, the aperture of connecting hole is less than the radial diameter of lead wire, when sealing fixture joint was on the lead wire, the lower terminal surface of blind hole was hugged closely on sealing fixture.
Through adopting above-mentioned technical scheme, when lead wire and corresponding connecting hole interference fit can avoid follow-up electroplating, the plating solution contacts with the lead wire in the blind hole, and when the lower terminal surface of blind hole is hugged closely on sealing fixture can avoid follow-up electroplating, the plating solution gets into in the blind hole 12 and then contacts with the inner wall of blind hole.
Optionally, the sealing fixture includes the backup pad, be provided with the electroplating hole in the backup pad, the electroplating hole top be provided with the boss that can embed in the blind hole in the backup pad, be provided with on the boss with the electroplating hole is linked together the connecting hole.
Optionally, a guide hole is arranged on the connecting hole.
By adopting the technical scheme, the guide hole is convenient for the lead wire to be inserted into the connecting hole.
Optionally, in step S5, the fourth electroplating layer adopts a hanging plating method.
In summary, the present application includes at least one of the following beneficial technical effects:
1. the thickness of the gold layer on the inner wall of the blind hole and the thickness of the gold layer on the lead wire in the blind hole are the same and are composed of a first gold layer and a second gold layer, the gold layer on the outer wall of the shell is composed of a first gold layer, a second gold layer and a third gold layer, and the gold layer on the lead wire outside the blind hole is composed of a first gold layer, a second gold layer, a third gold layer and a fourth gold layer, so that the thickness of the gold layer electroplated on each part can well meet the requirements.
2. Because the gold layer adopts electroplating in multiple steps, the residence time of the shell and the lead in the electroplating solution is shorter each time the gold layer is electroplated, so that the fluctuation of the thickness of the gold layer deposited on the inner wall of the blind hole, the outer wall of the shell and the lead is smaller and more uniform.
3. When the thickness of the inner wall of the blind hole and the thickness of the gold layer electroplated on the lead wire positioned in the blind hole meet the requirements, the sealing clamp is used for sealing the two parts, so that the two parts can be prevented from continuously depositing redundant gold layers in the subsequent gold plating process.
4. The sealing fixture is simple in structure and convenient to operate, and the cleaning rear shell is repeatedly used.
Drawings
FIG. 1 is a schematic view of a conventional metal package;
FIG. 2 is a schematic diagram of a sealing fixture for sealing a blind hole and a lead wire in the blind hole according to the present application;
FIG. 3 is an enlarged schematic view of the E part;
reference numerals illustrate: 1. a housing; 11. sealing the hole; 12. a blind hole; 2. a lead wire; 3. a glass insulator; 4. sealing clamp; 41. a support plate; 42. electroplating holes; 43. a boss; 44. a connection hole; 45. and a guide hole.
Detailed Description
The application is described in further detail below with reference to the drawings and examples.
The application designs a plating process of a metal packaging shell of a radio frequency interference filter.
The plating process of the metal packaging shell of the radio frequency interference filter is prepared by adopting the following method, and comprises the following steps of:
s1, electroplating a nickel layer on the outer wall of the shell, the inner wall of the blind hole and the lead;
s2, electroplating a first gold layer on the nickel layer, wherein the thickness of the first gold layer is 0.01-0.05 um;
s3, electroplating a second gold layer on the first gold layer, wherein the thickness of the second gold layer is 0.09-0.15 um;
s4, electroplating a third gold layer on the outer side wall of the shell and the lead wire positioned outside the blind hole, wherein the third gold layer is deposited on the second gold layer, and the thickness of the third gold layer is 0.2-0.6 um;
s5, electroplating a gold layer IV on the lead wire positioned outside the blind hole, wherein the gold layer IV is deposited on the gold layer III, and the thickness of the gold layer IV is 2.5-4.2. 4.2 um.
The thickness of the gold layer on the inner wall of the blind hole and the thickness of the gold layer on the lead wire in the blind hole are the same, and the gold layer on the outer wall of the shell is composed of a first gold layer to a third gold layer, and the gold layer on the lead wire outside the blind hole is composed of a first gold layer to a fourth gold layer, so that the thickness of the gold layer electroplated on each part can better meet the requirement; because the gold layer adopts electroplating in multiple steps, the residence time of the shell and the lead in the electroplating solution is shorter each time the gold layer is electroplated, so that the fluctuation of the thickness of the gold layer deposited on the inner wall of the blind hole, the outer wall of the shell and the lead is smaller and more uniform.
In the above technical solution, optionally, step S4 further includes sealing the inner wall of the blind hole and the lead wire located in the blind hole before the third gold plating layer.
By adopting the technical scheme, the thickness of the inner wall of the blind hole and the thickness of the gold layer electroplated on the lead wire positioned in the blind hole are satisfied, so that the two parts are sealed, and the two parts can be prevented from continuously depositing redundant gold layers in the subsequent gold plating process.
Example 1
A plating process of a metal packaging shell of a radio frequency interference filter comprises the following steps:
s1, decontamination and oil removal
The shell and the lead on the shell are integrally put into potassium ferricyanide solution, ultrasonic waves are utilized to carry out chemical decontamination, and tap water and deionized water are sequentially used for cleaning the shell and the lead after the decontamination; and (3) placing the cleaned shell and the whole lead wire on the shell into electrolyte, removing oil by electrolysis, and cleaning the shell and the lead wire by tap water and deionized water in sequence after removing the oil.
S2, chemical polishing
And (3) placing the decontaminated and deoiled shell and the whole lead on the shell into polishing solution, performing chemical polishing treatment to remove the oxide layers on the surfaces of the shell and the lead, wherein the polishing solution is formed by mixing concentrated phosphoric acid with the mass fraction of 85% and hydrogen peroxide with the mass fraction of 5%, and after chemical polishing, tap water and deionized water are sequentially used for cleaning the shell and the lead in the polishing solution, wherein the weight ratio of phosphoric acid to hydrogen peroxide is 7:3.
S3, barrel plating nickel layer
The shell and the lead on the shell are integrally placed into a roller containing nickel plating solution, the roller rotates for 10 minutes at a rotating speed of 5 revolutions per minute, so that the shell and the lead on the shell are subjected to horizontal barrel plating, a nickel layer is deposited on the outer wall of the shell, the inner side wall of the blind hole and the outer wall of the lead, the thickness of the nickel layer is 4 mu m, and tap water and deionized water are sequentially used for cleaning the nickel layer on the shell and the lead after barrel plating nickel.
S4, pre-plating gold
The shell deposited with the nickel layer and the lead are integrally placed into a roller filled with gold plating solution, and the roller rotates for 0.5 min at a rotating speed of 10 rpm, so that the shell and the lead on the shell are subjected to horizontal barrel plating treatment, and a gold layer I is deposited on the nickel layer, and the thickness of the gold layer I is 0.01um.
S5, barrel plating gold
And (3) integrally placing the shell deposited with the first gold layer and the lead into a roller filled with gold plating solution, enabling the roller to rotate for 1.5 minutes at a speed of 5 revolutions per minute, carrying out horizontal barrel plating treatment on the shell and the lead on the shell, enabling the thickness of the second gold layer deposited on the first gold layer to be 0.09um, cleaning the second gold layer on the shell and the lead by using tap water and deionized water in sequence after the second gold layer is rolled, taking out the shell and the lead on the shell, and carrying out drying treatment.
S6, electroplating gold on the outer wall of the shell and the lead outside the blind hole
After the inner side wall of the blind hole 12 and the lead wire positioned in the blind hole are plated with the second gold layer, the thickness of the inner side wall of the blind hole 12 and the thickness of the gold layer positioned on the lead wire positioned in the blind hole meet the required thickness, so that the two parts do not need to be subjected to electroplating treatment in subsequent electroplating treatment. The sealing fixture 4 is made of teflon, which is purchased from Shenzhen Jin Ruihuang plastic materials limited company, and the sealing fixture 4 has acid and alkali resistance, cold resistance and heat resistance, and elasticity.
As shown in fig. 2 and 3, the sealing fixture 4 comprises a supporting plate 41, wherein a plurality of electroplating holes 42 are arranged on the supporting plate 41, the aperture of the electroplating holes 42 gradually decreases in the direction from bottom to top, a plurality of leads 2 are arranged on the shell 1, and thus a plurality of blind holes 12 are formed, and a plurality of electroplating holes 42 correspond to a plurality of leads 2; the support plate 41 above the electroplating hole 42 is provided with a boss 43, the radial diameter of the boss 43 is smaller than the aperture of the blind hole 12, the boss 43 is provided with a connecting hole 44 communicated with the electroplating hole 42, the aperture of the connecting hole 44 is smaller than the radial diameter of the lead 2, the top of the connecting hole 44 is provided with a guide hole 45, the guide hole 45 is communicated with the connecting hole 44, and the aperture of the guide hole 45 gradually decreases in the direction from top to bottom.
When the sealing clamp is installed, the lead 2 is aligned with the corresponding guide hole 45, then the lead 2 is inserted into the corresponding connecting hole 44 and extends out of the electroplating hole 42, the lead 2 is in interference fit with the corresponding connecting hole 44, and the lower end face of the blind hole 12 is tightly attached to the upper surface of the supporting plate 41, so that the sealing clamp 4 is clamped on the shell and the lead more stably. The interference fit of the lead 2 and the corresponding connecting hole 44 can prevent the electroplating liquid from contacting with the lead in the blind hole during subsequent electroplating, the lower end surface of the blind hole 12 is clung to the upper surface of the supporting plate 41, and the electroplating liquid enters the blind hole 12 to contact with the inner wall of the blind hole 12 during subsequent electroplating.
After the sealing fixture 4 is clamped on the shell and the lead to form an assembly, carrying out ultrasonic chemical degreasing on the whole assembly, then cleaning the assembly by using tap water and deionized water in sequence, putting the cleaned assembly into electrolyte, degreasing by utilizing electrolysis, and cleaning the assembly by using tap water and deionized water in sequence after degreasing; placing the cleaned assembly into a roller containing gold plating solution, enabling the roller to rotate for 2.5 minutes at the speed of 7 revolutions per minute, carrying out horizontal barrel plating treatment on the shell and the lead wire on the shell, enabling the outer wall of the shell and the lead wire positioned outside the blind hole to be provided with an electric gold plating layer III, enabling the thickness of the gold plating layer III to be 0.2um, cleaning the shell and the gold plating layer III on the lead wire by using tap water and deionized water in sequence after barrel plating the gold plating layer III, and taking out the assembly after cleaning, and carrying out drying treatment.
S7, gold plating is hung on the lead
The assembly is mounted on a hanger, the large diameter end of the electroplating hole 42 faces upwards, then the assembly is placed into a gold plating solution, electrodeposition is carried out for 6 minutes, a fourth gold layer is deposited on a lead wire positioned outside the blind hole, the thickness of the fourth gold layer is 2.5mm, tap water and deionized water are sequentially used for cleaning the fourth gold layer on the assembly after the fourth gold layer is deposited on the third gold layer, after cleaning, the sealing clamp is detached, the shell and the lead wire are dried, the packaging link can be entered after the drying treatment, and the cleaned sealing clamp can be recycled.
Example 2
A plating process of a metal packaging shell of a radio frequency interference filter comprises the following steps:
s1, decontamination and oil removal
S2, chemical polishing
S3, barrel plating nickel layer
The shell and the lead on the shell are integrally placed in a roller containing nickel plating solution, the roller rotates for 5 minutes at the rotating speed of 7.5 revolutions per minute, so that the shell and the lead on the shell are subjected to horizontal barrel plating treatment, a nickel layer is deposited on the outer wall of the shell, the inner side wall of the blind hole and the outer wall of the lead, the thickness of the nickel layer is 3 mu m, and tap water and deionized water are sequentially used for cleaning the nickel layer on the shell and the lead after barrel plating nickel.
S4, pre-plating gold
And (3) integrally placing the shell deposited with the nickel layer and the lead into a roller filled with gold plating solution, and enabling the roller to rotate for 1 minute at a rotating speed of 5 revolutions per minute so as to carry out horizontal barrel plating treatment on the shell and the lead on the shell, so that a first gold layer is deposited on the nickel layer, and the thickness of the first gold layer is 0.04um.
S5, barrel plating gold
And (3) integrally placing the shell deposited with the first gold layer and the lead into a roller filled with gold plating solution, enabling the roller to rotate for 1 minute at a rotating speed of 15 revolutions per minute, carrying out horizontal barrel plating treatment on the shell and the lead on the shell, enabling the thickness of the second gold layer deposited on the first gold layer to be 0.1um, cleaning the second gold layer on the shell and the lead by using tap water and deionized water in sequence after the second gold layer is rolled, taking out the shell and the lead on the shell, and carrying out drying treatment.
S6, electroplating gold on the outer wall of the shell and the lead outside the blind hole
After the inner side wall of the blind hole 12 and the lead wire positioned in the blind hole are plated with the second gold layer, the thickness of the inner side wall of the blind hole 12 and the thickness of the gold layer positioned on the lead wire positioned in the blind hole meet the required thickness, so that the two parts do not need to be subjected to electroplating treatment in subsequent electroplating treatment.
After the sealing fixture 4 is clamped on the shell and the lead to form an assembly, carrying out ultrasonic chemical degreasing on the whole assembly, then cleaning the assembly by using tap water and deionized water in sequence, putting the cleaned assembly into electrolyte, degreasing by utilizing electrolysis, and cleaning the assembly by using tap water and deionized water in sequence after degreasing; placing the cleaned assembly into a roller containing gold plating solution, enabling the roller to rotate for 4 minutes at a rotating speed of 5 revolutions per minute, carrying out horizontal barrel plating treatment on the shell and a lead wire on the shell, enabling the outer wall of the shell and the lead wire positioned outside the blind hole to be provided with a third gold layer, enabling the thickness of the third gold layer to be 0.6um, cleaning the third gold layer on the shell and the lead wire by using tap water and deionized water in sequence after barrel plating the third gold layer, and taking out the assembly after cleaning, and carrying out drying treatment.
S7, gold plating is hung on the lead
The assembly is mounted on a hanger, the large diameter end of the electroplating hole 42 faces upwards, then the assembly is placed into a gold plating solution, electrodeposition is carried out for 6 minutes, a fourth gold layer is deposited on a lead wire positioned outside the blind hole, the thickness of the fourth gold layer is 2.5mm, tap water and deionized water are sequentially used for cleaning the fourth gold layer on the assembly after the fourth gold layer is deposited on the third gold layer, after cleaning, the sealing clamp is detached, the shell and the lead wire are dried, the packaging link can be entered after the drying treatment, and the cleaned sealing clamp can be recycled.
Example 3
A plating process of a metal packaging shell of a radio frequency interference filter comprises the following steps:
s1, decontamination and degreasing S2 and chemical polishing
S3, barrel plating nickel layer
The shell and the lead on the shell are integrally placed in a roller containing nickel plating solution, the roller rotates for 7 minutes at a rotating speed of 8 revolutions per minute, so that the shell and the lead on the shell are subjected to horizontal barrel plating, a nickel layer is deposited on the outer wall of the shell, the inner side wall of the blind hole and the outer wall of the lead, the thickness of the nickel layer is 4 mu m, and tap water and deionized water are sequentially used for cleaning the nickel layer on the shell and the lead after barrel plating nickel.
S4, pre-plating gold
And (3) integrally placing the shell deposited with the nickel layer and the lead into a roller filled with gold plating solution, and enabling the roller to rotate for 0.7 minutes at a speed of 7 revolutions per minute so as to perform horizontal barrel plating treatment on the shell and the lead on the shell, so that a first gold layer is deposited on the nickel layer, and the thickness of the first gold layer is 0.03um.
S5, barrel plating gold
And (3) integrally placing the shell deposited with the first gold layer and the lead into a roller filled with gold plating solution, enabling the roller to rotate for 2 minutes at a rotating speed of 10 revolutions per minute, carrying out horizontal barrel plating treatment on the shell and the lead on the shell, enabling the thickness of the second gold layer deposited on the first gold layer to be 0.12um, cleaning the second gold layer on the shell and the lead by using tap water and deionized water in sequence after the second gold layer is rolled, taking out the shell and the lead on the shell, and carrying out drying treatment.
S6, electroplating gold on the outer wall of the shell and the lead outside the blind hole
After the inner side wall of the blind hole 12 and the lead wire positioned in the blind hole are plated with the second gold layer, the thickness of the inner side wall of the blind hole 12 and the thickness of the gold layer positioned on the lead wire positioned in the blind hole meet the required thickness, so that the two parts do not need to be subjected to electroplating treatment in subsequent electroplating treatment.
After the sealing fixture 4 is clamped on the shell and the lead to form an assembly, carrying out ultrasonic chemical degreasing on the whole assembly, then cleaning the assembly by using tap water and deionized water in sequence, putting the cleaned assembly into electrolyte, degreasing by utilizing electrolysis, and cleaning the assembly by using tap water and deionized water in sequence after degreasing; placing the cleaned assembly into a roller containing gold plating solution, enabling the roller to rotate for 3 minutes at a rotating speed of 10 revolutions per minute, carrying out horizontal barrel plating treatment on the shell and a lead wire on the shell, enabling the outer side wall of the shell and the lead wire positioned outside the blind hole to be provided with a third gold layer, enabling the thickness of the third gold layer to be 0.5um, cleaning the third gold layer on the shell and the lead wire by using tap water and deionized water in sequence after barrel plating the third gold layer, and taking out the assembly after cleaning, and carrying out drying treatment.
S7, gold plating is hung on the lead
The assembly is arranged on a hanger, the electroplating hole 42 is upward, then the assembly is placed in a gold plating solution, electrodeposition is carried out for 8 minutes, a gold layer IV is deposited on a lead wire positioned outside the blind hole, the thickness of the gold layer IV is 4.2mm, after the gold layer IV is deposited on the gold layer III, tap water and deionized water are sequentially used for cleaning the gold layer IV on the assembly, after cleaning, the sealing clamp is detached, the shell and the lead wire are dried, the packaging link can be entered after the drying treatment, and the cleaned sealing clamp can be recycled.
Example 4
A plating process of a metal packaging shell of a radio frequency interference filter comprises the following steps:
s1, decontamination and oil removal
S2, chemical polishing
S3, barrel plating nickel layer
The shell and the lead on the shell are integrally placed into a roller containing nickel plating solution, the roller rotates for 5 minutes at a rotating speed of 10 revolutions per minute, so that the shell and the lead on the shell are subjected to horizontal barrel plating, a nickel layer is deposited on the outer wall of the shell, the inner side wall of the blind hole and the outer wall of the lead, the thickness of the nickel layer is 3.5 mu m, and tap water and deionized water are sequentially used for cleaning the nickel layer on the shell and the lead after barrel plating of nickel.
S4, pre-plating gold
The shell deposited with the nickel layer and the lead are integrally placed into a roller filled with gold plating solution, and the roller rotates for 0.55 min at a speed of 12 rpm, so that the shell and the lead on the shell are subjected to horizontal barrel plating treatment, and a gold layer I is deposited on the nickel layer, and the thickness of the gold layer I is 0.02um.
S5, barrel plating gold
And (3) integrally placing the shell deposited with the first gold layer and the lead into a roller filled with gold plating solution, enabling the roller to rotate for 1.6 minutes at the rotating speed of 7.5 revolutions per minute, so as to perform horizontal barrel plating treatment on the shell and the lead on the shell, enabling the first gold layer to deposit the second gold layer, enabling the thickness of the second gold layer to be 0.15um, cleaning the second gold layer on the shell and the lead by using tap water and deionized water in sequence after the second gold layer is rolled, and taking out the shell and the lead on the shell after cleaning, and performing drying treatment.
S6, electroplating gold on the outer wall of the shell and the lead outside the blind hole
After the inner side wall of the blind hole 12 and the lead wire positioned in the blind hole are plated with the second gold layer, the thickness of the inner side wall of the blind hole 12 and the thickness of the gold layer positioned on the lead wire positioned in the blind hole meet the required thickness, so that the two parts do not need to be subjected to electroplating treatment in subsequent electroplating treatment.
After the sealing fixture 4 is clamped on the shell and the lead to form an assembly, carrying out ultrasonic chemical degreasing on the whole assembly, then cleaning the assembly by using tap water and deionized water in sequence, putting the cleaned assembly into electrolyte, degreasing by utilizing electrolysis, and cleaning the assembly by using tap water and deionized water in sequence after degreasing; placing the cleaned assembly into a roller containing gold plating solution, enabling the roller to rotate for 3.5 minutes at a speed of 12 revolutions per minute, carrying out horizontal barrel plating treatment on the shell and a lead wire on the shell, enabling the outer side wall of the shell and the lead wire positioned outside the blind hole to be provided with an electro-gold layer III, enabling the thickness of the electro-gold layer III to be 0.3um, cleaning the shell and the electro-gold layer III on the lead wire by using tap water and deionized water in sequence after barrel plating the electro-gold layer III, and taking out the assembly after cleaning, and carrying out drying treatment.
S7, gold plating is hung on the lead
The assembly is arranged on a hanger, the electroplating hole 42 is upward, then the assembly is placed in a gold plating solution, electrodeposition is carried out for 7 minutes, a gold layer IV is deposited on a lead wire positioned outside the blind hole, the thickness of the gold layer IV is 3.5mm, after the gold layer IV is deposited on the gold layer III, tap water and deionized water are sequentially used for cleaning the gold layer IV on the assembly, after cleaning, the sealing clamp is detached, the shell and the lead wire are dried, the packaging link can be entered after the drying treatment, and the cleaned sealing clamp can be recycled.
Example 5
A plating process of a metal packaging shell of a radio frequency interference filter comprises the following steps:
s1, decontamination and oil removal
S2, chemical polishing
S3, barrel plating nickel layer
The shell and the lead on the shell are integrally placed into a roller containing nickel plating solution, the roller rotates for 15 minutes at a rotating speed of 12 revolutions per minute, so that the shell and the lead on the shell are subjected to horizontal barrel plating, a nickel layer is deposited on the outer wall of the shell, the inner side wall of the blind hole and the outer wall of the lead, the thickness of the nickel layer is 5 mu m, and tap water and deionized water are sequentially used for cleaning the nickel layer on the shell and the lead after barrel plating nickel.
S4, pre-plating gold
The shell deposited with the nickel layer and the lead are integrally placed into a roller filled with gold plating solution, and the roller rotates for 0.6 min at a speed of 15 rpm, so that the shell and the lead on the shell are subjected to horizontal barrel plating treatment, and a gold layer I is deposited on the nickel layer, and the thickness of the gold layer I is 0.02um.
S5, barrel plating gold
And (3) integrally placing the shell deposited with the first gold layer and the lead into a roller filled with gold plating solution, enabling the roller to rotate for 1.8 minutes at a rotating speed of 8 revolutions per minute, carrying out horizontal barrel plating treatment on the shell and the lead on the shell, enabling the thickness of the second gold layer deposited on the first gold layer to be 0.13um, cleaning the second gold layer on the shell and the lead by using tap water and deionized water in sequence after the second gold layer is rolled, taking out the shell and the lead on the shell, and carrying out drying treatment.
S6, electroplating gold on the outer wall of the shell and the lead outside the blind hole
After the inner side wall of the blind hole 12 and the lead wire positioned in the blind hole are plated with the second gold layer, the thickness of the inner side wall of the blind hole 12 and the thickness of the gold layer positioned on the lead wire positioned in the blind hole meet the required thickness, so that the two parts do not need to be subjected to electroplating treatment in subsequent electroplating treatment.
After the sealing fixture 4 is clamped on the shell and the lead to form an assembly, carrying out ultrasonic chemical degreasing on the whole assembly, then cleaning the assembly by using tap water and deionized water in sequence, putting the cleaned assembly into electrolyte, degreasing by utilizing electrolysis, and cleaning the assembly by using tap water and deionized water in sequence after degreasing; placing the cleaned assembly into a roller containing gold plating solution, enabling the roller to rotate for 3 minutes at a rotating speed of 15 revolutions per minute, carrying out horizontal barrel plating treatment on the shell and a lead wire on the shell, enabling the outer side wall of the shell and the lead wire positioned outside the blind hole to be provided with a third gold layer, enabling the thickness of the third gold layer to be 0.4um, cleaning the third gold layer on the shell and the lead wire by using tap water and deionized water in sequence after barrel plating the third gold layer, and taking out the assembly after cleaning, and carrying out drying treatment.
S7, gold plating is hung on the lead
The assembly is arranged on a hanger, the electroplating hole 42 is upward, then the assembly is placed in a gold plating solution, electrodeposition is carried out for 6.5 minutes, a fourth gold layer is deposited on a lead wire positioned outside the blind hole, the thickness of the fourth gold layer is 3mm, after the fourth gold layer is deposited on the third gold layer, tap water and deionized water are sequentially used for cleaning the fourth gold layer on the assembly, after cleaning, the sealing clamp is detached, the shell and the lead wire are dried, the packaging link can be entered after the drying treatment, and the cleaned sealing clamp can be recycled.
Example 6
A plating process of a metal packaging shell of a radio frequency interference filter comprises the following steps:
s1, decontamination and oil removal
S2, chemical polishing
S3, barrel plating nickel layer
The shell and the lead on the shell are integrally placed into a roller containing nickel plating solution, the roller rotates for 10 minutes at a rotating speed of 15 revolutions per minute, so that the shell and the lead on the shell are subjected to horizontal barrel plating, a nickel layer is deposited on the outer wall of the shell, the inner side wall of the blind hole and the outer wall of the lead, the thickness of the nickel layer is 4.2 mu m, and tap water and deionized water are sequentially used for cleaning the nickel layer on the shell and the lead after barrel plating of nickel.
S4, pre-plating gold
The shell deposited with the nickel layer and the lead are integrally placed into a roller filled with gold plating solution, and the roller rotates for 0.85 min at the rotating speed of 8 r/min, so that the shell and the lead on the shell are subjected to horizontal barrel plating treatment, and a gold layer I is deposited on the nickel layer, and the thickness of the gold layer I is 0.05um.
S5, barrel plating gold
And (3) integrally placing the shell deposited with the first gold layer and the lead into a roller filled with gold plating solution, enabling the roller to rotate for 1 minute at a speed of 12 revolutions per minute, carrying out horizontal barrel plating treatment on the shell and the lead on the shell, enabling the thickness of the second gold layer deposited on the first gold layer to be 0.1um, cleaning the second gold layer on the shell and the lead by using tap water and deionized water in sequence after the second gold layer is rolled, taking out the shell and the lead on the shell, and carrying out drying treatment.
S6, electroplating gold on the outer wall of the shell and the lead outside the blind hole
After the inner side wall of the blind hole 12 and the lead wire positioned in the blind hole are plated with the second gold layer, the thickness of the inner side wall of the blind hole 12 and the thickness of the gold layer positioned on the lead wire positioned in the blind hole meet the required thickness, so that the two parts do not need to be subjected to electroplating treatment in subsequent electroplating treatment.
After the sealing fixture 4 is clamped on the shell and the lead to form an assembly, carrying out ultrasonic chemical degreasing on the whole assembly, then cleaning the assembly by using tap water and deionized water in sequence, putting the cleaned assembly into electrolyte, degreasing by utilizing electrolysis, and cleaning the assembly by using tap water and deionized water in sequence after degreasing; placing the cleaned assembly into a roller containing gold plating solution, enabling the roller to rotate for 4 minutes at a rotating speed of 10 revolutions per minute, carrying out horizontal barrel plating treatment on the shell and a lead wire on the shell, enabling the outer side wall of the shell and the lead wire positioned outside the blind hole to be provided with a third gold layer, enabling the thickness of the third gold layer to be 0.3um, cleaning the third gold layer on the shell and the lead wire by using tap water and deionized water in sequence after barrel plating the third gold layer, and taking out the assembly after cleaning, and carrying out drying treatment.
S7, gold plating is hung on the lead
The assembly is arranged on a hanger, the electroplating hole 42 is upward, then the assembly is placed in a gold plating solution, electrodeposition is carried out for 6.5 minutes, a fourth gold layer is deposited on a lead wire positioned outside the blind hole, the thickness of the fourth gold layer is 3mm, after the fourth gold layer is deposited on the third gold layer, tap water and deionized water are sequentially used for cleaning the fourth gold layer on the assembly, after cleaning, the sealing clamp is detached, the shell and the lead wire are dried, the packaging link can be entered after the drying treatment, and the cleaned sealing clamp can be recycled.
The above embodiments are not intended to limit the scope of the present application, so: all equivalent changes in structure, shape and principle of the application should be covered in the scope of protection of the application.
Claims (10)
1. A plating process of a metal packaging shell of a radio frequency interference filter is characterized in that the metal packaging shell comprises a coating
The method comprises the following steps:
s1, electroplating a nickel layer on the outer wall of the shell, the inner wall of the blind hole and the lead;
s2, electroplating a first gold layer on the nickel layer, wherein the thickness of the first gold layer is 0.01-0.05 um;
s3, electroplating a second gold layer on the first gold layer, wherein the thickness of the second gold layer is 0.09-0.15 um;
s4, electroplating a third gold layer on the outer side wall of the shell and the lead wire positioned outside the blind hole, wherein the third gold layer is deposited on the second gold layer, and the thickness of the third gold layer is 0.2-0.6 um;
s5, electroplating a gold layer IV on the lead wire positioned outside the blind hole, wherein the gold layer IV is deposited on the gold layer III, and the thickness of the gold layer IV is 2.5-4.2. 4.2 um.
2. The process for plating a metal package of a radio frequency interference filter according to claim 1, wherein the step S1 is preceded by a step of removing dirt and oil from the case and the leads, and a step of chemical polishing.
3. The plating process of the metal packaging shell of the radio frequency interference filter according to claim 1, wherein in the step S1, a horizontal barrel plating mode is adopted to plate a nickel layer on the outer wall of the shell, the inner wall of the blind hole and the lead, and the thickness of the nickel layer is 3-5 um.
4. The plating process of metal packaging case of radio frequency interference filter according to claim 1, wherein in step S2, the first gold layer is plated by horizontal barrel plating, the shell deposited with nickel layer and the whole lead are put into a roller containing gold plating solution, and the roller rotates for 0.5-1 min at a rotation speed of 5-15 rpm, so that the first gold layer is deposited on the nickel layer.
5. The plating process of metal packaging shell of radio frequency interference filter according to claim 1, wherein in step S3, the second electroplating layer adopts a horizontal barrel plating method, the shell deposited with the first electroplating layer and the lead wire are integrally placed into a roller filled with gold plating solution, and the roller rotates for 1-2 minutes at a rotation speed of 5-15 rpm, so that the second electroplating layer is deposited on the first electroplating layer.
6. The process according to claim 1, wherein step S4 further comprises sealing the inner wall of the blind via and the lead wire located in the blind via before the third electroplating of the gold layer.
7. The process for plating a metal package of a radio frequency interference filter according to claim 6, wherein a sealing jig is used for sealing, the sealing jig is made of teflon, a connecting hole is formed in the sealing jig, the diameter of the connecting hole is smaller than the radial diameter of the lead, and when the sealing jig is clamped on the lead, the lower end face of the blind hole is tightly attached to the sealing jig.
8. The process according to claim 7, wherein the sealing jig comprises a support plate, wherein an electroplating hole is formed in the support plate, a boss capable of being embedded in the blind hole is formed in the support plate above the electroplating hole, and the connecting hole communicated with the electroplating hole is formed in the boss.
9. The plating process of a metal package housing of a radio frequency interference filter according to claim 7, wherein the connection hole is provided with a guide hole.
10. The plating process of a metal package housing of a radio frequency interference filter according to claim 1, wherein in step S5, a plating method of hanging plating is adopted for the electro-plating layer four.
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