CN117191237A - Residual stress simulation device and method for curing epoxy insulation parts based on non-uniform temperature - Google Patents
Residual stress simulation device and method for curing epoxy insulation parts based on non-uniform temperature Download PDFInfo
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- CN117191237A CN117191237A CN202310900177.6A CN202310900177A CN117191237A CN 117191237 A CN117191237 A CN 117191237A CN 202310900177 A CN202310900177 A CN 202310900177A CN 117191237 A CN117191237 A CN 117191237A
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Abstract
本发明涉及基于非均匀温度固化环氧绝缘件残余应力模拟装置及方法，本发明通过环氧树脂浇注部分以及隔热罩构建了基于非均匀温度固化的环氧树脂绝缘件残余应力模拟装置，并且对无隔热罩区域以及隔热罩覆盖区域分别测试试样残余应力最大值，可以实现同一试样两端应力出现较大差值，并且可对不同固化温度下环氧树脂固化产物的应力分布情况进行控制，量化固化温度对环氧树脂绝缘件残余应力的影响。本发明通过隔热棉覆被在块状试样模具的外表面，可以有效改变并检测环氧树脂固化产物的残余应力，为研究固化温度不均条件下环氧树脂绝缘件的残余应力集中情况提供了试验方法。
The present invention relates to a residual stress simulation device and method for epoxy insulation parts based on non-uniform temperature curing. The invention constructs a residual stress simulation device for epoxy resin insulation parts based on non-uniform temperature curing through an epoxy resin pouring part and a heat shield, and The maximum residual stress of the sample is measured separately in the area without the heat shield and the area covered by the heat shield, which can achieve a large difference in stress at both ends of the same sample, and can also analyze the stress distribution of epoxy resin cured products at different curing temperatures. The situation was controlled to quantify the effect of curing temperature on the residual stress of epoxy resin insulation parts. The present invention covers the outer surface of the block sample mold with thermal insulation cotton, which can effectively change and detect the residual stress of the cured epoxy resin product, in order to study the residual stress concentration of the epoxy resin insulation parts under the condition of uneven curing temperature. Test methods are provided.
Description
Technical Field
The invention belongs to the technical field of high-voltage electricity, and particularly relates to a device and a method for simulating residual stress of an epoxy insulating part based on non-uniform temperature curing.
Background
Along with the gradual expansion of the application scale of the ultra-high voltage transmission line in the electric power system of China, the sizes of the epoxy resin insulators in the GIS and the GIL are continuously increased, and the reliability requirement of the insulators is greatly improved. The epoxy resin insulating part is a key part for bearing electric insulation and mechanical support in GIS/GIL equipment, receives the comprehensive effect of multiple physical fields such as electricity, heat, magnetism and the like in the operation process, the working reliability of the epoxy resin insulating part directly influences the stability of an electric power system, and the epoxy resin insulating part is extremely complex in internal stress distribution condition, breaks and bursts and happens at the moment, so that the epoxy resin insulating part is widely focused by researchers.
The residual stress is a local stress concentration phenomenon caused by the influence of a process in the preparation process of the workpiece, and after coupling external stress application, the residual stress is extremely likely to cause the initiation or brittle failure of microcracks of the insulating part, so that serious accidents such as partial discharge, explosion and the like are caused. The insulating part inevitably contains residual stress before being put into operation, but the related factory inspection standard is not implemented by the current manufacturers, so that the operation reliability of the epoxy resin insulating part is greatly restricted. The reaction of epoxy and anhydride in the epoxy resin insulating part casting material is exothermic reaction, and the difference of the local crosslinking reaction degree is increased along with the increase of the volume of the die; and the temperature difference is extremely large in the production process, and large residual stress is likely to occur in the epoxy resin insulating part due to the fact that the thermal expansion coefficients of the metal insert, the guide rod and the epoxy composite insulating material are not matched.
Disclosure of Invention
The invention aims to overcome the defects of the prior art, provides a device and a method for simulating the residual stress of an epoxy insulating part based on non-uniform temperature curing, can effectively change and detect the residual stress of an epoxy resin cured product by coating the outer surface of a block-shaped sample die with heat insulation cotton, and provides a test method for researching the concentration condition of the residual stress of the epoxy resin insulating part under the condition of non-uniform curing temperature.
The invention solves the technical problems by adopting the following technical scheme:
the utility model provides an epoxy insulator residual stress analogue means based on inhomogeneous temperature solidification, including epoxy pouring part and heat exchanger, wherein, epoxy pouring part suit is inside the heat exchanger, and epoxy pouring part top includes mould backplate and mould roof, and the setting of mould roof carries out threaded connection through the screw hole that sets up in the four corners at the mould backplate, and the top of mould backplate and mould roof is equipped with pouring mouth and observation mouth simultaneously, and the observation mouth is cylindrical, and the pouring mouth is round platform shape, round platform shape top diameter is greater than round platform bottom diameter.
And moreover, the heat shield is a cuboid with a hollow inside, the inner surface layer is filled with heat insulation cotton and sleeved on the outer side of the epoxy resin pouring part, so that the tightness of the simulation device is improved.
A simulation method of an epoxy resin insulator residual stress simulation device based on non-uniform temperature curing comprises the following steps:
step 1, pouring CT-5531 epoxy resin, TF-1 curing agent and micrometer alumina into a clean beaker according to the mass ratio of 100:44:306;
step 2, placing the mixture into a magnetic stirrer, and stirring for 10 minutes to uniformly mix the mixture;
step 3, after the mixture is uniformly mixed, placing the mixture into a vacuum drying oven at 50 ℃, continuously vacuumizing for 15 minutes, and fully removing air in the mixture;
step 4, pouring the mixture into an epoxy resin pouring part;
step 5, sleeving the heat insulation cover with the heat insulation cotton plugged inside on the outer surface of the epoxy resin pouring part, and completing assembly;
step 6, placing the assembled simulation device into a constant-temperature oven at 130 ℃ for curing for 10 hours;
step 7, after the preset time is reached, taking out the assembled simulation device, cooling to room temperature, and demolding to obtain an epoxy resin insulating part sample;
and 8, performing stress detection by using ultrasonic stress detection equipment, and respectively testing the maximum value of the residual stress of the sample in the heat shield-free area and the heat shield coverage area.
The invention has the advantages and positive effects that:
according to the invention, the epoxy resin insulation part residual stress simulation device based on non-uniform temperature curing is constructed through the epoxy resin pouring part and the heat shield, and the maximum value of the residual stress of the sample is tested for the non-heat shield area and the heat shield coverage area respectively, so that a larger difference value of stress at two ends of the same sample can be realized, the stress distribution condition of an epoxy resin cured product at different curing temperatures can be controlled, and the influence of the curing temperature on the residual stress of the epoxy resin insulation part is quantized. According to the invention, the thermal insulation cotton is coated on the outer surface of the block sample mold, so that the residual stress of the epoxy resin cured product can be effectively changed and detected, and a test method is provided for researching the concentration condition of the residual stress of the epoxy resin insulating part under the condition of uneven curing temperature.
Drawings
FIG. 1 is a diagram of a casting portion of an epoxy resin according to the present invention;
FIG. 2 is a cross-sectional view of a casting portion of an epoxy resin according to the present invention;
fig. 3 is a structural view of the heat shield of the present invention.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings.
The utility model provides an epoxy insulator residual stress analogue means based on heterogeneous temperature solidification, as shown in fig. 1, including containing epoxy pouring part and heat exchanger, wherein, epoxy pouring part suit is inside the heat exchanger, as shown in fig. 2 and 3, epoxy pouring part top includes mould backplate and mould roof, the setting of mould roof carries out threaded connection through the screw hole that sets up in the four corners at the mould backplate, the top of mould backplate and mould roof is equipped with pouring mouth and observation mouth simultaneously, the observation mouth is cylindrical, the pouring mouth is round platform shape, round platform shape top diameter is greater than round platform bottom diameter. The bottom radius of the pouring opening is 0.5cm, the top radius is 1cm, and the height is 1cm. Meanwhile, a cuboid cavity of 10 multiplied by 2cm is dug in the die back plate and the die top plate to serve as a pouring cavity.
The heat shield is a cuboid with a hollow inside, the inner surface layer is filled with heat insulation cotton and sleeved on the outer side of the epoxy resin pouring part, and the heat shield is used for improving the tightness of the simulation device. The radius of the observation port is 0.5cm, the height of the observation port is 1cm, the effective discharge of internal bubbles can be realized through the observation port, and meanwhile, the effective inflow of the castable can be realized through the circular truncated cone design of the pouring port.
A simulation method of an epoxy resin insulator residual stress simulation device based on non-uniform temperature curing comprises the following steps:
step 1, pouring CT-5531 epoxy resin, TF-1 curing agent and micrometer alumina into a clean beaker according to the mass ratio of 100:44:306;
step 2, placing the mixture into a magnetic stirrer, and stirring for 10 minutes to uniformly mix the mixture;
step 3, after the mixture is uniformly mixed, placing the mixture into a vacuum drying oven at 50 ℃, continuously vacuumizing for 15 minutes, and fully removing air in the mixture;
step 4, pouring the mixture into an epoxy resin pouring part;
step 5, sleeving the heat insulation cover with the heat insulation cotton plugged inside on the outer surface of the epoxy resin pouring part, and completing assembly;
step 6, placing the assembled simulation device into a constant-temperature oven at 130 ℃ for curing for 10 hours;
step 7, after the preset time is reached, taking out the assembled simulation device, cooling to room temperature, and demolding to obtain an epoxy resin insulating part sample;
and 8, performing stress detection by using ultrasonic stress detection equipment, and respectively testing the maximum value of the residual stress of the sample in the heat shield-free area and the heat shield coverage area.
Performing stress detection by using ultrasonic stress detection equipment, wherein the maximum value of the residual stress of the sample is 1.03MPa in the region without the heat shield; in the heat shield coverage area, the maximum value of the residual stress of the test sample is 17.87MPa. The method has the advantages that the residual stress of the epoxy resin cured product can be effectively changed and detected by covering the outer surface of the block sample mold with the heat insulation cotton, and a test method is provided for researching the concentration condition of the residual stress of the epoxy resin insulating part under the condition of uneven curing temperature.
It should be emphasized that the examples described herein are illustrative rather than limiting, and therefore the invention includes, but is not limited to, the examples described in the detailed description, as other embodiments derived from the technical solutions of the invention by a person skilled in the art are equally within the scope of the invention.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310900177.6A CN117191237A (en) | 2023-07-21 | 2023-07-21 | Residual stress simulation device and method for curing epoxy insulation parts based on non-uniform temperature |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202310900177.6A CN117191237A (en) | 2023-07-21 | 2023-07-21 | Residual stress simulation device and method for curing epoxy insulation parts based on non-uniform temperature |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN120064345A (en) * | 2025-03-21 | 2025-05-30 | 中国科学院武汉岩土力学研究所 | Device and method for measuring residual stress of rock mass at non-uniform temperature |
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2023
- 2023-07-21 CN CN202310900177.6A patent/CN117191237A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN120064345A (en) * | 2025-03-21 | 2025-05-30 | 中国科学院武汉岩土力学研究所 | Device and method for measuring residual stress of rock mass at non-uniform temperature |
| CN120064345B (en) * | 2025-03-21 | 2025-12-02 | 中国科学院武汉岩土力学研究所 | Apparatus and method for measuring residual stress in rock masses under non-uniform temperatures |
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