CN117206830A - A kind of preparation method of copper-coated pad - Google Patents

A kind of preparation method of copper-coated pad Download PDF

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Publication number
CN117206830A
CN117206830A CN202311130767.1A CN202311130767A CN117206830A CN 117206830 A CN117206830 A CN 117206830A CN 202311130767 A CN202311130767 A CN 202311130767A CN 117206830 A CN117206830 A CN 117206830A
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copper
strip
fold
copper strip
side edge
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CN202311130767.1A
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宋冬冰
顾晓锋
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Cixi Hengli Packing & Sealing Co ltd
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Cixi Hengli Packing & Sealing Co ltd
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Priority to CN202311130767.1A priority Critical patent/CN117206830A/en
Publication of CN117206830A publication Critical patent/CN117206830A/en
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Abstract

A method for preparing a copper-clad pad, comprising the steps of: s1: preparing a first copper bar, a second copper bar and a nonmetallic filler strip; s2: turning up two sides of the first copper bar to form a first side edge and a second side edge; s3: firstly, filling a nonmetallic filler strip between a first side edge and a second side edge of a first copper bar, and then filling a second copper bar between the first side edge and the second side edge of the first copper bar; s4: inwards folding the first side edge to form a first folded edge, inwards folding the second side edge to form a second folded edge, and respectively covering two edges of the second copper strip by the first folded edge and the second folded edge so as to form a rudiment belt; s5: compacting the embryonic strip so that the nonmetallic filler strip is wrapped in the first copper strip and the second copper strip to form a copper cladding strip; s6: the copper cladding belt is looped into an annular shape with upper and lower surfaces, and then the head and the tail of the copper cladding belt are welded to form the copper cladding pad.

Description

一种铜包覆垫的制备方法A kind of preparation method of copper-coated pad

技术领域Technical field

本发明涉及一种铜包覆垫的制备方法。The invention relates to a method for preparing a copper-coated pad.

背景技术Background technique

金属包覆垫是一种将非金属填料(例如石墨)包裹在金属中的垫片,呈环形。例如CN 201884647 U就公开了一种金属包覆垫片,为环形构件,该环形构件由外层的金属包裹层和内层的填充层构成。所述的金属包裹层可以选用不锈钢、镍、钛、铜、铁、铝或者铅等金属材质,其中任意一种均可,不锈钢中优先选用300系列不锈钢,例如:304、316、321等。所述的填充层的材质为石墨、聚四氟乙烯、石棉或陶瓷中的任意一种。金属包裹层分环形金属凹槽和挡片为两部分组组成,首先将填充层设置在环形金属凹槽内,之后通过压力设备将挡片压在开口处将其制成一体结构的垫片。 A metal-clad gasket is a gasket in which a non-metallic filler (such as graphite) is encased in metal in the shape of a ring. For example, CN 201884647 U discloses a metal-coated gasket, which is an annular member composed of an outer metal coating layer and an inner filling layer. The metal coating layer can be made of stainless steel, nickel, titanium, copper, iron, aluminum or lead, any of which can be used. Among stainless steels, 300 series stainless steel is preferred, such as 304, 316, 321, etc. The filling layer is made of any one of graphite, polytetrafluoroethylene, asbestos or ceramics. The metal wrapping layer is composed of an annular metal groove and a baffle. First, the filling layer is placed in the annular metal groove, and then the baffle is pressed against the opening through a pressure device to form a gasket with an integrated structure.

现有的金属包覆垫的金属包覆层的环形金属凹槽和挡片均为一体环形件,填充层也是一体环形件。在成型环形的环形金属凹槽、环形的挡片、环形的填充层时采用的方法是在金属板和填充板上冲压出环形件,冲压后剩余的料成为废料,浪费极其严重。The annular metal groove and the baffle of the metal coating layer of the existing metal-coated pad are both integrated annular parts, and the filling layer is also an integrated annular part. The method used when forming annular metal grooves, annular baffles, and annular filling layers is to punch out ring-shaped parts on the metal plate and the filling plate. The remaining material after stamping becomes waste, which is extremely wasteful.

发明内容Contents of the invention

为了克服现有铜包覆垫制备方法的上述不足,本发明提供一种铜包覆垫的制备方法,可大大节约生产原材料。In order to overcome the above-mentioned shortcomings of the existing copper-coated pad preparation methods, the present invention provides a copper-coated pad preparation method, which can greatly save production raw materials.

本发明解决其技术问题的技术方案是:一种铜包覆垫的制备方法,包括下列步骤:The technical solution of the present invention to solve the technical problem is: a preparation method of a copper-coated pad, which includes the following steps:

S1:准备第一铜条、第二铜条和非金属填料带;S1: Prepare the first copper strip, the second copper strip and the non-metal filler strip;

S2:将所述的第一铜条的两侧向上翻折从而形成第一侧边和第二侧边;S2: Fold both sides of the first copper strip upward to form the first side and the second side;

S3:先将所述的非金属填料带填入所述第一铜条的第一侧边和第二侧边之间,再将所述的第二铜条填入所述第一铜条的第一侧边和第二侧边之间;S3: First fill the non-metallic filler strip between the first side and the second side of the first copper strip, and then fill the second copper strip between the first side and the second side of the first copper strip. between the first side and the second side;

S4:将所述的第一侧边向内折形成第一折边、将所述的第二侧边向内折形成第二折边,所述的第一折边和第二折边分别将所述的第二铜条的两边缘覆盖,从而形成雏形带;S4: Fold the first side inward to form a first fold, and fold the second side inward to form a second fold. The first fold and the second fold are respectively The two edges of the second copper strip are covered to form a prototype strip;

S5:压紧所述的雏形带从而所述的非金属填料带包裹在所述的第一铜条和第二铜条内形成铜包覆带;S5: Press the prototype belt so that the non-metal filler belt is wrapped in the first copper strip and the second copper strip to form a copper-clad strip;

S6:将所述的铜包覆带圈成具有上下表面的环形,再将铜包覆带的首尾两头焊接后形成铜包覆垫。S6: Loop the copper-clad tape into a ring shape with upper and lower surfaces, and then weld the first and last ends of the copper-clad tape to form a copper-clad pad.

进一步,所述的非金属填料带为石墨带。Further, the non-metallic filler tape is a graphite tape.

进一步,所述的非金属填料带具有若干层。Further, the non-metal filler tape has several layers.

进一步,所述第二铜条的两侧边分别与所述第一铜条的第一侧边和第二侧边内侧相抵。Further, both sides of the second copper strip are respectively offset from the inside of the first side and the second side of the first copper strip.

本发明的有益效果在于:第一铜条、第二铜条均为条状、非金属填料带亦呈条状,因此在生产时只需要条状的原材料即可,不需要通过冲压来获得原材料,可大大减少废料的产生,从而大大节约生产成本。The beneficial effects of the present invention are that: the first copper bar and the second copper bar are both in strip shape, and the non-metal filler strip is also in strip shape. Therefore, only strip-shaped raw materials are needed during production, and there is no need to obtain raw materials through stamping. , can greatly reduce the generation of waste materials, thus greatly saving production costs.

附图说明Description of drawings

图1是铜包覆垫的正视图。Figure 1 is a front view of a copper clad pad.

图2是第一铜条的剖视图。Figure 2 is a cross-sectional view of the first copper strip.

图3是第一铜条的两侧向上翻折从而形成第一侧边和第二侧边后的剖视图。Figure 3 is a cross-sectional view of the first copper strip after two sides are folded upward to form a first side and a second side.

图4是填入非金属填料带及第二铜条后的剖视图。Figure 4 is a cross-sectional view after filling the non-metal filler tape and the second copper strip.

图5是内折形成第一折边、第二折边后的剖视图。Figure 5 is a cross-sectional view after the first folding edge and the second folding edge are formed by inward folding.

实施方式Implementation

下面结合附图和具体实施方式对本发明作进一步详细说明。The present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.

参照图1-图5,一种铜包覆垫的制备方法,包括下列步骤:Referring to Figures 1-5, a method for preparing a copper-coated pad includes the following steps:

S1:参照图2,准备第一铜条1、第二铜条2和非金属填料带3;S1: Refer to Figure 2, prepare the first copper strip 1, the second copper strip 2 and the non-metal filler tape 3;

S2:参照图3,将所述的第一铜条1的两侧向上翻折从而形成第一侧边1-1和第二侧边1-2;S2: Referring to Figure 3, fold both sides of the first copper strip 1 upward to form a first side 1-1 and a second side 1-2;

S3:参照图4,先将所述的非金属填料带3填入所述第一铜条的第一侧边1-1和第二侧边1-2之间,再将所述的第二铜条2填入所述第一铜条的第一侧边1-1和第二侧边1-2之间;S3: Referring to Figure 4, first fill the non-metal filler strip 3 between the first side 1-1 and the second side 1-2 of the first copper strip, and then fill the second The copper strip 2 is filled between the first side 1-1 and the second side 1-2 of the first copper strip;

S4:参照图5,将所述的第一侧边1-1向内折形成第一折边1-3、将所述的第二侧边1-2向内折形成第二折边1-4,所述的第一折边1-3和第二折边1-4分别将所述的第二铜条2的两边缘覆盖,从而形成雏形带;S4: Referring to Figure 5, fold the first side 1-1 inward to form a first fold 1-3, and fold the second side 1-2 inward to form a second fold 1- 4. The first folding edge 1-3 and the second folding edge 1-4 cover the two edges of the second copper strip 2 respectively, thereby forming a prototype belt;

S5:压紧所述的雏形带从而所述的非金属填料带3包裹在所述的第一铜条1和第二铜条2内形成铜包覆带;S5: Press the prototype belt so that the non-metallic filler belt 3 is wrapped in the first copper strip 1 and the second copper strip 2 to form a copper-clad strip;

S6:将所述的铜包覆带圈成具有上下表面的环形,再将铜包覆带的首尾两头焊接后形成铜包覆垫。在焊接处会形成焊缝4,最好对焊缝4进行抛光处理。所谓的具有上下表面的环形,是指铜包覆带在圈成环形时,并非是圈成具有内外表面的环,而是具有上下表面的平面的环。S6: Loop the copper-clad tape into a ring shape with upper and lower surfaces, and then weld the first and last ends of the copper-clad tape to form a copper-clad pad. A weld seam 4 will be formed at the welding point, and it is best to polish the weld seam 4. The so-called ring shape with upper and lower surfaces means that when the copper-clad strip is wound into a ring shape, it is not a ring with inner and outer surfaces, but a flat ring with upper and lower surfaces.

所述的非金属填料带3通常为为石墨带,当然也可以是聚四氟乙烯等其他非金属填料。。The non-metallic filler tape 3 is usually a graphite tape, but of course it can also be other non-metallic fillers such as polytetrafluoroethylene. .

在一个实施例中,所述的非金属填料带3具有若干层,以期取得更好的密封效果。In one embodiment, the non-metallic filler tape 3 has several layers in order to achieve better sealing effect.

在一个实施例中,所述第二铜条2的两侧边分别与所述第一铜条的第一侧边1-1和第二侧边1-2内侧相抵,以使得非金属填料带3能够更好的被包裹。In one embodiment, both sides of the second copper strip 2 offset the inside of the first side 1-1 and the second side 1-2 of the first copper strip respectively, so that the non-metal filler strip 3 can be better wrapped.

在本说明书的描述中,参考术语“一个实施例”、“一些实施例”、“示例”、“具体示例”、或“一些示例”等的描述意指结合该实施例或示例描述的具体特征、结构、材料或者特点包含于本发明的至少一个实施例或示例中。在本说明书中,对上述术语的示意性表述不一定指的是相同的实施例或示例。而且,描述的具体特征、结构、材料或者特点可以在任何的一个或多个实施例或示例中以合适的方式结合。In the description of this specification, reference to the terms "one embodiment," "some embodiments," "an example," "specific examples," or "some examples" or the like means that specific features are described in connection with the embodiment or example. , structures, materials or features are included in at least one embodiment or example of the invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

以上,对本发明的实施方式进行了说明。但是,本发明不限定于上述实施方式。凡在本发明的精神和原则之内,所做的任何修改、等同替换、改进等,均应包含在本发明的保护范围之内。The embodiments of the present invention have been described above. However, the present invention is not limited to the above-described embodiment. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention shall be included in the protection scope of the present invention.

Claims (4)

1.一种铜包覆垫的制备方法,其特征在于包括下列步骤:1. A method for preparing a copper-coated pad, which is characterized by comprising the following steps: S1:准备第一铜条、第二铜条和非金属填料带;S1: Prepare the first copper strip, the second copper strip and the non-metal filler strip; S2:将所述的第一铜条的两侧向上翻折从而形成第一侧边和第二侧边;S2: Fold both sides of the first copper strip upward to form the first side and the second side; S3:先将所述的非金属填料带填入所述第一铜条的第一侧边和第二侧边之间,再将所述的第二铜条填入所述第一铜条的第一侧边和第二侧边之间;S3: First fill the non-metallic filler strip between the first side and the second side of the first copper strip, and then fill the second copper strip between the first side and the second side of the first copper strip. between the first side and the second side; S4:将所述的第一侧边向内折形成第一折边、将所述的第二侧边向内折形成第二折边,所述的第一折边和第二折边分别将所述的第二铜条的两边缘覆盖,从而形成雏形带;S4: Fold the first side inward to form a first fold, and fold the second side inward to form a second fold. The first fold and the second fold are respectively The two edges of the second copper strip are covered to form a prototype strip; S5:压紧所述的雏形带从而所述的非金属填料带包裹在所述的第一铜条和第二铜条内形成铜包覆带;S5: Press the prototype belt so that the non-metal filler belt is wrapped in the first copper strip and the second copper strip to form a copper-clad strip; S6:将所述的铜包覆带圈成具有上下表面的环形,再将铜包覆带的首尾两头焊接后形成铜包覆垫。S6: Loop the copper-clad tape into a ring shape with upper and lower surfaces, and then weld the first and last ends of the copper-clad tape to form a copper-clad pad. 2.如权利要求1所述的铜包覆垫的制备方法,其特征在于:所述的非金属填料带为石墨带。2. The method for preparing a copper-coated pad according to claim 1, wherein the non-metallic filler tape is a graphite tape. 3.如权利要求2所述的铜包覆垫的制备方法,其特征在于:所述的非金属填料带具有若干层。3. The method for preparing a copper-coated pad according to claim 2, wherein the non-metallic filler tape has several layers. 4.如权利要求1-3之一所述的铜包覆垫的制备方法,其特征在于:所述第二铜条的两侧边分别与所述第一铜条的第一侧边和第二侧边内侧相抵。4. The method for preparing a copper-coated pad according to any one of claims 1 to 3, characterized in that: both sides of the second copper strip are respectively connected with the first side and the second side of the first copper strip. The inner sides of the two sides touch each other.
CN202311130767.1A 2023-09-04 2023-09-04 A kind of preparation method of copper-coated pad Pending CN117206830A (en)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR19980069225A (en) * 1997-02-20 1998-10-26 이종철 Manufacturing method of gasket
CN201884647U (en) * 2010-11-04 2011-06-29 洛阳永定密封件有限公司 Metal jacketed gasket
CN110733227A (en) * 2019-10-25 2020-01-31 苏州工业园区麦特自动化技术有限公司 A device for manufacturing cladding gaskets
CN114811045A (en) * 2022-05-10 2022-07-29 慈溪市恒立密封材料有限公司 Preparation process of metal-coated gasket

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR19980069225A (en) * 1997-02-20 1998-10-26 이종철 Manufacturing method of gasket
CN201884647U (en) * 2010-11-04 2011-06-29 洛阳永定密封件有限公司 Metal jacketed gasket
CN110733227A (en) * 2019-10-25 2020-01-31 苏州工业园区麦特自动化技术有限公司 A device for manufacturing cladding gaskets
CN114811045A (en) * 2022-05-10 2022-07-29 慈溪市恒立密封材料有限公司 Preparation process of metal-coated gasket

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