CN1176496C - 半导体装置及其制作方法 - Google Patents

半导体装置及其制作方法 Download PDF

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Publication number
CN1176496C
CN1176496C CNB011439629A CN01143962A CN1176496C CN 1176496 C CN1176496 C CN 1176496C CN B011439629 A CNB011439629 A CN B011439629A CN 01143962 A CN01143962 A CN 01143962A CN 1176496 C CN1176496 C CN 1176496C
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CN
China
Prior art keywords
semiconductor device
circuit pattern
image sensing
state image
solid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB011439629A
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English (en)
Chinese (zh)
Other versions
CN1373519A (zh
Inventor
誉田敏幸
辻和人
־
小野寺正德
青木广志
小林泉
森屋晋
海谷宽
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Semiconductor Ltd
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Fujitsu Ltd
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Publication date
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Publication of CN1373519A publication Critical patent/CN1373519A/zh
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Publication of CN1176496C publication Critical patent/CN1176496C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/50—Encapsulations or containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F99/00—Subject matter not provided for in other groups of this subclass
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/011—Manufacture or treatment of image sensors covered by group H10F39/12
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/804—Containers or encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/806—Optical elements or arrangements associated with the image sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/40—Optical elements or arrangements
    • H10F77/407—Optical elements or arrangements indirectly associated with the devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/93—Interconnections
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N7/00—Television systems
    • H04N7/14—Systems for two-way working
    • H04N7/141—Systems for two-way working between two video terminals, e.g. videophone
    • H04N7/142—Constructional details of the terminal equipment, e.g. arrangements of the camera and the display
    • H04N2007/145—Handheld terminals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0284—Details of three-dimensional rigid printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/205—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a pattern electroplated or electroformed on a metallic carrier
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Studio Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
CNB011439629A 2001-02-28 2001-12-27 半导体装置及其制作方法 Expired - Fee Related CN1176496C (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2001055735 2001-02-28
JP055735/2001 2001-02-28
JP315672/2001 2001-10-12
JP2001315672 2001-10-12

Publications (2)

Publication Number Publication Date
CN1373519A CN1373519A (zh) 2002-10-09
CN1176496C true CN1176496C (zh) 2004-11-17

Family

ID=26610367

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB011439629A Expired - Fee Related CN1176496C (zh) 2001-02-28 2001-12-27 半导体装置及其制作方法

Country Status (6)

Country Link
US (1) US20020119658A1 (fr)
EP (2) EP2261993B1 (fr)
JP (1) JP3695583B2 (fr)
KR (1) KR100735806B1 (fr)
CN (1) CN1176496C (fr)
TW (1) TW548843B (fr)

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AU2003268702A1 (en) * 2003-09-30 2005-04-21 Fujitsu Limited Camera module
JP4170950B2 (ja) 2003-10-10 2008-10-22 松下電器産業株式会社 光学デバイスおよびその製造方法
FR2861217B1 (fr) * 2003-10-21 2006-03-17 St Microelectronics Sa Dispositif optique pour boitier semi-conducteur optique et procede de fabrication.
JP4561143B2 (ja) * 2004-03-26 2010-10-13 パナソニック株式会社 撮像装置
JP2005345571A (ja) * 2004-05-31 2005-12-15 Canon Inc 撮像装置および電子機器
CN100512379C (zh) * 2004-07-28 2009-07-08 富士通微电子株式会社 摄像装置和半导体装置
FR2875055B1 (fr) * 2004-09-06 2006-12-01 Kingpak Tech Inc Structure de module de capteur d'image
KR100691436B1 (ko) * 2005-11-01 2007-03-09 삼성전기주식회사 이미지센서 모듈 및 이를 이용한 카메라 모듈
JP2007194930A (ja) * 2006-01-19 2007-08-02 Matsushita Electric Ind Co Ltd 固体撮像装置およびその製造方法
KR100831710B1 (ko) 2006-08-17 2008-05-22 삼성전기주식회사 카메라 모듈의 조립 장치 및 그 조립 방법
JP4663667B2 (ja) * 2007-03-08 2011-04-06 パナソニック株式会社 撮像装置、その製造方法および携帯端末装置
WO2008093830A1 (fr) * 2007-02-02 2008-08-07 Panasonic Corporation Dispositif d'imagerie, procédé de fabrication du dispositif d'imagerie et dispositif de terminal portable
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JP4663666B2 (ja) * 2007-03-08 2011-04-06 パナソニック株式会社 撮像装置、その製造方法および携帯端末装置
EP2524264A4 (fr) * 2010-01-11 2014-02-19 Flextronics Ap Llc Module d'appareil photo équipé d'une monture d'imageur à puces retournées sur bande moulée et procédé de fabrication
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US10197716B2 (en) 2012-12-19 2019-02-05 Viavi Solutions Inc. Metal-dielectric optical filter, sensor device, and fabrication method
JP6502925B2 (ja) * 2014-04-23 2019-04-17 京セラ株式会社 電子素子実装用基板および電子装置
TWI776471B (zh) * 2014-06-18 2022-09-01 美商唯亞威方案公司 用於製造光學濾光器之方法及光學裝置
CN105282403B (zh) * 2014-07-07 2019-08-23 宁波舜宇光电信息有限公司 一种控制摄像模组解像力均匀性的方法及摄像模组
JP6506034B2 (ja) * 2015-01-29 2019-04-24 京セラ株式会社 電子素子実装用基板および電子装置
EP4622279A1 (fr) 2016-02-18 2025-09-24 Ningbo Sunny Opotech Co., Ltd. Module de caméra basé sur un processus d'encapsulation intégrale, composant de base intégrale de celui-ci, et son procédé de fabrication
CN106060727A (zh) * 2016-06-07 2016-10-26 广东欧珀移动通信有限公司 扬声器组件及移动终端
KR20190020096A (ko) 2016-07-03 2019-02-27 닝보 써니 오포테크 코., 엘티디. 감광성 부품과 카메라 모듈 및 그 제조방법
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JP2000049319A (ja) * 1998-07-27 2000-02-18 Olympus Optical Co Ltd 固体撮像装置
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Also Published As

Publication number Publication date
KR20020070773A (ko) 2002-09-11
JP2003189195A (ja) 2003-07-04
EP1237202B1 (fr) 2012-02-01
US20020119658A1 (en) 2002-08-29
JP3695583B2 (ja) 2005-09-14
EP1237202A3 (fr) 2004-12-08
TW548843B (en) 2003-08-21
CN1373519A (zh) 2002-10-09
EP2261993A2 (fr) 2010-12-15
EP2261993A3 (fr) 2012-07-11
EP2261993B1 (fr) 2014-12-31
KR100735806B1 (ko) 2007-07-06
EP1237202A2 (fr) 2002-09-04

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Effective date of registration: 20090206

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