CN118024347A - Diaphragm cutting device and diaphragm cutting method - Google Patents
Diaphragm cutting device and diaphragm cutting method Download PDFInfo
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- CN118024347A CN118024347A CN202410345069.1A CN202410345069A CN118024347A CN 118024347 A CN118024347 A CN 118024347A CN 202410345069 A CN202410345069 A CN 202410345069A CN 118024347 A CN118024347 A CN 118024347A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D9/00—Cutting apparatus combined with punching or perforating apparatus or with dissimilar cutting apparatus
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D7/18—Means for removing cut-out material or waste
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D7/18—Means for removing cut-out material or waste
- B26D7/1845—Means for removing cut-out material or waste by non mechanical means
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D7/27—Means for performing other operations combined with cutting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D2007/0012—Details, accessories or auxiliary or special operations not otherwise provided for
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Details Of Cutting Devices (AREA)
Abstract
The invention discloses a diaphragm cutting device and a diaphragm cutting method, and belongs to the technical field. The membrane cutting device comprises detection equipment, typesetting equipment, half-cutting equipment, hole picking equipment, hole cleaning equipment and full-cutting equipment, wherein the detection equipment is used for lighting a master slice and marking dead points, and an identity code is arranged on the master slice; the typesetting equipment is used for identifying the marked dead pixels and generating a half-cut typesetting map, a silver glue hole removing position, a silver glue hole cleaning position and a full-cut typesetting map of the master slice; the half-cutting equipment is used for cutting corresponding silver colloid holes in the master slice; the hole picking device is used for taking out the aluminum film material of the film at the silver adhesive hole; the hole cleaning equipment is used for cleaning the corresponding silver colloid hole inner phase Guan Yuliao; the full-cutting equipment is used for cutting the master slice into a plurality of sub-slices; the half-cutting equipment, the hole picking equipment, the hole cleaning equipment and the full-cutting equipment are all provided with membrane identity recognition modules. The invention not only avoids the mixing of the master slice, improves the cutting efficiency of the membrane, improves the utilization rate of the master slice, but also realizes automatic operation and reduces the labor cost.
Description
Technical Field
The invention relates to the technical field of electronic paper, in particular to a membrane cutting device and a membrane cutting method.
Background
In the current electronic paper industry, the structure of an electronic paper display screen consists of a TFT substrate, an IC chip, an FPC (flexible printed circuit), an electronic paper ink film and a PS (polystyrene) film, wherein the electronic paper ink film is a main material.
Since the incoming material film is a master film (size 816 x 622.mm or 390 x 622.3 mm), the incoming material film needs to be cut into sub-films (also called as small-grain finished products), and a series of process flows are needed in the operation process to meet the requirements. But has the following problems:
1. Because the identity information of each membrane cannot be identified in the process flow, a single-station procedure is needed for manual operation, and the reject ratio is extremely high when the large electronic paper ink membrane is finally cut into small particles, so that membrane mixing is easy to cause;
2. When the dead pixel is identified manually, half-cutting and full-cutting of the membrane can be carried out only according to the whole row layout which is planned by the previous size, so that the utilization yield of the electronic paper ink membrane is lower.
For this reason, it is necessary to provide a film cutting device and a film cutting method to solve the above-described problems.
Disclosure of Invention
The invention aims to provide a diaphragm cutting device and a diaphragm cutting method, which not only avoid mixing of a master slice, but also improve the utilization rate of the master slice when cutting is carried out along the technological process.
In order to achieve the above object, the following technical scheme is provided:
A film cutting device comprising:
The detection equipment is used for lighting a master slice and marking dead points, and the master slice is provided with an identity code;
The typesetting equipment is arranged on one side of the detection equipment and is used for identifying the marked dead pixels and generating a half-cut layout, a silver colloid hole removal position, a silver colloid hole cleaning position and a full-cut typesetting diagram of the master slice;
The half-cutting equipment is arranged on one side of the typesetting equipment and is used for cutting corresponding silver colloid holes in the master slice;
the hole picking device is arranged on one side of the half-cutting device and is used for taking out the aluminum film at the silver colloid hole;
The hole cleaning equipment is arranged on one side of the hole picking equipment and is used for cleaning the corresponding surplus materials in the silver colloid holes;
The full-cutting device is arranged on one side of the hole cleaning device and is used for cutting the master slice into a plurality of sub-slices; the semi-cutting equipment, the hole picking equipment, the hole cleaning equipment and the full-cutting equipment are all provided with membrane identity recognition modules.
As an alternative of the film cutting device, the detection device is provided with a laser engraving module, and the laser engraving module is used for engraving an identity code on the master film.
As an alternative of the film cutting device, the film cutting device further comprises a feeding device, wherein the feeding device is arranged on one side of the detecting device, and the feeding device is used for conveying the master film to the detecting device.
As an alternative scheme of the film cutting device, the film cutting device further comprises a blanking device, wherein the blanking device is arranged on one side of the full-cutting device and is used for taking the sub-pieces on the full-cutting device.
As an alternative to the film cutting device, the film identification module includes a scanning reader, and the hole picking device includes a CCD camera module.
The film cutting method adopts the film cutting device to cut the master film, and comprises the following steps:
S1, a master slice is lightened by detection equipment and bad points are marked, and a laser engraving module on the detection equipment engraves an identity code on the master slice;
S2, the typesetting equipment uses an algorithm to avoid bad points and generate a half-cut typesetting map, a silver glue hole removal position, a silver glue hole cleaning position and a full-cut typesetting map;
s3, the half-cutting equipment adopts a membrane identification module to identify a master slice, and corresponding silver colloid holes are cut on the master slice according to the half-cutting arrangement pattern;
s4, the hole picking equipment adopts a membrane identity recognition module to recognize a master slice, and takes out the aluminum membrane at each silver colloid hole according to the silver colloid hole removing position;
S5, the hole cleaning equipment adopts a membrane identity recognition module to recognize a master slice, and sprays a solvent to clean each silver colloid hole according to the silver colloid hole cleaning position;
S6, the full-cutting equipment adopts the membrane identification module to identify the master slice, and cuts the master slice according to the full-cutting typesetting diagram.
As an alternative to the film cutting method, in the step S3, the master from the typesetting device is turned over until the aluminum film of the master faces upward, and then silver colloid holes are cut.
As an alternative to the film cutting method, in the step S5, a roll brush is used for cleaning.
As an alternative to the film cutting method, step S01 is further included before step S1, where the master to be cut is conveyed to the detecting device through a feeding device.
As an alternative to the film cutting method, step S7 is further included after step S6, and the automatic blanking of the sub-sheets located in the full-cut device is completed by the blanking device.
Compared with the prior art, the invention has the beneficial effects that:
the invention provides a diaphragm cutting device, which is sequentially provided with a detection device, a typesetting device, a half-cutting device, a hole picking device, a hole cleaning device and a full-cutting device along the direction of a process flow, wherein after a defective pixel on a master slice is marked by the detection device, the typesetting device recognizes the position of the defective pixel and generates a half-cutting layout of the master slice, a silver colloid hole removing position, a silver colloid hole cleaning position and a full-cutting typesetting diagram by utilizing an algorithm, a corresponding silver colloid hole is cut on the master slice by the half-cutting device, the cleaning of the silver colloid hole is finished by utilizing the hole picking device and the hole cleaning device, and the whole master slice is cut into required sub-slices by utilizing the full-cutting device. The semi-cutting equipment, the hole picking equipment, the hole cleaning equipment and the full-cutting equipment are all provided with film identity recognition modules, each master film is provided with an identity code of the master film, and the film identity recognition modules are required to recognize the master film before the semi-cutting process, the hole picking process, the hole cleaning process and the full-cutting process, so that the master film is prevented from being mixed, and the reject ratio of the film cutting device is reduced; and a whole column layout with a planned size in advance is not needed, and a layout device is utilized to generate a corresponding layout for the master sheets with different bad point positions and bad point numbers, so that the master sheet utilization rate of the electronic paper ink film sheet is improved.
According to the membrane cutting method provided by the invention, the identity codes of the membrane are arranged on the master, and the membrane identity recognition module is used for recognizing the master to ensure that the master cannot be mixed; the bad points on the master slice are avoided to generate corresponding half-cut layout, silver glue hole removal positions, silver glue hole cleaning positions and full-cut layout, and the utilization rate of the master slice of the electronic paper ink membrane is improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following description will briefly explain the drawings needed in the description of the embodiments of the present invention, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and other drawings may be obtained according to the contents of the embodiments of the present invention and these drawings without inventive effort for those skilled in the art.
FIG. 1 is an assembled schematic view of a film cutting device according to an embodiment of the present invention;
FIG. 2 is a cross-sectional view of an electronic paper ink film according to an embodiment of the present invention;
Fig. 3 is a flowchart of a method for cutting a film according to an embodiment of the invention.
Reference numerals:
1. A feeding device; 2. a detection device; 3. typesetting equipment; 4. semi-cutting equipment; 5. hole picking equipment; 6. hole cleaning equipment; 7. full cutting equipment; 8. a blanking device;
100. An electronic paper ink membrane; 101. an aluminum film; 102. a first adhesive layer; 103. an ink ion layer; 104. a conductive layer; 105. a PET film; 106. silver colloid holes; 107. a second adhesive layer; 108. and a protective film.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are some embodiments of the present invention, but not all embodiments of the present invention. The components of the embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.
In the description of the present invention, it should be noted that, directions or positional relationships indicated by terms such as "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., are directions or positional relationships based on those shown in the drawings, or are directions or positional relationships conventionally put in use of the inventive product, are merely for convenience of describing the present invention and simplifying the description, and are not indicative or implying that the apparatus or element to be referred to must have a specific direction, be configured and operated in a specific direction, and thus should not be construed as limiting the present invention. Furthermore, the terms "first," "second," "third," and the like are used merely to distinguish between descriptions and should not be construed as indicating or implying relative importance. In the description of the present invention, unless otherwise indicated, the meaning of "a plurality" is two or more.
In the description of the present invention, it should also be noted that, unless explicitly specified and limited otherwise, the terms "disposed", "connected" and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected or integrally connected; either mechanically or electrically. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.
Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the invention.
Because the current electronic paper industry is in large piece, the characteristic requirement of the electronic paper ink film master film is higher, the requirement can be met only by a series of technological processes in the operation process, and the identity information of each master film cannot be identified in the process, so that the single-station process manual operation can be separated in the production process, and the reject ratio is extremely high when the large-piece master film is cut into small particles, and the master film mixing is easy to cause. When the dead pixels are marked manually, half-cutting and full-cutting of the master film can be performed only according to the whole row layout with the planned previous size, so that the utilization yield of the electronic paper ink film is lower, small-particle films with good or bad pixels are not effectively utilized, the labor is wasted, the cost is wasted and the like, a great deal of labor is consumed by each site, and if the management and control is not timely, the problems of poor product batch quality risk and consistency and the like are caused
The half-cut referred to in this embodiment refers to dividing the master into a plurality of grid areas (each grid area corresponds to a position of a sub-piece) according to the generated half-cut layout, and cutting silver colloid holes in each grid area (the specific number is not limited here). The full cutting refers to cutting the whole master slice into a plurality of sub-slices according to the generated full cutting layout.
In order to avoid mixing of the films and improve the utilization rate of the ink film of the electronic paper during the cutting along the process flow, the embodiment provides a film cutting device and a film cutting method, and the details of the embodiment are described in detail below with reference to fig. 1 to 3. As shown in fig. 2, the electronic paper ink film 100 includes an aluminum film 101, a first glue layer 102, an ink ion layer 103, a conductive layer 104, a PET film 105, a second glue layer 107, and a protective film 108, and silver glue holes 106 penetrate through the aluminum film 101, the first glue layer 102, and the ink ion layer 103. Illustratively, the protective film 108 is a PS film, PS is a polystyrene material, collectively Polystyrene, which is a thermoplastic. It is polymerized from styrene monomer, so it has good transparency, mechanical property and processing property, and can be widely used in various fields. The PET film 105 is also named as a high-temperature resistant polyester film, has excellent physical properties, chemical properties, dimensional stability, transparency and recyclability, and can be widely applied to the fields of magnetic recording, photosensitive materials, electronic and electric insulation, industrial films, package decoration, screen protection, optical-grade mirror surface protection and the like.
As shown in fig. 1 and fig. 2, the film cutting device provided in this embodiment includes a detecting device 2, a typesetting device 3, a half-cutting device 4, a hole picking device 5, a hole cleaning device 6, and a full-cutting device 7. Wherein the detection device 2 is used for lighting up a master and marking bad spots, and an identity code is arranged on the master. The typesetting equipment 3 is arranged on one side of the detection equipment 2, and the typesetting equipment 3 is used for identifying marked dead pixels and generating a half-cut layout, a silver glue hole removing position, a silver glue hole cleaning position and a full-cut typesetting diagram of the master. The half-cutting device 4 is arranged on one side of the typesetting device 3, and the half-cutting device 4 is used for cutting corresponding silver colloid holes 106 on a master. The hole picking device 5 is arranged on one side of the half-cutting device 4, and the hole picking device 5 is used for taking out the aluminum film 101 material of the membrane at the silver colloid hole 106. The hole cleaning device 6 is arranged on one side of the hole picking device 5, and the hole cleaning device 6 is used for cleaning relevant residual materials in the corresponding silver colloid holes 106. The full cutting device 7 is arranged on one side of the hole cleaning device 6, and the full cutting device 7 is used for cutting the master into a plurality of sub-pieces; the half-cutting equipment 4, the hole picking equipment 5, the hole cleaning equipment 6 and the full-cutting equipment 7 are all provided with membrane identity recognition modules.
In short, the film cutting device provided in this embodiment sets up detection device 2, typesetting device 3, half-cutting device 4, hole picking device 5, hole cleaning device 6 and full-cutting device 7 in sequence along the direction of the process flow, after the defective pixels on the master are marked by using the detection device 2, the typesetting device 3 recognizes the positions of the defective pixels and generates a half-cutting layout, a silver colloid hole removing position, a silver colloid hole cleaning position and a full-cutting typesetting map of the master by using an algorithm, the corresponding silver colloid holes 106 are cut out on the master by the half-cutting device 4, the cleaning of the silver colloid holes 106 is completed by using the hole picking device 5 and the hole cleaning device 6, and the whole master is cut into required sub-pieces by using the full-cutting device 7. The half-cutting equipment 4, the hole picking equipment 5, the hole cleaning equipment 6 and the full-cutting equipment 7 are all provided with membrane identity recognition modules, each master slice is provided with an identity code of the master slice, and the membrane identity recognition modules are required to recognize the master slice before the half-cutting procedure, the hole picking procedure, the hole cleaning procedure and the full-cutting procedure, so that the master slice is ensured not to be mixed, and the reject ratio of the membrane cutting device is reduced; the layout is not required to be planned in advance by using a whole row, and the layout is generated by using the typesetting equipment 3 for the master sheets with different bad point positions and bad point numbers, so that the master sheet utilization rate of the electronic paper ink film 100 is improved conveniently.
Further, the detection device 2 is provided with a laser engraving module, and the laser engraving module is used for engraving an identity code on the master. The identity code can be, but is not limited to, a two-dimensional code or a code formed by combining numbers and letters, and is used for the identity binding of the master.
Still further, the film cutting device further comprises a feeding device 1, wherein the feeding device 1 is arranged on one side of the detecting device 2, and the feeding device 1 is used for conveying the master film to the detecting device 2. The diaphragm cutting device is convenient for continuously supplying the master slice to the detection equipment 2 by additionally arranging the feeding equipment 1, and ensures batch processing of the master slice.
Optionally, the film cutting device further comprises a blanking device 8, wherein the blanking device 8 is arranged on one side of the full-cutting device 7, and the blanking device 8 is used for taking sub-sheets on the full-cutting device 7. The diaphragm cutting device is convenient for take out the sub-piece which is cut on the full cutting device 7 in time by additionally arranging the blanking device 8, and the material stacking is avoided.
Further, the membrane identification module includes a scanning reader. The scanning reader can be, but is not limited to, a scanning gun or a camera, and in actual use, the scanning reader scans and reads the identity code on the master, so that the equipment can conveniently call out the corresponding cutting layout or the hole site of the silver colloid hole 106. The hole picking device 5 comprises a CCD camera module, and the CCD camera module is used for identifying hole sites needing to be picked, so that the picking precision is ensured.
As shown in fig. 3, the present embodiment also provides a film cutting method for cutting a master film using the film cutting apparatus mentioned above, the film cutting method comprising the steps of: s1, a detection device 2 lights up a master slice and marks bad points, and a laser engraving module on the detection device 2 engraves an identity code on the master slice to realize the identity binding of the master slice; s2, the typesetting equipment 3 uses an algorithm to avoid bad points and generate a half-cut typesetting map, a silver glue hole removal position, a silver glue hole cleaning position and a full-cut typesetting map; s3, the half-cutting equipment 4 adopts a membrane identification module to identify a master slice, and cuts corresponding silver colloid holes 106 on the master slice according to the half-cutting arrangement pattern; s4, the hole picking device 5 adopts a membrane identity recognition module to recognize a master slice, and takes out the aluminum membrane 101 at each silver colloid hole 106 according to the silver colloid hole removing position; s5, the hole cleaning equipment 6 adopts a membrane identity recognition module to recognize a master slice, sprays a solvent to clean each silver colloid hole 106 according to the silver colloid hole cleaning position, and removes relevant residual materials; s6, the full-cutting equipment 7 adopts a membrane identity recognition module to recognize the master slice, and cuts the master slice according to the full-cutting typesetting diagram. According to the membrane cutting method provided by the embodiment, the identity codes of the membrane are arranged on the master, and the master is identified by the membrane identity identification module so as to ensure that the master cannot be mixed. The bad points on the master slice are avoided to generate corresponding half-cut layout, silver glue hole removal positions, silver glue hole cleaning positions and full-cut layout, and the utilization rate of the master slice of the electronic paper ink membrane 100 is improved.
Further, in step S3, the master from the typesetting apparatus 3 is first turned over until the aluminum film 101 of the master faces upward, and then the silver paste holes 106 are cut. In step S1 and step S2, the aluminum film 101 of the master is placed downward, so that the master needs to be turned 180 degrees before the silver colloid hole 106 is cut, so that the aluminum film 101 of the master faces upward, and the silver colloid hole 106 is conveniently machined on the master by the half-cutting device 4.
Further, in step S5, a roll brush is used for cleaning. The hole cleaning device 6 sprays solvent on the surface of the aluminum film 101 aiming at holes to be cleaned, the surface of the aluminum film 101 is cleaned one by adopting a rolling brush, the solvent flowing into the silver colloid holes 106 can wet the ink ion layer 103, and the ink ion layer 103 in the silver colloid holes 106 is discharged under the stirring of the rolling brush.
Further, step S01 is further included before step S1, and the master to be cut is conveyed to the detecting device 2 through the feeding device 1. The master from the feeding device 1 is placed on the detection table by the manipulator on the detection device 2.
Further, step S7 is further included after step S6, and automatic blanking is completed on the sub-sheet located in the full-cut device 7 through the blanking device 8. The blanking equipment 8 carries out the operation of arranging and packaging the unmarked products to the line body, and the products with marked dead spots are subjected to repeated judgment to carry out independent sub-packaging storage on defective products.
In summary, according to the film cutting device and the film cutting method in this embodiment, the incoming master is automatically lighted to identify the dead pixels and bound with the identity of the master, so that the master has a code, the dead pixels are identified by the optimization algorithm of the module and then calculated to obtain the optimal film cutting layout, and then all the master working procedures are added with the related working procedure diagrams for code scanning identification and processing, and the automation equipment is utilized to realize the online between the working procedures, so that the utilization rate and the yield of the master can be effectively improved, the problems of low manual working efficiency, high manual cost and high manual inspection risk are solved, the efficiency and the yield are improved, and the full automation of the cutting of the electronic paper ink film 100 can be realized.
Note that the above is only a preferred embodiment of the present invention and the technical principle applied. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, while the invention has been described in connection with the above embodiments, the invention is not limited to the embodiments, but may be embodied in many other equivalent forms without departing from the spirit or scope of the invention, which is set forth in the following claims.
Claims (10)
1. The diaphragm cutting device, its characterized in that includes:
The detection equipment (2) is used for lighting a master slice and marking bad points, and the master slice is provided with an identity code;
The typesetting equipment (3) is arranged on one side of the detection equipment (2), and the typesetting equipment (3) is used for identifying the marked dead pixels and generating a half-cut layout, a silver glue hole removal position, a silver glue hole cleaning position and a full-cut typesetting diagram of the master slice;
The half-cutting equipment (4) is arranged on one side of the typesetting equipment (3), and the half-cutting equipment (4) is used for cutting corresponding silver colloid holes (106) on the master slice;
The hole picking device (5) is arranged on one side of the half-cutting device (4), and the hole picking device (5) is used for taking out the aluminum film (101) at the silver colloid hole (106);
The hole cleaning device (6) is arranged on one side of the hole picking device (5), and the hole cleaning device (6) is used for cleaning the corresponding surplus materials in the silver colloid holes (106);
the full-cutting device (7) is arranged on one side of the hole cleaning device (6), and the full-cutting device (7) is used for cutting the master slice into a plurality of sub-slices; the semi-cutting device (4), the hole picking device (5), the hole cleaning device (6) and the full-cutting device (7) are respectively provided with a membrane identity recognition module.
2. The film cutting device according to claim 1, characterized in that the detection means (2) are provided with a laser engraving module for engraving an identity code on the master.
3. The film cutting device according to claim 2, further comprising a feeding device (1), wherein the feeding device (1) is arranged at one side of the detecting device (2), and the feeding device (1) is used for conveying the master to the detecting device (2).
4. A film cutting device according to claim 3, characterized in that the film cutting device further comprises a blanking device (8), wherein the blanking device (8) is arranged on one side of the full cutting device (7), and the blanking device (8) is used for taking the sub-pieces on the full cutting device (7).
5. The film cutting device according to any one of claims 1-4, wherein the film identification module comprises a scanning reader and the picking device (5) comprises a CCD camera module.
6. A film cutting method, characterized in that the film cutting device according to claim 5 is used for cutting a master film, comprising the steps of:
s1, a master slice is lightened by detection equipment (2) and bad points are marked, and a laser engraving module on the detection equipment (2) engraves an identity code on the master slice;
S2, the typesetting equipment (3) uses an algorithm to avoid bad points and generate a half-cut typesetting map, a silver glue hole removal position, a silver glue hole cleaning position and a full-cut typesetting map;
S3, the half-cutting equipment (4) adopts a membrane identity recognition module to recognize a master slice, and cuts corresponding silver colloid holes (106) on the master slice according to the half-cutting arrangement pattern;
S4, the hole picking device (5) adopts a membrane identity recognition module to recognize a master slice, and takes out the aluminum membrane (101) at each silver colloid hole (106) according to the silver colloid hole removing position;
S5, the hole cleaning equipment (6) adopts a membrane identity recognition module to recognize a master slice, and sprays a solvent to clean each silver colloid hole (106) according to the silver colloid hole cleaning position;
s6, the full-cutting equipment (7) adopts a membrane identity recognition module to recognize the master slice, and cuts the master slice according to the full-cutting typesetting diagram.
7. The method according to claim 6, characterized in that in step S3, the master from the typesetting device (3) is first turned over until the aluminum film (101) of the master is facing upwards, and then the cutting of the silver colloid holes (106) is performed.
8. The method according to claim 6, wherein in step S5, the cleaning is performed by using a roll brush.
9. The method according to claim 6, further comprising a step S01 of feeding the master to be cut to the detecting device (2) through a feeding device (1) before the step S1.
10. The method according to any one of claims 6-9, further comprising a step S7 of automatically blanking the sub-sheets located in the full-cut device (7) by a blanking device (8) after said step S6.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202410345069.1A CN118024347A (en) | 2024-03-25 | 2024-03-25 | Diaphragm cutting device and diaphragm cutting method |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202410345069.1A CN118024347A (en) | 2024-03-25 | 2024-03-25 | Diaphragm cutting device and diaphragm cutting method |
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| CN118024347A true CN118024347A (en) | 2024-05-14 |
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| CN202410345069.1A Pending CN118024347A (en) | 2024-03-25 | 2024-03-25 | Diaphragm cutting device and diaphragm cutting method |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN119148438A (en) * | 2024-09-10 | 2024-12-17 | 江西兴泰科技股份有限公司 | Electronic paper master cutting typesetting device and method |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20140104676A1 (en) * | 2012-10-12 | 2014-04-17 | Electronics And Telecommunications Research Institute | Method of fabricating display apparatus and display apparatus fabricated thereby |
| CN114326248A (en) * | 2022-01-12 | 2022-04-12 | 苏州清越光电科技股份有限公司 | Preparation method of electronic ink film |
| CN115524892A (en) * | 2022-10-21 | 2022-12-27 | 广东志慧芯屏科技有限公司 | Electronic paper display module processing method, electronic paper display module and display device |
| CN116504161A (en) * | 2023-05-11 | 2023-07-28 | 义乌清越光电科技有限公司 | Automatic inspection and identification device |
| CN117289520A (en) * | 2023-11-27 | 2023-12-26 | 成都捷翼电子科技有限公司 | Manufacturing method of roll-to-roll flexible electronic paper membrane |
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2024
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| US20140104676A1 (en) * | 2012-10-12 | 2014-04-17 | Electronics And Telecommunications Research Institute | Method of fabricating display apparatus and display apparatus fabricated thereby |
| CN114326248A (en) * | 2022-01-12 | 2022-04-12 | 苏州清越光电科技股份有限公司 | Preparation method of electronic ink film |
| CN115524892A (en) * | 2022-10-21 | 2022-12-27 | 广东志慧芯屏科技有限公司 | Electronic paper display module processing method, electronic paper display module and display device |
| CN116504161A (en) * | 2023-05-11 | 2023-07-28 | 义乌清越光电科技有限公司 | Automatic inspection and identification device |
| CN117289520A (en) * | 2023-11-27 | 2023-12-26 | 成都捷翼电子科技有限公司 | Manufacturing method of roll-to-roll flexible electronic paper membrane |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN119148438A (en) * | 2024-09-10 | 2024-12-17 | 江西兴泰科技股份有限公司 | Electronic paper master cutting typesetting device and method |
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