CN118678564A - Manufacturing method of printed circuit board with built-in passive device - Google Patents
Manufacturing method of printed circuit board with built-in passive device Download PDFInfo
- Publication number
- CN118678564A CN118678564A CN202410791298.6A CN202410791298A CN118678564A CN 118678564 A CN118678564 A CN 118678564A CN 202410791298 A CN202410791298 A CN 202410791298A CN 118678564 A CN118678564 A CN 118678564A
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- built
- printed circuit
- circuit board
- manufacturing
- inner core
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 32
- 238000000034 method Methods 0.000 claims abstract description 42
- 239000000853 adhesive Substances 0.000 claims abstract description 31
- 230000001070 adhesive effect Effects 0.000 claims abstract description 31
- 238000012545 processing Methods 0.000 claims abstract description 21
- 238000005553 drilling Methods 0.000 claims abstract description 10
- 230000000903 blocking effect Effects 0.000 claims description 14
- 239000003292 glue Substances 0.000 claims description 13
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- 238000009713 electroplating Methods 0.000 claims description 4
- 238000003475 lamination Methods 0.000 claims description 4
- 238000007639 printing Methods 0.000 claims description 4
- 238000005507 spraying Methods 0.000 claims description 4
- 239000003990 capacitor Substances 0.000 claims description 3
- 238000003825 pressing Methods 0.000 abstract description 7
- 229910000679 solder Inorganic materials 0.000 abstract description 7
- 238000003466 welding Methods 0.000 abstract description 4
- 238000004381 surface treatment Methods 0.000 abstract description 3
- 238000003754 machining Methods 0.000 abstract 1
- 238000005516 engineering process Methods 0.000 description 9
- 239000004020 conductor Substances 0.000 description 4
- 239000002390 adhesive tape Substances 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000006087 Brown hydroboration reaction Methods 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
本发明公开了一种内置无源器件印刷线路板的制作方法，包括在具有图形线路的内层芯板上加工出槽孔；通过导电型胶粘剂使元器件固定在槽孔中，其中，导电型胶粘剂与元器件端极连接后，在两侧内层芯板上形成平面导电层；对导电型胶粘剂的平面导电层进行压合工艺，使元器件埋嵌在PCB板内部；在平面导电层区域进行镭射/机械钻孔加工，使元器件的端极与PCB网络间进行导通；本发明通过导电型胶粘剂将元器件固定在槽孔内，可以取消内置元器件生产中的SMT流程，减少锡膏的使用，并且可以取消SMT焊接焊盘需要的表面处理流程，有利于简化加工流程，减少制程加工中的污染，提高印刷线路板的可靠性。
The invention discloses a method for manufacturing a printed circuit board with built-in passive components, comprising the steps of machining slots on an inner core board with a graphic circuit; fixing components in the slots by means of a conductive adhesive, wherein after the conductive adhesive is connected to the end electrodes of the components, a planar conductive layer is formed on the inner core boards at both sides; a pressing process is performed on the planar conductive layer of the conductive adhesive so that the components are embedded inside the PCB board; laser/mechanical drilling is performed in the planar conductive layer area so that the end electrodes of the components are connected to the PCB network; the invention fixes the components in the slots by means of a conductive adhesive, thereby eliminating the SMT process in the production of built-in components, reducing the use of solder paste, and eliminating the surface treatment process required for the SMT welding pad, which is conducive to simplifying the processing process, reducing pollution in the process, and improving the reliability of the printed circuit board.
Description
Technical Field
The invention relates to a manufacturing method of a printed circuit board with a built-in passive device, and belongs to the technical field of printed circuit boards.
Background
Along with the development of electronic products in the directions of lighter, thinner, shorter and smaller electronic products and higher integration level, more electronic products require a circuit board to reserve more space for a mounted chip. Through the processing technology of embedding components in the PCB, the surface mounting space can be greatly saved, the mounting cost is reduced, and the reliability of products can be greatly improved, so that the technology of embedding components becomes a development trend of the printed circuit board. The existing mainstream technology of built-in components mainly adopts a processing technology of combining a step groove embedded device with solder paste printed packaging, adopts an SMT technology to fix the components and the copper surface of a PCB and then carries out subsequent production processes such as pressing, and the like, and the processing technology depends on the use of solder paste, and when the solder paste is processed through pressing pretreatment (brown oxidation, and the like) after welding, liquid medicine reacts with the solder paste, so that the reliability of a circuit board is affected.
Therefore, in order to solve the bottleneck restriction in the production and manufacture of the printed circuit board of the built-in component, and ensure the good technological performance and the product reliability of the PCB, the method for manufacturing the printed circuit board of the built-in component needs to be broken through and innovated.
Disclosure of Invention
The invention aims to overcome the defects in the prior art and provides a manufacturing method of a printed circuit board with a built-in passive device, which is beneficial to simplifying the processing flow, reducing the pollution in the processing of the manufacturing process and improving the reliability of the printed circuit board.
In order to achieve the above purpose, the invention is realized by adopting the following technical scheme:
in a first aspect, the present invention provides a method for manufacturing a printed wiring board with a built-in passive device, including:
processing a slotted hole on an inner core plate with a graphic circuit;
Fixing the components in the slots through conductive adhesive, wherein after the conductive adhesive is connected with component end poles, a plane conductive layer is formed on the inner layer core plates at two sides;
Performing a lamination process on the plane conductive layer of the conductive adhesive to embed components in the PCB;
And carrying out laser/mechanical drilling processing on the planar conductive layer area to conduct between the terminal of the component and the PCB network.
Furthermore, the slot hole is rectangular, and glue blocking points are respectively designed at the positions close to four corners on the long edge of the slot hole.
Further, the glue blocking point is at least 0.35mm away from the short side of the slot hole, and the height of the glue blocking point is 0.1-0.3 mm.
Further, the application mode of the conductive adhesive comprises the steps of pasting, printing, spraying and dispensing.
Further, the method further comprises: the temporary carrier/jig is attached to the first surface of the inner core board to isolate the connection between the component terminals.
Further, the temporary carrier/jig uses an adhesive tape or a flat jig to form a plane between the surface of the component and the inner core board.
Furthermore, the temporary carrier/jig uses a planar jig with a boss, so that the surface of the component is staggered with the surface of the inner core plate, and a plane is not maintained; or the jig with the boss is used for realizing that components with different thicknesses are embedded on the same inner core plate.
Further, the method further comprises: and respectively attaching a layer of insulating medium on the upper and lower parts of the inner core plate through a pressing process.
Furthermore, after laser/mechanical drilling processing is carried out on the plane conducting layer area, stable connection is formed between the terminal electrode of the component and the PCB network through an electro-coppering process.
Further, the component is any one or more of a capacitor, a resistor and an inductor.
Compared with the prior art, the invention has the beneficial effects that:
The invention provides a manufacturing method of a printed circuit board with a built-in passive device, which is characterized in that components are fixed in slots through conductive adhesive, so that SMT (surface mount technology) processes in the production of the built-in components can be omitted, the use of solder paste can be reduced, the surface treatment process required by SMT welding pads can be omitted, the simplification of the processing process is facilitated, the pollution in the processing of the manufacturing process is reduced, and the reliability of the printed circuit board is improved.
Drawings
FIG. 1 is a schematic cross-sectional view of the present invention as applied to a PCB graphics processing structure;
FIG. 2 is a schematic cross-sectional view of a slot according to an embodiment of the present invention;
FIG. 3 is a schematic cross-sectional view of an embodiment of the present invention for securing components to an inner core using a conductive adhesive;
FIG. 4 is a schematic cross-sectional view of an insulating medium according to an embodiment of the present invention;
FIG. 5 is a schematic cross-sectional view of a laser/mechanical drilling process provided by an embodiment of the present invention;
FIG. 6 is a schematic plan view of a slot design according to an embodiment of the present invention.
In the figure, 101, an inner core plate; 201. an insulating medium; 301. a conductive adhesive; 401. a component; 101 (a) slots; 501. temporary carrier/jig.
Detailed Description
The invention is further described below with reference to the accompanying drawings. The following examples are only for more clearly illustrating the technical aspects of the present invention, and are not intended to limit the scope of the present invention.
In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first", "a second", etc. may explicitly or implicitly include one or more such feature. In the description of the present invention, unless otherwise indicated, the meaning of "a plurality" is two or more.
In the description of the present invention, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art in a specific case.
Embodiment 1, as shown in fig. 1 to 6, this embodiment describes a method for manufacturing a printed wiring board with a built-in passive device, including: the method comprises the steps of processing a slot 101 (a) with a special design on an inner core board 101 with a pattern circuit, fixing a component 401 in the inner core board 101 through a conductive adhesive 301, forming a planar conductive layer on the inner core boards 101 at two sides after the component 401 is connected with end poles of the component, embedding the component 401 in a PCB (printed circuit board) through a pressing process, and conducting between the component 401 and a PCB network through laser/mechanical drilling processing on the planar conductive layer of the conductive adhesive 301; the special designed slot 101 (a) is processed on the inner core board 101 with the pattern, as shown in fig. 6, glue blocking points are designed at two ends of the slot 101 (a), wherein, a glue blocking point is respectively designed at the long edge of the slot 101 (a) and near four corners, the glue blocking points are adjusted according to the type of the component 401, at least 0.35mm is away from the short edge of the slot 101 (a), the height of the glue blocking point is 0.1-0.3 mm, and when the conductive adhesive 301 is used, the flow of the adhesive can be blocked, so that the conductive adhesive 301 can prevent the end of the component 401 from conducting and shorting.
The conductive adhesive 301 is used as a medium to realize the connection between the component 401 and the PCB circuit, so that the use of solder paste in the production of the traditional built-in passive component printed circuit board is replaced, the surface treatment processing of the circuit board before welding is not needed, and the production flow is simplified; the conductive adhesive 301 is manufactured by a processing technology in the circuit board manufacturing process, and is generally manufactured by adopting a patch/printing/spraying/dispensing mode aiming at different types of conductive materials (film/paste).
The temporary carrier/jig 501 is attached to the first surface of the inner core board 101, so that the terminals of the components 401 are isolated when the components 401 are placed, and the short circuit between the terminals of the components 401 is avoided when the conductive adhesive 301 is applied; the temporary carrier/jig 501 may be of a type that uses an adhesive tape or a flat jig to form a plane between the surface of the component 401 and the inner core board 101, or a flat jig with a boss to stagger the surface of the component 401 and the surface of the inner core board 101 without maintaining a plane, or a jig with a boss to embed components 401 of different thicknesses on the same inner core board 101.
The conductive adhesive 301 is used to conduct connection on the side wall of the component 401, a planar conductive layer is formed on the second surface of the inner core board 101, laser/mechanical drilling processing is performed in the area of the planar conductive layer, and after copper electroplating process, the terminal of the component 401 is connected with the PCB network, so that the function of the component 401 is exerted.
The description of the above embodiment will be made with reference to a preferred embodiment.
1. As shown in fig. 2, after the inner layer pattern is manufactured, a slot 101 (a) required by the built-in component 401 is processed on the inner layer core board 101 through a CNC process, the slot 101 (a) is usually designed to be larger than the component by 0.1-0.3 mm, and glue blocking points are required to be manufactured on two sides of the slot 101 (a) (the distance between the glue blocking points and two sides depends on the components 401 with different specifications);
Component 401 capacitor, resistor, inductor, or combinations thereof;
2. As shown in fig. 3, after the temporary carrier/jig 501 is attached to the first surface of the inner core board 101, the conductive adhesive 301 is attached to the inner core board 101 and the component 401 by means of pasting/printing/spraying/dispensing, so as to form a planar conductive layer on the first surface of the inner core board 101;
The conductive material comprises a film type material and a paste type material, the processing technology comprises light curing and thermosetting, the conductive medium type in the material comprises gold, silver, copper or other conductive materials, and the thickness of the processed conductive material is usually 0.05-0.10 mm;
3. As shown in fig. 4, a layer of insulating medium 201 is respectively attached to the upper and lower parts of the inner core board 101 through a pressing process, so that the component 401 is embedded into the PCB;
4. as shown in fig. 5, the planar conductive layer area on the first surface of the inner core board 101 is subjected to laser/mechanical drilling processing by means of laser/mechanical drilling, and after copper electroplating, the component 401 and the PCB network are conducted;
5. according to the functional design requirement of the PCB product, the outer layer manufacturing process can be selected to form the PCB product, or the lamination of the printed circuit board can be increased through the secondary/multiple lamination process.
Embodiment 2, this embodiment describes a method for manufacturing a printed wiring board with a built-in passive device, including: after a circuit pattern is manufactured on the inner core board 101, the slot 101 (a) corresponding to the component 401 is fished out through a CNC process, and glue blocking points are designed at two ends of the slot 101 (a); the first surface of the inner core plate 101 is tightly attached to a temporary carrier/jig 501 by an adhesive tape or vacuum adsorption method, so that the first surface and the temporary carrier plane keep a gapless state; after the component 401 is placed in the slot 101 (a), the conductive adhesive 301 (paste or film) is filled into the gap between the slot 101 (a) and the component 401 from the second surface of the inner core board 101, at this time, the adhesive blocking points at the two ends of the slot 101 (a) can prevent the conductive adhesive from flowing, so as to avoid the short circuit between the ends of the component 401, the conductive adhesive 301 is cured by using UV light or baking, the temporary carrier is removed to obtain a piece of inner core board 101 fixed with the component 401, the component 401 is embedded in the internal structure of the PCB by pressing, and the conductive adhesive is processed at the position of the conductive adhesive, so that the component 401 is conducted with the circuit after copper electroplating.
The above description describes the PCB circuit board structure, main features, fabrication methods and advantages of the present invention. It should be appreciated by those skilled in the art that the embodiments described above may be implemented with equivalent alternatives or equivalent modifications, and are within the scope of the present invention.
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410791298.6A CN118678564A (en) | 2024-06-19 | 2024-06-19 | Manufacturing method of printed circuit board with built-in passive device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410791298.6A CN118678564A (en) | 2024-06-19 | 2024-06-19 | Manufacturing method of printed circuit board with built-in passive device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN118678564A true CN118678564A (en) | 2024-09-20 |
Family
ID=92718497
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202410791298.6A Pending CN118678564A (en) | 2024-06-19 | 2024-06-19 | Manufacturing method of printed circuit board with built-in passive device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN118678564A (en) |
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2024
- 2024-06-19 CN CN202410791298.6A patent/CN118678564A/en active Pending
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