CN119325552A

CN119325552A - Data processing device, data processing system, data processing method, and program

Info

Publication number: CN119325552A
Application number: CN202380044166.0A
Authority: CN
Inventors: 大木亮; 平尾祐亮
Original assignee: Konica Minolta Inc
Current assignee: Konica Minolta Inc
Priority date: 2022-06-01
Filing date: 2023-05-19
Publication date: 2025-01-17
Also published as: WO2023234079A1; KR20240165467A; JPWO2023234079A1

Abstract

The invention relates to a data processing device, a data processing system, a data processing method, and a program. The data processing device (3) is provided with a receiving means (35) for receiving measurement data from a hyperspectral device (2) capable of measuring spectroscopic data for each pixel of an image of a measurement object (4), a detecting means (36) for detecting the occurrence of a defect in the received measurement data, and a file generating means (37) for generating a measurement data file in which a determination value capable of determining defect data is embedded in a defect occurrence portion when the occurrence of the defect in the measurement data is detected.

Description

Data processing device, data processing system, data processing method, and program

Technical Field

The present invention relates to a data processing device, a data processing system, a data processing method, and a program for generating a measurement data file from measurement data of a hyperspectral apparatus capable of measuring two-dimensional spectroscopic data of an object to be measured.

Background

In the data processing system using the hyperspectral devices such as the hyperspectral cameras capable of measuring two-dimensional spectroscopic data as described above, measurement data files aggregated into a certain unit are generated from measurement data of the HSI devices, and stored in the storage unit, and data is read from the stored files to perform image generation, analysis of the spectroscopic data, and the like. In the following description, the "hyperspectral camera" may be referred to as an "HSI camera" and the "hyperspectral device" may be referred to as an "HSI device".

Since the measurement data obtained when the HSI device measures the measurement object 100 shown in fig. 8 (a) is the spectroscopic data 102 corresponding to the number of wavelengths based on the measurable wavelength range and resolution (shown in fig. 8 (C)), the measurement data is a considerable amount of data compared with the data 101 obtained by a normal RGB3 channel camera (shown in fig. 8 (B)).

In addition, for example, in a measurement object such as a micro LED (micro LED) wafer in which a large number of LED elements having a size of several tens of μm are formed on a substrate having a diameter of about 100mm, it is sometimes required to analyze and evaluate the spectroscopic characteristics of each of these elements at the time of inspection.

In order to fulfill such a requirement, measurement with a considerably high resolution needs to be performed at high speed. However, depending on the specifications of hardware on the data processing apparatus side such as a personal computer (hereinafter, also referred to as a PC) that receives measurement data, specifically, the performance of a data receiving unit, a storage unit (SSD, HDD, or the like), or the like, there are cases where the storage of measurement data cannot keep pace with measurement.

In this case, a data defect in which measurement data is missed is generated. Conventionally, a measurement data file is generated by interpolating defect data using data around a defect portion so as to be in a state where no data defect has occurred.

However, if the defect data is interpolated to generate a measurement data file, the following problems exist.

That is, after the generation of the measurement data file, a post-processing using the generated measurement data file may be required. In this case, depending on the processing content, it may be necessary to explicitly perform interpolation (a portion where data defect occurs) or to ignore data, but if defective data has been interpolated, there is a problem that these post-processing is hindered.

In particular, since the measurement data of the hyperspectral apparatus is two-dimensional spectroscopic data, analysis processing involving various aspects is performed using the measurement data file. If the interpolation is completed, these analysis processes are restricted, and execution of appropriate processes is prevented.

Patent document 1 proposes an image processing apparatus capable of repairing a defective region at a high speed and with high quality with respect to an input image including the defective region such as a punched hole or a trace of a stapler. The image processing device is provided with a structuring unit for structuring pixel values of pixels of a region not including a defective region, and a repairing unit for performing image processing for estimating pixel values of pixels included in the defective region based on the pixel values after structuring and repairing the defective region.

Patent document 1 Japanese patent application laid-open No. 2011-35567

However, the image processing apparatus described in patent document 1 is not a technique related to data corruption of measurement data from an HSI device having a large amount of measurement data, and therefore it is difficult to apply the image processing apparatus to measurement data from an HSI device. Therefore, according to patent document 1, the above-described problem that when a measurement data file is generated in a state where defect data is interpolated, post-processing using the measurement data file cannot be properly performed cannot be solved.

Disclosure of Invention

The present invention has been made in view of the above-described technical problems, and an object of the present invention is to provide a data processing apparatus, a data processing system, a data processing method, and a program capable of appropriately performing post-processing using a generated measurement data file when a defect occurs in measurement data of an HSI device.

The above object is achieved by the following means.

(1) A data processing device is provided with:

A receiving unit that receives measurement data from a hyperspectral device capable of measuring two-dimensional spectroscopic data of a measurement object;

a detecting unit for detecting the defect of the measurement data received by the receiving unit, and

And a file generation unit configured to generate a measurement data file in which a determination value capable of determining defect data is embedded in a defect generation site when the detection unit detects the occurrence of a defect in the measurement data.

(2) The data processing apparatus according to the above 1, wherein,

Comprises an analysis unit for analyzing the measurement data file generated by the file generation unit,

The analysis means switches the operation of the generation site of the defect of the measurement data file according to the analysis purpose.

(3) The data processing apparatus according to any one of the preceding items 1 or 2, wherein,

The above-mentioned determination value is 0 or a maximum value or a minimum value of values which can be held with respect to the measurement data.

(4) The data processing apparatus according to the above 2, wherein,

The analysis unit interpolates the measurement data by at least one interpolation method selected from linear interpolation, spline interpolation and Lagrange interpolation at the defect generation position.

(5) The data processing apparatus according to the above 2, wherein,

The detecting means counts the occurrence of defects, and determines whether defects equal to or greater than a predetermined value are continuously generated.

(6) The data processing apparatus according to the above item 5, wherein,

The object to be measured is a micro LED wafer having a plurality of LED elements, and the predetermined value is the number of times of occurrence of defects when the non-resolvable region occurring due to continuous occurrence of defects exceeds the size of the LED elements.

(7) The data processing apparatus according to the above item 5, wherein,

The device is provided with a control unit which controls the hyperspectral device to interrupt the measurement by the hyperspectral device or to re-measure the measurement part including the region where the defect is continuous when the detection unit determines that the defect is continuously generated at least equal to a predetermined value.

(8) The data processing apparatus according to the above 2, wherein,

The object to be measured is a micro LED wafer having a plurality of LED elements,

The analysis unit generates an image of the micro LED wafer based on the measured spectroscopic data, determines that the data is defective when the determination value is detected at the time of image generation, and interpolates the data using the determination value directly or replaced with another value or using data before and after the use.

(9) The data processing apparatus according to the above 2, wherein,

The analysis unit analyzes the LED elements on the micro LED wafer, and excludes the pixels of the determined value from the analysis object when the determined value is detected.

(10) The data processing apparatus according to the above 9, wherein,

When the number of pixels not excluded from the analysis object is smaller than a predetermined value, the analysis means adds warning information to the analysis result of the LED element.

(11) A data processing system, wherein,

The device comprises a hyperspectral device capable of measuring two-dimensional spectroscopic data of a measurement object, and the data processing device described in the previous item 1 or 2.

(12) A method of data processing, comprising:

a measurement step of measuring two-dimensional spectroscopic data of the measurement object by a hyperspectral device;

a detection step of detecting the occurrence of defects in the measurement data measured by the measurement step, and

And a file generation step of generating a measurement data file in which a determination value capable of determining defect data is embedded in a defect generation site when the defect generation of the measurement data is detected by the detection step.

(13) A program for causing a computer to execute:

A receiving step of receiving measurement data from a hyperspectral device capable of measuring two-dimensional spectroscopic data of a measurement object;

A detecting step of detecting the occurrence of defects in the measurement data received by the receiving step, and

(14) The process according to the preceding item 13, wherein,

Further, the computer may execute an analysis step of analyzing the measurement data file generated in the file generation step,

In the analyzing step, the computer is caused to execute a process of switching a generation site of the defect of the measurement data file according to an analysis purpose.

(15) The program according to any one of the preceding items 13 or 14, wherein,

(16) The program according to any one of the preceding items 13 or 14, wherein,

In the analyzing step, the computer is caused to perform a process of interpolating the measurement data by at least one interpolation method selected from the group consisting of linear interpolation, spline interpolation and Lagrange interpolation at the defect generation site.

(17) The program according to the preceding item 14, wherein,

In the detecting step, the computer is caused to count the occurrence of defects and determine whether defects equal to or greater than a predetermined value are continuously generated.

(18) The program according to the preceding item 17, wherein,

(19) The program according to the preceding item 17, wherein,

And a control step of controlling the hyperspectral device so as to interrupt measurement by the hyperspectral device or re-measure a measurement section including a region where the defect is continuous, when the detection step determines that the defect is continuously generated at or above a predetermined value.

(20) The program according to the preceding item 14, wherein,

In the analysis step, the computer is caused to generate image data of the micro LED wafer based on the measured spectroscopic data, determine that the data is defective when the determination value is detected at the time of image generation, and interpolate the data directly using the determination value or replacing the determination value with another value or using data before and after the determination value.

(21) The program according to the preceding item 14, wherein,

In the analyzing step, the computer is caused to analyze the LED elements on the micro LED wafer, and when the determined value is detected, pixels of the determined value are excluded from the analysis object.

(22) The program according to item 21 above, wherein,

In the analyzing step, the computer is caused to execute a process of adding warning information to the analysis result of the LED element when the number of pixels not excluded from the analysis object is smaller than a predetermined value.

According to the data processing device, the data processing system, and the data processing method of the present invention, the occurrence of a defect in the two-dimensional spectroscopic data of the measurement object measured by the HSI device is detected. When the occurrence of a defect in the measurement data is detected, a measurement data file in which a determination value capable of determining defect data is embedded in the occurrence site of the defect is generated.

In this way, since the determination value capable of determining the defect data is embedded in the data defect portion of the generated measurement data file, the data processing apparatus can recognize that the defect of the measurement data has occurred when performing post-processing such as analysis processing using the measurement data file. Accordingly, the interpolation processing in the subsequent processing can certainly perform various operations such as specifying the generation site of the data defect, or ignoring the data, and therefore, appropriate processing according to the content of the subsequent processing can be performed.

According to the program of the present invention, the computer can execute a receiving step of receiving measurement data from an HSI device capable of measuring two-dimensional spectroscopic data of a measurement object, a detecting step of detecting occurrence of a defect of the measurement data received by the receiving step, and a file generating step of generating a measurement data file in which a determination value capable of determining defect data is embedded in a defect occurrence portion when occurrence of the defect of the measurement data is detected by the detecting step.

Drawings

Fig. 1 is a block diagram showing the structure of a data processing system according to an embodiment of the present invention.

Fig. 2 is a diagram schematically showing a part of an image of a measurement object using pixels.

Fig. 3 (a) is a diagram showing a part of a micro LED wafer as a measurement target, fig. 3 (B) is a diagram schematically showing an image corresponding to one LED element and a portion around the same by a plurality of pixels, fig. 3 (C) is a diagram for explaining a state in which a data defect is generated, and fig. 3 (D) is a diagram showing a state in which a data defect generation site is buried with a certain value.

Fig. 4 (a) is a diagram schematically showing an image corresponding to one LED element and a portion around the LED element by a plurality of pixels, and shows a portion corresponding to the LED element by a grayscale image, fig. 4 (B) is a diagram showing a generation site of a data defect for the grayscale image maximum (white) of fig. 4 (a), fig. 4 (C) is an explanatory diagram in the case of interpolating the generated defect data, and fig. 4 (D) is a diagram showing a state after interpolation.

Fig. 5 (a) is an explanatory diagram in the case where, when 1 line of data defect is generated, analysis processing is performed by using other pixels in which no data defect is generated, and fig. 5 (B) is an explanatory diagram of a state in which data defect is continuously generated.

Fig. 6 is a flowchart showing a detection process of a data defect and a generation process of a measurement data file, which are executed by the data processing apparatus.

Fig. 7 is a flowchart showing analysis processing performed by the data processing apparatus.

Fig. 8 (a) is a diagram showing a measurement object, fig. 8 (B) is a diagram showing data obtained by a camera of an RGB3 channel, and fig. 8 (C) is a diagram showing data obtained by a hyperspectral device.

Detailed Description

Hereinafter, embodiments of the present invention will be described with reference to the drawings.

Fig. 1 is a block diagram showing the structure of a data processing system 1 according to an embodiment of the present invention. The data processing system 1 includes a hyperspectral device (HSI device) HSI camera 2 and a data processing device 3 configured by a Personal Computer (PC).

The HSI camera 2 is a known structure that performs measurement on two-dimensional spectroscopic data of a measurement target, that is, data corresponding to the number of wavelengths based on a wavelength region and a resolution that can be measured for each position of the measurement target, by scanning with a line sensor or by mounting a two-dimensional sensor.

In this embodiment, an example is given of a case where the measurement object is a micro LED wafer in which a plurality of LED elements having a size of several tens of μm are formed on a substrate having a diameter of about 100 mm.

The data processing device 3 includes a CPU31, a RAM32, a storage unit 33, an HSI camera control unit 34, a data receiving unit 35, a defect detecting unit 36, a measurement data file generating unit 37, and a measurement data analyzing unit 38.

The CPU31 is a processor that operates according to an operation program stored in the storage unit 33 and loaded into the RAM32, thereby uniformly controlling the entire data processing apparatus 3.

The RAM32 is a memory that provides a work area when operated by the CPU31 according to an operation program.

The storage unit 33 stores an operation program, various application programs, data, and the like of the CPU31, and is configured by an SSD (solid state drive), an HDD (hard disk drive), and the like.

The HSI camera control unit 34 controls the operation of the HSI camera 2 from the start to the end of measurement.

The data receiving unit 35 receives measurement data measured by the HSI camera 2 and transmitted from the HSI camera 2 under the control of the CPU 31.

The defect detection unit 36 detects occurrence of a data defect in the measurement data received by the data reception unit 35. The detection method will be described later.

The measurement data file generating unit 37 generates a measurement data file for the measurement data of the HSI camera 2 received by the data receiving unit 35. The measurement data file is generated by integrating measurement data for each predetermined unit, for example, for each predetermined area. When the defect detection unit 36 detects a defect in the data at the time of generating the measurement data file, a determination value capable of determining the defect data is embedded in the defect generation site by a method described later. The generated measurement data file is stored in the storage unit 33.

The measurement data analysis unit 38 reads the measurement data file generated by the measurement data file generation unit 37 and stored in the storage unit 33 from the storage unit 33, and performs various analysis processes as post-processing. Specific examples of the analysis process include a process for producing an image of an LED element of a micro LED wafer as a measurement target, and a process for analyzing spectral characteristics. The analysis process will be described later.

The functions of the HSI camera control unit 34, defect detection unit 36, measurement data file generation unit 37, and measurement data analysis unit 38 are realized by the CPU31 operating according to an operation program.

Next, the generation of the defect of the measurement data, the detection of the data defect by the defect detection unit 36, and the generation of the measurement data file by the measurement data file generation unit 37 will be described.

[ Production of data defect ]

As also described in the above-mentioned background art, the measurement data of the HSI camera 2 is a considerable amount of data compared with the data obtained by a normal RGB3 channel camera. In particular, in a measurement object such as a micro LED wafer having a plurality of LED elements formed on the surface of a substrate, the amount of data is increased.

Therefore, measurement with a considerably high resolution is required to be performed at a high speed. However, depending on the specifications of hardware on the data processing device 3 side, specifically, the performance of the data receiving unit 35, the storage unit 33, and the like, the measurement data may not be held in line with the measurement, and a data defect may occur in which the measurement data is missed.

[ Detection of data Defect ]

Fig. 2 is a diagram schematically showing a part of an image of a measurement object using pixels. The rectangular region is the pixel 21 which is the smallest unit of the image captured by the HSI camera 2. The number of pixels in one column of the vertical line indicates the area photographed 1 time, and spectral data for each wavelength is measured in each pixel 21. When the data defect occurs, the spectroscopic data of all pixels 21 of the 1-line size is defective. Further, as shown by an arrow in fig. 2, the image capturing by the HSI camera 2 is performed while moving at least one of the HSI camera 2 and the object to be measured in a scanning direction orthogonal to the column of pixels 21. The measurement data is attached with a serial number every time it is photographed by the HSI camera 2, and managed in accordance with the serial number. In the example of fig. 2, n, n+1, n+2, and n+6 serial numbers are given for each shooting.

If the data defect is generated, the sequence number is omitted correspondingly. In the example of fig. 2, there is no sequence number of n+4, and the data defect of the sequence number of n+4 is shown. Therefore, the defect detecting unit 36 can detect the occurrence of a data defect by checking the presence or absence of the serial number added to the measurement data received by the data receiving unit 35, and can identify the occurrence location.

The measurement results in the case where a data defect is generated are shown in fig. 3. Fig. 3 (a) shows a part of a micro LED wafer 4 as a measurement target, and a plurality of LED elements 42 are formed on a rectangular substrate 41. Fig. 3 (B) schematically shows an image corresponding to one LED element 42 and a portion around the LED element by using a plurality of pixels 21, and each rectangular region indicates a pixel. The region 5 surrounded by a thick frame inside the hatched region corresponds to one LED element 42. When a 1-line data defect occurs, as shown in fig. 3 (C), the data is contracted by 1 line in the scanning direction compared with the original data size shown in fig. 3 (B). If the data is stored in this state, a measurement result having a size different from the original data size is obtained.

Therefore, as shown in fig. 3 (D), the measurement data file generation unit performs data interpolation by embedding data of all pixels of the line where the data defect is generated with the determination value, so that the data size matches the original data size. The determination value used may be any value as long as it can be distinguished from the actual measurement value and can determine defect data. By this determination value, the generation site of the data defect can be identified in the analysis processing performed at the subsequent stage by the measurement data analysis unit 38. Fig. 3 (D) shows an example in which a number "0" is embedded as a representative of a certain value which cannot be an actual measurement value. The determined value also depends on the data processing system 1 being built. Therefore, if the maximum value, the minimum value, or the like cannot be the actual measurement value in the system 1, the occurrence of the data defect can be detected and specified from the measurement data by using the value without additionally managing the occurrence of the data defect.

Furthermore, the determined values need not be all shared in one determined data file. The determined values of the different classes may also be mixed.

[ Analysis Process ]

Next, analysis processing, which is an example of the post-processing performed by the measurement data analysis unit 38, will be described. This process is performed using a measurement data file generated by embedding a determination value in the generation site of the data defect by the measurement data file generation unit 37, and stored in the storage unit 33.

The micro LED wafer 4 may be analyzed to generate an RGB image, a 1-channel gray-scale image, for example, and visually confirm the image, and the spectroscopic data may be analyzed for each LED element 42 or for a certain data area. Here, the operation for the generation site of the data defect in each analysis process is shown.

1. Image generation time

In the case of image generation, it is sometimes necessary to indicate the site of occurrence of the data defect. The case where the indication is required is, for example, a case where the occurrence of a data defect or the occurrence of a situation is to be checked. In this case, the data defect is displayed with a numerical value completely different from the surrounding area in order to easily understand the occurrence site of the data defect.

This example is shown in fig. 4 (a) (B). Fig. 4 (a) schematically shows an image corresponding to one LED element 42 and a portion around the LED element by using a plurality of pixels 21, as in fig. 3 (B). The rectangular areas of each represent pixels. The region 5 surrounded by a thick frame inside the hatched region corresponds to one LED element 42.

In fig. 4 (a), a data defect is generated in one line, and a "0" is embedded in a pixel at the generation site of the data defect. In addition, the spectroscopic data of gradation is displayed for the pixels that are not defective, in other words, the gradation image is displayed.

Fig. 4 (B) shows a generation site of a data defect at a maximum value (white) for the grayscale image of fig. 4 (a). By changing the color of the data defect generation site in this way, the data defect generation site can be clearly confirmed. In the case of an RGB image, the color that does not exist here, for example, the color may be expressed in green with respect to a blue wafer.

As a case where the generation site of the defect of the data is not required to be specified, there is a case where the light emitting region of the LED element 42 is specified, for example. In this case, if the occurrence of the data defect is indicated in the same manner as described above, erroneous detection may occur in the detection process of the light emitting region of the LED element 42. In addition, it is possible that the LED element 42 is still judged to be separated.

In this case, therefore, interpolation by, for example, averaging is performed using the values before and after the generated defect data, as shown in fig. 4 (C), and the interpolation is used as a pixel value. By this interpolation processing, as shown in fig. 4 (D), image data in which no data defect occurs can be generated. Therefore, the influence on the detection process of the light emitting region of the LED element 42 can be suppressed to the minimum.

The interpolation method may be at least any one of linear interpolation, spline interpolation, and lagrangian interpolation. In the case where the generation site of the data defect is an end of the region, data before or after the generation site may be used as pixel values.

2. When analyzing spectroscopic data

In the case of analyzing the spectroscopic data, it is preferable not to use data of a generation site of the data defect. Therefore, when the occurrence of the data defect is detected during the analysis, the determination value is set as the analysis target and is not included in the numerical calculation.

For example, as shown in fig. 5a, when a 1-line data defect occurs, the pixel having the data defect is excluded from the pixels (pixels in the thick line region 5 in the figure) corresponding to the LED element 42 to be analyzed. If the pixel value of another pixel that does not generate a data defect is used, the LED element 42 can be analyzed.

However, if data defects are continuously generated, there are cases where analysis cannot be performed. Specifically, as shown in fig. 5B, if a continuous data defect of not less than the scanning direction size (in this example, the width) of one LED element 42 is generated, analysis of all the LED elements 42 existing in the row cannot be performed at all.

Therefore, the number of pixels in the analysis target area where no data defect occurs is counted, and if the number is smaller than the predetermined number N, the analysis is made impossible, and warning information is added to the analysis result. The prescribed number N depends on the accuracy of the data processing system. If sufficient measurement accuracy can be obtained even if the number of pixels in the analysis target area is 1, n=1 may be set, and if accuracy cannot be maintained if the number of pixels is not equal to or greater than a certain number of pixels, the number of pixels may be set to N. The number of pixels in the analysis target area where the data defect is not generated is counted, and if the number is smaller than the predetermined number N, the analysis is disabled. However, the number of pixels in which the data is defective may be counted, and if the number is equal to or greater than a predetermined number, the analysis may be made impossible, and warning information may be added to the analysis result.

In addition, the HSI camera 2 can count the number of lines of occurrence (the number of times of occurrence) of the data defect at the time of measurement of the spectroscopic data. Therefore, it is possible to determine whether or not the data defect is continuously generated at a predetermined value or more by counting the number of times of generation of the data defect by the defect detecting unit 6 while measuring the data defect. An error may be reported when a data defect equal to or larger than a predetermined value is continuously generated. The continuous generation portion of the data defect is an unresolveable region, but the number of continuous generation times of the defect when the unresolveable region exceeds the size of the LED element may be set to a predetermined value in advance.

When the data defect equal to or larger than the predetermined value is continuously generated, the HSI camera control unit 34 may immediately interrupt the measurement of the HSI camera 2 so as to confirm the status. Alternatively, the HSI camera 2 may be controlled so that the measuring section including the region where the defect is continuous is re-measured in real time.

In the method of determining whether or not the data defect equal to or larger than the predetermined value is continuously generated simultaneously with the measurement, it cannot be determined whether or not the continuous data defect corresponds to the portion where the LED element 42 is present. However, since the intervals between the LED elements 42 are generally smaller than the size of the LED elements 42, when continuous generation of data defects occurs, the probability that the unresolved region affects the portion of the LED elements 42 is high. Therefore, it is effective in reducing the trouble of re-measuring after the completion of the measurement in judging whether or not data defects equal to or larger than a predetermined value are continuously generated during the measurement.

Fig. 6 is a flowchart showing the detection processing of the data defect and the generation processing of the measurement data file, which are executed by the data processing apparatus 3. Fig. 7 is a flowchart showing the same analysis process. The processing shown in these flowcharts is executed by the CPU31 of the data processing apparatus 3 operating according to an operating program stored in the storage unit 33 or the like and loaded into the RAM 32.

In step S01 of fig. 6, it is determined whether measurement data is received from the HSI camera 2. Measurement data is sent each time a measurement is made in 1 row. If the measurement data is not received (no in step S01), the process stays in step S01 and waits until it is received.

When the measurement data is received (yes in step S01), in step S02, it is checked whether or not the sequence number added to the measurement data is continuously increased, in other words, whether or not a data defect is generated. If the sequence number is continuously increased (yes in step S02), no data defect is generated. Therefore, in step S03, the measurement data file is directly stored in the storage unit 33, and then the flow proceeds to step S04.

In step S02, if the sequence number does not continuously increase (no in step S02), a data defect is generated. Therefore, in step S05, it is determined whether or not the number of times of continuous generation of the data defect (the number of continuous lines of the data defect) is equal to or greater than a predetermined value. If the data is not less than the predetermined value (yes in step S05), it is determined that the continuous data defect area (unresolveable area) is not less than the size of the LED element 42. In step S06, since there is a possibility of an analysis error, the HSI camera 2 is instructed to control the re-measurement of the measurement unit including the area where the data defect is continuous, and then the process returns to step S01. It is also possible to indicate an interruption of the measurement without indicating a re-measurement.

If the number of consecutive occurrences of the data defect is not equal to or greater than the predetermined value in step S05 (no in step S05), a predetermined value is embedded in the occurrence location of the data defect in step S07. Then, in step S03, the data is stored in the storage unit 33, and the process advances to step S04.

In step S04, whether the measurement by the HSI camera is completed is investigated. If not (no in step S04), the process returns to step S01. When this is completed (yes in step S04), the present process is ended, and the process proceeds to the analysis process of fig. 7.

In the analysis processing of fig. 7, it is determined in step S21 whether or not to perform the image generation processing. If the image generation process is performed (yes in step S21), image generation is started in step S22. Next, in step S23, 1-line measurement data is read from the measurement data file stored in the storage unit 33 and expanded in the RAM 32. Then, in step S24, it is determined whether or not a certain value exists in the read data. If the determination value does not exist (no in step S24), the process proceeds to step S26. If the determination value exists (yes in step S24), in step S25, after the data defect generation site where the determination value exists is stored, the process proceeds to step S26.

After the data is directly converted into pixel values in step S26, it is investigated in step S27 whether the image generation of all the data is completed. If not (no in step S27), the routine returns to step S23, and the measurement data of the next 1-line amount is read in. When the image generation of all the data is completed (yes in step S27), the flow proceeds to step S28.

In step S28, whether or not the site of occurrence of the data defect is indicated is examined. In the case of the explicit indication (yes in step S28), in step S29, the generation site of the data defect is held at a predetermined value or converted to a predetermined fixed value and embedded. For example, in the case of a grayscale image, the data defect portion is indicated in white. Then, the process advances to step S31.

If the generation site of the data defect is not specified in step S28 (no in step S28), the values obtained by interpolation processing, such as pixel values of the data area before and after use, are embedded in the generation site of the data defect in step S30. Then, the image generation is completed and the analysis processing is ended in step S31.

On the other hand, if the image generation process is not performed in step S21 (no in step S21), analysis of the measurement data is started in step S32. Next, after the measurement data to be analyzed is read in step S33, it is determined in step S34 whether or not a certain value exists in the read data. If the determination value does not exist (no in step S34), the process proceeds to step S39 after the analysis of the target area is performed in step S38. If the determination value exists (yes in step S34), in step S35, the pixels of the determination value are set as the outside of the analysis object, and in step S36, it is determined whether the number of pixels of the analysis object is smaller than a predetermined value N.

If the analysis result is not smaller than the predetermined value N (no in step S36), the analysis of the target area is performed in step S38, and the process proceeds to step S39. If the analysis result is smaller than the predetermined value N (yes in step S36), the target area is set to be an analysis error in step S37, and after the warning information is added to the analysis result, the flow proceeds to step S39.

In step S39, whether or not the analysis processing of all the data is completed is checked, and if not (no in step S39), the routine returns to step S33 to read the measurement data of the next analysis target.

When the analysis processing of all the data ends (yes in step S39), the analysis processing of the measurement data is completed in step S40, and the analysis processing ends.

In the above, an embodiment of the present invention has been described, but the present invention is not limited to the above embodiment. For example, each embodiment may not be independent, but may be configured by combining 2 or more embodiments.

According to the present embodiment, a specific value capable of specifying defect data is embedded in a data defect portion of the measurement data file generated by the measurement data file generating unit 37. Therefore, the measurement data analysis unit 38 can identify that a defect of the measurement data has occurred when performing a post-process such as analysis process using the measurement data file. Therefore, the interpolation processing in the subsequent processing can certainly perform various operations such as specifying the generation site of the data defect, or ignoring the data. Therefore, appropriate processing corresponding to the content of the post-processing can be performed.

The present application is accompanied by the priority claims of japanese patent application No. 2022-089673 filed on 1/6/2022, the disclosure of which forms part of the present application directly.

Industrial applicability

The present invention can be used for a data processing device or the like that generates a measurement data file from measurement data of a hyperspectral instrument that can measure two-dimensional spectroscopic data of a measurement target.

The reference numerals indicate 1..data processing system, 2..hsi camera (HSI device), 21..pixel, 3..data processing device, 31..cpu, 32..ram, 33..storage portion, 34..hsi camera control portion, 35..data receiving portion, 36..defect detecting portion, 37..measurement data file generating portion, 38..measurement data analyzing portion, 4..micro LED wafer (object to be measured), 41..substrate, 42..led element, 5..region corresponding to LED element.

Claims

1. A data processing device is provided with:

A detection unit for detecting the defect of the measurement data received by the receiving unit, and

2. The data processing apparatus according to claim 1, wherein,

The analysis unit switches the operation of the generation part of the defect of the measurement data file according to the analysis purpose.

3. The data processing apparatus according to claim 1 or 2, wherein,

The determined value is 0 or a maximum or minimum value of values that can be maintained with respect to the measured data.

4. The data processing apparatus according to claim 2, wherein,

The analysis unit interpolates the measurement data by at least any one interpolation method of linear interpolation, spline interpolation and Lagrange interpolation at the generation position of the defect.

5. The data processing apparatus according to claim 2, wherein,

The detection means counts the occurrence of defects, and determines whether defects equal to or greater than a predetermined value are continuously generated.

6. The data processing apparatus according to claim 5, wherein,

The object to be measured is a micro LED wafer having a plurality of LED elements, and the predetermined value is the number of times of occurrence of defects when an unresolved region occurring due to continuous occurrence of defects exceeds the size of the LED elements.

7. The data processing apparatus according to claim 5, wherein,

The hyperspectral device is provided with a control unit, and when the detection unit judges that defects larger than a preset prescribed value are continuously generated, the control unit controls the hyperspectral device so as to interrupt the measurement performed by the hyperspectral device or re-measure a measurement part comprising a region where the defects are continuous.

8. The data processing apparatus according to claim 2, wherein,

The object of measurement is a micro LED wafer having a plurality of LED elements,

The analysis unit generates an image of the micro LED wafer based on the measured spectroscopic data, determines that the data is defective when the determination value is detected at the time of image generation, and interpolates the data directly using the determination value or replacing the determination value with another value or using the data before and after the use.

9. The data processing apparatus according to claim 2, wherein,

10. The data processing apparatus of claim 9, wherein,

11. A data processing system, wherein,

A hyperspectral device capable of measuring two-dimensional spectroscopic data of a measurement object, and the data processing apparatus according to claim 1 or 2.

12. A method of data processing, comprising:

A measurement step of measuring two-dimensional spectroscopic data of the measurement target object by a hyperspectral device;

13. A program for causing a computer to execute:

A detection step of detecting the occurrence of defects in the measurement data received by the reception step, and

14. The program according to claim 13, wherein,

Further, the computer may be caused to execute an analyzing step of analyzing the measurement data file generated by the file generating step,

In the analyzing step, the computer is caused to perform a process of switching the generation site of the defect of the measurement data file according to the purpose of analysis.

15. The program according to claim 13 or 14, wherein,

16. The program according to claim 13 or 14, wherein,

In the analyzing step, the computer is caused to perform a process of interpolating the measurement data by at least one interpolation method selected from the group consisting of linear interpolation, spline interpolation and Lagrange interpolation at the generation site of the defect.

17. The program according to claim 14, wherein,

18. The program according to claim 17, wherein,

19. The program according to claim 17, wherein,

And a control step of controlling the hyperspectral device so as to interrupt measurement by the hyperspectral device or re-measure a measurement section including a region where the defect is continuous, when it is determined that the defect is continuously generated at the detection step or more than a predetermined value.

20. The program according to claim 14, wherein,

In the analyzing step, the computer is caused to generate image data of the micro LED wafer based on the measured spectroscopic data, and when the determination value is detected at the time of image generation, it is determined that the data is defective, and interpolation is performed directly using the determination value or by replacing the determination value with another value or using data before and after the use.

21. The program according to claim 14, wherein,

In the analyzing step, the computer is caused to perform analysis in units of LED elements on a micro LED wafer, and pixels of the determined value are excluded from an analysis object when the determined value is detected.

22. The program according to claim 21, wherein,