CN119562425A

CN119562425A - Electrostatic protection structure and electronic equipment

Info

Publication number: CN119562425A
Application number: CN202510122516.1A
Authority: CN
Inventors: 韩雪妮; 王骞
Original assignee: Honor Device Co Ltd
Current assignee: Honor Device Co Ltd
Priority date: 2025-01-26
Filing date: 2025-01-26
Publication date: 2025-03-04
Anticipated expiration: 2045-01-26
Also published as: CN119562425B

Abstract

The embodiment of the present application provides an electrostatic protection structure and an electronic device, which relates to the field of terminal technology. At least one plastic structural member in the electronic device has a storage space, and the sensitive structure and the electrostatic protection structure are both arranged in the storage space, and the electrostatic protection structure is respectively connected to the sensitive structure and the grounding terminal; there is a gap between at least one plastic structural member and the sensitive structure, and the gap is used to allow static electricity to enter the storage space; the electrostatic protection structure at least includes: an insulating base and a conductive layer, the insulating base is connected to the sensitive structure, the conductive layer is arranged on the side of the insulating base away from the sensitive structure, and the conductive layer is also connected to the grounding terminal, and the conductive layer is used to receive static electricity and prevent static electricity from contacting the sensitive structure. As a result, the static electricity entering the storage space directly contacts the electrostatic protection structure instead of the sensitive structure, which can protect the sensitive structure from being damaged by static electricity, and the electronic device has a better anti-static effect.

Description

Electrostatic protection structure and electronic equipment

Technical Field

The present application relates to the field of terminal technologies, and in particular, to an electrostatic protection structure and an electronic device.

Background

Electronic equipment such as mobile phones gradually become an indispensable part in people's work and life, and at present, some structural members in the electronic equipment are often prepared by using plastics so as to realize the demands of weight reduction, water resistance and the like of the electronic equipment.

In the use process of the electronic equipment, static electricity can be generated by external charged objects or some structures inside the electronic equipment, and the static electricity can generate electrostatic discharge (electro-STATIC DISCHARGE, ESD) when striking some sensitive structures in the electronic equipment, if the sensitive structures have no reasonable protective measures, the sensitive structures are easy to fail due to the ESD. In order to solve the problem, a back adhesive or a dispensing adhesive is often disposed at some positions of the electronic device to block static electricity, that is, the back adhesive or the dispensing adhesive blocks static electricity from entering a space with a sensitive structure, so as to protect the sensitive structure.

Along with the development of the electronic equipment to be light and thin and miniaturized, the space in the electronic equipment is smaller and smaller, the space reserved for back glue or dispensing is also limited, static electricity is not sufficiently blocked when the size of the back glue or dispensing is small, then the back glue or dispensing enters the space with a sensitive structure when static electricity breaks down, and as a plurality of structural parts in the electronic equipment are plastic products, no static electricity discharge path exists, static electricity is directly hit on the sensitive structure, the sensitive structure is invalid, and the performance of the electronic equipment is seriously influenced.

Disclosure of Invention

The embodiment of the application provides an electrostatic protection structure and electronic equipment, wherein the electrostatic protection structure is directly connected with a sensitive structure, so that static electricity entering an accommodating space through a gap is firstly contacted with the electrostatic protection structure closest to the accommodating space, and cannot strike the sensitive structure, and the electrostatic protection structure can protect the sensitive structure from being damaged.

In order to achieve the above purpose, the embodiment of the application adopts the following technical scheme:

In a first aspect, an electrostatic protection structure for an electronic device is provided, the electronic device further includes a sensitive structure, a grounding end and at least one plastic structural member, the at least one plastic structural member has an accommodating space, the sensitive structure and the electrostatic protection structure are both arranged in the accommodating space, the electrostatic protection structure is respectively connected with the sensitive structure and the grounding end, a gap is arranged between the at least one plastic structural member and the sensitive structure, the width of the gap is smaller than or equal to 2mm, the height of the gap is 20 μm-40 μm, the gap is used for enabling static electricity to enter the accommodating space, the electrostatic protection structure at least includes an insulating substrate, the insulating substrate is connected with the sensitive structure, a conductive layer is arranged on one side of the insulating substrate far away from the sensitive structure, the conductive layer is further connected with the grounding end, and the conductive layer is used for receiving static electricity entering the accommodating space and preventing the static electricity from contacting the sensitive structure.

The embodiment of the application provides a static protection structure applied to electronic equipment, which is directly connected with a sensitive structure, so that when static enters an accommodating space, the distance from the static to the static protection structure is nearest, namely the impedance is minimum, the static can be directly beaten on a conductive layer, and the conductive layer is separated from the sensitive structure through an insulating substrate, namely the conductive layer and the sensitive structure are not electrically connected and are non-conductive, so that the static cannot beaten on the sensitive structure, a static discharge path is increased through the static protection structure, namely the static can be beaten on the static protection structure directly for discharging, and the static protection structure can protect the sensitive structure from being damaged.

In one possible implementation manner of the first aspect, the electrostatic protection structure further includes a reinforcing member, where the reinforcing member is disposed on a side of the conductive layer away from the insulating substrate, and the reinforcing member is connected to the conductive layer, and strength of the reinforcing member is greater than that of the conductive layer.

In this implementation, the reinforcement may enhance the strength of the insulating base and the conductive layer, thereby ensuring both reduced damage to the insulating base and the conductive layer and better connection between the structures.

In one possible implementation manner of the first aspect, the reinforcing member is disposed on a portion of a surface of the conductive layer on a side away from the insulating substrate, and a thickness of the reinforcing member is greater than or equal to 0.15mm.

In this implementation, the reinforcement may enhance the strength of the insulating base and the conductive layer in a partial region, thereby ensuring both reduced damage to the insulating base and the conductive layer and better connection between the structures.

In a possible implementation manner of the first aspect, the electrostatic protection structure further includes an adhesive layer, where the adhesive layer is disposed between the electrostatic protection structure and the sensitive structure, and the adhesive layer is used to adhere the electrostatic protection structure and the sensitive structure.

In this implementation, the adhesive layer may both connect the insulating substrate with the sensitive structure and also allow the conductive layer to be electrically disconnected from the sensitive structure.

In one possible implementation manner of the first aspect, the portion of the conductive layer penetrating through the insulating substrate is a first conductive layer, and the electrostatic protection structure further includes a protection member disposed between the first conductive layer and the ground terminal, where the protection member is connected to the first conductive layer and the ground terminal, respectively.

In this embodiment, the protective element can both protect the conductive layer from corrosion as much as possible and ensure the impedance continuity after a long period of use, so that a long-term reliable contact can be made at the location where the protective element is present.

In one possible implementation manner of the first aspect, the electrostatic protection structure further includes an elastic member, where the elastic member is disposed between the protection member and the grounding terminal, and the elastic member is connected to the protection member and the grounding terminal, respectively.

In this implementation, since the circuit board or the middle frame cannot be directly connected to the protection member when the circuit board or the middle frame is used as the ground terminal, an elastic member is added to ensure that the protection member is well connected to the ground terminal through the elastic member.

In a possible implementation manner of the first aspect, a portion of the conductive layer penetrating through the insulating substrate is a first conductive layer, and the first conductive layer is connected to a ground terminal.

In this implementation, the conductive layer itself is grounded, which is simple and easy to implement.

In one possible implementation manner of the first aspect, the electrostatic protection structure further includes an elastic member, where the elastic member is disposed between the first conductive layer and the ground terminal, and the elastic member is connected to the first conductive layer and the ground terminal, respectively.

In this implementation, since the circuit board or the middle frame cannot be directly connected to the protective member when the circuit board or the middle frame is used as the ground terminal, an elastic member is added to ensure that the first conductive layer is well connected to the ground terminal through the elastic member.

In one possible implementation manner of the first aspect, the electrostatic protection structure further includes an anti-oxidation layer, where the anti-oxidation layer is disposed on a side of the conductive layer away from the insulating substrate, and the anti-oxidation layer is used to protect the conductive layer from oxidation.

In this implementation, the oxidation preventing layer may reduce the risk of oxidation of the conductive layer by water oxygen or the like.

In a possible implementation manner of the first aspect, the oxidation preventing layer is used to be able to be broken down by static electricity smaller than 1 kV.

In this implementation, when static is directly hit the oxidation preventing layer, can make static break down the oxidation preventing layer and reach the conducting layer, because the conducting layer still grounds, therefore static just has directly arrived ground through the conducting layer, has both protected the conducting layer and has reduced the risk of being corroded by water oxygen like this, can carry out the static through the conducting layer again and release.

In one possible implementation manner of the first aspect, the sensitive structure is a rear camera assembly, the electronic device further comprises a middle frame, a main board, a plastic main board support and a plastic decoration piece, the main board, the plastic main board support and the plastic decoration piece are arranged on the same side of the middle frame, the plastic main board support and the plastic decoration piece enclose an accommodating space, the rear camera assembly is arranged in the accommodating space, the middle frame or the main board is used as a grounding end, a gap is formed between the plastic decoration piece and the rear camera assembly, an electrostatic protection structure is sleeved around the rear camera assembly, the electrostatic protection structure is connected with the main board or the middle frame, the electrostatic protection structure is arranged between the rear camera assembly and the main board and the plastic main board support, and the plastic decoration piece is arranged on one side, away from the middle frame, of the plastic main board support.

In this implementation, the distance to the static protective structure after static gets into accommodation space is nearest, and impedance is minimum, does not switch on between static protective structure and the rear-mounted camera subassembly, and static protective structure still is grounded through the elastic component, and it is the shortest impedance route to the mainboard to directly release through static protective structure for static, also is minimum impedance route, so static can not hit on the rear-mounted camera subassembly, but directly hit on the static protective structure, and static protective structure can protect the rear-mounted camera subassembly not damaged.

In one possible implementation manner of the first aspect, the rear camera assembly includes a rear camera substrate, a rear camera module, a voice coil motor metal housing and a lens, the rear camera substrate is disposed on one side of the middle frame, the rear camera module and the voice coil motor metal housing are disposed on the same side of the rear camera substrate away from the middle frame, the rear camera module and the voice coil motor metal housing are respectively connected with the rear camera substrate, the voice coil motor metal housing is sleeved around the rear camera module, the lens is disposed on one side of the rear camera module and the voice coil motor metal housing away from the middle frame, a gap is formed between the lens and the plastic decoration, an electrostatic protection structure is disposed between the voice coil motor metal housing and the plastic main board support, and between the plastic main board and the plastic main board support, and the electrostatic protection structure is respectively connected with the voice coil motor metal housing and the main board.

In this implementation, the static gets into the distance nearest to static protective structure behind the accommodation space, and impedance is minimum, does not switch on between static protective structure and the rear-mounted camera subassembly, and static protective structure still is grounded through the elastic component, and it is the shortest impedance path to the mainboard to directly release through static protective structure for static, therefore static can not hit on the rear-mounted camera subassembly, but directly hit on the static protective structure, and static protective structure can protect the rear-mounted camera subassembly not damaged.

In one possible implementation manner of the first aspect, the electrostatic protection structure includes an insulating substrate, a conductive layer, a reinforcing member, an adhesive layer, a protection member and an elastic member, where the insulating substrate and the conductive layer are integrally divided into a first portion, a second portion and a third portion, the first portion, the second portion and the third portion are sequentially connected, the extending directions of the first portion and the third portion are the same, the extending directions of the second portion and the extending directions of the first portion and the third portion are different, the insulating substrate in the first portion and the second portion are both connected with the voice coil motor metal casing through the adhesive layer, a gap is formed between the conductive layer and the plastic motherboard support, the third portion is disposed between the plastic motherboard support and the third portion, the reinforcing member is disposed between the conductive layer in the third portion and the plastic motherboard support, the protection member is disposed between the conductive layer penetrating the insulating substrate and the elastic member in the third portion, the elastic member is disposed between the protection member and the motherboard, and the motherboard is used as a grounding terminal.

In this implementation, when static gets into the distance nearest to the conducting layer behind the accommodation space, impedance is minimum, and conducting layer and camera module pass through insulating substrate and nonconducting glue and keep apart, that is to say, conducting layer and camera module between nonconducting, the conducting layer is the shortest impedance path to the mainboard through the conducting layer direct release, therefore static can not hit the camera module on, but directly hit the conducting layer, the conducting layer can protect the camera module not receive the damage, static protective structure can buckle simultaneously, thereby make its range of application wider.

In a possible implementation manner of the first aspect, the sensitive structure is an earpiece assembly;

The electronic equipment still includes plastic shell, the center, the mainboard, plastic mainboard support and plastic battery cover, plastic shell, plastic mainboard support and plastic battery cover enclose into accommodation space, the center, the mainboard, earphone subassembly and static protective structure all set up in accommodation space, have the gap between plastic shell and the plastic battery cover, the center sets up in one side of plastic shell, earphone subassembly and mainboard all set up in the same side that the center kept away from plastic shell, plastic mainboard support sets up in one side that earphone subassembly and mainboard kept away from the center, plastic battery cover sets up in one side that the center was kept away from to plastic mainboard support, center or mainboard are used as the earthing terminal.

In this implementation, the distance to the electrostatic protection structure after static gets into accommodation space is nearest, and impedance is minimum, does not switch on between electrostatic protection structure and the earphone subassembly, and electrostatic protection structure still is grounded through the elastic component, and it is the shortest impedance path to directly release to ground through electrostatic protection structure for static, therefore static can not hit on the earphone subassembly, but directly hit on the electrostatic protection structure, and electrostatic protection structure can protect the earphone not damaged.

In one possible implementation manner of the first aspect, the electrostatic protection structure includes an insulating substrate, a conductive layer, an adhesive layer, a protection member and an elastic member, where the insulating substrate and the conductive layer are integrally divided into a fourth portion, a fifth portion and a sixth portion, the fourth portion, the fifth portion and the sixth portion are sequentially connected, the extending directions of the fourth portion and the sixth portion are the same, the extending directions of the fifth portion and the extending directions of the fourth portion are different, the fourth portion is disposed between the earpiece assembly and the plastic motherboard bracket, the insulating substrates in the fourth portion and the fifth portion are both bonded to the earpiece assembly through the adhesive layer, the conductive layer in the fourth portion is adjacent to the plastic motherboard bracket and has a gap, the conductive layer in the fifth portion has a gap between the conductive layer in the fifth portion and the plastic housing, the sixth portion is disposed between the middle frame and the plastic battery cover, the protection member is disposed between the conductive layer penetrating the insulating substrate in the sixth portion and the elastic member, the elastic member is disposed between the protection member and the middle frame, and the middle frame is used as a grounding terminal.

In the implementation mode, when the static electricity enters the accommodating space and then is closest to the conducting layer, the impedance is minimum, the conducting layer and the earphone are separated through the insulating substrate and the non-conducting glue, namely, the conducting layer is not conducted with the earphone, the conducting layer is grounded through the elastic piece, and the static electricity is discharged to the middle frame directly through the conducting layer to form the shortest impedance path, so that the static electricity cannot be discharged to the earphone, but is directly discharged to the conducting layer, the conducting layer can protect the earphone from being damaged, and meanwhile, the static electricity protection structure can be bent, so that the application range of the static electricity protection structure is wider.

In a second aspect, an electronic device is provided, comprising an electrostatic protection structure as in the first aspect or any possible implementation of the first aspect.

The embodiment of the application provides electronic equipment, which effectively improves the electromagnetic compatibility problem of hard damage or soft failure of device functions and greatly improves the performance of the electronic equipment.

The embodiment of the application provides an electrostatic protection structure and electronic equipment, wherein the electrostatic protection structure is directly connected with a sensitive structure, so that when static electricity enters an accommodating space, the distance from the static electricity to the electrostatic protection structure is nearest, namely the impedance is minimum, the static electricity can be directly beaten on a conductive layer, and the conductive layer is separated from the sensitive structure through an insulating substrate, namely the conductive layer is not electrically connected with the sensitive structure and is non-conductive, so that the static electricity can not beaten on the sensitive structure, a static electricity discharging path is increased through the electrostatic protection structure, namely the static electricity can be directly beaten on the electrostatic protection structure for discharging, the electrostatic protection structure can protect the sensitive structure from being damaged, and when the electrostatic protection structure is further applied to the electronic equipment, the electrostatic protection capability of the electronic equipment is improved, the electromagnetic compatibility problem of hard damage or functional soft failure of the structure in the electronic equipment is reduced, and the performance of the electronic equipment is better.

Drawings

Fig. 1 is a schematic structural diagram of an electronic device provided in the related art;

fig. 2 is a schematic structural diagram of another electronic device provided in the related art;

FIG. 3 is a schematic illustration of the rear camera assembly of FIG. 2 in which ESD occurs;

Fig. 4 is a schematic front view of an overall structure of an electronic device according to an embodiment of the present application;

FIG. 5 is a schematic rear view of the electronic device shown in FIG. 1;

FIG. 6 is a schematic diagram of a split structure of the electronic device shown in FIG. 1;

fig. 7 is a schematic front view of an electrostatic protection structure according to an embodiment of the present application;

FIG. 8 is a schematic back view of an electrostatic protection structure according to an embodiment of the present application;

FIG. 9 is a schematic front view of another electrostatic protection structure according to an embodiment of the present application;

FIG. 10 is a schematic back view of another electrostatic protection structure according to an embodiment of the present application;

FIG. 11 is a cross-sectional view of FIGS. 8 and 10 after cutting along cut line T1T 2;

FIG. 12 is another cross-sectional view of FIGS. 8 and 10 after cutting along cut line T1T 2;

Fig. 13 is a schematic structural diagram of an electronic device according to an embodiment of the present application;

fig. 14 is a schematic structural diagram of another electronic device according to an embodiment of the present application;

Fig. 15 is a schematic structural diagram of still another electronic device according to an embodiment of the present application;

Fig. 16 is a schematic structural diagram of still another electronic device according to an embodiment of the present application.

Reference numerals:

01-an electronic device; 20-first plastic structural part, 21-middle frame, 22-main board, 23-sensitive structure, 24-static protector, 3-rear camera component, 25-static gun, 101-front camera component, 102-display screen, 1021-light-transmitting cover plate, 1022-screen, 104-back shell, 1041-back cover, 1042-frame, 107-mounting port, F-gap, JD-static, 7-plastic main board bracket, 8-plastic battery cover, 9-dispensing, 10-plastic decoration, 11-back glue, 12-LENS, 26-static protection structure, 261-insulating substrate, 262-conducting layer, 263-reinforcing component, 264-non-conducting glue, 265-finger protection, 266-elastic component, 267-oxidation-proof layer, 1-plastic shell, 100-RCV component, 4-connecting component, 41-BTB support, 42-BTB, 43-FPC, 31-rear camera substrate, 32-rear camera module, 33-metal shell and 14-sealing VCM.

Detailed Description

The technical solutions of the embodiments of the present application will be clearly and thoroughly described below with reference to the accompanying drawings. In the description of the embodiment of the present application, unless otherwise indicated, "/" means or, for example, a/B may represent a or B, and "and/or" in the text is merely an association relationship describing an association object, which means that three relationships may exist, for example, a and/or B, and that three cases of a alone, a and B together, and B alone exist.

The terms "first," "second," and the like, are used below for descriptive purposes only and are not to be construed as implying or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature, and in the description of embodiments of the application, unless otherwise indicated, the meaning of "a plurality" is two or more. The meaning of "at least one" is one or more.

Furthermore, in the present application, the terms of orientation such as "upper", "lower", "left", "right", "inner", "outer", and the like are defined with respect to the orientation in which the components in each of the drawings are schematically disposed, and it should be understood that these directional terms are relative concepts, which are used for relative description and clarity, and which may be correspondingly varied in response to the variation in the orientation in which the components in each of the drawings are disposed.

First, some terms in the embodiments of the present application will be explained in detail to facilitate understanding by those skilled in the art.

ESD refers to a charge transfer phenomenon ‌ ‌ that occurs when objects having different electrostatic potentials come close to each other or come into direct contact.

Arcing refers to the instantaneous spark created by the passage of electrical current through some insulating medium (e.g., air), a gas discharge phenomenon.

The instantaneous current refers to the electric energy with instantaneous high burst, and is an instantaneous state and abnormal state of current and voltage on an alternating current sine wave circuit.

The memory DUMP (DUMP) crash interface is an interface in which, when a program or a system crashes, an operating system automatically generates a memory DUMP file (DUMP file), and the DUMP file contains a memory state of the program or the system crashes, and can be used for recording the memory state and system information of the crashes and facilitating subsequent debugging and analysis.

Electromagnetic compatibility (electromagnetic compatibility, EMC) refers to the ability of a device or system to operate satisfactorily in its electromagnetic environment without intolerable electromagnetic interference to any structure in the environment, and thus EMC includes requirements that, on the one hand, the electromagnetic interference generated by the device or system during normal operation to the environment cannot exceed a certain limit, and on the other hand, any structure has a certain degree of immunity (also called electromagnetic sensitivity) to the electromagnetic interference present in the environment.

The back adhesive ‌ in the electronic device is generally formed by applying an adhesive to one side of a film and then attaching the adhesive to a structure to be bonded, wherein the adhesive may be a silicone gel or a glass gel, etc., which has good elasticity, abrasion resistance, temperature resistance and oxidation resistance, and these characteristics provide the back adhesive with electrostatic withstand voltage characteristics, and the electrostatic withstand voltage characteristics ‌ of the back adhesive are mainly represented by its resistance to static electricity and withstand voltage.

Glue in electronic equipment is usually dispensed or smeared on a plane, and then a structure to be bonded is placed to realize bonding, wherein white glue, ultraviolet (UV) glue or red glue and the like can be used as glue, the glue has the functions of strengthening and sealing during bonding, moisture and moisture invasion are prevented, meanwhile, the glue also has electrostatic withstand voltage characteristics ‌, the electrostatic withstand voltage characteristics ‌ are mainly represented by the electrostatic withstand voltage capability and withstand voltage capability, in the process of dispensing, the shape and size of the glue can be controlled through parameters such as pressure, speed and track of different dispensing heads and glue water, and the glue is suitable for precisely dispensing ‌ in a smaller area.

Board To Board (BTB) refers to an assembly for connecting different printed circuit boards (printed circuit board, PCBs) in an electronic device that can provide reliable electrical connections allowing signals, power or data to be transferred between one circuit board and another.

The foregoing is a simple description of the terms involved in the embodiments of the present application, and will not be repeated herein.

By way of example, fig. 1 shows an electronic device 01 to which embodiments of the present application are applicable.

As is well known, plastic has the advantages of light weight and less corrosion after meeting water and oxygen compared with metal, so that if the electronic equipment is required to realize weight reduction, water resistance and the like, some structural parts in the electronic equipment can be prepared by using plastic so as to optimize the performance of the electronic equipment.

As shown in fig. 1, taking an electronic device 01 as an example of a mobile phone, the mobile phone may include a first plastic structural member 20, a middle frame 21, a main board 22 and a sensitive structure 23, where the first plastic structural member 20 may itself enclose an accommodating space, and the middle frame 21, the main board 22 and the sensitive structure 23 are all disposed in the accommodating space.

Specifically, in the above-mentioned accommodation space, the middle frame 21 is disposed on the first plastic structural member 20, and the other surfaces except for one surface of the middle frame 21 are in contact with the first plastic structural member 20. The main board 22 is disposed on a surface of the middle frame 21 that is not in contact with the first plastic structural member 20, and the main board 22 is not in contact with the first plastic structural member 20. The sensitive structure 23 is disposed on a surface of the main board 22 away from the first plastic structural member 20, and the sensitive structure 23 is not in contact with the first plastic structural member 20. The receiving space will not normally be completely sealed, which might otherwise affect the performance and use of the middle frame 21, the main plate 22 and the sensitive structure 23, so that the receiving space may be unsealed by having a gap F between the first plastic structural member 20 itself and the sensitive structure 23.

In practical applications, the sensitive structure 23 refers to electronic components and traces that are prone to failure after electrostatic contact, such as a rear camera assembly, a receiver assembly, a microphone, an audio assembly, and PCB traces.

Referring to fig. 1 again, the mobile phone may further include an electrostatic shield 24, where the electrostatic shield 24 contacts the first plastic structural member 20, and the electrostatic shield 24 is used for filling at least part of the gap F to block static electricity from entering the accommodating space.

In practical applications, the electrostatic protection 24 may be back adhesive or dispensing, etc., and the electrostatic protection 24 such as back adhesive or dispensing is required to block the static electricity from entering the accommodating space, and meanwhile, the performance and the usage of the middle frame 21, the main board 22 and the sensitive structure 23 are not affected.

In order to pursue the effects of extreme appearance such as a narrow bezel, miniaturization and light weight, various structural designs are required to be compact, and meanwhile, the internal space of the mobile phone is required to be small, which causes the problem of insufficient space inside the mobile phone, and when applied to fig. 1, the width of the electrostatic shield 24 such as back glue or dispensing in the first direction (ox direction in fig. 1) and the height in the second direction (oy direction in fig. 1) are generally set to be small. Based on the electrostatic withstand voltage characteristics of the electrostatic shield 24, the product of the size and withstand voltage characteristics of the electrostatic shield 24 is required to meet the electrostatic test grade to block the electrostatic JD, but if the width of the electrostatic shield 24 along the ox direction and the height along the oy direction are smaller, the condition is difficult to meet, so that when the electrostatic JD enters into contact with the electrostatic shield 24 (i.e. hits the electrostatic shield 24) through the gap F, the electrostatic JD easily breaks through the electrostatic shield 24 such as back glue or dispensing, and enters into the accommodating space, and at this moment, because the vicinity of the sensitive structure 23 is the first plastic structure 20, the first plastic structure 20 has no electrostatic JD bleeder function, the electrostatic JD is directly hit on the sensitive structure 23, and a series of electromagnetic compatibility problems such as hard loss or functional soft failure are brought to the sensitive structure 23, so that the performance of the mobile phone is poor, and the user experience is poor.

In application, the static JD may be from static electricity outside the electronic device 01, for example, static electricity brought about when a human body touches, static electricity carried on some articles in a living environment, and the like, which is not particularly limited herein.

It should be noted that the mobile phone may not include the electrostatic protection device 24, and no structure is provided at the gap F of the first plastic structural member 20, i.e. an air gap, which inevitably causes the static JD to directly strike the sensitive structure 23 after entering the accommodating space, resulting in the above-mentioned problems.

Examples of the electrostatic discharge hazard at different locations of two mobile phones provided in the related art are given below.

Example one:

fig. 2 shows a schematic diagram of a rear camera assembly 3 and some structures related thereto in an electronic device 01 to which an embodiment of the present application is applied. It should be noted that the dashed line resembling a triangle in fig. 2 is not an actual structure, but merely illustrates the angle of the camera.

As shown in fig. 2, the electronic device 01 may include a center frame 21, a rear camera module 3, a main board 22, a plastic main board holder 7, a plastic battery cover 8, a dispensing 9, a plastic trim (decoration, DECO) 10, a back adhesive 11, a LENS 12, a connection module 4, and a sealing foam 14. The specific positions and the like of these structures are described in the following embodiments, and are not specifically described here.

The rear camera module 32 in the embodiment of the present application may refer to the rest of the rear camera assembly 3 except for the LENS (LENS) 12, the rear camera substrate 31, and the Voice Coil Motor (VCM) metal housing 33, for example, a camera and a photosensitive device. Further, the LENS 12 may be a glass LENS or the like.

In application, the plastic DECO 10 may be provided with a LENS 12, and the LENS 12 may allow light to penetrate and enter the light incident surface of the rear camera module 3.

Fig. 3 shows an electrostatic discharge schematic of the rear camera module 3 of fig. 2.

In some rear camera modules of mobile phones, the space reserved for the LENS by the plastic DECO is very small, and in order to prevent static electricity from directly striking the rear camera module, a back adhesive 11 is often disposed near the LENS 12 as shown in fig. 1 as a static electricity protector, so as to block the static electricity by the back adhesive and protect the rear camera module from being damaged by the static electricity.

As shown in fig. 2 and 3, the space limitation of the rear CAMERA assembly 3 makes the gap between the plastic DECO 10 and the LENS 12 and the space nearby the gap very limited, at this time, if the back glue 11 is disposed in the space of the part of the rear CAMERA assembly 3 except the gap between the plastic DECO 10 and the LENS 12, so as to block the static electricity entering from the gap, the size of the back glue 11 can only be made very small, for example, the width of the back glue 11 along the ox direction is only about 0.8mm, so that the small size of the back glue 11 is very difficult to completely block the static electricity, when the electrostatic gun 25 is used to perform ESD test on the rear CAMERA assembly 3 in the camela preview mode, it can be observed that the electrostatic gun 25 performs 10kV air discharge on the arc DECO and the nearby position thereof, after the back glue 11 is broken down by the 10kV air discharge, at this time, the static electricity can pass through the gap between the plastic DECO 10 and the LENS 12 and then strike the rear CAMERA assembly 3, for example, the static electricity can be directly hit the metal housing 33 of the rear CAMERA assembly 3, so that the metal housing 33 of the VCM assembly can produce large current, and the system can cause a transient current to be drawn into the system, or the system can cause a transient abnormal current, and cause a user to die system to cause an abnormal current, and an abnormal current to be caused to die a user to die system.

Example two:

If the gap between the plastic DECO and the plastic battery cover and the space nearby the gap are very limited, at this time, if glue dispensing is arranged in the space between the plastic DECO and the plastic battery cover except the gap to block static electricity entering from the gap, the size of the glue dispensing can only be small, so that the small-size glue dispensing is difficult to completely block static electricity, when the position of the plastic DECO and the plastic battery cover is subjected to ESD test under the condition that the mobile phone is in a CAMERA preview mode, 10kV air discharge can be observed at the position, after the glue dispensing is broken down by the 10kV air discharge, the static electricity protection function of the glue dispensing is invalid, at the moment, an electrostatic arc can pass through the gap between the plastic DECO and the plastic battery cover and then strike a flash lamp of the mobile phone, so that the flash lamp of the mobile phone can generate instantaneous large current, the instantaneous large current can damage a flash lamp power supply path of a power management unit (power management unit, PMU) and the flash lamp can be normally turned on, so that the mobile phone is abnormal, and user experience is poor.

Based on the above description, there are many plastic structural members in the electronic device, such as a plastic battery cover, a plastic DECO, a plastic motherboard bracket, etc., once the electrostatic protection device such as the back glue or the dispensing for blocking the static is failed, the static can enter the accommodating space where the sensitive structure is placed through the gap between the plastic structural member and the sensitive structure, and the plastic structural members around the sensitive structure cannot provide the static discharge path like metal, so that the static is directly applied to the sensitive structure to generate a series of electromagnetic compatibility problems, which seriously affects the performance of the electronic device and has poor user experience.

In view of this, the present application provides an electrostatic protection structure directly connected to a sensitive structure, so that when static electricity enters into an accommodating space, the distance from the static electricity to the electrostatic protection structure is nearest, which means that impedance is minimum, the static electricity can directly strike on a conductive layer, and because the conductive layer is separated from the sensitive structure by an insulating substrate, that is, the conductive layer is not electrically connected with the sensitive structure, and is non-conductive, the static electricity cannot strike on the sensitive structure, then a static electricity discharge path is increased through the electrostatic protection structure, that is, the static electricity can directly strike on the electrostatic protection structure to discharge, the electrostatic protection structure can protect the sensitive structure from being damaged, and thus, when the electrostatic protection structure is applied to an electronic device, the electrostatic protection capability of the electronic device is improved.

When the electrostatic protection structure is applied to electronic equipment, the electromagnetic compatibility problem of hard damage or soft failure of the device function of the electronic equipment is effectively improved, and the performance of the electronic equipment is greatly improved.

The specific type of the electronic device is not limited in the embodiments of the present application, and in some embodiments, the electronic device of the present application may include devices such as a mobile phone, a wearable device (e.g., a smart bracelet, a smart watch, and a headset), a tablet computer, a laptop computer (lapop), a handheld computer, a notebook computer (notebook), an ultra-mobile personal computer, a UMPC, a cellular phone, a personal digital assistant (personal DIGITAL ASSISTANT, PDA), an augmented reality (augmented reality, AR) \virtual reality (VR) device, and an internet of things (internet of things, IOT) device, and a vehicle-mounted electronic device.

Fig. 4 shows a schematic front structure of an electronic device 01 to which the embodiment of the present application is applied, fig. 5 shows a schematic rear structure of the electronic device 01 of fig. 4, and fig. 6 shows an exploded view of the electronic device 01 shown in fig. 4 and 5. For convenience of understanding, the embodiment of the present application is described by taking the electronic device 01 as a mobile phone, and the electronic device 01 in fig. 4 to 6 is described by taking a tablet mobile phone as an example.

In other embodiments, the electronic device may be a foldable mobile phone or other mobile phone, which is not limited herein.

The specific structure of the electronic device 01 to which the embodiment of the present application is applicable is further described below.

As shown in fig. 4 to 6, a mobile phone to which the embodiment of the present application is applied may include a display 102, a back shell 104, and a motherboard 22. It will be appreciated that figures 4 to 6 and the accompanying drawings below show only a few components of a handset schematically, the actual shape, size, location and configuration of these components being not limited by figures 4 to 6 and the accompanying drawings below.

In practical applications, the display screen 102 may be used to display images, videos, and the like. The display screen 102 may include a light-transmitting cover 1021 and a screen 1022, the light-transmitting cover 1021 being disposed in a stacked relationship with the screen 1022. The transparent cover 1021 is mainly used for protecting and dustproof the screen 1022. The screen 1022 may employ a flexible display screen or a rigid display screen, and exemplary screen 1022 may be any one of a liquid crystal screen (LCD), an Organic LIGHT EMITTING Diode (OLED) screen, a sub-millimeter light emitting diode (MINI LIGHT EMITTING diode, mini LED) screen, a Micro LIGHT EMITTING diode (Micro LED) screen, and the like.

In practical applications, the back shell 104 may be used to protect electronic components and the like inside the mobile phone. The back case 104 may include a back cover 1041 and a bezel 1042, wherein the back cover 1041 is disposed at a side of the screen 1022 remote from the light-transmitting cover 1021 and is stacked with the light-transmitting cover 1021 and the screen 1022. The frame 1042 is disposed between the back cover 1041 and the transparent cover 1021, and is fixed on the back cover 1041.

In practical applications, the motherboard 22 may be a hard circuit board, such as a PCB, or the motherboard 22 may be a flexible circuit board (flexible printed circuit, FPC), or the motherboard 22 may be a rigid-flex circuit board. Further, the motherboard 22 may be a single-sided board or a double-sided board, wherein the single-sided board refers to that one side of the motherboard 22 is provided with electronic components (not shown in fig. 4 to 6), and the double-sided board refers to that both sides of the motherboard 22 are provided with electronic components (not shown in fig. 3 to 5). The main board 22 may be a Radio Frequency (RF) board and an application processor (application processor, AP) board, etc., where the RF board may be used to carry a radio frequency chip (radio frequency integrated circuit, RF IC) and a radio frequency power amplifier (radio frequency power amplifier, RF PA), etc., and the application processor board may be used to carry an SOC, DDR, a main power management chip, an auxiliary power management chip, etc.

In the embodiments shown in fig. 4 to 6, the shape of the mobile phone to which the present application is applicable may be a rectangular flat plate, and of course, may be any other shape, which is not particularly limited herein.

Referring again to fig. 4 to 6, a mobile phone to which the present application is applicable may further include a camera assembly, which is generally divided into a front camera assembly (camera compact module, CCM) 101 and a rear camera assembly 3.

As shown in fig. 4, the front camera assembly 101 may be installed at the upper left portion of the display screen 102 and used for self-photographing.

As shown in fig. 5 and 6, the rear camera assembly 3 may be installed at the upper left portion of the back case 104 and used to capture a scene around the cellular phone.

It should be understood that the mounting positions, numbers, etc. of the front camera module 101 and the rear camera module 3 shown in fig. 4 to 6 are merely illustrative, and the actual application is specific.

The light incident surface of the rear camera assembly 3 faces the back cover 1041, the back cover 1041 is provided with a mounting opening 107, the mounting opening 107 can correspond to the plastic battery cover 8, the plastic DECO 10 covers and is fixed at the mounting opening 107, the plastic DECO 10 is connected with the plastic battery cover 8 through the mounting opening 107, and the plastic DECO 10 can be used for bearing and protecting the rear camera assembly 3. In a direction perpendicular to the plastic battery cover 8, the LENS is arranged below the opening of the plastic DECO 10, at which time the plastic DECO 10 is arranged around the LENS, and the user may be in direct contact with the plastic DECO 10, e.g. the user's hand may touch the upper surface and/or the side surface of the plastic DECO 10, etc.

In practical applications, the plastic DECO 10 may have a ring structure, such as a ring and a square ring, so that the ring portion of the plastic DECO 10 may be fixed and supported on one side of the plastic battery cover 8 by screwing, clamping or welding. Illustratively, the annular portion of the plastic DECO 10 may be secured to the plastic battery cover 8 by screws, thereby allowing the plastic DECO 10 to secure the plastic battery cover 8 against movement.

In practical applications, the rear camera assembly 3 may be a periscope type camera assembly, or may be a vertical type camera assembly, which is not limited herein.

Only matters related to the point of the invention will be described herein, and the remaining structures may be obtained by referring to the related art, and will not be described in detail herein.

Based on the structure, the electrostatic protection structure provided by the application is applied to the electronic equipment, and is directly connected with the sensitive structure, so that when static electricity enters the accommodating space, the distance from the static electricity to the electrostatic protection structure is nearest, namely the impedance is minimum, the static electricity can be directly beaten on the conducting layer, and the conducting layer is separated from the sensitive structure through the insulating substrate, namely the conducting layer is not electrically connected with the sensitive structure and is non-conductive, so that the static electricity can not beaten on the sensitive structure, a static electricity discharging path is increased through the electrostatic protection structure, namely the static electricity can be beaten on the electrostatic protection structure directly for discharging, the electrostatic protection structure can protect the sensitive structure from being damaged, and when the electrostatic protection structure is applied to the electronic equipment, the electrostatic protection capability of the electronic equipment is improved, the electromagnetic compatibility problem of hard damage or functional soft failure of the structure in the electronic equipment is reduced, and the performance of the electronic equipment is better.

The following describes the electrostatic protection structure 26 applicable to the present application in detail with reference to fig. 7 to 12. Fig. 11 and 12 are obtained by cutting fig. 8 and 10 along the cutting line T1T 2.

As shown in fig. 7 to 12, the present application provides an electrostatic protection structure 26 applied to an electronic device, where the electronic device may further include at least one plastic structural member, a sensitive structure, and a grounding terminal, the at least one plastic structural member has a receiving space, the sensitive structure and the electrostatic protection structure are disposed in the receiving space, and the electrostatic protection structure is connected to the sensitive structure and the grounding terminal respectively.

At least one of the plastic structural members and the sensitive structure has a gap therebetween, the gap having a width in a first direction (ox direction in fig. 7 to 12) of less than or equal to 2mm, and a height in a second direction (oy direction in fig. 7 to 12) of 20 μm-40 μm, the gap being for enabling static electricity to enter into the accommodation space in which the sensitive structure is placed.

The electrostatic protection structure 26 may at least include an insulating substrate 261 and a conductive layer 262, where the insulating substrate 261 contacts with the sensitive structure, the conductive layer 262 is disposed on a side of the insulating substrate 261 away from the sensitive structure, the conductive layer 262 is further connected to a ground terminal, and the conductive layer 262 is configured to receive the static electricity entering the accommodating space and prevent the static electricity from impinging on the sensitive structure.

As an example, the width of the slit in the ox direction may be 0.1mm, 0.5mm, 1mm, 1.5mm, 2mm, or the like, and the height of the slit in the oy direction may be 20mm, 25mm, 30mm, 35mm, 40mm, or the like

In application, the sensitive structure may or may not be in contact with at least one plastic structural member, and is not specifically limited herein, but the sensitive structure is not in direct contact with the ground terminal.

Similarly, the electrostatic protection structure 26 may or may not be in contact with at least one plastic structural member, and is not specifically limited herein.

It should be appreciated that the electronic device comprising at least one plastic structure may mean that the electronic device comprises only one plastic structure, or that the electronic device comprises a plurality of plastic structures, without being particularly limited herein. In the case of an electronic device comprising a plastic component, the plastic component itself and the space between the plastic component and the sensitive structure are provided with gaps through which static electricity outside the plastic component can enter the receiving space in which the sensitive structure is placed. In the case that the electronic device includes a plurality of plastic structural members, the electronic device may have an accommodating space in one plastic structural member, and gaps are formed between the one plastic structural member and the sensitive structure, or may also have an accommodating space defined by a plurality of plastic structural members, and gaps are formed between at least two of the plurality of plastic structural members, and between the plastic structural member and the sensitive structure, or may also have gaps between the one plastic structural member, and between the plastic structural member and the sensitive structure, specifically, may be determined according to actual needs.

Thus, having a gap between at least one plastic structural member and the sensitive structure may mean having a gap between one plastic structural member and the sensitive structure, or having a gap between a plurality of plastic structural members and the sensitive structure. The number of gaps between each plastic structural member and the sensitive structure may be one or more, which is not particularly limited herein. In the case where the number of slits is plural, the sizes, shapes, and the like of the plural slits may be the same or different, in particular, in accordance with practical applications.

The grounding terminal may be a PCB or a middle frame in the electronic device, that is, the PCB and the middle frame may be used as the grounding terminal, so that the electrostatic protection structure 26 flows the received static electricity into the ground.

The volume and position of the receiving space may be determined according to the shape and number of plastic structural members, and the volumes and positions of the sensitive and electrostatic protection structures 26.

In application, the insulating substrate 261 may be a rigid insulating substrate or a flexible insulating substrate. In the case where the insulating substrate 261 is a rigid insulating substrate, the rigid insulating substrate cannot be bent, and at this time, the electrostatic protection structure 26 may be disposed at some positions in the electronic device where bending of the electrostatic protection structure 26 is not required. Under the condition that the insulating substrate 261 is a flexible insulating substrate, the flexible insulating substrate can be bent, at this time, the electrostatic protection structure 26 can be arranged at any position of the electronic equipment, when the electrostatic protection structure 26 is required to be bent, the flexible insulating substrate is not required to be bent when the electrostatic protection structure 26 is not required to be bent, and therefore the insulating substrate 261 can meet the bending performance and can be suitable for various application scenes. The flexible insulating substrate may be ‌ Polyimide (PI) or polyester (polyethylene terephthalate, PET) ‌ ‌.

The thickness d1 of the insulating substrate 261 in the oy direction may be greater than or equal to 13 μm, and exemplary d1 may be 13 μm, 14 μm, 15 μm, 16 μm, 17 μm, or the like. Therefore, the insulating substrate 261 can not only play a role of supporting the conductive layer 262, but also isolate the conductive layer 262 from the sensitive structure due to the insulating substrate 261, so that the conductive layer 262 is not in direct contact with the sensitive structure, and thus when static electricity enters the accommodating space, air discharge (but not contact discharge) can strike the static electricity protection structure 26 but not the sensitive structure, so that protection of the sensitive structure is realized.

In application, the conductive layer 262 may be a conductive foil or wire, etc. Thus, the conductive layer 262 may bend with the flexible substrate when the static shield structure 26 is required to bend, and may not bend when the static shield structure 26 is not required to bend.

The material of the conductive layer 262 may be a metal, for example, copper (Cu), gold (Au), silver (Ag), or the like. In the case where the material of the conductive layer 262 is copper, the material of the conductive layer 262 may be electrolytic copper or rolled copper or the like in particular, and is not particularly limited herein.

The thickness d2 of the conductive layer 262 in the oy direction may be 12 μm-35 μm, and exemplary d2 may be 12 μm, 15 μm, 20 μm, 25 μm, 30 μm, 35 μm, or the like. Thus, the conductive layer 262 has a small thickness, is highly conductive, can be folded well, and can make the electronic device compact and slim.

The dc resistance of the conductive layer 262 may be less than or equal to 5Ω, and exemplary dc resistances of the conductive layer 262 may be 1Ω,2Ω,3Ω,4Ω,5Ω, or the like. Thus, the conductive layer 262 has good ductility and conductivity.

It is understood that the conductive layer 262 may be directly printed on one side of the insulating substrate 261, or the conductive layer 262 may be adhered on one side of the insulating substrate 261 by an adhesive, which is not particularly limited herein. In the case of using an adhesive, the adhesive of the embodiment of the present application may be an epoxy resin or the like, and thus, the adhesive property of the adhesive is good, and the properties of the insulating substrate 261 and the conductive layer 262 are not affected.

In one or more embodiments, the bending radius of the electrostatic protection structure 26 formed by the insulating substrate 261 and the conductive layer 262 may be greater than or equal to 5h, where h is the thickness of the electrostatic protection structure 26 along the oy direction, that is, the sum of the thickness of the insulating substrate 261 along the oy direction and the thickness of the conductive layer 262 along the oy direction.

Also, in the case where the electrostatic protection structure 26 composed of the insulating base 261 and the conductive layer 262 is required to be bent, the number of times of bending or the like may be determined according to actual needs, and for example, may be bent one or more times.

It should be understood that contact of the insulating substrate 261 with the sensitive structure may mean that the insulating substrate 261 is directly connected with the sensitive structure or that the insulating substrate 261 is connected with the sensitive structure through other structures, for example, the insulating substrate 261 may be bonded with the sensitive structure through an adhesive layer.

The adhesive layer may be a nonconductive adhesive 264, etc., and the nonconductive adhesive 264 herein may be a nonconductive adhesive backing, etc. containing no metal particles. The insulation resistance of the non-conductive paste 264 may be greater than or equal to 10mΩ, exemplary insulation resistances of the non-conductive paste 264 may be 10mΩ, 11mΩ, 12mΩ, 13mΩ, 14mΩ, 15mΩ, or the like, and the thickness d6 of the non-conductive paste 264 in the oy direction may be greater than or equal to 30 μm, exemplary d6 may be 30 μm, 35 μm, 40 μm, 45 μm, 50 μm, 60 μm, or the like. Thus, the non-conductive paste 264 can connect both the insulating substrate 261 and the sensitive structure and the conductive layer 262 is not electrically connected with the sensitive structure.

It should be understood that the connection of the conductive layer 262 to the ground terminal may mean that a portion of the conductive layer 262 penetrates a portion of the insulating substrate 261 in the oy direction and is directly contacted to the ground terminal, or that a portion of the conductive layer 262 penetrates a portion of the insulating substrate 261 in the oy direction and is contacted to the ground terminal through other protective members, that is, other protective members are disposed between the conductive layer 262 penetrating a portion of the insulating substrate 261 and the insulating substrate 261, where all of the other protective members are disposed at a side of the insulating substrate 261 away from the conductive layer 262 and the other protective members are respectively contacted to the insulating substrate 261 and the conductive layer 262 directly, or that a portion of the conductive layer 262 does not penetrate a portion of the insulating substrate 261 in the oy direction and is contacted to the ground terminal through other protective members, where other protective members are partially disposed at a side of the insulating substrate 261 away from the conductive layer 262 and the other protective members are disposed within a portion of the insulating substrate 261 and the other protective members are respectively contacted to the insulating substrate 261 and the conductive layer 262 directly. In these implementations, the insulating substrate 261 may have at least one through hole, and a portion of the conductive layer 262 may partially or entirely enter the through hole, and thus, other protective members may partially enter the through hole or not enter the through hole, which is not particularly limited herein.

Of course, the connection of the conductive layer 262 to the ground terminal may also mean that the conductive layer 262 does not directly contact the ground terminal through the insulating substrate 261, or that the conductive layer 262 does not pass through the insulating substrate 261 and contacts the ground terminal through other protecting members, and at this time, the other protecting members do not pass through the insulating substrate 261 and contact the ground terminal, in particular, depending on practical applications.

In application, the protective member may be the protective finger 265 in fig. 11, the protective finger 265 may be electroplated or coated on an outer surface of a side of the conductive layer 262 penetrating the insulating substrate 261, and the protective finger 265 may be connected to a ground terminal.

The material of the guard finger 265 may be gold, copper, or nickel (Ni), etc. In the case where the material of the protective finger 265 is gold and the material of the conductive layer 262 is copper, gold may be plated on the copper surface to form a gold finger, and the gold finger has good ductility and conductivity, so that the gold finger can protect copper from corrosion as much as possible, and can ensure impedance continuity after long-term use, so that long-term reliable contact can be performed.

Of course, the guard finger 265 may be a separate structure, and the guard finger 265 may be bonded to the outer surface of the conductive layer 262 penetrating the side of the insulating substrate 261 by an adhesive or the like, which is not particularly limited herein.

As shown in fig. 11, the thickness d4 of the guard finger 265 in the oy direction may be greater than or equal to 5 μm, and specifically, d4 may be 5 μm, 6 μm, 7 μm, 8 μm, 9 μm, or the like. Therefore, the protective finger can protect copper from corrosion as far as possible, and can ensure impedance continuity after long-time use, so that the conductive layer can be reliably contacted with the grounding terminal or other structures for a long time.

In one or more embodiments, the static electricity protection structure 26 may further include an elastic member 266, and the elastic member 266 may be a spring sheet, conductive foam, or the like, which has an elastic structure. The elastic sheet can be a convex hull elastic sheet and the like.

As an example, the elastic member 266 is disposed between the guard finger 265 and the ground terminal, and the elastic member 266 is in contact with the guard finger 265 and the ground terminal, respectively. In particular, the elastic member 266 may be welded or adhered to one side of the protective finger 265, the center frame 21, or the main board 22.

Further, the effective contact area between the protecting finger 265 and the elastic member 266 may be greater than or equal to 10mm ², specifically, the effective contact area between the protecting finger 265 and the elastic member 266 may be 10mm ²、11mm²、12mm²、13mm²、14mm² or 15mm ². Thereby, a long-term effective contact of the protective finger 265 with the elastic member 266 can be ensured.

It should be noted that the working height of the elastic member 266 may be determined according to the distance between the protecting finger 265 and the ground terminal along the oy direction.

Since the circuit board or the middle frame cannot be directly connected with the protecting finger 265 when being used as the grounding end, the elastic piece 266 is added to ensure that the protecting finger 265 is well connected with the grounding end through the elastic piece 266.

In one or more embodiments, the insulating base 261 and the conductive layer 262 are integrally softer, and in the case of the electrostatic protection structure 26 having the elastic member 266, the elastic member 266 is likely to burst the insulating base 261 and the conductive layer 262 in some application scenarios, which requires that the grounded portion of the electrostatic protection structure 26 be harder than the other portions, i.e., have a stronger strength, to ensure good performance. Therefore, as shown in fig. 11 and 12, the electrostatic protection structure 26 may further include a reinforcing member 263, where the reinforcing member 263 is disposed on a side of the conductive layer 262 away from the insulating substrate 261, and the reinforcing member 263 may be adhered to the conductive layer 262 by an adhesive such as glue, so as to not only ensure less damage to the insulating substrate 261 and the conductive layer 262, but also achieve better connection between the structures.

As one example, the reinforcement 263 may be provided at a part of the surface of the conductive layer on the side away from the insulating base. In the case where the conductive layer and the insulating base need to be bent, the reinforcement 263 may be provided on a part of the surface of a portion of the conductive layer that does not need to be bent, which is away from the side of the insulating base.

In application, the thickness d3 of the reinforcement 263 in the oy direction may be greater than or equal to 0.15mm, and specifically, d3 may be 0.15mm, 0.18mm, 0.2mm, 0.25mm, 0.3mm, or the like. Thus, the strength of the obtained reinforcement 263 is high.

Further, when the reinforcement 263 is a steel sheet, the thickness of the steel sheet in the oy direction may be greater than or equal to 0.15mm, or when the reinforcement 263 is a plastic PI, the thickness of the plastic PI in the oy direction may be greater than or equal to 0.25mm, which is not particularly limited herein.

In one or more embodiments, when the electrostatic protection structure 26 needs to be sleeved around the sensitive structure, whether the electrostatic protection structure 26 is provided with structures such as the protecting finger 265, the elastic member 266, and the reinforcing member 263, only a first hole is required to be provided in the insulating substrate 261, and a second hole is required to be provided in the conductive layer 262, where the first hole and the second hole at least partially overlap along the oy direction, then the first hole and the second hole are sleeved on the electrostatic protection structure 26, that is, the electrostatic protection structure 26 is sleeved around the sensitive structure. If the electrostatic protection structure 26 is further provided with a protective finger 265, an elastic member 266, a reinforcing member 263, and the like, these structures may be provided in a portion other than the first hole in the insulating base 261 and/or a portion other than the second hole in the conductive layer 262.

Notably, as shown in fig. 9 and 10, the first hole and the second hole are identical in shape, size, etc. For example, the shapes of the first hole and the second hole may be a cylinder, a cuboid, or a cube, so long as the insulating substrate 261 and the conductive layer 262 can be sleeved around the sensitive structure.

Under the condition that the shapes of the first hole and the second hole are cylindrical, obviously, the first hole and the second hole are selected to be completely overlapped along the oy direction, namely, the diameters of the first hole and the second hole are D1 shown in fig. 9 and 10, and D1 can be as small as possible under the condition that the sensitive structure can work normally. Specifically, D1 needs to be greater than or equal to the maximum length of the portion of the sensitive structure that cannot be covered during normal operation, so that the insulating substrate 261 and the conductive layer 262 can be sleeved on the sensitive structure, and a good protection effect can be achieved.

Further, the length D1 may be equal to the maximum length of the portion of the sensitive structure that cannot be covered during normal operation, that is, the insulating substrate 261 and the conductive layer 262 are sleeved on the sensitive structure and contact with the periphery of the sensitive structure, so that the electrostatic protection effect of the electrostatic protection structure 26 is very good.

In one or more embodiments, as shown in fig. 7 and 8, the insulating substrate 261 and the conductive layer 262 in the electrostatic protection structure 26 have no holes, and at this time, the electrostatic protection structure 26 cannot be sleeved around the sensitive structure, but may be attached to at least one surface of the sensitive structure, and the electrostatic protection structure 26 may be in contact with at least one surface of the sensitive structure.

In one or more embodiments, the static electricity protection structure 26 may further include an oxidation preventing layer 267, the oxidation preventing layer 267 being disposed at a side of the conductive layer 262 remote from the insulating substrate 261.

In the application, the material of the oxidation preventing layer 267 may be ink or gold or the like containing no metal particles. Thus, the risk of oxidation of the conductive layer 262 by water oxygen or the like can be reduced by the protection of the oxidation preventing layer 267.

Further, the oxidation preventing layer is used to be able to be broken down by static electricity with a voltage of less than 1kV, at which time the resistance of the oxidation preventing layer is small. For example, in the case that the oxidation preventing layer can be broken down by static electricity with the voltage of 0.5KV, static electricity with the voltages of 0.8KV, 1KV, 1.5KV, 10KV and the like can break down the oxidation preventing layer, then the static electricity reaches the conducting layer, and the conducting layer leads the static electricity to the grounding end, so that the sensitive structure is protected.

In the case where the material of the oxidation preventing layer 267 is an ink containing no metal particles, the oxidation preventing layer 267 is not conductive at this time, and it is further required that the thickness d7 of the oxidation preventing layer 267 in the direction perpendicular to the oy direction satisfies that d7 x electrostatic withstand voltage parameter (in kV/mm) is less than 1kV, that is, that static electricity of less than 1kV is required to break down the oxidation preventing layer 267.

When the oxidation preventing layer 267 is formed by plating gold on the conductive layer 262, since gold itself is conductive, static electricity can directly reach the conductive layer through gold and then be directly conducted away by grounding of the conductive layer, and then the electrostatic breakdown characteristics of the oxidation preventing layer 267 can be not limited at this time.

In one or more embodiments, the sensing device requires a sensing device that is capable of transmitting light or a sensing device that is transparent to sound, etc.

The embodiment of the application provides a static protection structure which is directly connected with a sensitive structure, so that when static enters an accommodating space, the distance from the static to the static protection structure is nearest, namely the impedance is minimum, the static can be directly beaten on a conductive layer, and the conductive layer is separated from the sensitive structure through an insulating substrate, namely the conductive layer is not electrically connected with the sensitive structure and is non-conductive, so that the static cannot beaten on the sensitive structure, a static discharge path is increased through the static protection structure, namely the static can be directly beaten on the static protection structure for discharging, and the static protection structure can protect the sensitive structure from being damaged.

When the electrostatic protection structure is applied to electronic equipment, the electrostatic protection capability of the electronic equipment is improved, the electromagnetic compatibility problem of hard loss or functional soft failure of the structure in the electronic equipment is reduced, and the performance of the electronic equipment is better.

The electrostatic protection structure provided by the application is applied to the electronic device, and the electronic device 01 of fig. 13 to 16 is obtained.

Embodiment 1 (sensitive structure is rear camera module 3):

Fig. 13 shows a schematic structural diagram of an electronic device 01 to which the embodiment of the present application is applied. It should be noted that, the electrostatic protection structure in fig. 13 is obtained after the section is cut along the position of the T3T4 section line in fig. 10, and the dashed line with an arrow in fig. 13 is a discharge path during the electrostatic discharge test.

As shown in FIG. 13, the width h1 of the slit in the ox direction is less than or equal to 2mm, and the height h2 of the slit in the oy direction is 20 μm to 40. Mu.m.

Referring to fig. 13 again, the electronic device 01 includes a middle frame 21, a LENS 12, a rear camera module 32, a rear camera substrate 31, a VCM metal housing 33, a motherboard 22, a plastic motherboard bracket 7, a plastic battery cover 8, a dispensing 9, a plastic DECO 10, and a back adhesive 11.

The middle frame 21 is used for supporting the main board 22, the plastic main board bracket 7, the plastic battery cover 8, the dispensing 9, the plastic DECO 10, the back glue 11, the rear camera module 32, the rear camera substrate 31, the VCM metal housing 33 and the LENS 12. In application, the middle frame 21 may be any one of a metal middle frame, for example, an aluminum alloy middle frame, a magnesium alloy middle frame, a titanium alloy middle frame, and the like.

The mainboard 22 sets up in the one side of center 21, and plastic mainboard support 7 sets up in the one side that center 21 was kept away from to mainboard 22, and plastic battery cover 8 sets up in the one side that center 21 was kept away from to plastic mainboard support 7, and plastic DECO 10 sets up in the one side that center 21 was kept away from to plastic battery cover 8, and plastic DECO 10 links to each other with plastic battery cover 8 through the point gum 9. The plastic motherboard bracket 7, the plastic battery cover 8 and the plastic DECO 10 constitute an accommodation space in which the rear camera module 32, the rear camera substrate 31, the VCM metal housing 33 and the LENS 12 are all disposed.

Wherein, rear camera base plate 31 sets up in the one side of center 21, rear camera module 32 sets up in the one side that rear camera base plate 31 kept away from center 21, rear camera module 32 links to each other with rear camera base plate 31, VCM metal casing 33 cover is established around rear camera module 32, VCM metal casing 33 also sets up in the one side that rear camera base plate 31 kept away from center 21, VCM metal casing 33 also links to each other with rear camera base plate 31, LENS 12 sets up in the one side that rear camera module 32 and VCM metal casing 33 kept away from center 21, LENS 12 do not link to each other with rear camera module 32 and VCM metal casing 33 respectively, LENS 12 still links to each other with plastic DECO 10 through gum 11.

The electronic device 01 further includes a BTB support 41, a BTB 42, and an FPC 43, the BTB support 41 being disposed on a side of the main board 22 away from the center frame 21, the BTB 42 being disposed on a side of the BTB support 41 away from the center frame 21, the BTB 42 being connected to the BTB support 41, the BTB 42 being connected to the rear camera substrate 31 through the FPC 43.

The electronic device 01 further comprises an electrostatic protection structure, the electrostatic protection structure is sleeved outside the VCM metal housing 33, the electrostatic protection structure is connected with the VCM metal housing 33, and the electrostatic protection structure is further located in a partial area among the motherboard 22, the plastic motherboard bracket 7 and the VCM metal housing 33.

The electrostatic protection structure comprises an insulating substrate 261, a conductive layer 262, a reinforcing member 263, a non-conductive adhesive 264, a protective finger 265 and an elastic member 266, wherein the whole body formed by the insulating substrate 261 and the conductive layer 262 consists of a first part, a second part and a third part, the first part, the second part and the third part are sequentially connected, the first part and the third part extend along the ox direction, the second part extend along the oy direction, the first part and the second part are respectively arranged between a VCM metal shell 33 and a plastic mainboard bracket 7, the insulating substrate 261 in the first part and the second part are respectively connected with the VCM metal shell 33 through the non-conductive adhesive 264, the conductive layer 262 is not contacted with the plastic mainboard bracket 7, the third part is arranged between the plastic mainboard bracket 7 and the mainboard 22, the conductive layer 262 in the third part is also provided with a reinforcing member 263, the reinforcing member 263 is contacted with the conductive layer 262, a gap is arranged between the insulating substrate 261 in the third part and the mainboard 22, the protective finger 266 is respectively arranged between the protective substrate 261 and the elastic member 266, the protective finger 266 is respectively contacted with the elastic member 266, and the finger 266 is respectively arranged between the elastic member 266 and the finger 266, and the finger 266 is respectively contacted with the finger 266, and the finger 266.

Because the static protection structure is smaller for sensitive structure isovolumetric, intensity is not enough, probably have the problem such as warp in electronic equipment's actual equipment, consequently, from the angle of improving static protection structure's equipment degree of difficulty, can directly paste static protection structure on VCM metal casing, carry out reliable connection with the earthing terminal again, only need guarantee that static protection structure cover establishes around VCM metal casing, on the static protection structure is beaten to priority after static gets into accommodation space by the gap between plastic DECO and LENS like this to play the static protection effect to VCM metal casing.

It should be noted that, the first portion (composed of the insulating substrate 261, the nonconductive adhesive 264, and the conductive layer 262) may cover the surface of the VCM metal housing 33 along the ox direction, thereby better realizing the electrostatic protection function.

The embodiment of the application provides electronic equipment, which is provided with an accommodating space for accommodating a rear camera component, so that when static electricity enters the accommodating space, the distance from the static electricity to a conducting layer is nearest, the impedance is minimum, the conducting layer and a VCM metal shell are separated through an insulating substrate and non-conducting glue, namely, the conducting layer is not conducted with the VCM metal shell, and is grounded through an elastic piece, and the static electricity is directly discharged to a main board through the conducting layer to form a shortest impedance path, so that the static electricity cannot be discharged to the VCM metal shell, but is directly discharged to the conducting layer, the conducting layer can protect the rear camera module from being damaged, and the performance of the electronic equipment is greatly improved.

Example 2 (sensitive structure is Receiver (RCV) assembly 100):

fig. 14 shows a schematic structural diagram of an electronic device 01 to which the embodiment of the present application is applied.

As shown in FIG. 14, the width h1 of the slit in the ox direction is less than or equal to 2mm, and the height h2 of the slit in the oy direction is 20 μm to 40. Mu.m.

Referring to fig. 14 again, the electronic device includes a plastic housing 1, a middle frame 21, a main board 22, a plastic main board support 7, a plastic battery cover 8, a BTB 42, a back adhesive 11, an RCV component 100, an insulating substrate 261, a conductive layer 262, a non-conductive adhesive 264, a protective finger 265 and an elastic member 266, wherein the plastic housing 1, the plastic main board support 7 and the plastic battery cover 8 enclose an accommodating space, the middle frame 21, the main board 22, the BTB 42, the back adhesive 11, the RCV component 100, the insulating substrate 261, the conductive layer 262, the non-conductive adhesive 264, the protective finger 265 and the elastic member 266 are all disposed in the accommodating space, a gap F is provided between the plastic housing 1 and the plastic battery cover 8, the back adhesive 11 seals the gap F, the back adhesive 11 contacts the plastic housing 1 and the plastic battery cover 8, the middle frame 21 is disposed on one side of the plastic housing 1, the surfaces of the middle frame 21 facing the plastic housing 1 contact the plastic housing 1, the RCV component 100 and the main board 22 are disposed on one side of the middle frame 21 facing away from the plastic housing 1 along the oy direction, the BTB 42 is disposed between the plastic main board 22 and the plastic battery cover 7 and the btv component 22 contacts the main board 22 and the RCV component 22 along the oy direction.

The insulating base 261 and the conductive layer 262 are integrally formed by a fourth part, a fifth part and a sixth part, the fourth part, the fifth part and the sixth part are sequentially connected, the fourth part and the sixth part extend along the ox direction, the fifth part extends along the oy direction, the fourth part is arranged between the RCV assembly 100 and the plastic motherboard bracket 7 along the oy direction, specifically, the insulating base 261 in the fourth part is bonded with the RCV assembly 100 through the non-conductive adhesive 264, and a gap is formed between the conductive layer 262 in the fourth part and the plastic motherboard bracket 7. The fifth part is disposed between the plastic case 1 and the RCV assembly 100 in the ox direction, and specifically, the insulating substrate 261 in the fifth part is bonded to the RCV assembly 100 by the non-conductive adhesive 264, and a gap is provided between the conductive layer 262 in the fifth part and the plastic case 1. The sixth portion is disposed between the middle frame 21 and the plastic battery cover 8 along the oy direction, a protecting finger 265 and an elastic member 266 are further disposed between the insulating base 261 and the middle frame 21 in the sixth portion, the protecting finger 265 is disposed between the insulating base 261 and the elastic member 266, the protecting finger 265 is respectively in contact with the conductive layer penetrating the insulating base 261 and the elastic member 266, the elastic member 266 is disposed between the protecting finger 265 and the middle frame 21, the elastic member 266 is respectively in contact with the protecting finger 265 and the middle frame 21, the middle frame 21 serves as a grounding end, and a gap is formed between the conductive layer 262 in the sixth portion and the plastic battery cover 8.

The embodiment of the application provides electronic equipment, which is provided with an accommodating space for accommodating a receiver, so that when static electricity enters the accommodating space, the distance from the receiver to a conducting layer is nearest, impedance is minimum, the conducting layer and the receiver are separated through an insulating substrate and non-conducting glue, namely, the conducting layer is not conducted with the receiver, and is grounded, and static electricity is directly discharged to a middle frame through the conducting layer to be the shortest impedance path, so that the static electricity cannot be discharged to the receiver, but is directly discharged to the conducting layer, the conducting layer can protect the receiver from being damaged, a series of electromagnetic compatibility problems of hard damage or soft failure of the device function brought to the electronic equipment are reduced, and the performance of the electronic equipment is greatly improved.

Example 3:

as shown in FIG. 15, the width h1 of the slit in the ox direction is less than or equal to 2mm, and the height h2 of the slit in the oy direction is 20 μm to 40. Mu.m. Fig. 16 may refer to the slit of fig. 15.

Referring to fig. 15 and 16 again, the electronic device 01 includes a first plastic structural member 20, a middle frame 21, a main board 22, a sensitive structure 23 and an electrostatic protection structure 26, wherein the first plastic structural member 20 can enclose an accommodating space, a gap F is provided between the first plastic structural member 20 itself, the first plastic structural member 20 itself and the sensitive structure 23, the middle frame 21 is disposed on the first plastic structural member 20, and the other surfaces except one surface of the middle frame 21 are all in contact with the first plastic structural member 20. The main board 22 is disposed on a surface of the middle frame 21 that is not in contact with the first plastic structural member 20, the main board 22 is not in contact with the first plastic structural member 20, and the main board 22 serves as a ground terminal. The sensitive structure 23 is disposed on a surface of the main board 22 away from the first plastic structural member 20, and the sensitive structure 23 is not in contact with the first plastic structural member 20.

Referring to fig. 15 again, the electrostatic protection structure 26 is disposed on one side of the sensitive structure 23 along the ox direction, and the electrostatic protection structure 26 is respectively contacted with the sensitive structure 23 and the motherboard 22.

Referring to fig. 16 again, the electrostatic protection structure 26 wraps all surfaces of the sensitive structure 23 and contacts the motherboard 22.

The embodiment of the application provides electronic equipment, which is provided with an accommodating space for accommodating a sensitive structure, so that after static electricity enters the accommodating space, the distance from the static electricity to the static electricity protection structure is nearest, the impedance is minimum, the static electricity protection structure is separated from the sensitive structure, namely, the static electricity protection structure is not conducted with the sensitive structure, and is grounded, and the static electricity is directly discharged to a main board through the static electricity protection structure to form a shortest impedance path, so that the static electricity cannot be discharged to the sensitive structure, but is directly discharged to the static electricity protection structure, the static electricity protection structure can protect the sensitive structure from being damaged, a series of electromagnetic compatibility problems of hard damage or soft failure of the device function of a device brought by the electronic equipment are reduced, and the performance of the electronic equipment is greatly improved.

Only some of the matters related to the invention are described herein, and the rest of the matters can be obtained by referring to the related art, which will not be described in detail herein.

It should be understood that the above description is only intended to assist those skilled in the art in better understanding the embodiments of the present application, and is not intended to limit the scope of the embodiments of the present application. It will be apparent to those skilled in the art from the foregoing examples that various equivalent modifications or variations can be made, for example, in various embodiments of the method, some steps may be optional, some steps may be newly added, etc., or a combination of any two/more of the foregoing. Such modifications, variations, or combinations are also within the scope of embodiments of the present application.

It should also be understood that the foregoing description of embodiments of the present application focuses on highlighting differences between the various embodiments and that the same or similar elements not mentioned may be referred to each other and are not repeated herein for brevity.

It should be further understood that the sequence numbers of the above processes do not mean the order of execution, and the execution order of the processes should be determined by the functions and the internal logic, and should not be construed as limiting the implementation process of the embodiments of the present application.

It should also be understood that the manner, the case, the category, and the division of the embodiments in the embodiments of the present application are merely for convenience of description, should not be construed as a particular limitation, and the features in the various manners, the categories, the cases, and the embodiments may be combined without contradiction.

It is also to be understood that in the various embodiments of the application, where no special description or logic conflict exists, the terms and/or descriptions between the various embodiments are consistent and may reference each other, and features of the various embodiments may be combined to form new embodiments in accordance with their inherent logic relationships.

It should be noted that the above description is only a specific embodiment of the present application, but the scope of the present application is not limited thereto, and any changes or substitutions within the technical scope of the present application should be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims

1. The electrostatic protection structure is characterized by being applied to electronic equipment, and further comprising a sensitive structure, a grounding end and at least one plastic structural member, wherein the at least one plastic structural member is provided with an accommodating space, the sensitive structure and the electrostatic protection structure are arranged in the accommodating space, and the electrostatic protection structure is respectively connected with the sensitive structure and the grounding end;

the electrostatic protection structure at least comprises:

an insulating substrate connected to the sensitive structure;

The conducting layer is arranged on one side, far away from the sensitive structure, of the insulating substrate, is further connected with the grounding end and is used for receiving static electricity entering the accommodating space and enabling the static electricity not to contact the sensitive structure.

2. The static-electricity-protecting structure according to claim 1, further comprising:

The reinforcing piece is arranged on one side, far away from the insulating substrate, of the conducting layer, the reinforcing piece is connected with the conducting layer, and the strength of the reinforcing piece is larger than that of the conducting layer.

3. The structure according to claim 2, wherein the reinforcing member is provided on a part of a surface of the conductive layer on a side away from the insulating base;

The thickness of the reinforcement is greater than or equal to 0.15mm.

4. The static-electricity protection structure according to any one of claims 1 to 3, characterized in that the static-electricity protection structure further comprises:

The bonding layer is arranged between the static protection structure and the sensitive structure and is used for bonding the static protection structure with the sensitive structure.

5. The structure according to any one of claims 1 to 3, wherein a portion of the conductive layer penetrating the insulating substrate is a first conductive layer;

The static electricity protection structure further includes:

The protection piece is arranged between the first conductive layer and the grounding end, and the protection piece is respectively connected with the first conductive layer and the grounding end.

6. The static-electricity-protecting structure according to claim 5, further comprising:

The elastic piece is arranged between the protection piece and the grounding end and is respectively connected with the protection piece and the grounding end.

7. A structure according to any one of claims 1 to 3, wherein the portion of the conductive layer penetrating the insulating substrate is a first conductive layer, and the first conductive layer is connected to the ground terminal.

8. The static-electricity-protecting structure according to claim 7, further comprising:

The elastic piece is arranged between the first conductive layer and the grounding end and is respectively connected with the first conductive layer and the grounding end.

9. The static-electricity protection structure according to any one of claims 1 to 3, characterized in that the static-electricity protection structure further comprises:

And the anti-oxidation layer is arranged on one side of the conductive layer away from the insulating substrate and is used for protecting the conductive layer from oxidation.

10. The structure according to claim 9, wherein the oxidation preventing layer is for being able to be broken down by static electricity of less than 1 kV.

11. The static electricity protection structure according to any one of claims 1 to 3, wherein the sensitive structure is a rear camera assembly;

The electronic equipment further comprises a middle frame, a main board, a plastic main board support and a plastic decoration piece, wherein the main board, the plastic main board support and the plastic decoration piece are arranged on the same side of the middle frame, the plastic main board support and the plastic decoration piece enclose an accommodating space, a rear camera component is arranged in the accommodating space, the middle frame or the main board is used as a grounding end, the plastic decoration piece and the rear camera component are provided with gaps, an electrostatic protection structure is sleeved on the periphery of the rear camera component, the electrostatic protection structure is connected with the main board or the middle frame, the electrostatic protection structure is arranged between the rear camera component and the main board and the plastic main board support, and the plastic decoration piece is arranged on one side of the plastic main board support away from the middle frame.

12. The static electricity protection structure according to claim 11, wherein the rear camera assembly comprises a rear camera substrate, a rear camera module, a voice coil motor metal housing and a lens, the rear camera substrate is arranged on one side of the middle frame, the rear camera module and the voice coil motor metal housing are arranged on the same side of the rear camera substrate away from the middle frame, the rear camera module and the voice coil motor metal housing are respectively connected with the rear camera substrate, the voice coil motor metal housing is sleeved around the rear camera module, the lens is arranged on one side of the rear camera module and the voice coil motor metal housing away from the middle frame, the lens and the plastic decorating piece are provided with gaps, the static electricity protection structure is arranged between the plastic motor metal housing and the plastic mainboard bracket, and between the main board and the plastic mainboard bracket, and the static electricity protection structure is respectively connected with the voice coil motor metal housing and the main board.

13. The structure according to claim 12, wherein the structure comprises the insulating base, the conductive layer, a reinforcing member, an adhesive layer, a protective member, and an elastic member, the whole body of the insulating base and the conductive layer is divided into a first portion, a second portion, and a third portion, the first portion, the second portion, and the third portion are sequentially connected, the extending directions of the first portion and the third portion are the same, and the extending directions of the second portion and the first portion are different;

The insulating base in the first part and the second part is connected with the voice coil motor metal shell through the bonding layer, a gap is formed between the conducting layer and the plastic mainboard support, the third part is arranged between the plastic mainboard support and the mainboard, the reinforcing piece is arranged between the conducting layer in the third part and the plastic mainboard support, the protecting piece is arranged between the conducting layer penetrating through the insulating base in the third part and the elastic piece, the elastic piece is arranged between the protecting piece and the mainboard, and the mainboard is used as the grounding end.

14. The static electricity protection structure according to any one of claims 1 to 3, wherein said sensitive structure is an earpiece assembly;

The electronic equipment further comprises a plastic shell, a middle frame, a main board, a plastic main board support and a plastic battery cover, wherein the plastic shell, the plastic main board support and the plastic battery cover enclose an accommodating space, the middle frame, the main board, the earphone assembly and the static protection structure are all arranged in the accommodating space, the plastic shell and the plastic battery cover are provided with gaps therebetween, the middle frame is arranged on one side of the plastic shell, the earphone assembly and the main board are all arranged on the same side of the middle frame away from the plastic shell, the plastic main board support is arranged on one side of the earphone assembly and the main board away from the middle frame, the plastic battery cover is arranged on one side of the plastic main board support away from the middle frame, and the middle frame or the main board is used as a grounding end.

15. The structure according to claim 14, wherein the structure comprises the insulating base, the conductive layer, an adhesive layer, a protective member, and an elastic member, the whole body of the insulating base and the conductive layer is divided into a fourth portion, a fifth portion, and a sixth portion, the fourth portion, the fifth portion, and the sixth portion are sequentially connected, the extending directions of the fourth portion and the sixth portion are the same, and the extending directions of the fifth portion and the fourth portion are different;

The fourth part is arranged between the earphone assembly and the plastic main board support, the insulating substrates in the fourth part and the fifth part are bonded with the earphone assembly through the bonding layer, the conducting layer in the fourth part is adjacent to the plastic main board support and is provided with a gap, the conducting layer in the fifth part is provided with a gap between the plastic shell, the sixth part is arranged between the middle frame and the plastic battery cover, the protecting piece is arranged between the conducting layer penetrating through the insulating substrate in the sixth part and the elastic piece, the elastic piece is arranged between the protecting piece and the middle frame, and the middle frame is used as the grounding end.

16. An electronic device comprising the electrostatic protection structure according to any one of claims 1 to 15.