CN1304468C - 硅橡胶 - Google Patents

硅橡胶 Download PDF

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Publication number
CN1304468C
CN1304468C CNB038217368A CN03821736A CN1304468C CN 1304468 C CN1304468 C CN 1304468C CN B038217368 A CNB038217368 A CN B038217368A CN 03821736 A CN03821736 A CN 03821736A CN 1304468 C CN1304468 C CN 1304468C
Authority
CN
China
Prior art keywords
silicone rubber
silica
potassium
doped
fumed silica
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB038217368A
Other languages
English (en)
Chinese (zh)
Other versions
CN1681877A (zh
Inventor
马里奥·肖尔茨
赫尔穆特·曼戈尔德
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Evonik Operations GmbH
Original Assignee
Degussa GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Degussa GmbH filed Critical Degussa GmbH
Publication of CN1681877A publication Critical patent/CN1681877A/zh
Application granted granted Critical
Publication of CN1304468C publication Critical patent/CN1304468C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/02—Ingredients treated with inorganic substances
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Silicon Compounds (AREA)
  • Containers And Packaging Bodies Having A Special Means To Remove Contents (AREA)
  • Processes Of Treating Macromolecular Substances (AREA)
  • Cosmetics (AREA)
CNB038217368A 2002-09-14 2003-08-19 硅橡胶 Expired - Fee Related CN1304468C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10242798A DE10242798A1 (de) 2002-09-14 2002-09-14 Silikonkautschuk
DE10242798.4 2002-09-14

Publications (2)

Publication Number Publication Date
CN1681877A CN1681877A (zh) 2005-10-12
CN1304468C true CN1304468C (zh) 2007-03-14

Family

ID=31969133

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB038217368A Expired - Fee Related CN1304468C (zh) 2002-09-14 2003-08-19 硅橡胶

Country Status (16)

Country Link
US (2) US20050215696A1 (de)
EP (1) EP1539869B1 (de)
JP (1) JP5108204B2 (de)
KR (1) KR100745394B1 (de)
CN (1) CN1304468C (de)
AT (1) ATE356851T1 (de)
AU (1) AU2003260428B9 (de)
CA (1) CA2498801C (de)
DE (2) DE10242798A1 (de)
ES (1) ES2285257T3 (de)
IL (1) IL167379A (de)
MX (1) MXPA05002639A (de)
PL (1) PL374079A1 (de)
PT (1) PT1539869E (de)
UA (1) UA77113C2 (de)
WO (1) WO2004033544A1 (de)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102004005222A1 (de) * 2004-02-03 2005-08-18 Degussa Ag Silikonkautschuk
DE102004010755A1 (de) 2004-03-05 2005-09-22 Degussa Ag Silikonkautschuk
ATE502982T1 (de) * 2004-11-18 2011-04-15 Evonik Degussa Gmbh Hydrophobe kieselsäure und verwendungin siliconkautschuk
DE102005001408A1 (de) * 2005-01-12 2006-07-20 Degussa Ag Pyrogen hergestelltes Siliciumdioxidpulver
DE102005027720A1 (de) * 2005-06-16 2006-12-21 Degussa Ag Alkalimetalloxid enthaltendes Mischoxidpulver und Siliconkautschuk enthaltend dieses Pulver
DE102006048575A1 (de) * 2006-10-13 2008-04-17 Evonik Degussa Gmbh Oberflächenmodifizierte Kieselsäuren
DE102006048508A1 (de) * 2006-10-13 2008-04-17 Evonik Degussa Gmbh Oberflächenmodifizierte Kieselsäuren
DE102007025685A1 (de) * 2007-06-01 2008-12-04 Evonik Degussa Gmbh RTV-Zweikomponenten-Silikonkautschuk
US20120252924A1 (en) * 2011-03-29 2012-10-04 Cassandra Ann Mahoney Flavored silicone products
CN104109386A (zh) * 2014-06-27 2014-10-22 胡红辉 一种有机硅橡胶
PL424389A1 (pl) * 2018-01-26 2019-07-29 Polewka Danuta Polwir Elektro-Pb Mieszanka do wytwarzania elementów termoizolacyjnych dla pieców przemysłowych
EP3954743A1 (de) 2020-08-12 2022-02-16 Evonik Operations GmbH Verwendung von siliziumdioxid zur verbesserung der leitfähigkeit von beschichtungen

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2284214A (en) * 1993-11-30 1995-05-31 Gen Electric Silicone and fluorosilicone heat cured filled rubber compositions
EP1216956A2 (de) * 2000-12-23 2002-06-26 Degussa AG Mit Kalium dotierte pyrogene Oxide

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2557121B1 (fr) * 1983-12-21 1986-10-10 Rhone Poulenc Spec Chim Compositions elastomeriques organopolysiloxaniques vulcanisables a chaud a caracteristiques physiques ameliorees
US4659621A (en) * 1985-08-22 1987-04-21 Xerox Corporation Release agent donor member and fusing assembly containing same
DE3782263T2 (de) * 1986-04-01 1993-04-08 Shinetsu Chemical Co Siloxankautschukzusammensetzung.
JPH01185373A (ja) * 1988-01-21 1989-07-24 Tokuyama Soda Co Ltd シリカおよびその製造方法
FR2637605B1 (fr) * 1988-10-11 1990-12-14 Rhone Poulenc Chimie Dispersion aqueuse de silicone a base de siliconate reticulant en un elastomere par elimination de l'eau
FR2637606B1 (fr) * 1988-10-11 1990-12-14 Rhone Poulenc Chimie Dispersion aqueuse de silicone a base d'alcenyloxysilane reticulant en un elastomere par elimination de l'eau
US5061965A (en) * 1990-04-30 1991-10-29 Xerox Corporation Fusing assembly with release agent donor member
US5859094A (en) * 1996-09-03 1999-01-12 Dow Corning Corporation Use of high molecular weight organopolysiloxanes to improve physical properties of liquid silicone rubber compositions
DE19650500A1 (de) * 1996-12-05 1998-06-10 Degussa Dotierte, pyrogen hergestellte Oxide
US5872176A (en) * 1997-07-11 1999-02-16 Bridgestone Corporation Addition of salts to improve the interaction of silica with rubber
DE19847097A1 (de) * 1998-10-13 2000-04-20 Wacker Chemie Gmbh Härtbare Organopolysiloxanmassen
DE19909338A1 (de) * 1999-03-03 2000-09-07 Wacker Chemie Gmbh Verfahren zur kontinuierlichen Herstellung hochviskoser füllstoffhaltiger Siliconmassen
JP3937120B2 (ja) * 1999-06-09 2007-06-27 信越化学工業株式会社 液状付加硬化型シリコーンゴム組成物及びその製造方法
DE19938338A1 (de) * 1999-08-13 2001-02-22 Wacker Chemie Gmbh Härtbare Organopolysiloxanmassen
DE10019599A1 (de) * 2000-04-20 2001-10-31 Wacker Chemie Gmbh Selbsthaftende additionsvernetzende Siliconzusammensetzungen
DE10025872A1 (de) * 2000-05-25 2001-12-06 Wacker Chemie Gmbh Verfahren zur Herstellung von feststoffhaltigen Kautschukmassen
DE50114065D1 (de) * 2001-03-24 2008-08-14 Evonik Degussa Gmbh Mit einer Hülle umgebene, dotierte Oxidpartikeln
JP4067790B2 (ja) * 2001-07-18 2008-03-26 信越化学工業株式会社 シリコーンゴム組成物及び導電性ゴム硬化物並びに導電性ゴム硬化物の製造方法
US6555237B1 (en) * 2001-09-20 2003-04-29 Nexpress Solutions Llc Fuser system with donor roller having a controlled swell release agent surface layer
US6759118B2 (en) * 2002-02-19 2004-07-06 Xerox Corporation Electrophotographic system with member formed from boron nitride filler coupled to a silane
DE10211314A1 (de) * 2002-03-14 2003-10-02 Wacker Chemie Gmbh Vernetzbare Massen auf der Basis von Organosiliciumverbindungen

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2284214A (en) * 1993-11-30 1995-05-31 Gen Electric Silicone and fluorosilicone heat cured filled rubber compositions
EP1216956A2 (de) * 2000-12-23 2002-06-26 Degussa AG Mit Kalium dotierte pyrogene Oxide

Also Published As

Publication number Publication date
WO2004033544A1 (en) 2004-04-22
US20090176922A1 (en) 2009-07-09
KR100745394B1 (ko) 2007-08-03
DE10242798A1 (de) 2004-04-01
PT1539869E (pt) 2007-06-22
ATE356851T1 (de) 2007-04-15
PL374079A1 (en) 2005-09-19
JP5108204B2 (ja) 2012-12-26
AU2003260428A1 (en) 2004-05-04
US20050215696A1 (en) 2005-09-29
ES2285257T3 (es) 2007-11-16
JP2005538240A (ja) 2005-12-15
EP1539869B1 (de) 2007-03-14
EP1539869A1 (de) 2005-06-15
MXPA05002639A (es) 2005-05-05
DE60312532T2 (de) 2007-11-29
CN1681877A (zh) 2005-10-12
KR20050057327A (ko) 2005-06-16
DE60312532D1 (de) 2007-04-26
CA2498801A1 (en) 2004-04-22
US8337794B2 (en) 2012-12-25
AU2003260428B9 (en) 2007-08-09
UA77113C2 (uk) 2006-10-16
IL167379A (en) 2010-06-30
AU2003260428B2 (en) 2007-03-01
CA2498801C (en) 2010-04-06

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Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
C56 Change in the name or address of the patentee

Owner name: EVONIK DEGUSSA CO., LTD.

Free format text: FORMER NAME: DECOUCHY STOCK COMPANY

CP03 Change of name, title or address

Address after: essen

Patentee after: Evonik Degussa GmbH

Address before: Dusseldorf, Germany

Patentee before: Degussa AG

CP01 Change in the name or title of a patent holder

Address after: Essen, Germany

Patentee after: Evonik Operations Ltd.

Address before: Essen, Germany

Patentee before: EVONIK DEGUSSA GmbH

CP01 Change in the name or title of a patent holder
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20070314

Termination date: 20210819

CF01 Termination of patent right due to non-payment of annual fee