CN1331237C - Active organic light emitting diode display and manufacturing method thereof - Google Patents

Abstract

An active organic LED display and its manufacturing method, the method provides a substrate, wherein the substrate has a display area and a non-display area, and the display area of the substrate has several pixel structures. And forming several transparent wires connected electrically to the pixel structure on the substrate, wherein the transparent wires extend from the display area to the non-display area. And forming a photosensitive colloid around the display region on the substrate, and arranging a packaging cover above the substrate to cover the display region of the substrate, wherein the packaging cover is bonded with the substrate through the photosensitive colloid. Then, an irradiation step is performed from the back side of the substrate to solidify the photosensitive colloid. And finally, forming a driving chip in the non-display area on the substrate, wherein the driving chip is electrically connected with the pixel structure through a transparent conducting wire.

Description

Active organic light emitting diode display and manufacturing method thereof

technical field

The present invention relates to a flat panel display and its manufacturing method, and in particular to an active matrix organic light emitting diode (Active Matrix Organic Light Emitting Diode, AMOLED) display and its manufacturing method.

Background technique

Organic light-emitting diodes are semiconductor elements that can convert electrical energy into light energy and have high conversion efficiency. Common applications are light-emitting elements of indicator lights, display panels, and optical read-write heads, etc. Due to the characteristics of organic light-emitting diodes, such as no viewing angle, simple process, low cost, high response speed, wide temperature range and full color, etc., which meet the requirements of display characteristics in the multimedia era, it has become a research boom in recent years.

An active organic light emitting diode is currently under active development. An organic light emitting layer and a cathode layer are formed on a substrate on which a thin film transistor array is formed to form an active organic light emitting diode. Therefore, active organic light emitting diodes use thin film transistors to drive light emitting diode elements. The manufacturing method of the known active organic light emitting diode display is as follows.

As shown in FIG. 1, it is a schematic top view of a known active organic light emitting diode display; FIG. 2 is a schematic cross-sectional view of FIG. 1 from I-I'.

Please refer to FIG. 1 and FIG. 2 at the same time. The known manufacturing method of an active organic light emitting diode display first provides a substrate 100, wherein the substrate 100 has a display area 120 and a non-display area 122, and the display area 120 of the substrate 100 has been Several pixel structures 107 arranged in an array are formed, wherein each pixel structure 107 includes an active element (thin film transistor) and an anode layer 102 , a light emitting layer 104 and a cathode layer 106 .

Wherein, each pixel structure 107 is controlled by a scan wiring (not shown) and a data wiring (not shown), and the scan wiring and the data wiring at the two edges of the display area 120 will continue to The non-display area 120 is extended to form a plurality of metal wires (fan-outs) 108 extending outwards, which are used to electrically connect with the driving chip subsequently installed in the non-display area 122 .

Afterwards, an ultraviolet colloid 112 is formed around the display area 120 of the substrate 100 , and an encapsulation cover 114 is disposed above the substrate 100 , and the substrate 100 and the encapsulation cover 114 are bonded by the ultraviolet colloid 112 . Next, a UV light irradiation step 116 is performed on the substrate 100 to cure the UV colloid 112 . Finally, a driver chip 110 is installed in the non-display area 122 on the substrate 100 , and the driver chip 110 is electrically connected to the pixel structure 107 through the metal wire 108 .

In a known method, the metal wire 108 used to electrically connect the pixel structure 107 to the driving chip 110 is made of the same metal material as the scan wire and the data wire. Therefore, in the subsequent ultraviolet light irradiation step 116, the ultraviolet light colloid 112 at the place where the metal wire 108 is arranged will be covered by the metal wire 108, so that the ultraviolet light colloid 112 here cannot fully absorb the ultraviolet light, so that here The UV colloid 112 cannot be completely cured. In this way, it will directly have a negative impact on the encapsulation effect, which means that moisture will easily penetrate into the display through the uncured part, and then damage the components inside the display.

Contents of the invention

Therefore, the object of the present invention is to provide an active organic light emitting diode display and its manufacturing method, so as to improve the problem of incomplete packaging in the known methods and structures.

The present invention proposes a method for manufacturing an active organic light emitting diode display. The method first provides a substrate, wherein the substrate has a display area and a non-display area, and several pixel structures arranged in an array have been formed in the display area of the substrate. , and each pixel structure includes an active element (thin film transistor) and an anode layer, a light emitting layer and a cathode layer. Then several transparent wires are formed in the non-display area on the substrate, which are electrically connected with the pixel structure. Wherein, the several transparent wires may be defined simultaneously when forming the anode layer of the pixel structure. In the present invention, the material of the transparent wire is, for example, a transparent conductive material such as indium tin oxide or indium zinc oxide. Then, a photosensitive colloid is coated around the display area of the substrate, and an encapsulation cover is arranged on the substrate, wherein the encapsulation cover covers the display area of the substrate, and the encapsulation cover and the substrate are connected to each other by the photosensitive colloid. glue. Next, a light irradiation step is performed on the substrate to cure the photosensitive colloid. Finally, a driver chip is installed in the non-display area on the substrate, wherein the driver chip and the pixel structure are electrically connected through transparent wires.

The invention provides an active organic light emitting diode display, which includes a substrate, a driving chip, several transparent wires, a packaging cover and a photosensitive colloid. Wherein, the substrate has a display area and a non-display area, and several pixel structures arranged in an array are arranged in the display area of the substrate, and each pixel structure includes an active element (thin film transistor) and an anode layer, an Light emitting layer and a cathode layer. The driving chip is arranged in the non-display area of the substrate. Several transparent wires are arranged on the substrate, wherein the transparent wires extend from the display area to the non-display area, and the transparent wires are electrically connected to the driver chip and the pixel structure, and the material of the transparent wires is, for example, indium tin oxide or indium Transparent conductive materials such as zinc oxide. In addition, the encapsulation cover is disposed above the substrate and covers the display area of the substrate. The photosensitive colloid is arranged around the display area on the substrate to bond the package cover and the substrate.

Since the wire used to electrically connect the pixel structure and the driver chip in the present invention is a transparent wire instead of using a metal wire as in the known method, the active organic light emitting diode display and its manufacturing method of the present invention can avoid the conventional metal wire. The problem that the colloid cannot be fully cured due to the masking.

The active organic light-emitting diode display and its manufacturing method of the present invention can improve the encapsulation effect of the display, so that the components inside the display will not be corroded by external moisture.

Since the present invention can effectively improve the defects of the packaging process of the active organic light emitting diode display, it can improve the overall reliability of the display.

Description of drawings

FIG. 1 is a schematic top view of a known active organic light emitting diode display;

Fig. 2 is the schematic sectional view of Fig. 1 by I-I ';

3 is a schematic top view of an active OLED display according to a preferred embodiment of the present invention; and

Fig. 4 is a schematic cross-sectional view of Fig. 3 from II-II'.

100: Substrate

102: Active components and anode layer

104: Luminous layer

106: cathode layer

107: Pixel structure

108: metal wire

110: Driver chip

112: colloid

114: package cover

116: Ultraviolet light irradiation

120: display area

122: Non-display area

300: transparent wire

Detailed ways

Fig. 3 is a schematic top view of an active organic light emitting diode display according to a preferred embodiment of the present invention; Fig. 4 is a schematic cross-sectional view of Fig. 3 taken from II-II'.

Please refer to FIG. 3 and FIG. 4 at the same time. The manufacturing method of the active organic light emitting diode display of the present invention firstly provides a substrate 100, wherein the substrate 100 has a display area 120 and a non-display area 122, and the display area 120 of the substrate 100 Several pixel structures 107 arranged in an array have been formed, wherein each pixel structure 107 includes an active element (thin film transistor) and an anode layer 102 , a light emitting layer 104 and a cathode layer 106 .

In particular, when forming the anode layer 102 of the pixel structure 107, several transparent wires 300 are defined at the same time, wherein the transparent wires 300 extend from the two edges of the display area 120 to the non-display area 120, forming several directions Extended wires (fan-out). The length of the transparent wire 300 is about 2 cm to 4 cm, which is used to electrically connect with the driver chip installed in the non-display area 122, so that the signal in the driver chip can be transmitted to the pixel structure 107. .

Since the transparent wire 300 and the anode layer are defined at the same time, the material of the transparent wire 300 is the same as that of the anode layer, such as transparent conductive material such as indium tin oxide or indium zinc oxide.

Afterwards, a photosensitive glue 112 is formed around the display area 120 on the substrate 100 , and an encapsulation cover 114 is disposed on the substrate 100 , and the substrate 100 and the encapsulation cover 114 are bonded by the photosensitive glue 112 . Wherein, the packaging cover 114 covers the display area 120 of the substrate 100 to protect the components in the display area 120 from being corroded by external moisture. The material of the package cover 114 is, for example, a metal material or a glass material. In this embodiment, metal material is preferred, because the manufacturing cost of the metal package cover is relatively low, and most of the current techniques use metal materials. package cover. In addition, the photosensitive colloid 112 is, for example, an ultraviolet colloid.

After the package cover 114 and the substrate 100 are bonded, an ultraviolet light irradiation step 116 is performed on the substrate 100 to cure the photosensitive adhesive 112 . At this time, since the transparent wire 300 extending outward from the pixel structure 107 is a light-transmitting material, during the ultraviolet light irradiation step 116, the photosensitive colloid 112 covered by the transparent wire 116 can still fully absorb the ultraviolet light. And fully cured. Therefore, the cured photosensitive adhesive 112 can provide a very good encapsulation effect.

Finally, a driver chip 110 is installed in the non-display area 122 on the substrate 100 , wherein the driver chip 110 is electrically connected to the pixel structure 107 through a transparent wire 108 .

Therefore, the active organic light emitting diode display of the present invention includes a substrate 100 , a driving chip 110 , several transparent wires 300 , a packaging cover 114 and a photosensitive glue 112 .

Wherein, the substrate 100 has a display area 120 and a non-display area 122, and the display area 120 of the substrate 100 is provided with several pixel structures 107 arranged in an array, and each pixel structure 107 includes an active element (thin film transistor) and an anode layer 102 , a light emitting layer 104 and a cathode layer 106 . The driving chip 110 is disposed in the non-display area 122 of the substrate 100 . And several transparent wires 300 are arranged on the substrate 100, wherein the transparent wires 300 extend from the display area 120 to the non-display area 122, and the transparent wires 300 are electrically connected with the driving chip 110 and the pixel structure 107, and the transparent wires 300 The material is, for example, a transparent conductive material such as indium tin oxide or indium zinc oxide.

In addition, the packaging cover 114 is disposed above the substrate 100 and covers the display area 120 of the substrate 100 . The photosensitive glue 112 is disposed around the display area 120 of the substrate 100 for bonding the package cover 114 and the substrate 100 .

It is particularly worth mentioning that the present invention can also define a power line (not shown) in the non-display area 122 of the substrate 100 when forming the transparent wire 300, and the power line is electrically connected to the pixel structure 107. , which is used to transmit the power provided by an external power supply to the pixel structure 107 .

In addition, although the impedance of the transparent wire 300 (such as indium tin oxide or indium zinc oxide material) used to electrically connect the driving chip 110 and the pixel structure 107 in the present invention is higher than that of metal, due to the general driving The chip 110 seldom needs a large current flow, and the length of the transparent wire 300 (the distance from the pixel structure 107 to the driving chip 110) is only about 2 cm to 4 cm, so the impact on signal attenuation is very small, and the use of The above situation can be overcome by increasing the output signal voltage of the driver chip 110 as a compensation.

In summary, the present invention has the following advantages:

1. Since the wire used to electrically connect the pixel structure and the driver chip in the present invention is a transparent wire, rather than using a metal wire as in the known method, the active organic light emitting diode display of the present invention and its manufacturing method can avoid known defects. The problem that the colloid cannot be fully cured due to the shielding of the metal wire.

2. The active organic light emitting diode display and its manufacturing method of the present invention can improve the packaging effect of the display, so that the components inside the display will not be corroded by external moisture.

3. Since the present invention can effectively improve the defects of the packaging process of the active organic light emitting diode display, it can improve the overall reliability of the display.

Claims (11)

1. A method for manufacturing an active organic light emitting diode display, characterized in that the method comprises: A substrate is provided, the substrate has a display area and a non-display area, wherein a plurality of pixel structures have been formed in the display area of the substrate; forming a plurality of transparent wires electrically connected to the pixel structures on the substrate, wherein the transparent wires extend from the display area to the non-display area; an encapsulation cover is arranged above the substrate to cover the display area of the substrate; A photosensitive colloid is formed between the substrate and the package cover, and the photosensitive colloid is correspondingly formed around the display area, which is used to bond the package cover and the substrate; performing a step of illuminating the substrate to cure the photosensitive colloid; and A driving chip is formed in the non-display area on the substrate, wherein the driving chip is electrically connected with the transparent wires. 2 . The method for manufacturing an active organic light emitting diode display according to claim 1 , wherein the material of the transparent wire includes indium tin oxide or indium zinc oxide. 3 . The method for manufacturing an active organic light emitting diode display as claimed in claim 1 , wherein the length of the transparent wires is between 2 cm and 4 cm. 4 . 4. The method of manufacturing an active organic light emitting diode display as claimed in claim 1, wherein the photosensitive colloid comprises a UV colloid. 5. The method of manufacturing an active organic light emitting diode display as claimed in claim 4, wherein the step of illuminating light comprises a step of illuminating ultraviolet light. 6 . The method for manufacturing an active organic light emitting diode display as claimed in claim 1 , wherein the package cover is a metal package cover or a glass package cover. 7. An active organic light emitting diode display, characterized in that the display comprises: A substrate, the substrate has a display area and a non-display area, and a plurality of pixel structures are arranged in the display area of the substrate; a driving chip configured in the non-display area of the substrate; A plurality of transparent wires are arranged on the substrate, wherein the transparent wires extend from the display area to the non-display area, and the transparent wires are electrically connected to the driving chip and the pixel structures; An encapsulation cover is arranged above the substrate and covers the display area of the substrate; and a photosensitive colloid is arranged around the display area to bond the encapsulation cover and the substrate. 8 . The active organic light emitting diode display as claimed in claim 7 , wherein the material of the transparent wire comprises indium tin oxide or indium zinc oxide. 9. The active organic light emitting diode display as claimed in claim 7, wherein the length of the transparent wires is between 2 cm and 4 cm. 10. The active organic light emitting diode display as claimed in claim 7, wherein the photosensitive colloid comprises a UV colloid. 11. The active organic light emitting diode display as claimed in claim 7, wherein the package cover is a metal package cover or a glass package cover.