CN1484302A - High heat dissipation micro package of semiconductor chip - Google Patents

Abstract

A high heat dissipation micro-package of a semiconductor chip comprises a lead frame and a substrate; a concave platform-shaped chip seat is arranged in the center of the lead frame, hollow slotted holes are arranged around the chip seat, and the chip seat is connected to the lead frame only by a plurality of supporting belts; the substrate is adhered below the lead frame, the substrate is provided with a high-density circuit, a plurality of foot pads and solder balls, and a chip is adhered above a chip seat of the lead frame by a bonding agent, the foot pads of the chip and the foot pads of the substrate are connected by gold wires, and the hollowed slotted hole is filled with sealing glue and covers partial surfaces of the gold wires and the lead frame. The invention can effectively increase the pin number and the function of the whole packaging body, and uses the lead frame as the radiating fin to reduce the cost, and can make the whole packaging body small and thin and have high radiating function.

Description

Micro-packages with high heat dissipation for semiconductor chips

【Technical field】

The invention relates to a packaging body of a semiconductor chip, in particular to a micro packaging body of a semiconductor chip with high heat dissipation.

【Background technique】

Generally speaking, in the known three-dimensional packaging technology of semiconductor chips, the common structure shown in Figure 1 is generally used in TEBGA, IIQFP, etc., and its main structural feature is that it is on a substrate 1' with a bonding agent 23' Bonding a chip 2', and bonding the pads 21' of the chip 2' and the substrate 1' with gold wires 22' by wire bonding technology, and covering the chip 2' and its gold wires 22' with a cooling plate 3', The outer periphery of the cooling plate 3' is packaged with a sealing glue 5'. Since this method must add a heat sink 3' outside the chip 2', it cannot achieve the goal of being small and thin.

Another common method is shown in Figure 2, which is generally used in EBGA, TBGA, etc. Its main structural feature is to combine the substrate with the copper plate, and use the copper plate as a heat dissipation source: first, a substrate 1' and a copper plate 4' are attached, and then Open a hole (not shown in the figure) on the substrate 1' so that the chip 2' is placed in the hole and attached to the copper plate 4', and then the foot pad 21' of the chip 2' is connected to the substrate 1' with a gold wire 22' To output chip 2' function. However, in this method, since the chip 2' must be placed below the entire package, the size of the chip and the location of the bonding wire must be considered when designing the solder ball 12' on the surface of the substrate 1', so that the entire package cannot be effectively reduced. volume of.

【Content of invention】

In view of the shortcomings of the above-mentioned conventional combined structure technology, the primary purpose of the present invention is to provide a semiconductor chip micro-package with high heat dissipation, using the lead frame as a heat sink, which can effectively reduce the overall volume, especially the thickness.

The secondary object of the present invention is to provide a micro-package body with high heat dissipation for semiconductor chips, and the cost can be reduced by using the above-mentioned lead frame structure instead of copper plates or heat sinks.

Another object of the present invention is to provide a semiconductor chip micro-package with high heat dissipation, which can make full use of the substrate's ability to produce high-density circuits to produce a high-pin-count package.

The invention provides a high heat dissipation tiny package body of a semiconductor chip, comprising a lead frame and a substrate; it is characterized in that:

The center of the lead frame is provided with a recessed platform-shaped chip seat, and hollowed-out slots are set around the chip seat, and the chip seat is connected to the lead frame with only a few support straps;

The substrate is pasted under the lead frame, and the substrate is provided with high-density circuits and many pads and solder balls.

A chip, the chip is bonded on the chip seat of the lead frame with a bonding agent, and the pads of the chip and the pads of the substrate are connected with gold wires to achieve the purpose of its function output, and the heat generated during the operation of the chip can be The high heat dissipation function is achieved through the conduction of the chip base to other areas of the lead frame through the support tape; then the sealing glue is used to fill the hollow slot and cover the gold wire and part of the surface of the lead frame.

The high heat dissipation micro-package body of the semiconductor chip of the present invention is mainly composed of a lead frame and a substrate, and utilizes the recessed chip seat of the substrate to carry the chip, so as to effectively improve the I/O (Input/O) of the whole package body. Output) pins and their functions, and use the lead frame as a heat sink to reduce costs, and can make the overall volume of the package small and thin while having high heat dissipation function.

The above-mentioned structure is hereby described as follows in conjunction with accompanying drawings and preferred embodiments:

【Description of drawings】

FIG. 1 is a schematic structural view of a conventional semiconductor chip package using a heat sink.

FIG. 2 is a schematic structural diagram of another conventional semiconductor chip package.

FIG. 3 is a schematic structural view of a semiconductor chip package of the present invention.

4 is a schematic cross-sectional view of the structure of the semiconductor chip package of the present invention.

【Detailed ways】

First please refer to Fig. 3 and shown in Fig. 4, the high heat dissipation tiny package body of the semiconductor chip of the present invention comprises:

A lead frame 1, the lead frame 1 produces a platform of a recessed chip holder 11 by an etching process, and hollow hollow slots 13 are set around the chip holder 11, leaving only a few supporting strips 12 connected to the lead frame main body ;

A substrate 3, the substrate 3 can be applied to the production of high-density circuits to meet the requirements of high pin count, the substrate 3 is attached to the bottom of the lead frame 1, and the substrate 3 is provided with high-density circuits and a large number of foot pads 31 and solder balls 32, and make the foot pads 31 in the hollow slot 13 position relative to the lead frame 1, so as to join the gold wire 22;

A chip 2, the chip 2 is positively bonded to the chip holder 11 of the lead frame 1 with the bonding agent 23, and the gold wire 22 is placed on the chip pad 21 and the reserved pad 31 on the substrate 3 by wire bonding technology , in order to achieve the purpose of its functional output, and the heat generated by the chip 2 during operation can be dissipated by the chip holder 11 through the support belt 12 to other areas of the lead frame 1 to achieve high heat dissipation;

After the lead frame 1 is bonded to the substrate 3 according to the above structure, the chip 2 is bonded to the chip holder 11 of the lead frame 1, and the chip pad 21 and the pad 31 of the substrate 3 and the tin implanted on the surface are bonded by wire bonding technology. The balls 32 are connected with gold wires 22 , and finally the hollow slots 13 are filled with sealant 4 to cover the gold wires 22 and part of the surface area of the lead frame 1 .

To sum up, the present invention integrates the lead frame and the substrate with micro-packaging technology, so that the overall package can achieve an ultra-thin shape without using a copper plate or a heat sink, and at the same time can meet the demand for a high number of pins; The heat can be conducted out through the lead frame to achieve high heat dissipation effect.

Claims (1)

1, a kind of height of semiconductor chip small packaging body that dispels the heat comprises a lead frame and a substrate; It is characterized in that:

These lead frame central authorities are provided with recessed mesa-shaped chip carrier, are made as the hollow-out slot bore of hollow out around this chip carrier, only with several pieces support belts chip carrier are connected to lead frame;

This baseplate-laminating is in this lead frame below, and this substrate is provided with high-density line and most foot pad and tin ball;

One chip, this chip is engaged in the chip carrier top of lead frame with cement, and with the foot pad of gold thread connection chip and the foot pad of this substrate, fills in this hollow-out slot bore and coat gold thread and the part surface of lead frame with sealing.

Images