CN1551276A - Chip fuse box - Google Patents
Chip fuse box Download PDFInfo
- Publication number
- CN1551276A CN1551276A CNA2004100329693A CN200410032969A CN1551276A CN 1551276 A CN1551276 A CN 1551276A CN A2004100329693 A CNA2004100329693 A CN A2004100329693A CN 200410032969 A CN200410032969 A CN 200410032969A CN 1551276 A CN1551276 A CN 1551276A
- Authority
- CN
- China
- Prior art keywords
- fuse
- adhesive layer
- film
- notch
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000012790 adhesive layer Substances 0.000 claims abstract description 37
- 239000000758 substrate Substances 0.000 claims abstract description 33
- 238000004519 manufacturing process Methods 0.000 claims abstract description 15
- 229910052751 metal Inorganic materials 0.000 claims description 20
- 239000002184 metal Substances 0.000 claims description 20
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 18
- 229920002050 silicone resin Polymers 0.000 claims description 13
- 239000011241 protective layer Substances 0.000 claims description 12
- 239000011248 coating agent Substances 0.000 claims description 10
- 238000000576 coating method Methods 0.000 claims description 10
- 239000011810 insulating material Substances 0.000 claims description 9
- 239000000945 filler Substances 0.000 claims description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 6
- RMAQACBXLXPBSY-UHFFFAOYSA-N silicic acid Chemical compound O[Si](O)(O)O RMAQACBXLXPBSY-UHFFFAOYSA-N 0.000 claims description 4
- 235000012239 silicon dioxide Nutrition 0.000 claims description 4
- 239000011889 copper foil Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 abstract description 19
- 239000011347 resin Substances 0.000 abstract description 19
- 239000010410 layer Substances 0.000 abstract description 8
- 239000003822 epoxy resin Substances 0.000 abstract 1
- 229920000647 polyepoxide Polymers 0.000 abstract 1
- 229920001296 polysiloxane Polymers 0.000 abstract 1
- 229920001721 polyimide Polymers 0.000 description 7
- 239000009719 polyimide resin Substances 0.000 description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 238000009825 accumulation Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 239000010949 copper Substances 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 230000033228 biological regulation Effects 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 238000010422 painting Methods 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 206010007247 Carbuncle Diseases 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000005030 aluminium foil Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000005764 inhibitory process Effects 0.000 description 1
- 239000000075 oxide glass Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
Images
Landscapes
- Fuses (AREA)
Abstract
To provide a chip fuse in which a manufacturing cost is reduced because the manufacturing is easy and necessary mechanical strength and blow-out precision can be secured in spite the size of the product is formed thin. In the chip fuse in which the fuse film is installed on an insulating substrate via an adhesive layer, a notch part 11a is formed in a part of the adhesive layer 11 where the blown-out part 14b of the fuse film 14 is overlapped, and this notch part is larger than the blown-out part of the fuse film. Furthermore, a silicone based resin 13 is filled into the notch part of the adhesive layer, and an epoxy resin is used for a protecting layer 15 covering the fuse film. (C)2005,JPO&NCIPI.
Description
Technical field
The present invention relates to chip fuse.
Background technology
Used chip fuse in the surface-assembled for example, utilizes the metallic film of the electrically conductive film that forms by thick film screen printing and the metal film that forms by electroless plating, sputter etc. to be formed at as fuse element on the insulated substrate such as ceramic substrate.
Above-mentioned fuse conductor film, good aspect quick-break and degree easy to manufacture, but then,, the situation that can not obtain desired anti-pulse performance is arranged also as the protection component of phase inverter.Therefore, require to be inserted into two performances that chip fuse in the phase inverter satisfies quick-break and anti-pulse performance as protection component.
From above viewpoint; the spy opens the 2001-52593 communique and has disclosed fuse element is formed at technology on the polyimide resin layer; this chip fuse; on insulated substrate, form polyimide resin layer; fuse figure in accordance with regulations forms the 1st metal film in the above; the 2nd metal film that is made of low-melting-point metal by stacked formation such as coating processing on the 1st metal film constitutes fuse element with these the 1st and the 2nd metal films, covers fuse element with the insulating properties protective layer.
The said chip fuse has following shortcoming: manufacturing process complexity, size are also thicker, in addition, though the employed polyimide resin excellent heat resistance of said chip fuse, the material price height, thermal diffusivity is low.And, also exist such problem, promptly be formed on the polyimide resin layer owing to above-mentioned fuse element is stacked, so the heat that produces when fuse element is switched on can not be to heat radiations such as insulated substrates, by the polyimide resin layer accumulation of heat, therefore, the surface temperature of chip fuse excessively rises, or makes insulating properties after the fusing unstable and produce fluctuation.
In addition, open in the described chip fuse of flat 11-96886 communique the spy, substantial middle position on insulated substrate is with the low resin-shaped film forming of thermal conductivity, substantial middle on this film forms fuse element, be configured to two ends above insulated substrate with the integrally formed lead upper part of fuse element, these fuse elements and lead upper part cover with the silicone resin molding.
In the said chip fuse, because the substantial middle on insulated substrate forms the low resin molding of thermal conductivity, and forms fuse element thereon, so the fuse element injustice exists the shortcoming that can not obtain uniform fuse film.In addition, cover the bad mechanical strength of the silicone resin molding of fuse element upper surface, the shortcoming that the effect of the caused external carbuncles such as absorption when existing because of assembling sustains damage fuse blows portion easily.
Summary of the invention
Problem of the present invention provides a kind of chip fuse, and this chip fuse so can reduce manufacturing cost, though product size forms thinlyyer, also can be guaranteed necessary mechanical strength, quick-break and anti-pulse feature etc. owing to make easily.
In order to solve above-mentioned problem; the invention provides a kind of chip fuse; on insulated substrate, be formed with adhesive layer; on this adhesive layer, be formed with the fuse film that constitutes by fuse key element portion and table electrode part, on this fuse film, be provided with protective layer, in this chip fuse; this adhesive layer has notch in substantial middle portion; be filled with insulating material in this notch, this fuse film is made of metal forming, and this fuse key element portion is configured on this insulating material.
Owing to constitute chip fuse as described above, thereby, fuse key element portion is not configured in poor heat resistance, carries out on the adhesive layer of excessive accumulation of heat, therefore, even the refractory layer of polyimide resin between omission fuse film and the insulated substrate and so on, also can be anti-during energising and the heating during fusing, and owing to have the fuse key element portion that constitutes by metal forming, so can make the good chip fuse of anti-pulse feature.
In the said chip fuse, preferably silicone resin or epoxylite are filled in the notch of above-mentioned adhesive layer, by filling these materials, the fuse key element portion of fuse film is surrounded by resin, has effect that produces arc light when preventing to fuse and the effect that improves the quick-break of fusing.In addition, utilize the resin in the notch that is filled in adhesive layer, can obtain suitable heat radiation and accumulation of heat, and obtain good operating chacteristics.And because resin is filled in the notch of adhesive layer, it is smooth that notch becomes, and the fuse film of being pasted also becomes smooth, so operating chacteristics is stable, also can make the chip fuse slimming.
In addition, more satisfactory is silicone resin or epoxylite to be filled in the notch of above-mentioned adhesive layer, and to form the protective layer that covers the fuse film with the higher epoxylite of mechanical strength.Utilize the silicone resin or the epoxylite of filling above-mentioned notch; arc eliminator in the time of can guaranteeing to fuse and suitable thermal diffusivity; on the other hand; utilize the epoxylite of mechanical strength; can guarantee the flatness of mechanical strength and outside, so can obtain in assembling procedure, to prevent that fuse key element portion is damaged and improve the advantage of carrying efficient.
And; by protective layer being set as the stepped construction of undercoating and external coating; wherein undercoating forms by containing the epoxylite of silicic acid as filler at least; external coating forms by containing the epoxylite of aluminium oxide as filler at least; like this; can absorb the thermal expansion in when fusing and when cutting off to the pressure of outside, and can guarantee the mechanical strength and the flatness of outer surface.
Description of drawings
Fig. 1 is the cutaway view of chip fuse of the present invention.
Fig. 2 (a)～Fig. 2 (g) is the stereogram of explanation chip fuse of the present invention manufacturing process.
Embodiment
Below, with reference to accompanying drawing, suitable form of implementation of the present invention is illustrated.
Fig. 1 is the cutaway view of chip fuse of the present invention.
Chip fuse 10; on insulated substrate 12, be provided with electrode part 14a, the 14c of fuse film by adhesive layer 11; adhesive layer 11, with the fuse key element 14b of the portion superposed part of fuse film on be formed with notch 11a; be filled with the thermal endurance with regulation and the resin 13 of flexibility in this notch 11a, the electrode part 14a of fuse film, 14c and the fuse key element 14b of portion protected seam 15 are covered with.In addition, on the back side of insulated substrate 12, be formed with backplate 17, the mode of switching on electrode part 14a, 14c with this backplate 17 and fuse film is formed with end electrode 16, and, on each exposed division of end electrode 16 and backplate 17 and electrode part 14a, 14c, be formed with plated film 18.
At this, above-mentioned insulated substrate 12 uses aluminium oxide ceramic substrate, but as long as insulating properties and thermal endurance are good, also can use glass substrate and resin substrate.
In addition,, preferably use the epoxylite sheet, in addition, also can use acrylic resin sheet, silicone resin sheet as above-mentioned adhesive layer 11.It is big that the shape of the notch 11a of adhesive layer 11 cans be compared to the fuse key element 14b of portion most, mainly is set as circular port, except that circular port, can form rectangular opening, polygonal holes and slit-shaped.
Be filled in the resin 13 among the above-mentioned notch 11a, use flame retardancy, good silicone resin or the epoxylite with suitable thermal conductivity of thermal endurance, being filled to adhesive layer 11 becomes the general planar shape.When filling the silicone resin in notch 11a, because this resin is except above-mentioned characteristic, the extinguishing arc height is so can be applied to the rated value that for example reaches 5A or the rated value more than the 5A.In the time of in notch 11a, filling epoxylite,, can be applied to rated value for example and reach rated value about 3A according to above-mentioned characteristic.
Above-mentioned fuse film carries out this metal forming etching and forms needed figure by having guaranteed that the metal forming with corresponding to material of required operating chacteristics and thickness makes, and like this, forms electrode part 14a, 14c and the fuse key element 14b of portion of fuse film.This metal forming also can be used the Copper Foil for example selected and alloy of aluminium foil or copper and other metal etc. from thickness 5～35 μ m.In addition, when using Copper Foil,, on the fuse key element 14b of portion, form the tin film in order to obtain good fuse as the fuse film, and, in order to prevent the diffusion of copper and tin, also can before forming the tin film, form the nickel film, adjust molten disconnected characteristic with this.
Above-mentioned protective layer 15 is laminated to undercoating 15a with external coating 15b and goes up and form; undercoating 15a by flame resistance, thermal endurance and thermal conductivity good, contain silicic acid at least and form as the epoxylite of filler, external coating 15b by mechanical strength and thermal endurance good, contain aluminium oxide at least and form as the epoxylite of filler.This undercoating 15a is actually that mode except the notch 11a of the fuse key element 14b of portion of electrode part 14a, the 14c of fuse film and adhesive layer 11 is provided with to cover.
Backplate 17 can be used electroconductive resin etc., when before forming the fuse film, being formed on the insulated substrate 12, metal glaze class paste or metallorganic paste etc. can be used, when after forming the fuse film, being formed on the insulated substrate 12, electroconductive resin paste etc. can be used.In addition, the metal film that end electrode forms by the electroconductive resin paste or by sputter etc. forms, and plated film 18 can form by zinc-plated and nickel plating, so by and use copper facing, reduce the effect of electrode resistance value in addition.
Below, the manufacture method of chip fuse is described.
Fig. 2 (a)～Fig. 2 (g) is the stereogram of representing with a chip unit for the manufacturing process that chip fuse of the present invention is described.These manufacturing processes are actually to be illustrated in cuts apart the operation of launching as on a slice insulated substrate before several chips, but for easy understanding, illustrates with a chip unit.
At first, shown in Fig. 2 (b), bonding sheet 11 usefulness lamination modes are pasted and form adhesive layer.Insulated substrate 12 uses assembly substrate, and this assembly substrate is divided into predetermined aluminium oxide ceramics, glass or the resin etc. of each chip and makes by cutting into a plurality of unit areas.Bonding sheet 11 uses such sheet, promptly, have a plurality of unit areas area by epoxylite, on the sheet that constitutes such as acrylic resin or silicone resin, on the part of the fusing portion of the fuse element that is equivalent to each unit area part, form the notch 11a as Fig. 2 (a).The notch 11a of bonding sheet 11 though be that the bonding sheet 11 that will be pre-formed notch 11a sticks on the insulated substrate 12, also can form notch 11a on bonding sheet 11 after sticking on bonding sheet 11 on the insulated substrate 12.
After bonding sheet 11 sticks on the insulated substrate 12,, silicone resin or the epoxylite of Fig. 2 (c) is filled among the notch 11a by screen painting or cast encapsulation.
Then, will stick on the adhesive layer 11 with the lamination mode by the metal forming that copper or aluminium etc. is made, as Fig. 2 (d) that the fuse film is temporary fixed, carry out thermo-compressed thereafter and form.For making the fuse film consistent with desirable operating chacteristics, form figure by etching, shown in Fig. 2 (e), form electrode part 14a, 14c and the fuse key element 14b of portion, at this moment the 14b of fuse key element portion is formed in the scope of notch 11a of adhesive layer 11.As mentioned above, on the fuse key element 14b of portion, can suitably carry out zinc-plated or nickel plating and zinc-plated.
And then, behind electrode part 14a, the 14c and the fuse key element 14b of portion that form the fuse film, form and cover the protective layer 15 fuse key element 14b of portion, that constitute by undercoating 15a and external coating 15b fully.Promptly; shown in Fig. 2 (f); at first on the fuse key element 14b of portion; with flame resistance, thermal endurance and thermal conductivity good, contain silicic acid at least and carry out screen painting and form undercoating 15a as the epoxylite of filler, then, shown in Fig. 2 (g); on this undercoating 15a; with mechanical strength and thermal endurance good, contain aluminium oxide at least and carry out screen painting as the epoxylite of filler, thereby form external coating 15b, form protective layer 15 by such two layers.
After forming protective layer 15, form backplate 17 at the back side of insulated substrate 12.Backplate 17 as mentioned above, can form by the printed vulcanized of electroconductive resin, and, when before forming the fuse film, on insulated substrate 12, forming backplate 17, also can bake to wait and form by the printing of metal glaze class paste or metallorganic paste.Then, once cut apart the back and form end electrode 16, and then carry out secondary splitting, on each exposed division of end electrode 16 and backplate 17 and electrode part 14a, 14c, form plated film 18, just finished chip fuse 10.
In the present invention, because not in poor heat resistance, carry out configuration fuse key element portion on the adhesive layer of excessive accumulation of heat, and dispose fuse key element portion in the mode that overlaps on the notch of adhesive layer, therefore, even for example omit refractory layer such as polyimide resin, also can produce can be anti-during energising and the chip fuse of the heating during fusing, because simplified manufacturing process, manufacturing cost can be reduced,, the chip fuse of all size, various rated values can be provided because of good production efficiency.In addition, because the fuse film is formed by metal forming, so as long as adjust the thickness of metal forming aptly according to desirable operating chacteristics, can easily form operating chacteristics and reach in a big way fuse film, and, owing to form the uniform fuse film of thickness easily, so can obtain the good operating chacteristics of precision.
Also have, the fuse film is bonded on the insulated substrate by the adhesive layer of epoxylite sheet, thus can easily on insulated substrate, constitute the fuse film, owing to can not need to carry out high-temperature operation, so can simplify working process.
In the present invention, owing to will have the thermal endurance of regulation and the resin of flexibility is filled in the notch of adhesive layer,, the effect that produces arc light when preventing to fuse is arranged and improve the quick-break effect that fuses so fuse key element portion is surrounded by resin.In addition, accumulation of heat and thermal diffusivity owing to the formed appropriateness of resin in the notch that is filled in adhesive layer can prevent excessive accumulation of heat or heat radiation, and obtain good operating chacteristics.In addition, because resin is filled in the notch of adhesive layer,, and become smooth, can flatly paste the fuse film, can make that operating chacteristics is stablized, the chip fuse slimming so notch is not concaveconvex shape.In addition, form under the situation of the notch that utilizes the material encirclement adhesive layer that constitutes adhesive layer, when thermo-compressed fuse film, the resin that can prevent to be filled in the notch is discharged to the substrate outside.
In the present invention, utilize silicone resin or epoxylite in the notch that is filled into adhesive layer, the arc eliminator when having guaranteed fusing.Particularly utilize the silicone resin, the arc eliminator when having guaranteed the fusing of high rating electrical fuse.
In addition, in the present invention, also by cover fuse key element portion, thermal endurance and thermal endurance and the good epoxylite of thermal conductivity form undercoating, epoxylite by mechanical strength and excellent heat resistance forms external coating, they is formed laminated construction, like this, pressure when thermal expansion when absorbing fusing and cut-out to the outside, simultaneously, have good thermal diffusivity, can guarantee the mechanical strength and the flatness of outer surface.Undercoating is actually that mode except the notch of the fuse key element portion of table electrode part and adhesive layer is provided with to cover; so in the seal of guaranteeing the adaptation of protective layer, fuse key element portion; also inhibition is passed undercoating and is too dispelled the heat to electrode part, and obtains suitable operating chacteristics.
Claims (6)
1. chip fuse; on insulated substrate, be formed with adhesive layer; on this adhesive layer, be formed with the fuse film that constitutes by fuse key element portion and table electrode part; in this fuse key element portion, be provided with protective layer; it is characterized in that this adhesive layer has notch in substantial middle portion, in this notch, filling insulating material; this fuse film is formed by metal forming, and this fuse key element portion is configured on this insulating material.
2. chip fuse according to claim 1 is characterized in that, above-mentioned insulating material is silicone resin or epoxylite.
3. chip fuse according to claim 1 and 2 is characterized in that above-mentioned metal forming is a Copper Foil.
4. chip fuse according to claim 1 and 2; it is characterized in that; above-mentioned protective layer is the protective layer that is provided with external coating on undercoating; this undercoating forms by containing the epoxylite of silicic acid as filler at least, and this external coating forms by containing the epoxylite of aluminium oxide as filler at least.
5. chip fuse according to claim 4 is characterized in that, above-mentioned undercoating is actually that mode except the insulating material in this fuse key element portion of this table electrode part and the notch that is filled in this adhesive layer is provided with to cover.
6. the manufacture method of a chip fuse, it is the manufacture method that on insulated substrate, is provided with the chip fuse of fuse film by adhesive layer, it is characterized in that this manufacture method comprises following operation: the sheet adhesive layer that will be formed with notch sticks on the operation on the insulated substrate; With the operation of filling insulating material in this notch; The fuse film is sticked on operation on this sheet adhesive layer and this insulating material; The fuse film is formed figure to form the operation of fuse key element portion on this insulating material.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP108942/2003 | 2003-04-14 | ||
| JP108942/03 | 2003-04-14 | ||
| JP2003108942A JP4112417B2 (en) | 2003-04-14 | 2003-04-14 | Chip fuse and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1551276A true CN1551276A (en) | 2004-12-01 |
| CN100530485C CN100530485C (en) | 2009-08-19 |
Family
ID=33470258
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2004100329693A Expired - Lifetime CN100530485C (en) | 2003-04-14 | 2004-04-14 | Chip fuse box |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP4112417B2 (en) |
| CN (1) | CN100530485C (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100517545C (en) * | 2005-07-14 | 2009-07-22 | 科伦电器股份有限公司 | Method for manufacturing surface-mounted fuse |
| CN101527236B (en) * | 2008-03-03 | 2011-07-27 | 邱鸿智 | Compression mode fuse structure and manufacturing method thereof |
| WO2012051942A1 (en) * | 2010-10-22 | 2012-04-26 | 广东风华高新科技股份有限公司 | Thin film chip fuse and preparation method thereof |
| CN101542670B (en) * | 2007-08-08 | 2012-06-20 | 釜屋电机株式会社 | Chip fuse and its manufacturing method |
| TWI391974B (en) * | 2008-02-18 | 2013-04-01 | Kamaya Electric Co Ltd | Chip type fuse and manufacturing method thereof |
| CN104347312A (en) * | 2013-07-29 | 2015-02-11 | 泰科电子日本合同会社 | Protective element |
| CN104576254A (en) * | 2013-10-11 | 2015-04-29 | 保险丝公司 | Barrier layer for electrical fuses utilizing the Metcalf effect |
| CN112701931A (en) * | 2019-10-23 | 2021-04-23 | 三菱电机株式会社 | Power conversion device and power conversion device integrated rotating electric machine |
| WO2021195871A1 (en) * | 2020-03-30 | 2021-10-07 | 华为技术有限公司 | Embedded substrate, circuit board assembly, and electronic device |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4632358B2 (en) * | 2005-06-08 | 2011-02-16 | 三菱マテリアル株式会社 | Chip type fuse |
| JP5287154B2 (en) * | 2007-11-08 | 2013-09-11 | パナソニック株式会社 | Circuit protection element and manufacturing method thereof |
| JP6135895B2 (en) * | 2012-03-19 | 2017-05-31 | パナソニックＩｐマネジメント株式会社 | Circuit protection element |
-
2003
- 2003-04-14 JP JP2003108942A patent/JP4112417B2/en not_active Expired - Lifetime
-
2004
- 2004-04-14 CN CNB2004100329693A patent/CN100530485C/en not_active Expired - Lifetime
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100517545C (en) * | 2005-07-14 | 2009-07-22 | 科伦电器股份有限公司 | Method for manufacturing surface-mounted fuse |
| CN101542670B (en) * | 2007-08-08 | 2012-06-20 | 釜屋电机株式会社 | Chip fuse and its manufacturing method |
| TWI391974B (en) * | 2008-02-18 | 2013-04-01 | Kamaya Electric Co Ltd | Chip type fuse and manufacturing method thereof |
| CN101527236B (en) * | 2008-03-03 | 2011-07-27 | 邱鸿智 | Compression mode fuse structure and manufacturing method thereof |
| WO2012051942A1 (en) * | 2010-10-22 | 2012-04-26 | 广东风华高新科技股份有限公司 | Thin film chip fuse and preparation method thereof |
| CN104347312A (en) * | 2013-07-29 | 2015-02-11 | 泰科电子日本合同会社 | Protective element |
| CN104576254A (en) * | 2013-10-11 | 2015-04-29 | 保险丝公司 | Barrier layer for electrical fuses utilizing the Metcalf effect |
| CN112701931A (en) * | 2019-10-23 | 2021-04-23 | 三菱电机株式会社 | Power conversion device and power conversion device integrated rotating electric machine |
| WO2021195871A1 (en) * | 2020-03-30 | 2021-10-07 | 华为技术有限公司 | Embedded substrate, circuit board assembly, and electronic device |
| US12224146B2 (en) | 2020-03-30 | 2025-02-11 | Huawei Technologies Co., Ltd. | Embedded substrate, circuit board assembly, and electronic device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP4112417B2 (en) | 2008-07-02 |
| JP2004319168A (en) | 2004-11-11 |
| CN100530485C (en) | 2009-08-19 |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP02 | Change in the address of a patent holder |
Address after: The Japanese are deep in the city of Kanagawa County Ling 8 chome 4 No. 17 Patentee after: KAMAYA ELECTRIC Co.,Ltd. Address before: Kawasaki, Kanagawa, Japan Patentee before: KAMAYA ELECTRIC Co.,Ltd. |
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| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20090819 |