CN1574466A - Electric connection structure, connector and electric connecting system - Google Patents

Abstract

The present invention relates to an electrical connection system which electrically connects the inside and outside of a vacuum chamber with narrow pitch wiring. The system comprises: an insulating first substrate covering a hole of a separator and having through holes filled with conductive material; conductive spacers distributed on the inside and outside surfaces of the chamber and connected to the material connection; the first connector, each of the first connecting device second substrate, a conductive layer is formed on one surface, the internal wiring of the chamber is soldered to an end of the conductive layer, the spring contact, It is soldered to the other end of the conductive layer and its end is pressed against the conductive pads distributed on the inner surface of the chamber, and a second connector having a connection with the first connectors. The same structure and located on the outside of the chamber.

Description

Electrical connection structure, connector and electrical connection system

technical field

The present invention relates to an electrical connection structure, a connector and an electrical connection system; the electrical connection structure electrically connects the outside and the inside of a chamber, the chamber is separated by a partition and the internal pressure of the chamber is regulated; the The connector is compatible with the electrical connection structure; the electrical connection system is composed of the electrical connection structure and the connector.

Background technique

Normally, a vacuum chamber or the like capable of reducing the internal pressure thereof to a near vacuum is used in the manufacturing process of a semiconductor chip containing an integrated circuit or the like; it is recommended to use a device that electrically connects the inner and outer parts of the vacuum chamber or the like structure.

For example, Patent Document 1 discloses a pressure and airtight terminal in which a via hole is provided on a support made of a certain composite material, and a hermetic seal is provided between the via hole and a lead wire passing through the via hole. between.

Also, Patent Document 2 discloses a connection terminal in which a hole is provided in a ceramic substrate and a copper thin film is provided between the hole and a wire passing through the hole.

[Patent Document 1]

Japanese Patent Publication No.60-100384

[Patent Document 2]

Japanese Patent Publication No.2000-299149

However, according to the technique disclosed in Patent Document 1, since two hermetic sealing layers and supports are provided between adjacent leads, it is difficult to arrange the leads in high density (with a small pitch). According to the technique disclosed in Patent Document 2, since the copper thin film is thinner than the hermetic seal, it is possible to reduce the pitch of the leads to some extent. However, it is difficult to further reduce the pitch because of the predetermined diameter of the lead wire and the presence of a copper plate layer in contact with the lead wire and the copper thin film.

In recent years, various types of complex controllers have been used in vacuum chambers such as those described above, and more and more wires have been used to connect the inner and outer parts of these chambers. Therefore, it is a challenge to install wiring inside and outside these cavities with a small pitch.

In view of the above, the purpose of the present invention is to provide; an electrical connection structure, which can electrically connect the inner and outer parts of the chamber with a smaller pitch than conventional techniques; a connector, which is compatible with the electrical connection structure; And an electrical connection system, the system is composed of the electrical connection structure and the connector.

Contents of the invention

To achieve the above object, the present invention provides an electrical connection structure, which electrically connects the outside and the inside of a chamber, which is separated by a partition and whose internal pressure is regulated, the electrical connection structure has: to cover the partition An insulating substrate of a hole of the plate, wherein the insulating substrate has a through hole communicating with the inner side surface and the outer side surface of the chamber and filled with conductive material; and conductive pads, each conductive pad is distributed in the chamber A corresponding outer surface and an inner surface are connected with the conductive material.

The first electrical connection structure of the present invention has the hole of the chamber covered with the insulating substrate, thus enabling the chamber to be kept highly airtight. The insulating substrate is mainly composed of via holes filled with a conductive material corresponding to the leads or wires described in Patent Documents 1 and 2. Conventional techniques, however, require a hermetic seal or copper film around the leads or wires. The present invention only requires the conductive material in the vias and does not require any hermetic seals or copper films. Therefore, the present invention can realize high-density electrical connections.

Also, in order to achieve the above object, the present invention provides an electrical connector having: an insulating substrate having a conductive layer formed on one surface; wires soldered to one end of the conductive layer and spring contacts welded to the other end of the conductive layer and having resilient joints at their ends.

The electrical connector of the present invention is suitable for the electrical connection structure of the present invention. When the elastic contacts of the electrical connector are held in press contact with the conductive pads on the surface of the insulating substrate in the electrical connection structure, electrical operation can be more reliably achieved. Also, the connector of the present invention uses field-tested materials commonly used for wiring, including: the insulating substrate; the conductive layer, wires, and elastic joints made of metal such as copper; and solder for welding. When applied in a chamber such as a vacuum chamber they give little outgassing and do not adversely affect equipment and the like exposed in the chamber. The connector is also suitable for the electrical connection in this respect.

Also, to achieve the above objects, the present invention provides an electrical connection system which electrically connects internal wiring and external wiring of a chamber which is partitioned by a partition and whose internal pressure is regulated. The electrical connection system has: an insulating first substrate covering a hole of the partition and having a through-hole communicating the inner surface and the outer surface of the chamber and filled with a conductive material; and conductive spacers, each A conductive gasket is distributed on one of the corresponding inner surface and outer surface of the chamber and is connected with the conductive material; each first connector has a second substrate, and one of the second substrates A conductive layer is formed on the surface, the internal wiring of the chamber is soldered to one end of the conductive layer, and a spring contact is soldered to the other end of the conductive layer and the end of the contact is pressed against the conductive layer. Pads, the conductive pads are distributed on the inside surface of the chamber; and second connectors, each second connector has a third substrate, a conductive layer is formed on one surface of the third substrate, and the chamber External wiring is soldered to one end of the conductive layer, and a spring contact is soldered to the other end of the conductive layer and the end of the contact is pressed against the conductive pad distributed on the on the outer surface of the chamber.

In addition, in order to achieve the above object, the present invention provides an electrical connection structure, which electrically connects the outside and the inside of a chamber separated by a partition and whose internal pressure is regulated, the electrical connection structure has : an insulating substrate, which covers a hole of the separator, wherein the insulating substrate has: a through hole communicating with the outer surface and the inner surface of the chamber and filled with a conductive material; a conductive pad, each conductive pads disposed on one of the respective inner and outer surfaces of the chamber and connected to the conductive material; and contacts disposed on the outer and inner surfaces of the chamber and soldered to adjacent conductive pads pieces to form contact pairs, each contact pair configured to compress a board.

Due to the above-mentioned electrical connection structure, this electrical connection structure can keep the chamber highly airtight. Also, this electrical connection structure can form denser wiring than the above-mentioned electrical connection structure due to the provision of paired contacts pressing the board (the insulating substrate of the connector described below).

Also, the present invention provides a connector compatible with the electrical connection structure, the connector having; an insulating substrate having conductive layers on both surfaces; and wires soldered to the conductive layers.

Since this connector has a conductive layer on each surface of the insulating substrate and conductors are soldered to the conductive layer, it can perform higher density wiring than the above-mentioned connector.

In addition, the present invention provides an electrical connection system which electrically connects internal wiring and external wiring of a chamber which is separated by a partition and whose internal pressure is regulated, the electrical connection system having: a An insulating first substrate, which covers a hole on the partition and has a through hole communicating with the inner side surface and the outer side surface of the chamber and filled with a conductive material; conductive pads, each conductive pad is distributed on the One of the corresponding inner surface and outer surface of the chamber and connected with the conductive material; each contact piece is provided on the inner surface and the outer surface of the chamber and is welded to the adjacent conductive pad to form each Contact pairs, each contact pair is configured to press a board; first connectors, each first connector has a second substrate, each surface of the second substrate has a conductive layer, and the the internal wiring of the chamber is connected to the conductive layers on both surfaces, where the conductive layers are pressed by and connected to the contacts on the inner surface of the chamber; and second connectors, each The second connector has a third substrate having a conductive layer on both surfaces to which the external wiring of the chamber is soldered, where the conductive layer is The contacts on the outside surface of the chamber are compressed and connected to the respective contacts. This electrical connection system enables higher density wiring than the electrical connection system described above.

As described above, the present invention can keep the chamber highly airtight and can realize high-density circuit wiring.

Description of drawings

1 is a front view showing an extremely high vacuum bulkhead connector provided with an example of an electrical connection structure according to the present invention;

Fig. 2 is a cross-sectional view of the extremely high vacuum bulkhead connector taken along line A-A in Fig. 1;

Fig. 3 is a sectional view of the very high vacuum bulkhead connector taken along the line B-B in Fig. 1;

Figure 4 is a top view showing a ceramic substrate of the very high vacuum bulkhead connector;

Figure 5 is a top view of a board connector to be connected to the very high vacuum bulkhead connector;

Fig. 6 is a schematic view showing the board connector seen from the direction of arrow C in Fig. 5;

Figure 7 is a sectional view of the board connector taken along the line D-D in Figure 5;

Figure 8 is a schematic diagram showing the connection between the ceramic substrate of the very high vacuum bulkhead connector and the board connector;

9 is a plan view showing a ceramic substrate of an extremely high vacuum bulkhead connector equipped with an electrical connection structure according to a second embodiment of the present invention; and

FIG. 10 is a schematic view showing the connection structure between the ceramic substrate of FIG. 9 and the board connector according to the second embodiment of the present invention.

Detailed ways

Various embodiments of the present invention will be described below.

Fig. 1 is a front view showing an extremely high vacuum barrier connector provided with an example of an electrical connection structure according to the present invention, and Fig. 2 is a view of the very high vacuum barrier taken along line A-A in Fig. 1 A sectional view of the panel connector, and Fig. 3 is a sectional view of the extremely high vacuum bulkhead connector taken along line B-B in Fig. 1 .

As shown in FIG. 3 , the very high vacuum bulkhead connector 10 is mainly composed of a flange 11 , an adapter 12 and a ceramic substrate 13 . As shown in FIG. 2 , the very high vacuum bulkhead connector 10 is placed outside the vacuum chamber so as to close a hole 101 of a bulkhead 100 . The very high vacuum bulkhead connector 10 is connected to the bulkhead 100 of the vacuum chamber using 4 bolt holes 111 on the flange 11 so that the bulkhead 100 is firmly held in contact with a sealing area which is In Fig. 1, it is represented by a shaded portion, whereby the vacuum chamber is kept airtight.

The adapter 12 has two through holes 121 , and a power rod 122 passes through each through hole 121 . The gap between the power bar 122 and the through hole 121 is filled with a glass hermetic seal 123 . The power bar 122 is connected to a power connector (not shown) from the inside and outside of the vacuum chamber to supply power from the outside to the inside of the vacuum chamber. The adapter 12 is airtightly welded to the flange 11 .

The ceramic substrate 13 has a soldering region 131 on its periphery and an electrical connection region 132 inside. The adapter 12 has a through hole 124 (see FIG. 3 ) in its center which is large enough to expose the electrical connection area 132 of the ceramic substrate 13 . The brazing region 131 of the ceramic substrate 13 is hermetically brazed to the periphery of the through hole 124 with a gold-tin brazing alloy.

FIG. 4 is a top view showing the ceramic substrate 13 of the very high vacuum bulkhead connector 10 shown in FIGS. 1-3. For simplicity of explanation, no distinction is made between the soldering area 131 and the electrical connection area 132 shown in FIG. 1 .

A large number of conductive pads 133 are two-dimensionally arranged on the electrical connection area 132 of the ceramic substrate 13 . Only one surface of the ceramic substrate 13 is shown in FIG. 4 , but conductive pads 133 of the same shape are arranged in the same manner on the other surface (the one opposite to the top surface shown in FIG. 4 ). bottom surface).

The ceramic substrate 13 has a through hole 134 corresponding to each conductive pad 133 and extending through the ceramic substrate 13 . The through holes 134 are entirely filled with a conductive material to seal the ceramic substrate 13 . Each conductive pad 133 shown in FIG. 4 is connected to the conductive material in the corresponding via 134 . The conductive pads are likewise connected to the conductive material in the vias 134 on the bottom surface opposite the top surface shown in FIG. 4 . Accordingly, each conductive pad on the top surface of the ceramic substrate 13 is connected to a corresponding conductive pad on the bottom surface.

Incidentally, the respective through holes 134 are alternately provided on top and bottom of the respective conductive pads 133 which are arranged horizontally in FIG. 4 . This is to prevent cracks in the ceramic substrate 13 from being caused by the through-holes being too close to each other.

Fig. 5 is a top view of a board connector to be connected to the very high vacuum bulkhead connector described with reference to Figs. 1-4, and Fig. 6 shows the board connector viewed from the direction of arrow C in Fig. 5 , and FIG. 7 is a cross-sectional view of the board connector taken along line D-D in FIG. 5 . However, a signal line 22 and spring contacts 23 are not cut.

The board connector 20 has a ceramic substrate 21, a large number of signal wires 22 arranged in a row, and spring contacts 23 arranged in the same direction and pitch as the signal wires.

Slots 212 cut in the ceramic substrate 21 at the same pitch as the spring contacts 23 extend through the ceramic substrate 21 and open towards the front edge 211 of the ceramic substrate 21 . Each conductive pattern plate 213 is formed on one surface of the ceramic substrate 21 immediately behind each groove 212 in a one-to-one correspondence with each groove 212 . Each conductive plate 213 includes a rectangular area 213a, an elongated area 213b and a connecting area 213c, and the connecting area 213c connects the rectangular area 213a and the elongated area 213b. Each exposed joint 221 of the signal line 22 is soldered to the rectangular area 213 a of the corresponding conductive plate 213 . The spring contacts 23 are arranged in the corresponding grooves 212 and are soldered to the elongated regions 213b of the respective conductive pattern plates 213 with their ends protruding slightly from the front edge 211 of the ceramic substrate 21 .

As shown in FIG. 7 , the middle of the spring contact piece 23 is greatly bent to provide elastic force. Also, each spring contact 23 has a bent end 231, and the end 231 is connected to the corresponding conductive pad 133 on the ceramic substrate 13 of the very high vacuum bulkhead connector shown in FIGS. 1-4. Contact, thus making electrical connection with it. Therefore, the line spacing of the spring contacts 23 on the board connector 20 is the same as the line spacing (in the horizontal direction of FIG. 4 ) of the conductive pads 133 on the ceramic substrate 13 shown in FIG. The number of spring contacts 23 on the ceramic substrate 13 in FIG. 4 is the same as the number (ten in this example) of conductive pads 133 arranged in horizontal rows on the ceramic substrate 13 in FIG. 4 .

Fig. 8 is a schematic diagram showing the connection between the ceramic substrate (see Fig. 4) of the very high vacuum bulkhead connector shown in Figs. 1-4 and the board connector shown in Figs. 5-7.

As mentioned above, the very high vacuum bulkhead connector 10 shown in FIGS. 1-4 is positioned in a position adjacent to an aperture of the bulkhead in the vacuum chamber. As shown in FIG. 8, a plate connector 20A (installed in the vacuum chamber) having the same shape as the plate connector 20 shown in FIGS. The ceramic substrate 13 of the very high vacuum bulkhead connector 10 is used to connect the end of the spring contact 23 with a corresponding conductive pad 133a on an inner surface 13a of the ceramic substrate 13 . Similarly, a board connector 20B having the same shape as the board connector 20 shown in FIGS. The corresponding conductive pads 133b on an outer surface 13b of 13 are connected.

As shown in FIG. 4 , ten conductive pads 133 are horizontally arranged on the ceramic substrate 13 of the extremely high vacuum barrier connector. Therefore, ten spring contacts 23 are arranged in a direction perpendicular to the paper surface of FIG. 8 on each board connector 20A or 20B. Besides, five conductive pads 133 are vertically arranged on the ceramic substrate 13 in FIG. 4 . Therefore, every five board connectors 20A inside the vacuum chamber and board connectors 20B outside the vacuum chamber are installed vertically, as shown in FIG. 8 . In this way, the signal lines 22 on the inside and outside of the vacuum chamber pass through the conductive plate 213 on the board connector 20A inside the vacuum chamber, the spring contact 23, the ceramic substrate of the extremely high vacuum barrier connector. The conductive layer 133a on the sheet 13, the conductive material in each through hole 134, the conductive layer 133b on the outer surface of the vacuum chamber, each spring contact piece 23 on the board connector 20B on the outer side of the vacuum chamber, and each conductive type Board 213 is connected.

In this way, according to the present embodiment, the inside and outside of the vacuum chamber are connected to each other via the conductive material filling the through holes of the ceramic substrate 13, making it possible to keep the vacuum chamber highly airtight and arrange a large number of signal line.

Next, a second embodiment of the present invention will be described.

9 is a top view showing a ceramic substrate of a very high vacuum bulkhead connector provided with an electrical connection structure according to a second embodiment of the present invention.

The very high vacuum bulkhead connector of the second embodiment of the present invention differs from the first embodiment described above only in the ceramic substrate, and therefore only the ceramic substrate will be shown and described here. Also, for ease of understanding, the same components as those of the ceramic substrate 13 in FIG. the difference.

The electrical connection region 132 of the ceramic substrate 13 in Fig. 9 contains as many (10) conductive pads 133 on the ceramic substrate shown in Fig. 4 in the horizontal direction, and the density of the conductive hot plates contained in the vertical direction is higher The height is twice (10) that in Figure 4 (5 conductive pads). The same number of conductive pads are arranged at the corresponding positions on the two surfaces of the ceramic substrate 13 with the same pitch, and each pair of conductive pads at the corresponding positions on the two surfaces of the ceramic substrate 13 passes through The conductive material filling the respective through holes 134 of the ceramic substrate 13 is connected to each other. These through holes 134 are arranged alternately on the top and bottom of the conductive pads 133 , and each conductive pad 133 is arranged horizontally in FIG. 9 , which prevents these through holes 134 from causing cracks in the ceramic substrate 13 .

Each contact piece 135 is soldered to a corresponding conductive pad 133 on the ceramic substrate 13 in FIG. 9 . Each contact 135 will be described with reference to FIG. 10 .

FIG. 10 is a schematic diagram showing the connection between the ceramic substrate in FIG. 9 and the board connector of the second embodiment of the present invention.

Each contact piece 135 of the shape shown in this figure is welded on each conductive pad 133, and this each conductive pad 133 is positioned on the ceramic substrate on the inner and outer sides of this vacuum chamber, and every pair of vertically adjacent contact pieces 135 in the direction indicated by arrow E or F constitutes a female contact for receiving a board connector 20A or 20B. However, the two paired contacts 135 are independent of each other as far as electrical connection is concerned.

Both board connectors 20A and 20B have a ceramic substrate 21 and signal lines 22, where the ceramic substrate 21 has conductive type plates 213 formed on both surfaces, and the signal lines 22 are provided on the ceramic substrate 21 On both surfaces of the ceramic substrate 21 , the wires 221 at the ends are welded to the conductive plate 213 . The conductive pattern plates 213 on the top and bottom surfaces of the ceramic substrate 21 are electrically independent from each other.

Although FIG. 10 shows only one column of contacts 135, according to the present embodiment, 10 contacts 135 are arranged in the horizontal direction in FIG. 9 (perpendicular to the paper direction of FIG. 10). Therefore, a ceramic substrate 21 in a board type connector contains 10 conductive pattern plates 213, and each conductive pattern plate 213 on the top surface and the bottom surface is perpendicular to the direction of the paper of FIG. 10 . In addition to this, correspondingly ten signal lines 22 are arranged in a direction perpendicular to the sheet of FIG. 10 .

According to the second embodiment shown in FIGS. 9 and 10, the inside and outside of the vacuum chamber are connected to each other through the conductive material filling the through holes of the ceramic substrate 13, so that the vacuum chamber is like the case of the first embodiment. Keep it highly airtight. In addition, since the signal lines are independently mounted on the top and bottom surfaces of the ceramic substrate 21 of the two board connectors 20A or 20B, these signal lines can be connected at a higher density than that of the first embodiment. layout. Incidentally, a cover may be added to cover each pair of contact pieces 135 in order to use the ceramic substrate 21 as a guide and protect the respective contact pieces 135.

Also, although a vacuum chamber is cited as an example, the chamber of the present invention is not limited to a vacuum chamber, and it may be another chamber which is partitioned by a partition and whose internal pressure is adjusted. For example, it may be a chamber whose internal pressure is adjusted to a level equal to or higher than atmospheric pressure. Furthermore, as an illustrative substrate, a ceramic substrate which hardly outgasses has been described as an example, but other forms of substrates which do not outgas can be substituted.

Claims (6)

1. electric connection structure, it is electrically connected the medial and lateral of a Room mutually, and this chamber is separated by a dividing plate and its internal pressure is conditioned, and this electric connection structure comprises:

The substrate of one insulation, it covers a hole that is formed on this dividing plate,

Wherein, the substrate of this insulation comprises:

Through hole, this through hole are communicated with the surface, medial and lateral of this chamber and are filled by electric conducting material; With

Conductive spacer, each conductive spacer are distributed in corresponding inboard, this chamber and the outer surface one and go up and connect with electric conducting material.

2. connector, it comprises:

The substrate of one insulation, this substrate has and is formed at a lip-deep conductive layer;

Lead is welded in an end of this conductive layer; With

Spring contacts is welded in another end of this conductive layer, and has elastomeric joint in the termination.

3. an electrical connection system, it makes the internal wiring of a Room be electrically connected mutually with outside wiring, and this chamber is conditioned by dividing plate separation and its internal pressure, and this electrical connection system comprises:

First substrate of one insulation, it covers the hole on this dividing plate and comprises: through hole, this through hole are communicated with the inboard, outer surface of this chamber and are filled with electric conducting material; And conductive spacer, each conductive spacer is distributed in corresponding inboard, this chamber and the outer surface one and goes up and be connected with this electric conducting material;

First connector, each first connector comprises: second substrate, be formed with a conductive layer on the one surface, this internal wiring of this chamber is welded in an end of this conductive layer; And spring contacts, another end and its termination that this spring contacts is welded in this conductive layer are pressed towards this each conductive spacer, and this each conductive spacer is distributed on the inner surface of this chamber; With

Second connector, each this second connector comprises: the 3rd substrate, be formed with a conductive layer on the one surface, the outside wiring of this chamber is welded in an end of this conductive layer; And spring contacts, this each spring contacts is welded in another end of this conductive layer, and its termination is pressed towards this each conductive spacer, and this each conductive spacer is distributed on the outer surface of this chamber.

4. electric connection structure, it is electrically connected outer, the inboard of a Room mutually, and this chamber is separated by a dividing plate and its internal pressure is conditioned, and this electric connection structure comprises:

The substrate of one insulation, it covers a hole that is formed on this dividing plate,

Wherein, the substrate of this insulation comprises:

The through hole that the inboard of this chamber and outer surface is communicated with and fills with electric conducting material;

Conductive spacer, this each conductive spacer are distributed in corresponding inboard, this chamber and the outer surface one and go up and be connected with this electric conducting material; With

Contact, this each contact are arranged on this surface, medial and lateral of this chamber and to be welded in the adjacent conductive pad right to form contact, and each contact is to being configured to compress a plate.

5. connector, it comprises:

The substrate of one insulation all has conductive layer on two surface; With

Lead is welded in this conductive layer.

6. electrical connection system, it makes the internal wiring of a Room be electrically connected mutually with outside wiring, and this chamber is conditioned by dividing plate separation and its internal pressure, and this electrical connection system comprises:

First substrate of one insulation, it covers the hole in this dividing plate and comprises: through hole is communicated with the inboard of this chamber and outer surface and is filled by electric conducting material; Conductive spacer, each conductive spacer be distributed in this chamber accordingly should the inboard and outer surface in one go up and be connected with this electric conducting material; And contact, this contact is located on the inner surface of this chamber and the outer surface and is welded on the adjacent conductive pad rightly to form each contact, and each contact is to being configured to compress a plate;

First connector, each first connector comprises: second substrate, it all has a conductive layer on two surfaces; With the internal wiring of this chamber, it is welded on these two lip-deep conductive layers, and wherein, this conductive layer is compressed and is connected on the corresponding contact by each contact on this indoor side surface; With

Second connector, each this second connector comprises: the 3rd substrate, it all has a conductive layer on two surfaces; With the outside wiring of this chamber that is welded in these two lip-deep conductive layers, wherein this each conductive layer is compressed and is connected to corresponding contact by each contact on this outdoor side surface.

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