CN1593075B - 电绝缘模块 - Google Patents

电绝缘模块 Download PDF

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Publication number
CN1593075B
CN1593075B CN02820232.5A CN02820232A CN1593075B CN 1593075 B CN1593075 B CN 1593075B CN 02820232 A CN02820232 A CN 02820232A CN 1593075 B CN1593075 B CN 1593075B
Authority
CN
China
Prior art keywords
electric tool
module
power device
control module
tool
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN02820232.5A
Other languages
English (en)
Chinese (zh)
Other versions
CN1593075A (zh
Inventor
Z·W·普里维特
B·R·克罗维尔
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Black and Decker Inc
Original Assignee
Black and Decker Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Black and Decker Inc filed Critical Black and Decker Inc
Publication of CN1593075A publication Critical patent/CN1593075A/zh
Application granted granted Critical
Publication of CN1593075B publication Critical patent/CN1593075B/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/209Heat transfer by conduction from internal heat source to heat radiating structure
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01HELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H9/00Details of switching devices, not covered by groups H01H1/00 - H01H7/00
    • H01H9/52Cooling of switch parts

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Registering, Tensioning, Guiding Webs, And Rollers Therefor (AREA)
  • Conductive Materials (AREA)
  • Control And Other Processes For Unpacking Of Materials (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Control Of Electric Motors In General (AREA)
CN02820232.5A 2001-08-10 2002-08-09 电绝缘模块 Expired - Fee Related CN1593075B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US92741801A 2001-08-10 2001-08-10
US09/927,418 2001-08-10
PCT/US2002/025547 WO2003017742A1 (en) 2001-08-10 2002-08-09 Electrically isolated module

Publications (2)

Publication Number Publication Date
CN1593075A CN1593075A (zh) 2005-03-09
CN1593075B true CN1593075B (zh) 2011-07-13

Family

ID=25454700

Family Applications (1)

Application Number Title Priority Date Filing Date
CN02820232.5A Expired - Fee Related CN1593075B (zh) 2001-08-10 2002-08-09 电绝缘模块

Country Status (11)

Country Link
EP (1) EP1421837B1 (de)
JP (1) JP4130628B2 (de)
CN (1) CN1593075B (de)
AT (1) ATE508621T1 (de)
AU (1) AU2002343325B2 (de)
BR (1) BR0211840A (de)
CA (1) CA2457438A1 (de)
DE (1) DE60239942D1 (de)
NZ (1) NZ531008A (de)
TW (1) TW579322B (de)
WO (1) WO2003017742A1 (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102008041366A1 (de) 2008-08-20 2010-02-25 Robert Bosch Gmbh Elektronikmodul
JP5610284B2 (ja) * 2010-09-28 2014-10-22 日本電産シンポ株式会社 発熱素子の放熱構造
US20140138811A1 (en) * 2012-11-21 2014-05-22 Nvidia Corporation A semiconductor device including a heat-spreading lid
WO2015174158A1 (ja) * 2014-05-15 2015-11-19 富士電機株式会社 パワー半導体モジュールおよび複合モジュール
EP4201565A3 (de) 2015-02-25 2023-09-20 Milwaukee Electric Tool Corporation Gehrungssäge
CN107645874A (zh) * 2016-07-20 2018-01-30 珠海市声驰电器有限公司 一种密封电路结构及其灌封方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5909358A (en) * 1997-11-26 1999-06-01 Todd Engineering Sales, Inc. Snap-lock heat sink clip
US5926373A (en) * 1996-12-23 1999-07-20 Lucent Technologies Inc. Encapsulated, board-mountable power supply and method of manufacture

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IT992650B (it) * 1973-07-19 1975-09-30 Ates Componenti Elettron Elemento per accoppiare un radiatore di calore con la massa termica di un dispositivo integra to nel montaggio su circuito stam pato
GB2190795B (en) * 1986-05-09 1990-01-10 Hella Kg Hueck & Co Circuit arrangement
IT1252624B (it) * 1991-12-05 1995-06-19 Cons Ric Microelettronica Dispositivo semiconduttore incapsulato in resina e elettricamente isolato di migliorate caratteristiche di isolamento,e relativo processo di fabbricazione
US5321582A (en) * 1993-04-26 1994-06-14 Cummins Engine Company, Inc. Electronic component heat sink attachment using a low force spring
US5558166A (en) * 1995-04-28 1996-09-24 Chen; Ching-Jen Power tool
DE69905036T2 (de) * 1999-09-01 2004-01-22 Ramarathnam, Ramachandran Elektrohandwerkzeug

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5926373A (en) * 1996-12-23 1999-07-20 Lucent Technologies Inc. Encapsulated, board-mountable power supply and method of manufacture
US5909358A (en) * 1997-11-26 1999-06-01 Todd Engineering Sales, Inc. Snap-lock heat sink clip

Also Published As

Publication number Publication date
EP1421837A4 (de) 2008-04-23
NZ531008A (en) 2006-08-31
DE60239942D1 (de) 2011-06-16
BR0211840A (pt) 2004-09-08
EP1421837B1 (de) 2011-05-04
AU2002343325B2 (en) 2006-08-03
CN1593075A (zh) 2005-03-09
EP1421837A1 (de) 2004-05-26
WO2003017742A1 (en) 2003-02-27
TW579322B (en) 2004-03-11
JP4130628B2 (ja) 2008-08-06
CA2457438A1 (en) 2003-02-27
JP2005500677A (ja) 2005-01-06
ATE508621T1 (de) 2011-05-15

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Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20110713

Termination date: 20160809