CN1667155B - 溅射装置 - Google Patents

溅射装置 Download PDF

Info

Publication number: CN1667155B
Authority: CN; China
Prior art keywords: target; mentioned; magnetic field; magnet; deposition system
Prior art date: 2004-03-11
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired - Lifetime

Application number

CN2005100527186A

Other languages

English (en)

Chinese (zh)

Other versions

CN1667155A (zh

Inventor

新井真

大石祐一

石桥晓

小松孝

谷典明

清田淳也

太田淳

中村久三

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Ulvac Inc

Original Assignee

Ulvac Inc

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2004-03-11

Filing date

2005-03-10

Publication date

2010-05-26

2005-03-10 Application filed by Ulvac Inc filed Critical Ulvac Inc

2005-09-14 Publication of CN1667155A publication Critical patent/CN1667155A/zh

2010-05-26 Application granted granted Critical

2010-05-26 Publication of CN1667155B publication Critical patent/CN1667155B/zh

2025-03-10 Anticipated expiration legal-status Critical

Status Expired - Lifetime legal-status Critical Current

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Classifications

- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3464—Sputtering using more than one target

Landscapes

Chemical & Material Sciences (AREA)
Chemical Kinetics & Catalysis (AREA)
Engineering & Computer Science (AREA)
Materials Engineering (AREA)
Mechanical Engineering (AREA)
Metallurgy (AREA)
Organic Chemistry (AREA)
Physical Vapour Deposition (AREA)

CN2005100527186A 2004-03-11 2005-03-10 溅射装置 Expired - Lifetime CN1667155B (zh)

Applications Claiming Priority (6)

Application Number	Priority Date	Filing Date	Title
JP2004069413		2004-03-11
JP69413/04		2004-03-11
JP69413/2004		2004-03-11
JP40668/2005		2005-02-17
JP40668/05		2005-02-17
JP2005040668A JP4780972B2 (ja)	2004-03-11	2005-02-17	スパッタリング装置

Publications (2)

Publication Number	Publication Date
CN1667155A CN1667155A (zh)	2005-09-14
CN1667155B true CN1667155B (zh)	2010-05-26

Family

ID=35038430

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
CN2005100527186A Expired - Lifetime CN1667155B (zh)	2004-03-11	2005-03-10	溅射装置

Country Status (4)

Country	Link
JP (1)	JP4780972B2 (ja)
KR (1)	KR101164047B1 (ja)
CN (1)	CN1667155B (ja)
TW (1)	TWI375729B (ja)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP4320019B2 (ja) *	2006-01-11	2009-08-26	株式会社アルバック	スパッタリング装置
JP4963023B2 (ja) *	2006-01-11	2012-06-27	株式会社アルバック	スパッタリング方法及びスパッタリング装置
US8460522B2 (en)	2006-10-24	2013-06-11	Ulvac, Inc.	Method of forming thin film and apparatus for forming thin film
JP4707693B2 (ja) *	2007-05-01	2011-06-22	株式会社アルバック	スパッタリング装置及びスパッタリング方法
JP5186152B2 (ja) *	2007-08-10	2013-04-17	株式会社アルバック	薄膜形成方法
US20110180394A1 (en) *	2007-08-20	2011-07-28	Tatsunori Isobe	Sputtering method and sputtering apparatus
TWI518194B (zh) *	2007-08-20	2016-01-21	Ulvac Inc	Sputtering method
JP5291907B2 (ja) *	2007-08-31	2013-09-18	株式会社アルバック	スパッタリング装置
JP5429771B2 (ja) *	2008-05-26	2014-02-26	株式会社アルバック	スパッタリング方法
JP5429772B2 (ja)	2008-06-30	2014-02-26	株式会社アルバック	電源装置
WO2010090197A1 (ja) *	2009-02-04	2010-08-12	シャープ株式会社	透明導電膜形成体及びその製造方法
JP5363166B2 (ja) *	2009-03-31	2013-12-11	株式会社アルバック	スパッタリング方法
KR20150092375A (ko) *	2010-06-17	2015-08-12	울박, 인크	스퍼터 성막 장치 및 방착부재
CN102312206B (zh) *	2010-06-29	2015-07-15	株式会社爱发科	溅射方法
JP5189674B2 (ja) *	2010-12-28	2013-04-24	出光興産株式会社	酸化物半導体薄膜層を有する積層構造、積層構造の製造方法、薄膜トランジスタ及び表示装置
JP5653257B2 (ja) *	2011-03-07	2015-01-14	株式会社アルバック	スパッタリング装置及びスパッタリング方法
WO2013026491A1 (en) *	2011-08-25	2013-02-28	Applied Materials, Inc.	Sputtering apparatus and method
JP5301021B2 (ja) *	2011-09-06	2013-09-25	出光興産株式会社	スパッタリングターゲット
CN102677008B (zh) *	2012-05-14	2014-02-19	深圳市创益科技发展有限公司	在线制备太阳能电池导电极膜层的装置
WO2014080815A1 (ja) *	2012-11-20	2014-05-30	株式会社アルバック	スパッタ装置
WO2014112376A1 (ja) *	2013-01-16	2014-07-24	出光興産株式会社	スパッタリングターゲット、酸化物半導体薄膜及び当該酸化物半導体薄膜を備える薄膜トランジスタ
CN103184422B (zh) *	2013-03-25	2015-07-22	肇庆市腾胜真空技术工程有限公司	Tco透明导电膜的低温沉积装置及工艺
JP2014218706A (ja) *	2013-05-09	2014-11-20	出光興産株式会社	スパッタリングターゲット、酸化物半導体薄膜及びそれらの製造方法
CN106661722A (zh) *	2014-07-31	2017-05-10	株式会社爱发科	基板处理装置
WO2019003809A1 (ja) *	2017-06-30	2019-01-03	凸版印刷株式会社	フィルムの処理方法及びフィルムの製造方法
KR102053400B1 (ko) *	2017-07-07	2020-01-07	주식회사 에이치앤이루자	자속 블록을 갖는 스퍼터링 장치
CN109487225A (zh) *	2019-01-07	2019-03-19	成都中电熊猫显示科技有限公司	磁控溅射成膜装置及方法
CN114318269B (zh) *	2022-01-05	2022-10-28	中国科学院兰州化学物理研究所	一种磁性粉体材料表面溅射沉积金属的装置及方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
CN1119552A (zh) *	1994-07-20	1996-04-03	松下电器产业株式会社	溅射装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPH0610347B2 (ja) *	1985-05-23	1994-02-09	日本電気株式会社	三極スパツタリングソ−ス
JPH02156080A (ja) *	1988-12-09	1990-06-15	Tokuda Seisakusho Ltd	スパッタ装置
JP3269834B2 (ja) *	1991-11-26	2002-04-02	旭硝子株式会社	スパッタリング装置とスパッタリング方法
JP4592852B2 (ja) *	1999-11-12	2010-12-08	キヤノンアネルバ株式会社	スパッタリング装置のマグネトロンカソード
JP2001262335A (ja) *	2000-03-21	2001-09-26	Nippon Sheet Glass Co Ltd	被膜の被覆方法

2005
- 2005-02-17 JP JP2005040668A patent/JP4780972B2/ja not_active Expired - Lifetime
- 2005-02-22 TW TW094105312A patent/TWI375729B/zh not_active IP Right Cessation
- 2005-03-10 CN CN2005100527186A patent/CN1667155B/zh not_active Expired - Lifetime
- 2005-03-10 KR KR1020050020100A patent/KR101164047B1/ko not_active Expired - Lifetime

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
CN1119552A (zh) *	1994-07-20	1996-04-03	松下电器产业株式会社	溅射装置

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
JP特开平7-18435A 1995.01.20
JP特表2002-508447A 2002.03.19

Also Published As

Publication number	Publication date
JP2005290550A (ja)	2005-10-20
TW200538568A (en)	2005-12-01
KR20060043832A (ko)	2006-05-15
TWI375729B (en)	2012-11-01
CN1667155A (zh)	2005-09-14
KR101164047B1 (ko)	2012-07-18
JP4780972B2 (ja)	2011-09-28

Legal Events

Date	Code	Title	Description
2005-09-14	C06	Publication
2005-09-14	PB01	Publication
2007-03-21	C10	Entry into substantive examination
2007-03-21	SE01	Entry into force of request for substantive examination
2010-05-26	C14	Grant of patent or utility model
2010-05-26	GR01	Patent grant
2025-03-28	CX01	Expiry of patent term	Granted publication date: 20100526
2025-03-28	CX01	Expiry of patent term

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