CN1777832B - Adhesive chuck device - Google Patents

Abstract

A board is surely mounted and removed by a simple structure. On a board side of a holding plate (1), an adhesive member (3) for adhering and holding a board (A) by facing a rear plane (A1) of the board, and a deforming film (4) which can deform by protruding and receding in a direction crossing a plane (1a) on the board side are provided. An adhesive surface (3a) of the adhesive member (3) and the board (A) are abutted and adhered by the protruding and receding deformation of the deforming film (4), and the board (A) is peeled from the adhesive surface (3a) of the adhesive member (3) without difficulty by forcibly separating the both.

Description

Adhesive chuck device

technical field

The present invention relates to a bonding chuck device used in a substrate assembly device including a substrate bonding machine used in, for example, a liquid crystal display (LCD) In the manufacturing process of flat panel displays such as plasma displays (PDP), glass substrates such as CF glass and TFT glass or synthetic resin substrates are bonded and held together.

More specifically, it relates to a bonding chuck device for freely holding a substrate by bonding attachment and detachment with respect to a holding plate.

Background technique

Conventionally, in a substrate laminating machine that superimposes two substrates, the substrate is held by an electrostatic chuck. However, as the size of the substrate has increased in recent years, it has become difficult to manufacture a large-sized electrostatic chuck, and even if it can be manufactured, the cost is very high. high.

Therefore, in order to solve these problems, an adhesive chuck device using an adhesive member for holding a substrate has been known.

As an example of such an adhesive chuck device, after the upper substrate is pasted and held with respect to the adhesive sheet stretched freely on a pair of rollers, the upper substrate and the lower substrate are bonded together, and then, Driven by a plurality of motors, the mandrel is rotated and the adhesive sheet is taken up. At the same time, the mandrel and one roller are moved horizontally in the take-up direction at a speed synchronous with the take-up speed, so that the adhesive sheet The knot sheet is slowly peeled off from the top of the upper substrate. (For example, refer to Patent Document 1)

In addition, instead of winding the adhesive sheet by the mandrel mentioned above, after the two substrates can be bonded to form a component, the tool table and the tool seat can be raised to the The position of the lower end of the cutting blade, and then by moving the cutter laterally to the adhesive sheet, cut off the adhesive sheet pasted with the upper substrate, take out the component with the adhesive sheet, and remove it from the component when appropriate. Peel off the adhesive sheet.

As another example, a plurality of holes are opened on the upper pressure plate, actuators are respectively provided in these holes, and an adhesive member is pasted on the front end of the shaft protruding downward from each actuator. The action of the actuator lowers the adhesive member in the opening, and if the lower surface of the adhesive member touches the upper substrate, it will be fixed to the lower surface of the pressure plate through its adhesive action to maintain the shape. In addition, when the substrate is completed, When the adhesive member is peeled off from the upper substrate after bonding, if the adhesive member is raised in the opening by the actuator, the peripheral portion of the opening prevents the movement of the upper substrate and pulls the upper substrate away from the adhesive member. (For example, refer to Patent Document 2)

Also, a plurality of openings are opened on the upper pressure plate, and the actuators for rotation and the actuators for driving up and down are respectively provided in these openings. Adhesive parts are installed at the front end, and each adhesive part is lowered in the opening by the action of the actuator for driving up and down, and the upper substrate is held by these adhesive parts and suction and adsorption, and the positioning is carried out, and bonding is performed at the same time. When the bonding member is returned to the pressure plate, the bonding member is twisted relative to the substrate surface by the actuator for rotation, or retracted by the actuator for driving up and down after twisting, thereby peeling the bonding member from the upper substrate. (For example, refer to Patent Document 3)

Patent Document 1: Japanese Unexamined Patent Publication No. 2001-133745 (pages 3 to 5, FIGS. 1 to 7)

Patent Document 2: Japanese Unexamined Patent Publication No. 2003-241160 (page 5, FIG. 7 )

Patent Document 3: Japanese Unexamined Patent Application Publication No. 2003-273508 (page 5, Figs. 1-5)

Contents of the invention

However, in such a conventional adhesive chuck device, in the case of Patent Document 1, there is a problem that, in order to peel off the adhesive member and the substrate, it is necessary to wind up the adhesive sheet at the same speed as the winding speed. The synchronous speed makes it move horizontally in the winding direction, or it is necessary to raise the tool table and the tool holder and cut the adhesive sheet with the tool. To complete each action, multiple driving sources such as motors and actuators are required, resulting in a complicated structure. .

In the case of Patent Document 2, in order to raise the bonding member in the opening of the pressure plate, a plurality of actuators are required for each bonding member, and in the case of Patent Document 3, due to Each bonding member requires a rotary actuator and an actuator for driving up and down for twisting and retracting the bonding member, which complicates the structure.

Therefore, in Patent Documents 1 to 3, especially since the exfoliation structure is complicated, not only

Embodiments of the present invention will be described below with reference to the drawings. Fig. 1 is a schematic front sectional view of an oil supply device for a sewing machine according to the present invention. At the lower end of the frame 1 , as shown in FIG. 5 , an oil pan 3 is installed via a washer 20 through a screw 16 , and an upper cover 2 is installed at the upper end. As shown in Fig. 2, in the interior of the frame 1, on the partition wall 1a extending in the front-rear direction, a bearing support hole 1b is penetrated in the left-right direction, and at the same time, a bearing support hole 1b is formed in the vertical direction at both ends. The upper side is pierced with a fixing hole 1c, and the lower side is pierced with a flow hole 1d.

The bearing 9 is inserted into the bearing support hole 1 b of the frame 1 . The bearing 9 connects the upper side member 9a and the lower side member 9aa divided up and down by screws 21 and 21 . An oil groove 9 b is provided in the circumferential direction on the inner peripheral surface of the bearing 9 . An oil guide hole 9d is pierced in the lower member 9aa so that the upper end opens to the oil groove 9b and the lower end opens to the upper end of the flow hole 1d. A discharge hole 9c is pierced in the upper member 9a. The lower end of the discharge hole 9c opens to the oil groove 9b, and the upper end of the discharge hole 9c opens to the outer peripheral surface. The upper end of the discharge hole 9c is screwed to the discharge pipe 18, and the discharge pipe 18 is inserted through the fixing hole 1c of the frame 1, whereby the bearing 9 is fixed in the bearing support hole 1b. A fuel injection pipe 19 is screwed to the upper end of the discharge pipe 18 , and a nozzle-shaped fuel injection port 19 a opens at the upper end of the fuel injection pipe 19 . The oil injection port 19a of the oil injection pipe 19 protrudes upwards through the through hole 8b of the oil container 8, and is opposite to the oil window 7 installed on the upper cover 2, and the oil container 8 is installed on the upper cover by screws 17, 17. on the protrusion 2a of the cover 2. In addition, an oil hole 8a for dripping and supplying lubricating oil to a desired position is appropriately provided in the oil container 8 .

The main shaft 4 is inserted and supported by a bearing 9 in the supported portion 4d. As shown in FIG. 3, an oil hole 4a is perforated in the supported part 4d, and its outer peripheral surface side end is opened at a position opposite to the oil groove 9b, and the other end is opened at the through hole 4b provided in the main shaft 4. . In addition, a plurality of oil holes 4c . And open on the outer peripheral surface of the main shaft 4.

As shown in Fig. 1 and Fig. 5, the pump 5 is installed on the frame 1 by screws 15, 15. In this embodiment, the pump 5 is a known trochoid pump, and the worm wheel 5 a engages with a worm 6 mounted on the right side of the main shaft 4 . One end of the oil guide pipe 10 is connected to the discharge port 5 b of the pump 5 through a coupling screw 14 and a coupling 13 , and the other end is connected to the lower end of the flow hole 1 d through a coupling 11 and a coupling screw 12 . Although omitted in FIGS. 1 and 5 , the oil guide pipe 10 has a structure that does not branch midway.

Next, the operation of the oil supply device of the sewing machine constructed as above will be described. When the main shaft 4 is rotated by the driving source of the sewing machine (not shown), the pump 5 is operated by the engagement of the worm wheel 5a and the worm 6, and the lubricating oil stored in the oil pan 3 is sucked up by the pump 5 and discharged from the discharge port 5b. Through coupling screw 14, coupling 13, oil guide pipe 10, coupling 11, coupling screw 12, flow hole 1d, oil guide hole 9d of bearing 9 is sent in the oil groove 9b. The lubricating oil sent to the oil groove 9b lubricates the sliding surfaces of the bearing 9 and the main shaft 4, and at the same time, part of it is taken into the through hole 4b through the oil hole 4a, and the known internal forced oil supply is performed to each mechanism connected to the main shaft.

The lubrication of the sliding surface of the bearing 9 and the main shaft 4 and the remaining lubricating oil without forced oil supply on the inner surface are sprayed from the oil groove 9b through the discharge hole 9c, the discharge pipe 18, and the oil injection pipe 19 toward the oil window 7, so that Check whether the oil supply is performed normally. A part of the lubricating oil sprayed toward the oil window 7 drops onto the oil receiver 8, and then is dripped and supplied to a desired position from the oil hole 8a.

Hold the substrate solidly.

Description of drawings

Fig. 1 is a partial longitudinal sectional front view showing Embodiment 1 of the bonding chuck device of the present invention, and (a) to (c) show the working steps thereof.

Fig. 2 is a partial transverse section bottom view along line (2)-(2) of Fig. 1 .

Fig. 3 is a partial longitudinal sectional front view showing Embodiment 2 of the bonding chuck device of the present invention, (a) to (c) showing its working steps.

Fig. 4 is a partial transverse sectional bottom view taken along line (4)-(4) of Fig. 3 .

Fig. 5 is a partial longitudinal sectional front view showing Embodiment 3 of the bonding chuck device of the present invention, (a) to (c) showing the working steps thereof.

Fig. 6 is a partial transverse sectional bottom view along line (6)-(6) of Fig. 5 .

Detailed ways

The bonding chuck device of the present invention shows a case where it is arranged in a substrate bonding machine on which a glass substrate such as a liquid crystal display (LCD) panel is bonded and held and bonded.

In this substrate bonding machine, as shown in FIGS. 1 to 6, two glass substrates A, B are respectively held on the parallel and opposite holding surfaces 1a, 2a of the holding plates 1, 2 arranged on the upper and lower sides. After the sealed space S formed by dividing reaches a specified vacuum degree, the upper and lower holding plates 1 and 2 are adjusted and moved relatively in the XYθ direction to position the substrates A and B, and then the upper substrate A is moved from the upper holding plate 1 The holding surface 1a is forcibly peeled off and instantly crimped to the ring-shaped adhesive (sealing material) C on the lower substrate B, thereby sealing and superimposing the two, and then passing the two substrates A, B inside and outside The resulting air pressure difference pressurizes the space between the two substrates A and B to a predetermined gap.

If described in detail, the upper and lower holding plates 1, 2 are supported relatively movable in the Z direction by the lifting device (not shown in the figure), and in the state where these upper and lower holding plates 1, 2 are separated in the upward and downward direction, The substrates A, B are set on the respective holding surfaces 1a, 2a, and the upper and lower holding plates 1, 2 are brought close to each other by the operation of the elevating device, thereby dividing and forming a closed space S.

Then, when air is sucked from the closed space S by the operation of the air extraction device (not shown in the figure) to reach a predetermined vacuum degree, the vertical moving mechanism (not shown in the figure) is moved up and down. Either one of the holding plates 1 and 2 is adjusted and moved relative to the other direction XYθ direction, thereby sequentially performing alignment of the substrates A and B held on the holding plates, that is, rough alignment and fine alignment.

After these positionings are completed and the upper and lower substrates A and B are superimposed, air or nitrogen gas is supplied into the closed space S, and the air pressure in the closed space S is returned to atmospheric pressure to uniformly increase the pressure difference between the inside and outside of the two substrates A and B. Press, and squeeze the predetermined interval in the state of sealing the liquid crystal to complete the product.

Furthermore, the bonding chuck device of the present invention is provided on the substrate side of the aforementioned holding plates 1 and 2 .

Specifically, as shown in Fig. 1, Fig. 3 and Fig. 5, on any one or both sides of the holding surfaces 1a, 2a on the substrate side as the upper and lower holding plates 1, 2, adhesive members 3, 3' are provided. And the deformable film 4, the above-mentioned bonding members 3, 3' are bonded to the opposite sides A1, B1 of the substrates A, B to hold the substrates A, B, and the aforementioned deformable film 4 can be concavely deformed and protrudingly deformed to the side of the substrate. The deformable film 4 is concavely deformed or protrudingly deformed to make the substrates A, B contact and bond the bonding surfaces 3a, 3a' of the bonding members 3, 3', and the deformation of the deformable film 4 in the opposite direction The action forces the two to separate, whereby the substrates A, B are effortlessly peeled off from the bonding surfaces 3a, 3a' of the bonding member 3.

Embodiments of the present invention will be described below with reference to the drawings.

Embodiment 1

This embodiment 1, as shown in FIGS. 1 to 2 , shows the case where the upper and lower holding plates 1 and 2 are flat plate-shaped platforms formed of rigid bodies such as metals and ceramics to a thickness without bending (bending) deformation. , only the substrate side of the upper holding plate 1 among these is covered by a plate-shaped body 4' composed of a plurality of adhesive members 3 and a plurality of deformable films (pressurized films) 4, and these are deformed by applying pressure. The film 4 deforms protrudingly (convexly) from the substrate side of the upper holding plate 1 , whereby the upper substrate A is forcibly pulled away from the bonding surface 3 a of the bonding member 3 to be peeled off.

On the holding surface 1a of the upper holding plate 1, a plurality of or single recesses 1b are recessed, and these recesses 1b are connected with suction sources (not shown) such as vacuum pumps, compressors, etc. The operation of the gas source discharges the gas in the recess 1b to the outside, and the adhesive member 3 is detachably fixed around the recess 1b, and the opening of the recess 1b is covered by the deformable film 4.

In the illustrated example, as shown in FIG. 2, on the holding surface 1a of the upper holding plate 1, a plurality of circular recesses 1b are provided through partition walls 1d arranged at approximately equal intervals, and the openings of all the recesses 1b are deformed from one piece. The membranes 4 are respectively covered in a sealed shape, and the annular adhesive member 3 is fixed by the deformable membrane 4 at a position corresponding to the front end surface of the partition wall 1d so as to overlap with the surface of the deformable membrane 4 .

The adhesive member 3 is an adhesive sheet made of adhesive materials such as silicon, acrylic, and fluorine, and its adhesive surface 3a is preferably arranged as close as possible to the deformable membrane 4 described later, and The area of the bonding surface 3a is preferably set small within the range of the bonding force capable of suspending the upper substrate A, and at the same time, it is preferable that the bonding member 3 can be easily replaced.

In the case of the illustrated example, the adhesive force of the adhesive surface 3a of the adhesive member 3 in contact with the aforementioned glass substrate A is set to be smaller than the adhesive force of the fixed back surface 3b in contact with the deformable film 4, The deformable film 4 is disposed on the holding surface 1a side of the upper holding plate 1, and the adhesive member 3 will not be peeled off from the holding surface 1a side by its weight when bonding with the substrate A, but the adhesive member 3 can be removed at any time as needed. 3 is peeled off from the surface of the deformable membrane 4.

The above-mentioned plate-shaped body 4' and the deformable membrane 4 are diaphragms that can be elastically deformed, and the diaphragm is made of a thin metal plate such as stainless steel or a thin sheet formed by synthetic resin such as rubber or engineering plastics, or other elastic materials. The front end surface of the partition wall 1d is bonded by welding such as electron beam welding or by a bonding member, and the deformable film 4 is flexed and deformed by discharging gas from the inside of each recess 1b to the outside through the above-mentioned air passage 1c, and flows to each recess. 1b is recessed; on the other hand, by supplying gas from the outside into each recess 1b, the deformable film 4 is bent and deformed so as to protrude from the opening of each recess 1b.

And, the installation method of aforementioned plate-shaped body 4' is not limited to the above-mentioned joining method by welding or adhesives, by installing a pressure plate (not shown) with respect to, for example, the partition wall 1d between each recessed portion 1b with a fixing device such as a screw. ), the plate-shaped body 4' may be detachably clamped between the front end faces of these partition walls 1d and the pressure plate.

In addition, if necessary, as shown in FIG. 2 , small holes 4a may be formed through the deformable membrane 4 at positions corresponding to the approximate centers of the recesses 1b.

Next, the operation of this substrate bonding machine will be described.

First, as shown in FIG. 1( a), under the state where the upper and lower holding plates 1, 2 are separated from each other in the up and down direction, the upper and lower substrates A, B are set on the respective holding surfaces 1a, 2a. The inside of the concave portion 1b formed on the holding surface 1a of the plate 1 is evacuated and the pressure is reduced, so that the deformable membrane 4 is bent into a concave shape.

In this state, the upper substrate A is conveyed by the substrate conveying robot (not shown), and the reverse side A1 is moved upward to the holding surface 1a of the holding plate 1. 3a, the upper substrate A can be held by the adhesive force of the adhesive surface 3a.

In addition, as shown in FIG. 2, in the case where small holes 4a are formed in the deformable film 4 corresponding to the respective recesses 1b, if a vacuum is drawn from these small holes 4a, the upper substrate A can be adsorbed and held more strongly. .

Then, as shown in Figure 1(b), after the upper and lower holding plates 1, 2 approach and the sealed space S reaches a predetermined vacuum degree, any one of the upper and lower holding plates 1, 2 is adjusted and moved relative to the other direction XYθ direction , the positioning of the substrates A and B held thereon is performed.

After the positioning is completed, as shown in Fig. 1(c), gas is introduced into the concave portion 1b formed on the holding surface 1a of the upper holding plate 1, and the deformable film 4 is pressed from the back side to bend it into a convex shape. , and make its front end protrude from the bonding surface 3 a of the bonding member 3 .

Thereby, the upper substrate A bonded and held on the bonding surface 3a of the bonding member 3 is forcibly pulled apart, while the upper substrate A is effortlessly peeled off from the bonding surface 3a of the bonding member 3, by The protruding pressure of these deformable films 4 presses the upper substrate A onto the ring-shaped adhesive C on the lower substrate B and overlaps them.

At this time, in the case of opening small holes 4a on the deformable membrane 4, the upper substrate A is removed from the bonding surface of the bonding member 3 by ejecting gas such as nitrogen gas from the small holes 4a to the back surface A1 of the upper substrate A. 3a is forcibly peeled off, and the ring-shaped adhesive C on the lower substrate B is momentarily pressure-bonded to seal the two.

Therefore, the upper and lower glass substrates A and B can be uniformly pressure-bonded in vacuum without deformation, and the applied pressure can be easily changed.

Moreover, since the substrate side of the upper holding plate 1 is covered by the plate-shaped body 4' composed of a plurality of adhesive members 3 and a plurality of deformable films 4, a plurality of positions of the upper substrate A are bonded and held at the same time, and can be performed simultaneously. For peeling, even if the upper substrate A is large, it can be reliably held and peeled off.

Moreover, since the above-mentioned bonding member 3 and the deformable film 4 are arranged as close as possible, when the upper substrate A made of glass is peeled from the bonding surface 3a by the protruding pressure of the deformable film 4, a part of the upper substrate A does not Since it is greatly bent, there will be no problems of positional misalignment on the positioned upper and lower substrates A and B, and no disconnection of the ring-shaped adhesive C sealing the liquid crystal.

Again, since the area of the bonding member 3 is set to be small, when the upper substrate A made of glass is peeled off from the bonding surface 3a, no great force is required, and accidents such as breakage of the glass can be prevented. Since the adhesive member can be easily replaced and installed, although there is concern about the adhesion of foreign matter and the reduction of the adhesive force caused by repeated adhesive contact and separation of the upper substrate A, it can be repaired by replacing the adhesive member 3 at this time. solve.

Embodiment 2

In this second embodiment, as shown in FIGS. 3 to 4 , a plurality of ventilation holes 1 e are opened in a penetrating manner from the partition wall 1 d formed on the holding surface 1 a of the holding plate 1 to the bonding member 3 and the deformable film 4 . The air passage 1f connecting these air holes 1e with a suction source (not shown) such as a vacuum pump, a compressor, etc. and the air passage 1c of the aforementioned recessed portion 1b are formed in a different system. The embodiment 1 shown in 2 is different, and the other structures are the same as the embodiment 1 shown in FIGS. 1 to 2.

According to the above configuration, as shown in FIG. 3( a ), the upper substrate A can be sucked and held with a stronger force by sucking air from the ventilation holes 1e when the upper substrate A is placed on the holding surface 1a of the upper holding plate 1 . In addition, as shown in FIG. 3(c), when the substrates A and B are positioned and then peeled off, since the gas such as compressed air or nitrogen is sprayed from the vent hole 1e, the upper substrate A can be lifted with a greater force. It is forcibly peeled off from the bonding surface 3 a of the bonding member 3 and crimped on the ring-shaped adhesive C on the lower substrate B in an instant.

Therefore, Embodiment 2 shown in FIGS. 3 to 4 can obtain the same effect as that of Embodiment 1 shown in FIGS. In addition to the base plate A, the upper base plate is vacuum-adsorbed and held by the suction from the air hole 1e, so there are advantages that the structure of the suction piping system and suction control can be easily realized, and more reliable holding can be achieved. The upper substrate A, at the same time, can completely prevent the positional displacement of the upper substrate A due to the instability of the protruding pressure of the deformable film 4 .

Embodiment 3

This embodiment 3, as shown in FIGS. 5 to 6, has the following structure different from the embodiment 1 shown in the aforementioned FIGS. 1 to 2 and the embodiment 2 shown in FIGS. 3 to 4. In addition, other structures It is the same as the embodiment 1 shown in FIGS. 1 to 2 and the embodiment 2 shown in FIGS. 3 to 4. The different structure is: instead of the above-mentioned ring-shaped bonding member 3, the above-mentioned deformable film 4 Adhesive parts 3' are set on a part to form a plate-shaped body 4" made of a plurality of deformable membranes 4 and adhesive parts 3', and the plate-shaped body 4" covers the substrate side of the upper holding plate 1, and at the same time, In the state where the deformable film 4 is made flat, the bonding surface 3a' of the bonding member 3' is brought into contact with the upper substrate A to be bonded and held. The submerged (concave) deformation is performed under the decompression of the substrate side of the substrate, whereby the bonding surface 3a' of the bonding member 3' is forcibly separated from the upper substrate A and peeled off.

As a method of disposing the adhesive member 3' on a part of the above-mentioned deformable membrane 4, by surface-treating the deformable membrane 4 made of an elastic material or performing similar processing to it, only at a desired position on its surface The adhesive surface 3a' is formed integrally with the surface of the deformable membrane 4 in the same plane or provided integrally as a plate-shaped body 4".

The shape of the plate-shaped body 4″ is not limited to the flat plate shape shown in the figure, and it may also be incomplete, such as partially recessing the deformable film 4 toward the recess 1b formed on the holding surface 1a of the upper holding plate 1. of flat form.

In the case shown in the figure, the circular adhesive surface 3a' is partially integrally formed at the substantially central position of the deformable film 4, but other shapes are also acceptable as long as the reverse surface A1 of the upper substrate A can be reliably held. Can.

In addition, in the illustrated example, the above-mentioned small hole 4a is not pierced on the deformable membrane 4, but if necessary, it can also be used in the same way as the device shown in FIG. 2 of the aforementioned embodiment 1 and FIG. Small holes 4a are respectively penetrating through the substantially central positions of the adhesive members 3'.

With the above structure, as shown in FIG. 5(a) and FIG. 5(b), the gas is introduced into the recess 1b formed on the holding surface 1a of the upper holding plate 1, and the deformable film 4 is heated from the back side thereof. If the bonding surface 3a' of the bonding member 3' is brought into contact with the upper substrate A, the upper substrate A can be held by the adhesive force.

After the upper and lower substrates A and B are superimposed, the environment in the closed space S is returned to atmospheric pressure, as shown in FIG. If the deformable film 4 is concavely bent and the bonding surface 3a' of the bonding member 3' is submerged in the recess 1b, the bonding surface 3a' can be forcibly pulled away from the upper substrate A.

At the same time, if the gas such as compressed air or nitrogen is ejected from the vent hole 1e, the upper substrate A can be forcibly peeled off from the bonding surface 3a' of the bonding member 3' with a greater force. As a result, Embodiment 3 shown in Figures 5 to 6 can obtain the same effect as Embodiment 1 shown in Figures 1 to 2 and Embodiment 2 shown in Figures 3 to 4, and has the following advantages : Since the bonding surface 3a' of the bonding member 3' is disposed on a part of the deformable film 4, only by covering the entirety of the holding surface 1a and the recessed portion 1b on the substrate side of the upper holding plate 1 with the plate-shaped body 4', The bonding part 3' of the bonding part 3' can be configured at the same time, thus the overall structure of the bonding chuck device can be simplified, because it is not necessary to combine the bonding part 3 with the deformable film 4 as in Embodiment 1 and Embodiment 2. Since it is attached separately, it can be manufactured in a short time at low cost.

Also, when the bonding surface 3a' of the bonding member 3' and the surface of the deformable film 4 are integrally formed into the same plane by surface treatment, etc., due to the gap between the bonding surface 3a' and the surface of the deformable film 4, There is no step difference between them, so when bonding the upper and lower substrates A and B, not only can the substrates A and B be uniformly pressure-bonded without deformation, but also has the advantage of minimizing other adverse effects.

In addition, although the case where the adhesive chuck device of the present invention is equipped in a laminating machine for adhesively holding and laminating glass substrates such as liquid crystal display (LCD) panels, the present invention is not limited to Limited to this, it may be arranged in a substrate assembly device other than the substrate bonding machine, or a substrate transfer device for transferring substrates, to bond and hold substrates other than the glass substrate for LCD panels.

In addition, although the substrate bonding machine that bonds the substrates A and B in a vacuum has been described, it is not limited to this, and it may be a substrate bonding machine that bonds the substrates A and B in the air. Even in this case, The same effect as that of the above-mentioned vacuum laminating machine can be obtained.

Also, in the embodiment shown above, the adhesive member 3 and the deformable film 4 are arranged only on the holding surface 1a of the substrate side as the upper holding plate 1, but it is not limited to this, and it can also be used as the lower holding plate 2. On the holding surface 2a on the substrate side of the lower substrate B, an adhesive member 3 is fixed to be bonded and held opposite to the reverse surface B1 of the lower substrate B, and at the same time, a deformable film 4 capable of elastically deforming upward and downward may be provided.

Moreover, on the holding surface 1a of the upper holding plate 1, a plurality of circular recesses 1b are recessed, and the openings of all these recesses 1b are covered by a plate-shaped body 4', 4", but it is not limited thereto. The shape of the recesses 1b is changed to a shape other than a circle, and each recess 1b is covered with a plurality of deformable films 4, respectively.

Claims (5)

1. A bonding chuck device, which holds the substrate (A) freely by bonding with respect to the holding plate (1), is characterized in that, on the substrate side of the holding plate (1), the substrate (A) ) on the opposite side (A1) is relatively recessed with multiple or single recesses (1b), and a bonding member (3) is detachably arranged around the recesses (1b), and the opening of the recesses (1b) is formed by a deformable film (4) Covering, by causing the above-mentioned deformable film (4) to undergo concave deformation, the bonding surface (3a) of the above-mentioned bonding member (3) is brought into contact with the above-mentioned substrate (A) to bond, and by making the above-mentioned deformable film (4) Protrudingly deformed to forcibly pull and peel off the above-mentioned substrate (A) from the bonding surface (3a) of the above-mentioned bonding member (3). 2. A bonding chuck device, which holds the substrate (A) freely by bonding with respect to the holding plate (1), characterized in that, on the substrate side of the holding plate (1), the substrate (A) ) is relatively recessed with multiple or single recesses (1b), the opening of the recess (1b) is covered by a deformable film (4), and an adhesive member is arranged on a part of the deformable film (4) (3'), in the state where the deformable film (4) is made flat, the adhesive surface of the above-mentioned bonding member (3') is brought into contact with the above-mentioned substrate (A) to carry out bonding and holding, by making the above-mentioned deformable film ( 4) Concave deformation, the bonding surface (3a') of the above-mentioned bonding member (3') is forcibly pulled away from the above-mentioned substrate (A) and peeled off. 3. The bonded chuck device according to claim 1 or 2, wherein the bonded member is integrally formed with the deformable membrane. 4. The adhesive chuck device according to claim 1 or 2, wherein an adhesive member is provided on a part of the deformable membrane. 5. The bonding chuck device as claimed in claim 3, characterized in that, a part of the plate-shaped body is provided with a vent hole, and the reverse side of the substrate is sucked and adsorbed from the vent hole, and the plate-shaped body is bonded by the above-mentioned bonding chuck device. components and deformable membranes.

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