CN1849852A - 薄膜组件及所述组件的制造方法 - Google Patents

薄膜组件及所述组件的制造方法 Download PDF

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Publication number
CN1849852A
CN1849852A CNA2004800259133A CN200480025913A CN1849852A CN 1849852 A CN1849852 A CN 1849852A CN A2004800259133 A CNA2004800259133 A CN A2004800259133A CN 200480025913 A CN200480025913 A CN 200480025913A CN 1849852 A CN1849852 A CN 1849852A
Authority
CN
China
Prior art keywords
thin
film
layer
film assembly
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA2004800259133A
Other languages
English (en)
Chinese (zh)
Inventor
马库斯·伍克斯
尼古莱·哈斯莱布纳
罗纳德·弗罗施
曼弗雷德·里德勒
冈瑟·莱辛
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
At&s Austrian Technology And Systems Technology Co ltd
Original Assignee
At&s Austrian Technology And Systems Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by At&s Austrian Technology And Systems Technology Co ltd filed Critical At&s Austrian Technology And Systems Technology Co ltd
Publication of CN1849852A publication Critical patent/CN1849852A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0317—Thin film conductor layer; Thin film passive component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/046—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer
    • H05K3/048—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer using a lift-off resist pattern or a release layer pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/421—Blind plated via connections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroluminescent Light Sources (AREA)
CNA2004800259133A 2003-09-09 2004-09-09 薄膜组件及所述组件的制造方法 Pending CN1849852A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
AT0141503A AT413170B (de) 2003-09-09 2003-09-09 Dünnschichtanordnung und verfahren zum herstellen einer solchen dünnschichtanordnung
ATA1415/2003 2003-09-09
ATA894/2004 2004-05-24

Publications (1)

Publication Number Publication Date
CN1849852A true CN1849852A (zh) 2006-10-18

Family

ID=34427297

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA2004800259133A Pending CN1849852A (zh) 2003-09-09 2004-09-09 薄膜组件及所述组件的制造方法

Country Status (2)

Country Link
CN (1) CN1849852A (de)
AT (1) AT413170B (de)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103474394A (zh) * 2013-09-11 2013-12-25 华进半导体封装先导技术研发中心有限公司 免金属cmp的tsv工艺方法
CN103884751A (zh) * 2014-04-18 2014-06-25 苏州怡拓生物传感技术有限公司 一种用于血液快速检测系列生物传感器连续化生产的方法
CN107240596A (zh) * 2016-03-29 2017-10-10 三星显示有限公司 显示设备
CN110709725A (zh) * 2017-06-05 2020-01-17 伟摩有限责任公司 通过非均匀抓握焊盘堆叠进行的pcb光学隔离

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62216259A (ja) * 1986-03-17 1987-09-22 Fujitsu Ltd 混成集積回路の製造方法および構造
US4839558A (en) * 1988-05-23 1989-06-13 Hamilton Standard Controls, Inc. Integrated DC electroluminescent display system
WO1997003460A1 (en) * 1995-07-12 1997-01-30 Hoya Corporation Bare chip mounted board, method of manufacturing the board, and method of forming electrode of bare chip
JP4345153B2 (ja) * 1999-09-27 2009-10-14 ソニー株式会社 映像表示装置の製造方法

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103474394A (zh) * 2013-09-11 2013-12-25 华进半导体封装先导技术研发中心有限公司 免金属cmp的tsv工艺方法
CN103884751A (zh) * 2014-04-18 2014-06-25 苏州怡拓生物传感技术有限公司 一种用于血液快速检测系列生物传感器连续化生产的方法
CN107240596A (zh) * 2016-03-29 2017-10-10 三星显示有限公司 显示设备
CN110709725A (zh) * 2017-06-05 2020-01-17 伟摩有限责任公司 通过非均匀抓握焊盘堆叠进行的pcb光学隔离
CN110709725B (zh) * 2017-06-05 2023-10-03 伟摩有限责任公司 通过非均匀抓握焊盘堆叠进行的pcb光学隔离

Also Published As

Publication number Publication date
ATA14152003A (de) 2005-04-15
AT413170B (de) 2005-11-15

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PB01 Publication
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication