CN1865523B - Operation panel of power supply unit for electroplating - Google Patents
Operation panel of power supply unit for electroplating Download PDFInfo
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- CN1865523B CN1865523B CN2006100789107A CN200610078910A CN1865523B CN 1865523 B CN1865523 B CN 1865523B CN 2006100789107 A CN2006100789107 A CN 2006100789107A CN 200610078910 A CN200610078910 A CN 200610078910A CN 1865523 B CN1865523 B CN 1865523B
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- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/007—Current directing devices
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
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Abstract
本发明提供一种电镀用电源装置的操作板,该操作板被区分为以下三个区域。第一区域中配置有切换电镀电流输出的ON或者OFF用的ON/OFF键;第二区域中配置有选择操作方式的方式选择键群,操作方式包括所述控制方式选择键和所述波形方式选择键;第三区域中配置有数值显示部和旋转式编码器,该数值显示部用于显示电流值的数值,所述旋转式编码器包括可旋转操作的旋转操作部,通过旋转操作部的顺时针方向旋转或逆时针方向旋转的旋转操作,可加大或减小显示于所述数值显示部的所述数值。
The present invention provides an operation panel of a power supply device for electroplating, which is divided into the following three areas. The ON/OFF key for switching the ON or OFF of the electroplating current output is configured in the first area; the mode selection key group for selecting the operation mode is configured in the second area, and the operation mode includes the control mode selection key and the waveform mode selection key; a numerical display part and a rotary encoder are arranged in the third area, and the numerical display part is used to display the numerical value of the current value, and the rotary encoder includes a rotary operation part that can be rotated; The rotation operation of rotating clockwise or counterclockwise can increase or decrease the numerical value displayed on the numerical value display part.
Description
技术领域technical field
本发明涉及一种可以提高其操作性的电镀用电源装置的操作板。The present invention relates to an operation panel of a power supply unit for electroplating capable of improving its operability.
背景技术Background technique
现有的电镀用电源装置的操作板,如特开平5-44099公报中所述那样,由UP·DOWN按钮以及多个排列于按钮下部的开关构成。The operation panel of the conventional power supply unit for electroplating is composed of UP·DOWN buttons and a plurality of switches arranged below the buttons, as described in JP-A-5-44099.
图5为上述的电镀用电源装置的操作板的平面图。如图所示,在显示部30的下部配置有输入键34~42,水平右侧配置有UP·DOWN按钮41,使得能够在进行数字设定时显示数字用,在水平左侧配置有输出电流显示部43和输出电压显示部44。在输入键34~42的左侧配置有输出开关33。UP·DOWN按钮41是用于将显示于显示部30上显示的数值进行增大(UP)或者减小(DOWN)操作的开关,通过持续按压的方式,显示数值可以连续地增大或减小。输入键34~42由段切换按钮34、开始/停止按钮35、设置按钮36、编辑按钮37、写入按钮38,功能按钮39、复位按钮40、以及高速按钮42构成。高速按钮42是将UP·DOWN按钮41的UP速度以及DOWN的速度高速化的按钮。Fig. 5 is a plan view of an operation panel of the power supply unit for electroplating described above. As shown in the figure, the
作为操作方法,例如,在显示部30上设置输出电流值时,持续按压UP按钮41,使显示值升高,当该值超过目标值时,按一下DOWN按钮41。此时,根据需要按高速按钮42,以便快速变化显示数值。As an operation method, for example, when setting the output current value on the
但是,如上结构的显示部,各个开关和按钮没有按照功能类别配置而成,由此容易发生操作失误,另外,在操作UP·DOWN按钮41时,有时也有需要高速按钮42的开关操作,因此存在设置输出电流值等数值时操作速度慢等问题。However, in the display unit with the above structure, each switch and button are not configured according to the functional category, so that operation errors are prone to occur. In addition, when the UP·
特别是,电镀用电源装置在错误地设定电流值等的数值时,完成品离电镀质量要求相差甚远,因此,需要对每个被电镀物品的电流值以及其波形调整到最合适,但根据现有的操作板,容易产生数值设定错误,另外,不能够迅速地实施设置操作。In particular, when the power supply unit for electroplating is incorrectly set the current value and other values, the finished product will be far from the quality requirements of electroplating. According to the conventional operation panel, numerical value setting errors are likely to occur, and setting operations cannot be quickly performed.
发明内容Contents of the invention
本发明的目的在于提供一种电镀用电源装置的操作板,研究操作板布置和开关的结构,以便避免发生数值设定错误,可以迅速地设定操作,且操作性优异。The object of the present invention is to provide an operation panel of a power supply unit for electroplating, and study the arrangement of the operation panel and the structure of the switches so as to avoid numerical value setting errors, enable quick setting operation, and have excellent operability.
本发明的电镀用电源装置的操作板,至少区分为三个区域。The operation panel of the power supply unit for electroplating of the present invention is divided into at least three areas.
第一区域中配置有切换电镀电流输出的ON或者OFF用的ON/OFF键。An ON/OFF key for switching ON or OFF of the plating current output is arranged in the first area.
第二区域中配置有方式选择键群,该方式选择键群包括,在恒定电流控制方式和恒定电压控制方式中任意选择的控制方式选择键和波形方式选择键,该波形方式选择键用于选择以选出的控制方式进行输出的电镀电流的波形方式;The mode selection key group is arranged in the second area, and the mode selection key group includes the control mode selection key and the waveform mode selection key arbitrarily selected in the constant current control mode and the constant voltage control mode, and the waveform mode selection key is used to select The waveform mode of the electroplating current output in the selected control mode;
第三区域中配置有数值显示部和旋转式编码器,该数值显示部用于显示电流值等数值,所述电流值等数值是按照由配置于所述第二区域的所述方式选择键群选择的方式进行设定的,所述旋转式编码器包括可旋转操作的旋转操作部,对应顺时针方向旋转或逆时针方向旋转的旋转操作,可加大或减小显示于所述数值显示部的所述数值。A numerical display unit and a rotary encoder are arranged in the third area, and the numerical display unit is used to display numerical values such as current values, which are selected from the group of keys according to the method arranged in the second area. If the selected method is set, the rotary encoder includes a rotary operation part that can be rotated, corresponding to the rotation operation of clockwise rotation or counterclockwise rotation, and can increase or decrease the value displayed on the numerical display part said value of .
由此,根据功能类别将操作键配置于三个区域,操作性大幅地提高,避免操作失误,且可进行高速操作。As a result, the operation keys are arranged in three areas according to the function category, the operability is greatly improved, operation errors can be avoided, and high-speed operation can be performed.
附图说明Description of drawings
图1为,本发明的实施方式中电镀用电源装置的操作板的正面图;FIG. 1 is a front view of an operation panel of a power supply unit for electroplating in an embodiment of the present invention;
图2为,电镀用电源装置的线路图;Figure 2 is a circuit diagram of a power supply device for electroplating;
图3为,表示通过波形方式选择键选择的电镀电流的波形方式图;Fig. 3 is, represents the waveform mode diagram of the electroplating current selected by the waveform mode selection key;
图4为,表示电镀用电源装置并列工作时的同期输出特性图;Fig. 4 is a graph showing the synchronous output characteristics when the power supply devices for electroplating are operated in parallel;
图5为,现有的电镀用电源装置的操作板的正面图。Fig. 5 is a front view of an operation panel of a conventional power supply unit for electroplating.
具体实施方式Detailed ways
图1为,本发明的实施方式中电镀用电源装置的操作板的正面图。FIG. 1 is a front view of an operation panel of a power supply unit for electroplating in an embodiment of the present invention.
在图1中,操作板被分为第一区域P1、第二区域P2、以及第三区域P3。In FIG. 1, the operation panel is divided into a first area P1, a second area P2, and a third area P3.
所述的第三区域P3中设置有数字显示部300。数字显示部300为4位数显示的LED,在上下两段上分别具有4位数的显示部,上段显示部和下段显示部都可切换显示电流A以及电压V。在数字显示部300的下侧设置有包括旋转操作部的旋转式编码器(微调刻度盘:ジョグダィャル)410。旋转式编码器410由微调刻度盘构成,该微调刻度盘可对旋转操作部实施旋转操作和推进操作(プッシュ)的两个方向的操作。每次进行推进操作时可以变化所指定的数字显示部300所显示的数值的位,通过顺时针方向旋转或逆时针方向旋转的旋转操作,可加大或减小由推进操作所指定的位的数值。由此,可以通过单手操作,更快更准确地完成上述数值的变更。作为微调刻度盘,可以使用例如特开平6-178371号公报中公开的微调刻度盘。The
在数字显示部300的右侧配置有显示单位灯301。显示单位灯301指定显示在数字显示部300的数值单位,在内部设置有作为背面光的LED,由通过LED点灯使得文字浮出的膜片开关构成。通过按压膜片开关,设置于该膜片开关内的LED点亮而文字浮出。在各个开关上预先印刷有的文字,即,通过按压而浮出的文字有A(安培)、%、H(小时)、M(分钟)、S(秒)。因此,明确地知道显示于数字显示部300的数值单位,避免数值设定错误,可以迅速正确地进行数值设定。进而,在显示单位灯301的右侧设置有用于复位显示于数字显示部300的数字的复位键400。A
以上的数字显示部300、显示单位灯301、旋转式编码器(微调刻度盘:ジョグダィャル)410、以及复位键400,它们相互靠近配置于第三区域P3上。The above
第二区域P2相邻于第三区域P3而设置。The second region P2 is disposed adjacent to the third region P3.
在第二区域P2上配置有,由包括操作方式选择键510、波形方式选择键520、CC(恒定电流)/CV(恒定电压)方式选择键530、显示方式选择键540、本体/远程选择键550的各种方式选择键所构成的方式选择键群,设置键360和清零键370。The second area P2 is equipped with operation
操作方式选择键510在作为操作方式的正常(ノ一マル)、存储、图像(パタ一ン)操作等中任意地选择.每个操作方式的键的内部也设置有LED,通过按压该键切换各种操作模式,同时显示相对应的LED.其他的上述各种方式选择键也与操作方式选择键510相同,也为通过按压该键的方式切换各种操作模式,同时显示相对应的LED的结构.波形方式选择键520选择电镀电流的波形方式(波形形状).图3表示波形方式.在这里,列举有图3(a)~(d)所示那样的四种类型的波形方式.CC(恒定电流)/CV(恒定电压)方式选择键530可以选择恒定电流控制方式(CC)和恒定电压控制方式(CV)中任意选择.The operation
将以上的方式选择键群集中地配置于一个区域(第二区域P2)内。The group of mode selection keys described above is concentratedly arranged in one area (second area P2).
进而,第一区域P1相邻于第二区域P2而设置。在第一区域P1上设置有输出ON/OFF键350。在输出ON/OFF键350的内部设置有LED,通过按压切换输出ON和输出OFF状态,在输出ON的状态下显示LED。Furthermore, the first region P1 is provided adjacent to the second region P2. An output ON/
如上所述,将操作板区分为第一区域P1、第二区域P2、第三区域P3,在第一区域P1上设置有输出ON/OFF键35,在第二区域P2上配置方式选择键群,在第三区域P3上配置包括数值设定用旋转式编码器410和数字显示部300的数字输入部,由此,各个区域分别设定为,第一区域P1为输出ON/OFF功能,第二区域P2为各种选择方式选择功能,第三区域P3为数字输入功能。As mentioned above, the operation panel is divided into the first area P1, the second area P2, and the third area P3, the output ON/
因此,被区分的各个区域,其功能也不同,此外,输入数值(电流值、电压值、波形)的操作容易,且正确迅速。Therefore, the function of each divided area is also different, and the operation of inputting numerical values (current value, voltage value, waveform) is easy and correct and quick.
设置于电镀操作现场的电源装置的显示部,由于灰尘落在其上面,因此,很难看清楚,在这种环境下要求良好的视认性(視認性),如本实施例那样,操作板按照功能来区分开来,且通过使用旋转式编码器和LED内藏键,在恶劣的环境下也能够提高视认性。The display unit of the power supply unit installed at the electroplating operation site is difficult to see due to dust falling on it. In this environment, good visibility (visibility) is required. As in this embodiment, the operation panel follows Functions are distinguished, and by using rotary encoders and LED built-in keys, visibility can be improved even in harsh environments.
图2表示上述电镀用电源装置的线路。Fig. 2 shows the wiring of the above-mentioned power supply device for electroplating.
连接于商用电源1的第一电源装置71具备第一整流电路21、第一高频变化器31、第一PWM信号发生器61,切换恒定电流控制和恒定电压控制,从输出端子100输出电镀电流。4为高频变压器,5为输出整流电路。操作板9与控制电路相连接,且具备输出并记忆输出波形的CPU。示于图3的(a)、(b)、(c)、(d)的电流波形中,选出的波形电流被输出。The first power supply unit 71 connected to the commercial power supply 1 is equipped with a first rectifier circuit 21, a first high-frequency inverter 31, and a first PWM signal generator 61, switches between constant current control and constant voltage control, and outputs a plating current from an output terminal 100. . 4 is a high-frequency transformer, and 5 is an output rectifier circuit. The operation panel 9 is connected to a control circuit, and includes a CPU that outputs and stores output waveforms. Among the current waveforms shown in (a), (b), (c), and (d) of FIG. 3 , selected waveform currents are output.
连接于商用电源1的第二电源装置72具备第二整流电路22、第二高频变化器32、第二PWM信号发生器62,切换恒定电流控制和恒定电压控制,从输出端子100输出电镀电流。对于第二电源装置72同样,从示于图3的(a)、(b)、(c)、(d)的电流波形中,选出的波形电流被输出。The second power supply device 72 connected to the commercial power supply 1 is equipped with a second rectifier circuit 22, a second high-frequency inverter 32, and a second PWM signal generator 62, switches between constant current control and constant voltage control, and outputs the plating current from the output terminal 100. . Similarly for the second power supply unit 72, a waveform current selected from the current waveforms shown in (a), (b), (c) and (d) of FIG. 3 is output.
所述的第一电源装置71与第二电源装置72并联(並列)连接。即,从各电源装置71、72的输出整流电路5的输出,通过二极管导入到输出端子100,两边的输出合成后再输出。The first power supply device 71 and the second power supply device 72 are connected in parallel (parallel). That is, the output from the output rectifying circuit 5 of each power supply device 71, 72 is introduced into the output terminal 100 through the diode, and the outputs of both sides are combined and then output.
该电镀用电源装置设置有上升(立ち上がり)信号同期电路6,该上升信号同期电路6连接到第一PWM信号发生器61和第二PWM信号发生器62上。操作上升信号同期线路6,使得第一电源装置71和所述第二电源装置的输出脉冲上升时间为同期。图4表示输出脉冲电流。图4(a)表示,随机发生所述第一电源装置71和所述第二电源装置的输出脉冲的上升时间的偏移,图4(b)表示,输出脉冲的上升时间的偏移为0.1毫秒以下。该电镀用电源装置是通过上升信号同期电路6的工作,如图4(b)所示那样控制,使两边的输出脉冲的上升时间之间没有偏移(同期)。这样,通过控制并联的2台电源装置的输出时间一致的上升,合成的电镀电流不存在脉冲波形变形。另外,可以消除并联运转时的循环电流的流失等内部消耗等。当偏移较大时,输出电流波的并联(並列)合成波在上升和下降中成为阶梯状的波形。This power supply device for electroplating is provided with a rise signal synchronization circuit 6 connected to a first PWM signal generator 61 and a second PWM signal generator 62 . The synchronous line 6 of the rising signal is operated so that the rising time of the output pulses of the first power supply device 71 and the second power supply device are synchronous. Figure 4 shows the output pulse current. Fig. 4 (a) shows that the offset of the rise time of the output pulse of the first power supply device 71 and the second power supply device occurs randomly, and Fig. 4 (b) shows that the offset of the rise time of the output pulse is 0.1 milliseconds or less. This power supply device for electroplating is controlled as shown in FIG. 4( b ) by the operation of the rising signal synchronization circuit 6 so that there is no shift (synchronization) between the rising times of the output pulses on both sides. In this way, by controlling the rise of the outputs of the two parallel-connected power supply devices at the same time, there is no pulse waveform distortion in the synthesized electroplating current. In addition, internal consumption such as loss of circulating current during parallel operation can be eliminated. When the offset is large, the parallel (parallel) composite wave of the output current wave becomes a stepped waveform during rising and falling.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005135167 | 2005-05-06 | ||
| JP2005135167A JP4680664B2 (en) | 2005-05-06 | 2005-05-06 | Plating power supply |
| JP2005-135167 | 2005-05-06 |
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| CN1865523A CN1865523A (en) | 2006-11-22 |
| CN1865523B true CN1865523B (en) | 2010-05-12 |
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| KR (1) | KR101137659B1 (en) |
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| CN102609065A (en) | 2011-01-19 | 2012-07-25 | 鸿富锦精密工业(深圳)有限公司 | Over-current protection device |
| US9397514B2 (en) | 2013-03-15 | 2016-07-19 | Bakercorp | DC power signal generation for electro-chemical reactor |
| CN105040087B (en) * | 2015-07-08 | 2017-05-03 | 东北石油大学 | Method and device used for optimizing electroplating parameters in laboratory |
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| CN87107414A (en) * | 1987-04-14 | 1988-09-14 | 华中工学院 | Electroplating technology and parameter microcomputer control system |
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| JPH0745568Y2 (en) * | 1989-12-28 | 1995-10-18 | マツダ株式会社 | Electro-deposition coating device |
| JP4666323B2 (en) * | 2000-10-20 | 2011-04-06 | 株式会社三社電機製作所 | Power supply for high-speed current reversal plating |
| JP4773002B2 (en) * | 2001-08-17 | 2011-09-14 | 株式会社三社電機製作所 | Plating power supply |
| JP3877649B2 (en) * | 2002-06-17 | 2007-02-07 | 大阪瓦斯株式会社 | control panel |
| JP2003214939A (en) | 2002-12-04 | 2003-07-30 | Seirei Ind Co Ltd | Operation panel for automatic grain weighing apparatus |
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2005
- 2005-05-06 JP JP2005135167A patent/JP4680664B2/en not_active Expired - Fee Related
-
2006
- 2006-04-27 CN CN2006100789107A patent/CN1865523B/en not_active Expired - Lifetime
- 2006-05-01 TW TW095115477A patent/TWI363472B/en not_active IP Right Cessation
- 2006-05-08 KR KR1020060040921A patent/KR101137659B1/en not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN87107414A (en) * | 1987-04-14 | 1988-09-14 | 华中工学院 | Electroplating technology and parameter microcomputer control system |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI363472B (en) | 2012-05-01 |
| JP2006312758A (en) | 2006-11-16 |
| CN1865523A (en) | 2006-11-22 |
| TW200703855A (en) | 2007-01-16 |
| KR101137659B1 (en) | 2012-04-20 |
| KR20060115665A (en) | 2006-11-09 |
| JP4680664B2 (en) | 2011-05-11 |
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