CN1966258A - Surface covering and method of manufacture - Google Patents

Abstract

A surface covering is suitable for covering the surface of a shell and comprises a supporting layer, a leather layer and a resin layer. The supporting layer is in a preset shape and is provided with a first surface and a second surface which are opposite. In addition, the cortical layer is arranged on the first surface of the supporting layer, the resin layer is arranged on the second surface of the supporting layer, and the resin layer is suitable for being attached to the surface of the shell. In addition, the invention also provides a manufacturing method of the surface covering.

Description

Surface covering and method of manufacture

technical field

The invention relates to a surface covering and a manufacturing method thereof, in particular to a surface covering that can be flatly attached to a three-dimensional curved surface and a manufacturing method thereof.

Background technique

In today's era of information explosion, human life is closely related to electronic products, especially small portable electronic products such as mobile phones, personal digital assistants (PDAs) and notebook computers. The shells of these electronic products are mostly made of plastic or metal, and the appearance of the shells of each product varies mostly in shape and color. However, after considering the function and volume of electronic products, the change in shape and color extremely limited. Therefore, generally speaking, electronic products of the same type are mostly similar in appearance.

Because the uneven texture of the cortical surface has the characteristics of beauty, uniqueness and friction resistance, the surface of many items is covered with a cortical layer to make the item look more beautiful. Therefore, in the known technology, some people also stick the cortical layer on the electronic product.

FIG. 1 is a schematic cross-sectional view of a known electronic product covered with a cortical layer. Please refer to FIG. 1 , in the known technology, the cortical layer 110 with patterns and soft material is directly attached to the surface of the shell S of the electronic product, wherein there will be a gap between the cortical layer 110 and the surface of the shell S of the electronic product. resin layer 112 . Generally speaking, when the surface to which the cortical layer 110 is attached is a two-dimensional plane, the cortical layer 110 can be attached to the surface evenly. However, if the surface to which the cortical layer 110 is attached is a three-dimensional arc surface or a three-dimensional curved surface of other shapes, the cortical layer 110 is often unable to be attached to the surface smoothly, that is, the cortex attached to the shell S Layer 110 is prone to wrinkles.

In addition, at the edge A of the cortical layer 110 , it is easy to cause the edge of the cortical layer 110 to warp due to poor attachment or the user frequently touches the edge of the cortical layer 110 , and in severe cases, the cortical layer 110 may fall off in one piece.

Contents of the invention

The purpose of the present invention is to provide a surface covering to solve the problem that the known technology cannot evenly attach the cortex layer to the three-dimensional curved surface.

Another object of the present invention is to provide a method for manufacturing a surface covering to manufacture a surface covering that can flatly cover a three-dimensional curved surface.

To achieve the above or other purposes, the present invention provides a surface covering suitable for covering the surface of the casing, and the surface covering includes a supporting layer, a cortical layer and a resin layer. Wherein, the support layer has a predetermined shape, and the support layer has a first surface and a second surface opposite to each other. In addition, the cortex layer is disposed on the first surface of the support layer, and the resin layer is disposed on the second surface of the support layer, and the resin layer is suitable for being attached to the surface of the casing.

In one embodiment of the present invention, the above-mentioned surface covering further includes an edge coating layer, which covers the edges of the cortical layer, the support layer and the resin layer.

In one embodiment of the present invention, the edge of the above-mentioned supporting layer is in a stepped structure, which can make the exposed part of the surface of the cladding layer be located on the extension surface of the exposed surface of the cortical layer.

In one embodiment of the present invention, the material of the above-mentioned edge covering layer may be thermoplastic rubber or thermoplastic polyurethane.

In an embodiment of the present invention, the melting point of the edge covering layer is lower than the melting points of the cortex layer, the resin layer and the supporting layer.

In one embodiment of the present invention, the above-mentioned surface covering further includes an adhesive layer disposed between the supporting layer and the resin layer.

In one embodiment of the present invention, the material of the above-mentioned support layer may be plastic.

The invention proposes a method for manufacturing a surface covering, which includes the following steps: firstly, a cortical layer is placed on the first surface of the supporting layer. The cortical layer is then molded together with the support layer to form a predetermined shape. Afterwards, a resin layer is formed on the second surface of the supporting layer opposite to the first surface.

In an embodiment of the present invention, the method for manufacturing the above-mentioned surface covering further includes forming an edge coating layer at the common edge of the cortex layer, the support layer and the resin layer.

In one embodiment of the present invention, in the method for manufacturing the above-mentioned surface covering, the method of forming the edge covering layer may be injection molding or casting molding.

In an embodiment of the present invention, in the above-mentioned method of manufacturing the surface covering, before forming the resin layer, it further includes coating an adhesive layer on the second surface of the supporting layer.

In one embodiment of the present invention, in the above method of manufacturing the surface covering, the method of forming the resin layer may be injection molding.

In the surface covering of the present invention, the cortical layer is disposed on the support layer, and the support layer has a predetermined shape corresponding to the surface of the casing. Thus, the cortical layer will be shaped by the support layer to have a shape corresponding to the shell surface. In this way, the entire surface covering can be evenly attached to the surface of the casing. In addition, the edge covering layer wraps the edges of the cortical layer, support layer and resin layer, thus effectively preventing the edge of the surface covering from lifting.

In order to make the above and other objects, features and advantages of the present invention more comprehensible, preferred embodiments are specifically cited below and described in detail with accompanying drawings.

Description of drawings

FIG. 1 is a schematic cross-sectional view of a known cortical layer attached to an electronic product casing.

2A to 2C are sequential schematic diagrams of the manufacturing process of the surface covering of the present invention.

Figure 3 is a schematic illustration of an edge covering of the present invention.

FIG. 4 is a schematic diagram of the surface covering of FIG. 3 attached to the housing. Description of main component marking

110, 210: Cortical layer

112: Resin

200: surface covering

212: supporting layer

212a: first surface

212b: second surface

214: resin layer

216: Adhesive layer

218: Edge cladding

A: At the edge of the cortex

B: stepped structure

S: Shell

S1: Shell

Detailed ways

2A to 2C are schematic diagrams of the manufacturing process of the surface covering according to an embodiment of the present invention. Please refer to FIG. 2A first, the manufacturing method of the surface covering in this embodiment includes the following steps: firstly, disposing the cortical layer 210 on the first surface 212 a of the supporting layer 212 . In this embodiment, the cortical layer 210 can be pasted on the first surface 212a of the support layer 212 by sticking. In addition, the material of the supporting layer 212 may be plastic.

Then, referring to FIG. 2B , the cortical layer 210 and the support layer 212 are molded together to form a predetermined shape. In practice, the above forming method can be formed by processing the forming mold, and the predetermined shape corresponds to the shape of the electronic product shell to be covered by the surface covering. The more common ones are flat, arc-shaped and curved surfaces, and of course it can also be are three-dimensional surfaces of other shapes. Generally speaking, the cortex layer 210 is relatively soft, and the support layer 212 made of plastic material is relatively elastic, which can be used to support the cortex layer 210 . Therefore, after the cortex layer 210 is molded together with the support layer 212 , the shape of the cortex layer 210 can be supported by the support layer 212 .

Next, please refer to FIG. 2C , a resin layer 214 is formed on the second surface 212b of the supporting layer 212 opposite to the first surface 212a. The above method of forming the resin layer 214 may be injection molding. In addition, the adhesive layer 216 can be coated on the second surface 212 b of the support layer 212 before forming the resin layer 214 , so as to facilitate the resin layer 214 to adhere closely to the support layer 212 . The material of the adhesive layer 216 can be an adhesive.

Up to now, the manufacture of the surface covering 200 can be preliminarily completed. The predetermined shape formed by the cortex layer 210 and the support layer 212 may correspond to the shape of the electronic product casing to be covered. Therefore, the surface covering 200 can be tightly and smoothly covered on the casing surface of the electronic product through the resin layer 214 without wrinkling.

Figure 3 is a schematic illustration of a surface covering according to another embodiment of the present invention. Referring to FIG. 3 , the difference between the surface covering 200 a of this embodiment and the surface covering 200 shown in FIG. 2C is that the surface covering 200 a also has an edge coating 218 . In more detail, in order to prevent the edge of the surface covering 200 a from warping, an edge covering layer 218 may be formed at the common edge of the cortex layer 210 , the supporting layer 212 and the resin layer 214 . Wherein, the material of the edge covering layer 218 is, for example, thermoplastic rubber (Thermal Plastic Rubber, TPR) or thermoplastic polyurethane (Thermoplastic Polyurethane, TPU). In addition, the method of forming the edge cladding layer 218 is, for example, injection molding or molding. It should be noted here that since the edge coating layer 218 is molded in a high temperature environment, in order to ensure that the cortex layer 210, the support layer 212 and the resin layer 214 will not be melted, the material of the edge coating layer 218 must be selected with a low melting point. The material is at the melting point of the cortex layer 210 , the resin layer 214 and the supporting layer 212 .

It is worth mentioning that, in order to make the exposed part of the surface of the edge covering layer 218 be located on the extension surface of the exposed surface of the cortical layer 210, so that the exposed part of the surface of the edge covering layer 218 and the exposed surface of the cortical layer 210 are smoothly bonded. , when the cortex layer 210 and the support layer 212 are formed into a predetermined shape, a stepped structure B can be formed at the edge of the support layer 212 .

FIG. 4 is a schematic diagram of the surface covering of FIG. 3 covering the housing. Please refer to FIG. 4 , the surface covering 200a of the present invention is suitable for covering the surface of a case S1 , which may be a shell of a common electronic device. The surface covering 200 a includes a supporting layer 212 , a cortical layer 210 and a resin layer 214 . Wherein, the supporting layer 212 has a predetermined shape, and the predetermined shape corresponds to the shape of the surface of the shell S1 to be attached. Specifically, the supporting layer 212 has a first surface 212a and a second surface 212b opposite to each other. In addition, the cortex layer 210 is disposed on the first surface 212 a of the supporting layer 212 , and the resin layer 214 is disposed on the second surface 212 b of the supporting layer 212 .

Since the supporting layer 212 has a shape corresponding to the shape of the housing S1 , the leather layer 210 and the resin layer 214 attached to the supporting layer 212 conform to the supporting layer 212 . In this way, no matter whether the surface of the casing S1 is a two-dimensional plane or a three-dimensional curved surface, the surface covering 200a can be smoothly attached to the surface of the casing S without wrinkles.

In addition, the edges of the cortical layer 210 , the supporting layer 212 and the resin layer 214 are covered by the edge coating layer 218 to prevent the edges of the surface covering 200 a from lifting. It is worth noting that, in order to make the exposed part of the surface of the edge coating layer 218 and the exposed surface of the cortical layer 210 smoothly bonded, a stepped structure B can be formed on the edge of the support layer 212, so that the exposed part of the edge coating layer 218 Part of the surface is located on an extension of the exposed surface of the cortical layer 210 . In addition, the adhesive layer 216 disposed between the support layer 212 and the resin layer 214 can make the resin layer 214 closely adhere to the support layer 212 .

To sum up, in the surface covering of the present invention, since the support layer has a shape corresponding to the surface of the casing, the cortical layer has a shape corresponding to the surface of the casing through the support of the support layer. Therefore, no matter whether the shell surface to be covered by the surface covering is a two-dimensional plane or a three-dimensional curved surface, the surface covering can be attached thereon evenly. In addition, the edges of the cortical layer, support layer and resin layer are covered by the edge covering layer, which can effectively prevent the edges of the surface covering from lifting.

Although the present invention has been disclosed as above with preferred embodiments, it is not intended to limit the present invention. Any professional in the technical field may make some changes and improvements without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention should be defined by the claims.

Claims (15)

1. surface covering is suitable for the surface of covering shell, it is characterized in that this surface covering comprises:

Supporting course is a predetermined shape, and this supporting course has opposite first and second surface;

Cortical layer is arranged on this first surface of this supporting course; And

Resin bed is arranged on this second surface of this supporting course, and wherein this resin bed is suitable for being attached on the surface of this housing.

2. surface covering according to claim 1 is characterized in that also comprising the edge clad, coats the edge of this cortical layer, this supporting course and this resin bed.

3. surface covering according to claim 2 is characterized in that the edge of this supporting course is the scalariform structure, so that the part surface that this edge clad exposes is positioned on the extended surface on the surface that this cortical layer exposes.

4. surface covering according to claim 2 is characterized in that the material of this edge clad comprises thermoplastic elastomer or thermoplastic poly amido formate.

5. surface covering according to claim 2 is characterized in that the fusing point of this edge clad is lower than the fusing point of this cortical layer, this resin bed and this supporting course.

6. surface covering according to claim 1 is characterized in that also comprising adhesion coating, and it is arranged between this supporting course and this resin bed.

7. surface covering according to claim 1 is characterized in that the material of this supporting course comprises plastics.

8. the manufacture method of a surface covering is characterized in that comprising:

Cortical layer is arranged on the first surface of supporting course;

With this cortical layer and the together moulding of this supporting course, to form a predetermined shape; And

On this supporting course and this first surface opposing second surface, form resin bed.

9. the manufacture method of surface covering according to claim 8 is characterized in that also comprising:

The edge common in this cortical layer, this supporting course and this resin bed forms the edge clad.

10. the manufacture method of surface covering according to claim 9 is characterized in that the method that forms this edge clad comprises ejection formation or moldings formed therefrom.

11. the manufacture method of surface covering according to claim 9 is characterized in that the fusing point of this edge clad is lower than the fusing point of this cortical layer, this resin bed and this supporting course.

12. the manufacture method of surface covering according to claim 9 is characterized in that the material of this edge clad comprises thermoplastic elastomer or thermoplastic poly amido formate.

13. the manufacture method of surface covering according to claim 8 is characterized in that being coated with adhesion coating on this second surface that also is included in this supporting course before this resin bed of formation.

14. the manufacture method of surface covering according to claim 8 is characterized in that the method that forms this resin bed comprises ejection formation.

15. the manufacture method of surface covering according to claim 8 is characterized in that the material of this supporting course comprises plastics.

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