CN201501059U - Resin mould cooling mechanism - Google Patents
Resin mould cooling mechanism Download PDFInfo
- Publication number
- CN201501059U CN201501059U CN200920048287XU CN200920048287U CN201501059U CN 201501059 U CN201501059 U CN 201501059U CN 200920048287X U CN200920048287X U CN 200920048287XU CN 200920048287 U CN200920048287 U CN 200920048287U CN 201501059 U CN201501059 U CN 201501059U
- Authority
- CN
- China
- Prior art keywords
- cooling water
- water pipe
- lower mold
- lower mould
- cooling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000011347 resin Substances 0.000 title claims abstract description 15
- 229920005989 resin Polymers 0.000 title claims abstract description 15
- 238000001816 cooling Methods 0.000 title claims abstract description 14
- 239000000498 cooling water Substances 0.000 claims abstract description 37
- 238000007789 sealing Methods 0.000 claims description 7
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 238000007664 blowing Methods 0.000 abstract 2
- 238000010924 continuous production Methods 0.000 abstract 1
- 238000000465 moulding Methods 0.000 abstract 1
- 239000007789 gas Substances 0.000 description 12
- 239000000112 cooling gas Substances 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
Images
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
The utility model relates to a resin mould cooling mechanism which comprises a lower mould bottom plate, a lower mould body, a cooling water pipe connector, a cooling air pipe connector and a cooling water pipe; the lower mould body is fixedly arranged on the lower mould bottom plate; the space of the back cavity of the lower mould body and the lower mould bottom plate is sealed; the cooling water pipe is laid between the back cavity of the lower mould body and the lower mould bottom plate; a certain spacing is left between the cooling water pipe and the molding surface of the lower mould body; both ends of the cooling water pipe are respectively connected with the cooling water pipe connector, for the flowing in and out of cooling water; the lower mould body is provided with a blowing hole; compressed air is fed into the back cavity of the lower mould body through the cooling air pipe connector, and escapes from the blowing hole. The resin mould cooling mechanism has reasonable structure, cools a mould through the common action of a cooling waterway and a cooling air path, can effectively reduce the temperature of the mould and reduce the instability of the product caused by mould deformation caused by temperature rise, and simultaneously, can facilitate continuous production, save the production time and improve the production efficiency.
Description
Technical field
The utility model belongs to the mould structure technical field, specifically relates to a kind of cooling body that is applicable to the hot material series products of cold mould resin dies such as automobile ceiling, luggage case decoration, carpet, back-shelf board.
Background technology
At present, at automotive development in earlier stage, some interior products need be constantly perfect to product according to actual entrucking according to data creating, often needs out resin die that product design is verified, entrucking is carried out formal mould input after confirming.Often also tackle for the product that some output are less with resin die.The resin die heat radiation is slower, is unfavorable for the stability of product quality, is unfavorable for the continuity of production.
Summary of the invention
The purpose of this utility model is to overcome weak point of the prior art, thereby provides a kind of rational in infrastructure, can reduce the resin die surface temperature, shortens to guarantee that product can be produced continuously and stay-in-grade resin die cooling body cool time.
The purpose of this utility model realizes by following technical scheme: described resin die cooling body comprises baffle plate, lower mold body, cooling water pipe joint, cold gas pipe joint and cooling water pipe down, lower mold body is fixedly mounted on down on the baffle plate, seal between lower mold body back of the body chamber and the following baffle plate, cooling water pipe is laid between lower mold body back of the body chamber and the following baffle plate, the profile of cooling water pipe and lower mold body leaves a determining deviation, the cooling water pipe two ends connect the cooling water pipe joint respectively, are used for the inflow and outflow of cooling water; Offer gas hole on the described lower mold body, compressed air feeds in the lower mold body back of the body chamber via the cold gas pipe joint, and overflows in gas hole.
As further improvement of the utility model, the spacing of the profile of described cooling water pipe and lower mold body is 20mm.
As further improvement of the utility model, between described lower mold body and the following baffle plate sealing gasket is housed, make lower mold body back of the body chamber and following baffle plate sealing.
The utility model is rational in infrastructure, by cooling water channel and the acting in conjunction of cooling gas circuit mould is cooled off, and can effectively reduce mold temperature, reduce temperature and increase the unstability that the generation die deformation causes product, simultaneously also can make the production serialization, save the production time, enhance productivity.
Description of drawings
Fig. 1 is a structural representation of the present utility model.
The specific embodiment
Below in conjunction with concrete drawings and Examples the utility model is further described.
The utility model is mainly assembled by following baffle plate 1, lower mold body 2, cooling water pipe joint 4, cold gas pipe joint 3 and cooling water pipe 5, offers gas hole 6 on the lower mold body 2.
During concrete the application, in the formed product process, cooling water feeds from a cooling water pipe joint 4, flow out from another cooling water pipe joint 4 via cooling water pipe 5, circulate in the cooling water pipe 5 of cooling water in lower mold body 2 back of the body chambeies, take the temperature that formed product produced out of lower mold body 2, reduce the resin die temperature, lower mold body 2 is cooled off.Formed product and take out after, compressed air feeds in lower mold body 2 back of the body chambeies via cold gas pipe joint 3, and overflows in gas hole 6, compressed air blows out the hot gas in the lower mold body 2 when overflowing and distributes, and further reduces lower mold body 2 temperature.
Claims (3)
1. resin die cooling body, comprise baffle plate (1) down, lower mold body (2), cooling water pipe joint (4), cold gas pipe joint (3) and cooling water pipe (5), it is characterized in that: described lower mold body (2) is fixedly mounted on down on the baffle plate (1), sealing between the back of the body chamber of lower mold body (2) and the following baffle plate (1), cooling water pipe (5) is laid between lower mold body (2) back of the body chamber and the following baffle plate (1), cooling water pipe (5) leaves a determining deviation with the profile of lower mold body (2), cooling water pipe (5) two ends connect cooling water pipe joint (4) respectively, are used for the inflow and outflow of cooling water; Offer gas hole (6) on the described lower mold body (2), compressed air feeds in lower mold body (2) back of the body chamber via cold gas pipe joint (3), and overflows in gas hole (6).
2. resin die cooling body according to claim 1, its feature also is: described cooling water pipe (5) is 20mm with the spacing of the profile of lower mold body (2).
3. resin die cooling body according to claim 1, its feature also is: between described lower mold body (2) and the following baffle plate (1) sealing gasket is housed, makes lower mold body (2) back of the body chamber and following baffle plate (1) sealing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200920048287XU CN201501059U (en) | 2009-09-03 | 2009-09-03 | Resin mould cooling mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200920048287XU CN201501059U (en) | 2009-09-03 | 2009-09-03 | Resin mould cooling mechanism |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201501059U true CN201501059U (en) | 2010-06-09 |
Family
ID=42451999
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200920048287XU Expired - Fee Related CN201501059U (en) | 2009-09-03 | 2009-09-03 | Resin mould cooling mechanism |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201501059U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103878960A (en) * | 2014-04-02 | 2014-06-25 | 福尔斯通电子(昆山)有限公司 | Mold water channel structure |
| CN104501488A (en) * | 2014-12-24 | 2015-04-08 | 苏州景联精密机械有限公司 | Quick cooling supporting plate |
-
2009
- 2009-09-03 CN CN200920048287XU patent/CN201501059U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103878960A (en) * | 2014-04-02 | 2014-06-25 | 福尔斯通电子(昆山)有限公司 | Mold water channel structure |
| CN104501488A (en) * | 2014-12-24 | 2015-04-08 | 苏州景联精密机械有限公司 | Quick cooling supporting plate |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100609 Termination date: 20100903 |