CN202425199U - Battery protection circuit board combining thick gold plating and organic solderability preservatives (OSP) - Google Patents
Battery protection circuit board combining thick gold plating and organic solderability preservatives (OSP) Download PDFInfo
- Publication number
- CN202425199U CN202425199U CN2012200136436U CN201220013643U CN202425199U CN 202425199 U CN202425199 U CN 202425199U CN 2012200136436 U CN2012200136436 U CN 2012200136436U CN 201220013643 U CN201220013643 U CN 201220013643U CN 202425199 U CN202425199 U CN 202425199U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- protection circuit
- battery protection
- thick gold
- osp
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000010931 gold Substances 0.000 title claims abstract description 34
- 229910052737 gold Inorganic materials 0.000 title claims abstract description 34
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 title claims abstract description 32
- 238000007747 plating Methods 0.000 title claims abstract description 5
- 239000003755 preservative agent Substances 0.000 title abstract 2
- 230000003064 anti-oxidating effect Effects 0.000 claims abstract description 8
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 7
- 229910052759 nickel Inorganic materials 0.000 claims description 4
- 238000007254 oxidation reaction Methods 0.000 abstract description 4
- 230000003647 oxidation Effects 0.000 abstract description 3
- 238000005299 abrasion Methods 0.000 abstract 1
- 230000002265 prevention Effects 0.000 abstract 1
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000004073 vulcanization Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
Description
技术领域 technical field
本实用新型属于线路板技术领域，涉及一种厚金与OSP结合的电池保护线路板。The utility model belongs to the technical field of circuit boards and relates to a battery protection circuit board combined with thick gold and OSP.
背景技术 Background technique
现有电镀普通金电池保护线路板金手指的厚度约为0.02UM，而电池保护板的金手指区域是手机电池与手机、充电器的直接接触点，所以会经常摩擦，普通的镀金在与其它金属直接摩擦后金层会脱落，且不能过盐雾及硝酸实验。随着人们对电子产品的轻、薄、短、小型化、多功能化方向发展，印制线路板向着高精密度、薄型化、多层化、小孔化方向发展，现有的电镀普通金电池保护线路板无法满足工艺的要求。The thickness of the gold finger of the existing electroplated ordinary gold battery protection circuit board is about 0.02UM, and the gold finger area of the battery protection board is the direct contact point between the mobile phone battery, the mobile phone and the charger, so it will often rub. The gold layer will fall off after the metal is directly rubbed, and it cannot pass the salt spray and nitric acid tests. With the development of light, thin, short, miniaturized, and multi-functional electronic products, printed circuit boards are developing in the direction of high precision, thinner, multi-layered, and small holes. The battery protection circuit board cannot meet the requirements of the process.
实用新型内容 Utility model content
本实用新型所要解决的技术问题是克服现有技术的不足，提供一种厚金与OSP结合的电池保护线路板，该厚金与OSP结合的电池保护线路板具有防氧化的优点，而且金手指及测试焊盘具有耐磨特性。The technical problem to be solved by the utility model is to overcome the deficiencies of the prior art and provide a battery protection circuit board combined with thick gold and OSP. The battery protection circuit board combined with thick gold and OSP has the advantage of anti-oxidation, and the gold finger and test pads have wear resistance properties.
实用新型的技术解决方案如下：The technical solution of the utility model is as follows:
一种厚金与OSP结合的电池保护线路板，在电池保护线路板的需要焊接的焊盘上均设置抗氧化膜；在电池保护线路板的金手指上依次设有镀镍层和镀厚金层。A battery protection circuit board combined with thick gold and OSP. An anti-oxidation film is provided on the pads of the battery protection circuit board that need to be welded; a nickel-plated layer and a thick gold-plated layer are sequentially provided on the gold fingers of the battery protection circuit board. layer.
在电池保护线路板的测试焊盘上依次设有镀镍层和镀厚金层。A nickel-plated layer and a thick gold-plated layer are sequentially provided on the test pad of the battery protection circuit board.
厚金为线路板技术领域的常用术语，OSP即抗氧化膜。Thick gold is a commonly used term in the field of circuit board technology, and OSP is an anti-oxidation film.
有益效果：Beneficial effect:
本实用厚金与OSP结合的电池保护线路板，由于采用厚金与OSP结合方式，因而该厚金与OSP结合的电池保护线路板具有防氧化的优点，而且金手指及测试焊盘具有耐磨特性。The battery protection circuit board combined with thick gold and OSP in the utility model adopts the combination method of thick gold and OSP, so the battery protection circuit board combined with thick gold and OSP has the advantage of anti-oxidation, and the gold fingers and test pads are wear-resistant characteristic.
附图说明 Description of drawings
图1是本实用新型的厚金与OSP结合的电池保护线路板的焊接面示意图；Fig. 1 is the schematic diagram of the welding surface of the battery protection circuit board combined with thick gold and OSP of the present invention;
图2为需要焊接的焊盘区域的剖面结构示意图；FIG. 2 is a schematic cross-sectional structure diagram of the pad area to be soldered;
图3为本实用新型的厚金与OSP结合的电池保护线路板的金手指外露面示意图。3 is a schematic diagram of the exposed surface of the gold finger of the battery protection circuit board combined with thick gold and OSP of the present invention.
图4为金手指及测试焊盘区域的剖面结构示意图；FIG. 4 is a schematic cross-sectional structure diagram of a gold finger and a test pad area;
标号说明：1-电池保护线路板，2-金手指及测试焊盘区域，3-需要焊接的焊盘区域，31-抗氧化膜，32-需要焊接的焊盘区域的铜层，21-镀厚金层，22-镀镍层，23-金手指及测试焊盘区域的铜层。Description of symbols: 1-battery protection circuit board, 2-gold finger and test pad area, 3-pad area to be soldered, 31-anti-oxidation film, 32-copper layer on the pad area to be soldered, 21-plating Thick gold layer, 22- nickel plating layer, 23- gold finger and copper layer in the test pad area.
具体实施方式 Detailed ways
以下将结合附图和具体实施例对本实用新型做进一步详细说明：The utility model will be described in further detail below in conjunction with accompanying drawing and specific embodiment:
如图1-4所示，一种厚金与OSP结合的电池保护线路板，在电池保护线路板的需要焊接的焊盘上均设置抗氧化膜；在电池保护线路板的金手指上依次设有镀镍层和镀厚金层。在电池保护线路板的测试焊盘上依次设有镀镍层和镀厚金层。As shown in Figure 1-4, a battery protection circuit board with a combination of thick gold and OSP is provided with an anti-oxidation film on the solder pads of the battery protection circuit board; Available in nickel plated and thick gold plated. A nickel-plated layer and a thick gold-plated layer are sequentially provided on the test pad of the battery protection circuit board.
本实用新型利用硬厚金的特性硬度达骆氏137度、韦氏83度以及0.5um金厚耐磨测试能力标准测试4500次露镍(一般标准为1000次)来改善电镀普通金摩擦后易脱落问题。利用OSP的特性防止氧化，OSP就是在洁净的裸铜表面上，以化学的方法长出一层有机皮膜(OSP为现有技术)。这层膜具有防氧化，耐热冲击，耐湿性，用以保护铜表面于常态环境中不再继续生锈(氧化或硫化等)；在后续的焊接高温中，此种保护膜很容易被助焊剂所迅速清除，可使露出的干净铜表面得以在极短的时间内与熔融焊锡立即结合成为牢固的焊点，且符合环保要求。The utility model utilizes the characteristic hardness of hard and thick gold up to 137 degrees of Luo's, 83 degrees of Webster's and 0.5um gold thickness wear-resisting test ability standard test 4500 times exposed nickel (the general standard is 1000 times) to improve the problem that electroplating common gold is easy to fall off after friction . Utilize the characteristics of OSP to prevent oxidation. OSP is to grow a layer of organic film chemically on the clean bare copper surface (OSP is a prior art). This layer of film has anti-oxidation, thermal shock resistance, and moisture resistance, and is used to protect the copper surface from rusting (oxidation or vulcanization, etc.) in a normal environment; The rapid removal of the flux allows the exposed clean copper surface to be immediately combined with the molten solder to form a firm solder joint in a very short period of time, and meets environmental protection requirements.
Claims (2)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012200136436U CN202425199U (en) | 2012-01-12 | 2012-01-12 | Battery protection circuit board combining thick gold plating and organic solderability preservatives (OSP) |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012200136436U CN202425199U (en) | 2012-01-12 | 2012-01-12 | Battery protection circuit board combining thick gold plating and organic solderability preservatives (OSP) |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202425199U true CN202425199U (en) | 2012-09-05 |
Family
ID=46749918
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012200136436U Expired - Lifetime CN202425199U (en) | 2012-01-12 | 2012-01-12 | Battery protection circuit board combining thick gold plating and organic solderability preservatives (OSP) |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202425199U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104066270A (en) * | 2014-07-02 | 2014-09-24 | 三星半导体(中国)研究开发有限公司 | Surface coating used for circuit board, pad and circuit board |
| US9504152B2 (en) | 2014-07-02 | 2016-11-22 | Samsung Electronics Co., Ltd. | Printed circuit board for semiconductor package |
| WO2022048011A1 (en) * | 2020-09-03 | 2022-03-10 | Tcl华星光电技术有限公司 | Light-emitting panel and manufacturing method therefor, and display panel |
-
2012
- 2012-01-12 CN CN2012200136436U patent/CN202425199U/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104066270A (en) * | 2014-07-02 | 2014-09-24 | 三星半导体(中国)研究开发有限公司 | Surface coating used for circuit board, pad and circuit board |
| US9504152B2 (en) | 2014-07-02 | 2016-11-22 | Samsung Electronics Co., Ltd. | Printed circuit board for semiconductor package |
| WO2022048011A1 (en) * | 2020-09-03 | 2022-03-10 | Tcl华星光电技术有限公司 | Light-emitting panel and manufacturing method therefor, and display panel |
| US11817461B2 (en) | 2020-09-03 | 2023-11-14 | Tcl China Star Optoelectronics Technology Co., Ltd. | Light-emitting panel, method manufacturing the same, and display device having the same with connection portion |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20120905 |
|
| CX01 | Expiry of patent term |