CN202425200U - Double-sided circuit board - Google Patents

Abstract

The utility model discloses a double-sided circuit board, it is including a base plate, be equipped with a circuit layer on two opposite flanks of this base plate respectively, and be equipped with the through hole that runs through base plate and circuit layer on this double-sided circuit board, and set up the conducting layer at the pore wall of through hole, and the conducting layer further lateral extension to the lateral surface of circuit layer at the opening part of neighbouring through hole, this double-sided circuit board is equipped with the solder mask on the lateral surface of circuit layer, wherein, the circuit layer of base plate both sides can be connected to the conducting layer, can provide electrically conductive, the function of heat conduction, and the solder mask can provide the function of protection to the circuit layer.

Description

double sided circuit board

technical field

The utility model relates to a double-sided circuit board, in particular to a double-sided circuit board which is provided with a conductive layer for conducting electricity and provided with a solder-proof layer for protection.

Background technique

The existing double-sided circuit board includes a substrate, and a circuit layer is respectively arranged on two opposite sides of the substrate, wherein the two circuit layers of the double-sided circuit board cannot be connected by lines, and there is no protective layer outside the circuit layer to provide protection. Protection, so it has the problems of limited wiring and poor protection.

Utility model content

The technical problem to be solved by the utility model is to provide a double-sided circuit board to improve the problems of limited circuit wiring and poor protection of the double-sided circuit board.

The technical solution of the present invention is to provide a double-sided circuit board, which includes a substrate, a circuit layer is respectively provided on two opposite sides of the substrate, and a circuit layer is provided on the double-sided circuit board to penetrate the substrate and the circuit layer. The through hole is provided with a conductive layer on the hole wall of the through hole, and the conductive layer further extends laterally to the outer surface of the circuit layer adjacent to the opening of the through hole, and the double-sided circuit board is equipped with an anti- solder layer.

In the above-mentioned double-sided circuit board, an insulating layer can be provided on the conductive layer exposed to the through hole, and the insulating layer can extend to the solder mask layer. In addition, the conductive layer can be a component made of copper glue conductive ink. In addition , the double-sided circuit board can be provided with an electroplating layer outside the circuit layer, and the electroplating layer extends to the hole wall of the through hole.

The utility model has the advantages that: the conductive layer can connect the circuit layers on both sides of the substrate, can provide the functions of electric conduction and heat conduction, and the solder resist layer can provide protection for the circuit layer.

Description of drawings

FIG. 1 is a schematic side view cross-sectional view of the first embodiment of the double-sided circuit board of the present invention.

Fig. 2 is a schematic side view cross-sectional view of a second embodiment of the double-sided circuit board of the present invention.

FIG. 3 is a schematic side view cross-sectional view of a third embodiment of the double-sided circuit board of the present invention.

FIG. 4 is a schematic side view cross-sectional view of a fourth embodiment of the double-sided circuit board of the present invention.

Fig. 5 and Fig. 6 show the cross-sectional schematic diagrams of the double-sided circuit board of the present invention with electroplating layer.

Explanation of reference numbers:

10 substrate 11 circuit layer

12 Through hole 13 Conductive layer

14 solder mask 15 groove

16 insulation layer 17 plating layer.

Detailed ways

In the following, the technical means adopted by the utility model for realizing the intended purpose of the invention will be further elaborated in conjunction with the preferred embodiments of the drawings and the utility model.

1 to 4, the double-sided circuit board includes a substrate 10, a circuit layer 11 is respectively provided on two opposite sides of the substrate 10, and a circuit layer 11 is provided on the double-sided circuit board through the substrate 10 and the circuit layer 11. The through hole 12 is provided with a conductive layer 13 on the wall of the through hole 12, and the conductive layer 13 further extends laterally to the outer surface of the circuit layer 11 adjacent to the opening of the through hole 12, and the conductive layer 13 covers part of the circuit layer 11, The section of the conductive layer 13 at the through hole 12 is shaped like a rivet, and the double-sided circuit board is provided with a solder resist layer 14 on the outer surface of the circuit layer 11 . In the above structure, the conductive layer 13 is a component made of copper glue conductive ink. 5 and 6, the double-sided circuit board is provided with an electroplating layer 17 outside the circuit layer 11, and the electroplating layer 17 extends to the hole wall of the through hole 12, and the electroplating layer 17 located in the through hole 12 is interposed between the substrate. 10 and the conductive layer 13, wherein the electroplating layer 17 can improve the heat conduction and heat dissipation performance of the double-sided circuit board.

Please refer to FIG. 3 , FIG. 4 , and FIG. 6 , the circuit layer 11 on the substrate 10 may be an integrally formed component. Or as shown in FIG. 1, FIG. 2, and FIG. 5, the circuit layer 11 is provided with a groove 15 adjacent to the through hole 12, wherein the conductive layer 13 extends to cover the circuit layer between the through hole 12 and the groove 15. 11 , and the solder resist layer 14 covers the circuit layer 11 around the groove 15 , and the solder resist layer 14 extends into the groove 15 . Referring also to FIG. 3 and FIG. 4 , the solder resist layer 14 is adjacent to the conductive layer 13 . In addition, referring to FIG. 2 and FIG. 4 , an insulating layer 16 is disposed on the conductive layer 13 exposed from the through hole 12 . In FIG. 4, the insulating layer 16 extends to the solder resist layer 14. In FIG. 2, the insulating layer 16 covers the conductive layer 13 exposed in the through hole 12, and extends into the groove 15 and covers the solder resist layer. 14.

In summary, the double-sided circuit board is provided with through-holes 12, and the conductive layer 13 with good electrical and thermal conductivity at the through-holes 12 can be electrically connected to the circuit layers 11 on both sides of the substrate 10 to play Good electrical and thermal conductivity, and the electroplating layer 17 can provide thermal conductivity to receive good heat dissipation, and the solder resist layer 14 is provided outside the circuit layer 11 to provide protection for the circuit layer 11 .

The above descriptions are only preferred embodiments of the utility model, and are not intended to limit the utility model in any form. Although the utility model has been disclosed as above with preferred embodiments, it is not intended to limit the utility model, and belongs to the field Those of ordinary skill who do not depart from the scope of the technical solution of the utility model can use the technical content disclosed above to make some changes or modify them into equivalent embodiments with equivalent changes, but all those that do not deviate from the technical solution of the utility model Content, any simple modifications, equivalent changes and modifications made to the above embodiments according to the technical essence of the utility model still belong to the scope of the technical solution of the utility model.

Claims (6)

1. a double-sided PCB is characterized in that,

This double-sided PCB includes a substrate; Be respectively equipped with a circuit layer on the two relative side of this substrate; And this double-sided PCB is provided with the perforation that runs through substrate and circuit layer; And conductive layer is set at the hole wall of perforation, and conductive layer further extends laterally to the lateral surface of circuit layer in the opening part of contiguous perforation, and this double-sided PCB is provided with welding resisting layer in the lateral surface of circuit layer.

2. double-sided PCB according to claim 1 is characterized in that the conductive layer that exposes to perforation is provided with insulating barrier.

3. double-sided PCB according to claim 2 is characterized in that insulating barrier extends to welding resisting layer.

4. according to each described double-sided PCB in the claim 1 to 3, it is characterized in that said conductive layer is the parts that copper glue electrically conductive ink is processed.

5. according to each described double-sided PCB in the claim 1 to 3, it is characterized in that this double-sided PCB is provided with an electrodeposited coating outside circuit layer, and electrodeposited coating extends to the Kong Bi of perforation.

6. double-sided PCB according to claim 4 is characterized in that this double-sided PCB is provided with an electrodeposited coating outside circuit layer, and electrodeposited coating extends to the Kong Bi of perforation.

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