CN202425276U - Cooling module with loop vapor chamber - Google Patents
Cooling module with loop vapor chamber Download PDFInfo
- Publication number
- CN202425276U CN202425276U CN2011205488210U CN201120548821U CN202425276U CN 202425276 U CN202425276 U CN 202425276U CN 2011205488210 U CN2011205488210 U CN 2011205488210U CN 201120548821 U CN201120548821 U CN 201120548821U CN 202425276 U CN202425276 U CN 202425276U
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- CN
- China
- Prior art keywords
- loop
- plate
- heat dissipation
- heat
- vapor chamber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000001816 cooling Methods 0.000 title abstract description 8
- 230000017525 heat dissipation Effects 0.000 claims abstract 21
- 238000010438 heat treatment Methods 0.000 claims 3
- 239000011324 bead Substances 0.000 claims 1
- 230000005855 radiation Effects 0.000 abstract description 37
- 230000000694 effects Effects 0.000 abstract description 10
- 239000012530 fluid Substances 0.000 description 23
- 238000009833 condensation Methods 0.000 description 15
- 230000005494 condensation Effects 0.000 description 15
- 239000007788 liquid Substances 0.000 description 14
- 125000006850 spacer group Chemical group 0.000 description 11
- 238000010276 construction Methods 0.000 description 8
- 239000003292 glue Substances 0.000 description 4
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 3
- 239000004411 aluminium Substances 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 229910052796 boron Inorganic materials 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 239000011135 tin Substances 0.000 description 3
- 229910052718 tin Inorganic materials 0.000 description 3
- 229910052725 zinc Inorganic materials 0.000 description 3
- 239000011701 zinc Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 230000012447 hatching Effects 0.000 description 2
- 238000010992 reflux Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Images
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- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model relates to a heat radiation module with a loop type uniform temperature plate, which comprises a heat radiation body, a loop type uniform temperature plate and a heat conducting medium; the heat radiation body is provided with an embedding groove; the loop type temperature-equalizing plate is arranged at a position corresponding to the caulking groove of the heat dissipation body, is completely covered by the heat dissipation body and is tightly connected with the heat dissipation body through a heat conduction medium, the loop type temperature-equalizing plate comprises an annular body, capillary tissues and a supporting structure, the annular body comprises a bottom plate and a cover plate which is covered corresponding to the bottom plate, a vacuum cavity is formed between the bottom plate and the cover plate, the capillary tissues are distributed along the inner surfaces of the cover plate and the bottom plate, and the supporting structure correspondingly presses the capillary tissues to be attached towards the cover plate and the bottom plate; a loop type temperature equalizing plate. The utility model provides a heat dissipation module with return circuit formula temperature-uniforming plate utilizes return circuit formula temperature-uniforming plate to allocate in one side of radiator, and each fixed plate allocates in the opposite side of return circuit formula temperature-uniforming plate, borrows this in order to reach the effect of cooling a plurality of working element heat sources.
Description
Technical field
The utility model relates to a kind of heat radiation module, refers to a kind of heat radiation module with loop-type temperature-uniforming plate especially.
Background technology
Because sci-tech product is day by day lightening; Therefore most electronic working elements must be set in narrow space; In order to make electronic component can remain on normal working temperature; To reach best operating efficiency and to prevent heat-induced damage, so the heat radiation of electronic component is significant design main points in sci-tech product.
Known heat radiation module mainly comprises a ring-type heat pipe and a radiator, and the ring-type inside heat pipe is provided with a capillary structure, and a side of ring-type heat pipe is the portion of being heated, and offside is a condensation part, and radiator is connected with the condensation part, and the electronic component of desire heat radiation is connected with the portion of being heated; After the thermal source of electronic component is passed to the capillary structure of the portion of being heated; After liquid working fluid in the capillary structure absorbs the thermal source of electronic component, be evaporated to gaseous working fluid, gaseous working fluid moves to the condensation part of ring-type heat pipe; Capillary structure through the condensation part is passed to radiator with thermal source; Do heat exchange through radiator and air and make the temperature decline of gaseous working fluid condense into liquid state, the capillary structure of the portion that is condensed absorbs, and utilizes capillarity that liquid working fluid is back to the portion of being heated; To take away the thermal source of electronic component once more, to reach circulating cooling effect.
Yet known heat radiation module has following shortcoming; Cooled liquid working fluid is back to the path of the portion of being heated from the condensation part long; Cause liquid working fluid in the path of refluxing, to do heat exchange with the external air of this path tube; The be heated temperature of liquid working fluid of portion that making refluxes is low inadequately, and can't take away heat-source energy as expected, makes the poor effect of cooling electronic components; So the heat radiation module can only cool off single electronic element, so if any the then necessary indivedual installing one heat radiation modules of most electronic components, and cause the heat radiation module in sci-tech product, to take too much spatial volume.
The utility model content
In view of this; The purpose of the utility model is to provide a kind of heat radiation module with loop-type temperature-uniforming plate; In order to amplexiform most heat-generating electronic elements on the circuit board; It utilizes the loop-type temperature-uniforming plate to be equipped on a side of radiator, reaches the opposite side that each fixed head is equipped on the loop-type temperature-uniforming plate, whereby to reach the effect of most heat-generating electronic elements thermals source of cooling.
In order to reach above-mentioned purpose, the utility model provides a kind of heat radiation module with loop-type temperature-uniforming plate, and said heat radiation module with loop-type temperature-uniforming plate comprises:
One radiator, it is provided with a caulking groove;
One heat-conducting medium; And
One loop-type temperature-uniforming plate, the caulking groove position of its corresponding radiator set and by the complete covering of said radiator, and connect airtight through heat-conducting medium and radiator, and said loop-type temperature-uniforming plate comprises a ring body, a capillary structure and a supporting construction; Said ring body comprises the cover plate that a base plate and corresponding said base plate cover, and between said base plate and cover plate, is formed with a vacuum chamber; Said capillary structure is laid along the inner surface of cover plate and base plate; Said supporting construction correspondence compresses capillary structure and amplexiforms towards the direction of cover plate and base plate.
As above-mentioned a kind of preferred version with heat radiation module of loop-type temperature-uniforming plate, wherein said cover plate outer surface is formed with a ring rib, and the ring rib correspondence is embedded in the caulking groove of radiator.
As above-mentioned a kind of preferred version with heat radiation module of loop-type temperature-uniforming plate, the caulking groove of wherein said radiator has and the corresponding shape of said ring rib profile, and the girth of caulking groove is greater than the girth of ring rib.
As above-mentioned a kind of preferred version with heat radiation module of loop-type temperature-uniforming plate, wherein said radiator most the fin of serving as reasons are arranged in a combination with equally spaced.
As above-mentioned a kind of preferred version with heat radiation module of loop-type temperature-uniforming plate, wherein said heat-conducting medium is processed by the heat-conducting glue or the scolder of argentiferous, aluminium, boron, zinc, tin or silicon composition.
In order to reach above-mentioned purpose, the heat radiation module that the utility model provides another kind to have the loop-type temperature-uniforming plate is installed on most heat-generating electronic elements on the circuit board, and said heat radiation module with loop-type temperature-uniforming plate comprises:
One radiator;
One heat-conducting medium;
One loop-type temperature-uniforming plate, a side of its corresponding radiator set and by the complete covering of said radiator, and connect airtight through heat-conducting medium and radiator, and said loop-type temperature-uniforming plate comprises a ring body, a capillary structure and a supporting construction; Said ring body is enclosed jointly by two long limits and two minor faces and constitutes a hollow rectangular shape, and is formed with a vacuum chamber in the inside of each long limit and each minor face; Said capillary structure is laid along the inner surface of each long limit and each minor face; Said supporting construction correspondence compresses capillary structure and amplexiforms towards each inner surface of growing limit and each minor face; And
A most fixed head; Its a part of fixed head is striden the bonding station of being located at each long limit and each minor face; The fixed head of another part is then striden and is located on each long limit, and each fixed head sets with the symmetrical, parallel Rankine-Hugoniot relations and affixed corresponding to the position of each said heat-generating electronic elements.
Have the preferred version of the heat radiation module of loop-type temperature-uniforming plate as above-mentioned another kind, wherein said ring body comprises a base plate and a cover plate, and the corresponding base plate of cover plate covers, and vacuum chamber is formed between base plate and the cover plate.
The preferred version that has the heat radiation module of loop-type temperature-uniforming plate as above-mentioned another kind; Wherein said lid surface is formed with a ring rib; Radiator also has and the corresponding caulking groove of ring rib shape; And the ring rib correspondence is embedded in the caulking groove of radiator, and the girth of caulking groove is greater than the girth of ring rib.
Have the preferred version of the heat radiation module of loop-type temperature-uniforming plate as above-mentioned another kind, the both sides of wherein said fixed head are extended with a pair of pin respectively, and each pin has a perforation respectively, and the perforation of corresponding each pin of radiator and be provided with most through holes.
The preferred version that has the heat radiation module of loop-type temperature-uniforming plate as above-mentioned another kind; Wherein said heat radiation module with loop-type temperature-uniforming plate also comprises most screws; Said circuit board also is provided with and each corresponding majority screw of boring a hole, and said heat-generating electronic elements is fixed on the fixed head through each screw that each screw is arranged in corresponding each through hole, each perforation and said circuit board.
Have the preferred version of the heat radiation module of loop-type temperature-uniforming plate as above-mentioned another kind, wherein said radiator most the fin of serving as reasons are arranged in a combination with equally spaced.
Have the preferred version of the heat radiation module of loop-type temperature-uniforming plate as above-mentioned another kind, wherein said heat-conducting medium is processed by the heat-conducting glue or the scolder of argentiferous, aluminium, boron, zinc, tin or silicon composition.
The heat radiation module with loop-type temperature-uniforming plate that the utility model provided is the flat-shaped ring body that a cover plate and a base plate combine through the loop-type temperature-uniforming plate, and reaches the effect of dwindling the volumetric spaces that takies of heat radiation module; Because of heat-conducting medium is a heat-conducting glue or high-termal conductivity scolder, can increase the thermal source transfer rate between loop-type temperature-uniforming plate and the radiator in addition, to promote the speed of cooling; In addition; Liquid working fluid is back to the path weak point of the portion of being heated in each spacer portion and condensation part; So liquid working fluid moves to and still possesses the low temperature that is equivalent to each spacer portion and condensation part when being heated portion, can take away the more thermal source of heat-generating electronic elements, promote the effect of cooling whereby.
Description of drawings
Fig. 1 is the three-dimensional exploded view of the utility model;
Fig. 2 is the loop-type temperature-uniforming plate profile of the utility model;
Fig. 3 is the combination section of the utility model;
Fig. 4 is the three-dimensional combination figure of the utility model;
Fig. 5 is another embodiment three-dimensional exploded view of the utility model;
Fig. 6 is another embodiment combination section of the utility model;
Fig. 7 is the working fluid flow regime figure in the utility model loop-type temperature-uniforming plate;
Fig. 8 is the profile of the utility model Fig. 7 along the A-A hatching.
[main element symbol description]
Radiator-10; Fin-11; Caulking groove-12; Through hole-13;
Loop-type temperature-uniforming plate-20; Ring body-21; Long limit-211; Minor face-212; Base plate-213; The portion-2131 of being heated; Cover plate-214; Condensation part-2141; Vacuum chamber-215; Ring rib-216; Spacer portion-217; Capillary structure-22; Supporting construction-23;
Heat-conducting medium-30;
Fixed head-40; Pin-41; Perforation-42;
Circuit board-50; Heat-generating electronic elements-51; Screw-52;
Working fluid-A;
Screw-S.
Embodiment
Detailed description of relevant the utility model and technology contents, conjunction with figs. are explained as follows, yet accompanying drawing only provides the usefulness of reference with explanation, are not to be used to limit the utility model.
Please with reference to Fig. 1 and shown in Figure 2; Be respectively the three-dimensional exploded view and the loop-type temperature-uniforming plate profile of the utility model; The utility model provides a kind of heat radiation module with loop-type temperature-uniforming plate, mainly comprises a radiator 10, a loop-type temperature-uniforming plate 20, a heat-conducting medium 30.
With parallel and equally spaced being arranged in a combination, radiator 10 is provided with a caulking groove 12 to radiator 10 by most fin 11.
Loop-type temperature-uniforming plate 20 is enclosed jointly by two long limits 211 and two minor faces 212 and forms the ring body 21 with a vacuum chamber 215; The cover plate 214 that ring body 21 comprises that a base plate 213, corresponding base plate 213 cover, be located in a capillary structure 22 and a supporting construction 23 in the vacuum chamber 215; Capillary structure 22 is laid along the internal face of cover plate 214 and base plate 213, and supporting construction 23 correspondences compress capillary structure 22 and amplexiform towards the internal face of cover plate 214 and base plate 213; In addition, loop-type temperature-uniforming plate 20 is by radiator 10 complete coverings, and caulking groove 12 positions of loop-type temperature-uniforming plate 20 corresponding radiators 10 set.
Please with reference to shown in Figure 3; Combination section for the utility model; Heat-conducting medium 30 can be the heat-conducting glue or the scolder of argentiferous, aluminium, boron, zinc, tin or silicon composition; Heat-conducting medium 30 is coated between the cover plate 214 and radiator 10 of ring body 21, and wherein heat-conducting medium 30 has the function of filling up the slight gap between loop-type temperature-uniforming plate 20 and the radiator 10, makes loop-type temperature-uniforming plate 20 and radiator 10 connect airtight through heat-conducting medium 30.
Please with reference to Fig. 4 and shown in Figure 5; Be respectively three-dimensional combination figure and another embodiment three-dimensional exploded view of the utility model; The heat radiation module also has most fixed heads 40 and most screw S; The mode that each fixed head 40 is arranged with symmetrical, parallel is incorporated into the outer surface of base plate 213; And partial fixing plate 40 is each long limit 211 and each minor face 212 of cross-over connections respectively, and another part fixed head 40 is positioned at the middle part on each long limit 211, each fixed head 40 away from a surface of base plate 213 respectively with circuit board 50 on most heat-generating electronic elements 51 corresponding connections; The both sides of fixed head 40 are extended with a pair of pin 41 respectively; Each pin 41 has a perforation 42 respectively; Radiator 10 is provided with most the through holes 13 that the perforation 42 with each pin 41 sets each other; Circuit board 50 is provided with and each 42 corresponding majority screw 52 of boring a hole; Be beneficial to screw S (as shown in Figure 6) and be arranged in through hole 13, perforation 42 and the screw 52 of circuit board 50, borrowing, each heat-generating electronic elements 51 firmly is connected on corresponding each fixed head 40 circuit board 50 and the solid mode of the heat radiation mutual spiral shell of module.
Please with reference to shown in Figure 6; Another embodiment combination section for the utility model; At first radiator 10 is covered on the loop-type temperature-uniforming plate 20 through heat-conducting medium 30 during use; Then each fixed head 40 is incorporated on the outer surface of base plate 213, each heat-generating electronic elements 51 is corresponding respectively to be connected on the surface of each fixed head 40 away from base plate 213, is arranged in the screw 52 of through hole 13, perforation 42 and circuit board 50 with screw at last; The module that will dispel the heat is fixed on the circuit board 50, and heat-generating electronic elements 51 firmly is connected on the heat radiation module.
Please with reference to Fig. 7 and shown in Figure 8; Be the working fluid flow regime figure in the loop-type temperature-uniforming plate of the utility model and Fig. 7 profile along the A-A hatching; At first the part of base plate 213 each heat-generating electronic elements 51 of connection is the portion of being heated 2131; And with the part of the cover plate 214 of its opposite position be a condensation part 2141, the part that ring body 21 is not connected with heat-generating electronic elements 51 is a spacer portion 217.When each heat-generating electronic elements 51 produces thermal source, transfer heat in the portion of being heated 2131 of base plate 213 through each fixed head 40 respectively, pass to the liquid working fluid A in the portion of being heated 2131 again, flash to gaseous working fluid A to absorb thermal source; The gaseous working fluid A of part moves toward the direction of condensation part 2141; The gaseous working fluid A of another part makes gaseous working fluid A via condensation part 2141 and each spacer portion 217 thermal source is passed to cover plate 214 because the relation of pressure differential then moves toward the spacer portion 217 of ring body 21; The back is because of being coated with heat-conducting medium 30 between cover plate 214 and the radiator 10; And heat-conducting medium 30 is a high-termal conductivity medium, makes cover plate 214 through heat-conducting medium 30 thermal source is passed to radiator 10 apace, and radiator 10 is done heat exchange with air; Thermal source is transmitted in the air, reaches the effect of heat radiation; Whereby, gaseous working fluid A in the condensation part 2141 and each spacer portion 217 condense into liquid working fluid A, and in portion 2141 and each spacer portion 217 that be condensed capillary structure 22 absorb; 2141 the part in the condensation part is back in the capillary structure 22 of the portion of being heated 2131 liquid working fluid A through capillarity, or flows back in the capillary structure 22 of the portion of being heated 2131 along supporting construction 23; Part in each spacer portion 217; Liquid working fluid A is refluxed be heated through capillarity in the capillary structure 22 of portion 2131; Or along supporting construction 23 from cover plate 214 capillary structure 22 flow in the capillary structure 22 of base plate 213, be back in the capillary structure 22 of the portion of being heated 2131 via capillarity at last.
So loop-type temperature-uniforming plate 20 can be simultaneously the low temperature liquid working fluid A of many places is transferred to the portion of being heated 2131 to cool off the temperature of each heat-generating electronic elements 51; So not only can promote the effect of heat radiation; More can reduce the temperature of most heat-generating electronic elements 51 simultaneously; Reach the effect that solves most thermals source, in addition because the path of condensation part 2141 and each spacer portion 217 to the portion of being heated 2131 is short, therefore the liquid working fluid A temperature that is back to the portion of being heated 2131 still can be kept the temperature with condensation part 2141 and each spacer portion 217; To absorb more thermal source, the better effects if that makes cooling.
The above; Be merely the preferred embodiment of the utility model; Be not in order to limiting the claim of the utility model,, all should in like manner be contained in the scope of patent protection of the utility model so the equivalence of using the utility model specification and accompanying drawing content to do such as changes with modification etc.
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011205488210U CN202425276U (en) | 2011-12-23 | 2011-12-23 | Cooling module with loop vapor chamber |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011205488210U CN202425276U (en) | 2011-12-23 | 2011-12-23 | Cooling module with loop vapor chamber |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202425276U true CN202425276U (en) | 2012-09-05 |
Family
ID=46749994
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011205488210U Expired - Lifetime CN202425276U (en) | 2011-12-23 | 2011-12-23 | Cooling module with loop vapor chamber |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202425276U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109362208A (en) * | 2018-10-27 | 2019-02-19 | 飞依诺科技(苏州)有限公司 | Quick soakage device and hand-held ultrasound detection device |
| WO2022083149A1 (en) * | 2020-10-19 | 2022-04-28 | 青岛海信宽带多媒体技术有限公司 | Optical module |
-
2011
- 2011-12-23 CN CN2011205488210U patent/CN202425276U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109362208A (en) * | 2018-10-27 | 2019-02-19 | 飞依诺科技(苏州)有限公司 | Quick soakage device and hand-held ultrasound detection device |
| WO2022083149A1 (en) * | 2020-10-19 | 2022-04-28 | 青岛海信宽带多媒体技术有限公司 | Optical module |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20120905 |