CN202494051U - Light-emitting diode (LED) circuit board with bending metal matrix - Google Patents
Light-emitting diode (LED) circuit board with bending metal matrix Download PDFInfo
- Publication number
- CN202494051U CN202494051U CN2012201160146U CN201220116014U CN202494051U CN 202494051 U CN202494051 U CN 202494051U CN 2012201160146 U CN2012201160146 U CN 2012201160146U CN 201220116014 U CN201220116014 U CN 201220116014U CN 202494051 U CN202494051 U CN 202494051U
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- China
- Prior art keywords
- led
- wiring board
- metal substrate
- electronic circuit
- shell
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000002184 metal Substances 0.000 title claims abstract description 46
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 46
- 238000005452 bending Methods 0.000 title claims abstract description 27
- 239000011159 matrix material Substances 0.000 title abstract 7
- 239000011347 resin Substances 0.000 claims abstract description 7
- 229920005989 resin Polymers 0.000 claims abstract description 7
- 239000000758 substrate Substances 0.000 claims description 31
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 6
- 239000000741 silica gel Substances 0.000 claims description 6
- 229910002027 silica gel Inorganic materials 0.000 claims description 6
- 239000000919 ceramic Substances 0.000 claims description 5
- 239000012528 membrane Substances 0.000 claims description 5
- 229920005372 Plexiglas® Polymers 0.000 claims description 2
- 239000002131 composite material Substances 0.000 claims description 2
- 239000004744 fabric Substances 0.000 claims description 2
- 239000004926 polymethyl methacrylate Substances 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 14
- 238000009434 installation Methods 0.000 abstract description 10
- 230000009931 harmful effect Effects 0.000 abstract description 2
- 238000009413 insulation Methods 0.000 abstract 4
- 238000013461 design Methods 0.000 description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 239000011889 copper foil Substances 0.000 description 6
- 238000005194 fractionation Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 238000011900 installation process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
The utility model provides a light-emitting diode (LED) circuit board with a bending metal matrix. The LED circuit board with the bending metal matrix comprises a metal matrix, a light shell, LED lights, an electronic circuit and an insulation heat-conduction layer, wherein the light shell is of skew face with a plurality of bendings. The metal matrix forms corresponding plane unit according to the skew face of a shell. Penetrated windows at intervals are arranged between the plane units. The insulation heat-conduction layer is a flexible layer and fixed on the plane units, and covers the penetrated windows. The electronic circuit and the LED lights are arranged on an upper portion of the insulation heat-conduction layer, and the electronic circuit connects the LED lights. Due to the fact that the LED lights and the electronic circuit are arranged on the insulation heat-conduction layer, harmful effects of bonding of the metal matrix and resin are avoided, the LED circuit board with the bending metal matrix brings conveniences to installation and use of the electronic circuit and the LED on the skew face, reduces manufacturing difficulties of LED circuit boards and LED lights, and also brings conveniences to installation of circuit boards.
Description
Technical field
The utility model relates to lighting apparatus, and the wiring board of a kind of LED of being used for light fixture of saying so exactly, this wiring board need not the wiring board fractionation just can be installed on the metal shell with antarafacial.
Background technology
Technology
In the middle of high-power LED illumination is used at present; Meet the light fixture that will arrive the antarafacial structural design inevitably; Need the LED wiring board forming the problem of installing on the antarafacial of certain angle each other, form certain angle between these faces and the face, these faces are radiator faces that the LED wiring board must be close to installation; Because the size of the interface gaps of LED wiring board and radiator installed surface; The LED wiring board directly influences of the conduction of the heat of LED wiring board, and then influences the life-span of LED light fixture, so must be installed by the held against heat sink face to radiator.If will LED wiring board held against heat sink installed surface be installed, make the installation interface slit minimum, wiring board just must be done certain bending so.As shown in Figure 1.Radiator (shell) 6 ' the have antarafacial of bending; Therefore; The LED wiring board will be designed to a plurality of unit 2 ' (normally metal substrate or ceramic substrate are made); Each unit 2 ' on all have LED lamp 5 ', LED lamp 5 ' be welded on electronic circuit 3 ' on, different units 2 ' electronic circuit 3 ' between through wire jumper 4 ' connection; Each unit 2 ' through insulating heat-conductive layer 1 ' be fixed on radiator 6 ' on.
The great power LED wiring board is because the needs of heat conduction and heat radiation, and common what adopt is heat conductivility good metal substrate or ceramic substrate.Ceramic substrate can brittle failure once bending; Though the metal substrate Metal Substrate has ductility; Can bending according to installed surface; But the insulating heat-conductive layer in the metal substrate between copper foil circuit and metal substrate is the resin after the heat cure; Ductility is very poor, and excessive bending degree can cause its embrittlement, metal substrate and copper foil circuit insulating properties is reduced significantly even conducting so that led light source are scrapped; Moreover copper foil circuit meeting attenuation after bending, copper foil circuit resistance is increased cause the decline of copper foil circuit electric conductivity and cause the led light source performance to descend.So during LED wiring board design at present, can design the LED on same wiring board generally speaking, having no alternative to split is designed to a plurality of unit, pass through wire jumper then between the unit with circuit communication.In installation process, each unit will independently be installed, and then through the wire jumper connecting circuit, has increased difficulty so not only for manufacturing of LED wiring board and the manufacturing of LED light fixture, has also increased cost of manufacture.
Summary of the invention
Based on this; Use the light fixture of central antarafacial structural design in order to overcome present high-power LED illumination; Owing to the LED wiring board will be installed the defective of bringing on the antarafacial that forms certain angle each other, the primary and foremost purpose of the utility model provides a kind of LED wiring board with bending Metal Substrate, and this wiring board need not just can be installed on the wiring board fractionation on the metal shell with antarafacial; Reduce manufacturing of LED wiring board and LED light fixture manufacture difficulty in the antarafacial structural design, also be convenient to the installation of wiring board.
Another purpose of the utility model provides one and has the LED wiring board that bends Metal Substrate, and this circuit board structure is simple, reliable, has improved installation effectiveness, has reduced cost of manufacture.
In order to achieve the above object, the utility model is to realize like this.
A kind of LED wiring board with bending Metal Substrate; This wiring board includes metal substrate, lamp housing, LED lamp, electronic circuit and insulating heat-conductive layer; Said shell is the antarafacial with a plurality of bendings; It is characterized in that said metal substrate forms corresponding flat unit according to the antarafacial of shell, said flat unit is fixed on the shell; Have the window that passes through at interval between the said flat unit, the insulating heat-conductive layer is a flexible layer, is fixed in above the said flat unit, and covers said window, and said electronic circuit and LED lamp are arranged at insulating heat-conductive layer top, and electronic circuit couples together the LED lamp.Through this structure; LED lamp and electronic circuit are arranged on the flexible insulating heat-conductive layer; The harmful effect of having avoided metal substrate bending and resin-bonded to bring; Be convenient to electronic circuit and LED installing and using on antarafacial, reduced manufacturing of LED wiring board and LED light fixture manufacture difficulty in the antarafacial structural design, also be convenient to the installation of wiring board.
Described insulating heat-conductive layer is resin Ceramic Composite glued membrane, plexiglas cloth, pure resin glued membrane, heat conductive silica gel, silica gel, the formed flexible layer of any one of bond plies.
Said window, its cross section are trapezoidal, to eliminate the distortion that shell is produced when forming antarafacial.
Said flat unit, its bottom can be provided with outstanding locating piece, and simultaneously, the shell corresponding position is provided with locating hole, so that quick location and installation.
Said flat unit can have connecting portion between the adjacent planar unit, and said connecting portion forms for thin metal edges, can a plurality of flat units being carried out Fast Installation in an orderly manner.Generally, after cutting out window, a side of flat unit is stayed a thin bonding jumper at least; This bonding jumper forms connecting portion; Connect two flat units that close on, flat unit still can be linked together, when flat unit is installed on the shell; Metal edges can be removed, and also can be folded in the window.
The beneficial effect of the utility model is: 1, metal base LED wiring board bending position is a window, passes through on the window and is coated with soft layer, can not cause the circuit damage during bending and cause the led light source performance to descend.2, need the LED fractionation that originally can design on same wiring board be designed to a plurality of unit, simplify circuit design work, simplify the assembling of follow-up light fixture owing to having reduced circuit unit simultaneously, thereby reduced the manufacturing cost of light fixture.
Description of drawings
Fig. 1 is the prior art constructions sketch map.
The structural representation that Fig. 2 implements for the utility model.
The specific embodiment
Below, shown in accompanying drawing, the practical implementation of the utility model is elaborated.
A kind of LED wiring board with bending Metal Substrate shown in Figure 2, that the utility model is realized, this wiring board includes shell 6, metal substrate 1, insulating radiation layer 2, electronic circuit 3, LED lamp 5.Wherein, shell 6 bends, and has formed the antarafacial of most bendings; In order to adapt to the structure of shell 6; Metal substrate 1 also must form corresponding flat unit according to the antarafacial of shell, and flat unit is arranged at shell and has on the antarafacial on plane, is not arranged on the bending place of shell.Usually, metal substrate 1 adopts welding, and perhaps fixed form such as bolt is fixed on the shell 6, and the fixed form of each flat unit and antarafacial also is like this; So, just make formed between the flat unit of metal substrate 1 at interval pass through window 4 owing to form, it is trapezoidal passing through window 4 common cross sections.
Insulating heat-conductive layer 2 is a flexible layer; Be preferably pure resin glued membrane, heat conductive silica gel, silica gel, any one of bond plies both had been convenient to be fixed in above the flat unit; And cover said window, be convenient on insulating heat-conductive layer 2, be provided with electronic circuit 3 and LED lamp 5 again.
A kind of reliable production method is following.
1. select the metal species and the thickness of metal substrate 1 according to the size of LED power; Then according to light fixture wiring board installed surface; The needs of the angle between face and the face and the size of installed surface; Metal on the position that the LED wiring board need bend when on metallic plate 1, removing the assembling of follow-up LED light fixture forms and passes through window, this window can be trapezoidal also can be special-shaped.
2. according to the FPC that needs designing and preparing excellent heat conductivity performance of fitting structure.FPC is made up of with the electronic circuit (normally Copper Foil) 3 that is covered in above the insulating heat-conductive layer 2 the insulating heat-conductive layer 2 of flexibility, then flexible circuit board pressing is prepared into metal base circuit board to foregoing metal substrate 1; Then metal base circuit board is processed along prefabricated processing line in the circuit board through mould or machinery, just processed a kind of bent metal base LED wiring board.
The utility model need not the wiring board fractionation just can be installed on the metal shell with antarafacial, can not cause the circuit damage during bending and cause the led light source performance to descend; Manufacturing of LED wiring board and LED light fixture manufacture difficulty in the antarafacial structural design have been reduced; Simplified circuit design work; Simultaneously simplified the assembling of follow-up light fixture, thereby reduced the manufacturing cost of light fixture, also be convenient to the installation of wiring board owing to having reduced circuit unit.
In a word; The above is merely the preferred embodiment of the utility model; Not in order to restriction the utility model, any modification of being done within all spirit at the utility model and the principle, be equal to and replace and improvement etc., all should be included within the protection domain of the utility model.
Claims (5)
1. one kind has the LED wiring board that bends Metal Substrate; This wiring board includes metal substrate, lamp housing, LED lamp, electronic circuit and insulating heat-conductive layer; Said shell is the antarafacial with a plurality of bendings; It is characterized in that said metal substrate forms corresponding flat unit according to the antarafacial of shell, said flat unit is fixed on the shell; Have the window that passes through at interval between the said flat unit, the insulating heat-conductive layer is a flexible layer, is fixed in above the said flat unit, and covers said window, and said electronic circuit and LED lamp are arranged at insulating heat-conductive layer top, and electronic circuit couples together the LED lamp.
2. the LED wiring board with bending Metal Substrate as claimed in claim 1; It is characterized in that described insulating heat-conductive layer; Be resin Ceramic Composite glued membrane, plexiglas cloth, pure resin glued membrane, heat conductive silica gel, silica gel, the formed flexible layer of any one of bond plies.
3. the LED wiring board with bending Metal Substrate as claimed in claim 1 is characterized in that said window, and its cross section is trapezoidal.
4. the LED wiring board with bending Metal Substrate as claimed in claim 1 is characterized in that said flat unit, and its bottom can be provided with outstanding locating piece, and simultaneously, the shell corresponding position is provided with locating hole.
5. the LED wiring board with bending Metal Substrate as claimed in claim 1 is characterized in that said flat unit, can have connecting portion between the adjacent planar unit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012201160146U CN202494051U (en) | 2012-03-26 | 2012-03-26 | Light-emitting diode (LED) circuit board with bending metal matrix |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012201160146U CN202494051U (en) | 2012-03-26 | 2012-03-26 | Light-emitting diode (LED) circuit board with bending metal matrix |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202494051U true CN202494051U (en) | 2012-10-17 |
Family
ID=47000276
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012201160146U Expired - Fee Related CN202494051U (en) | 2012-03-26 | 2012-03-26 | Light-emitting diode (LED) circuit board with bending metal matrix |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202494051U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016070402A1 (en) * | 2014-11-07 | 2016-05-12 | 袁志贤 | Rotary heat-dissipation led lamp |
| CN107924980A (en) * | 2015-08-31 | 2018-04-17 | 富士胶片株式会社 | Thermo-electric conversion module, the manufacture method of thermo-electric conversion module and heat-conducting substrate |
| CN110332471A (en) * | 2019-08-08 | 2019-10-15 | 广东品美电子科技有限公司 | A kind of arc lamp with VCUT circuit board and its manufacturing process |
-
2012
- 2012-03-26 CN CN2012201160146U patent/CN202494051U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016070402A1 (en) * | 2014-11-07 | 2016-05-12 | 袁志贤 | Rotary heat-dissipation led lamp |
| CN107924980A (en) * | 2015-08-31 | 2018-04-17 | 富士胶片株式会社 | Thermo-electric conversion module, the manufacture method of thermo-electric conversion module and heat-conducting substrate |
| CN110332471A (en) * | 2019-08-08 | 2019-10-15 | 广东品美电子科技有限公司 | A kind of arc lamp with VCUT circuit board and its manufacturing process |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20121017 Termination date: 20140326 |