CN203200367U - Deep-hole simulated electroplating experimental tank - Google Patents
Deep-hole simulated electroplating experimental tank Download PDFInfo
- Publication number
- CN203200367U CN203200367U CN 201320205759 CN201320205759U CN203200367U CN 203200367 U CN203200367 U CN 203200367U CN 201320205759 CN201320205759 CN 201320205759 CN 201320205759 U CN201320205759 U CN 201320205759U CN 203200367 U CN203200367 U CN 203200367U
- Authority
- CN
- China
- Prior art keywords
- millimeters
- test piece
- hole
- current density
- electroplating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000009713 electroplating Methods 0.000 title claims abstract description 20
- 238000012360 testing method Methods 0.000 claims abstract description 35
- 238000004088 simulation Methods 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 4
- 238000007599 discharging Methods 0.000 claims description 2
- 239000011248 coating agent Substances 0.000 abstract description 6
- 238000000576 coating method Methods 0.000 abstract description 6
- 238000005516 engineering process Methods 0.000 abstract description 4
- 238000007747 plating Methods 0.000 abstract description 3
- 230000002708 enhancing effect Effects 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 238000011056 performance test Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000008676 import Effects 0.000 description 1
Images
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
The utility model discloses a deep-hole simulated electroplating experimental tank which is used for electroplating technology research and plating solution performance testing. Since the straight foot of the cathode right-angle foot test piece is arranged in the hole of the wall of the cathode of the electroplating experimental tank, the hole shields the power line, the current density on the right-angle foot is greatly lowered, and the current density difference between the hole and the right-angle foot is enlarged, i.e. the current density high area/low area ratio is enlarged, so that the experimental test piece with limited length has a wider current density range, thereby widening the testing range. The hole and the right-angle foot are formed, and the current density level area and the observation window are added to the test piece, thereby enhancing the testing functions and precision. On the premise of maintaining the original functions and actions of the Hall tank, the utility model increases the experimental functions in research and testing of uniformity of complex-geometric-shape coating, microporous electroplating filling of printed circuits and the like. The experimental tank and the test piece are economic to manufacture, and simple and convenient to use.
Description
Technical field:
The utility model relates to electroplating technology research, electroplating solution performance test, especially relates to the test set that complex geometry coating degree of uniformity, printed electronic circuit (PCB) micropore filling ability are characterized.
Background technology:
The test set that is used for the electroplating technology aspect has many, and main commonly used be Hull Cell, see version " electroplating solution and coating performance test " the 123rd page in 2003, because the test piece of Hull Cell negative electrode is subjected to limitation of length, the current density range of its displaying is narrower, the ratio that is the high district of current density/low district is lower, the strength of current that adopts of experiment makes the plating density that shows may be not in the scope of actual requirement, the in addition impact of tested plate plane shape, can only show the coating situation in a certain current density range section, and can not depth show coating situation on a certain current density point, so to some complex geometry coating uniformity coefficient, the research test of PCB micropore filling ability is just not too applicable.
Summary of the invention:
The purpose of this utility model provides a kind of deep hole simulation electroplating experimental bath, enlarges the test specification of current density in the negative electrode test piece, increases current density and shows window, the deficiency that the planar cathode test piece of solution Hull Cell exists.
The technical scheme that the utility model adopts is: deep hole simulation electroplating experimental bath is improved by Hull Cell and forms, keep Hull Cell yin, yang pole distance and cathode wall length and placement gradient constant, cathode wall is expanded thick 15 millimeters~24 millimeters, at wall 1~10 rectangular through-hole is set, its aperture is wide 6 millimeters~and 10 millimeters, high 4 millimeters~24 millimeters, place negative electrode right angle pin test piece in cathode wall, its pin places in the rectangular opening.Owing to the formation of hole and pin, increased level zone and the current density impression window of current density.
Cathode wall in the deep hole simulation electroplating experimental bath has two kinds of settings; Fixed: as will to choose the cathode wall of hole figure place and aperture specification, permanent being fixed on the desired location.Movable: the desired location of cathode wall in experimental tank, adopt the setting of loading onto and discharging, be convenient for changing like this cathode wall of different size type.
The material of the negative electrode right angle pin test piece that deep hole simulation electroplating experimental bath adopts, thickness and length and width size are identical with the used test piece of Hull Cell, thereunder utilize 1~10 of test piece material of main part making to be 90 degree and stretch to consistent pin, 6 millimeters~10 millimeters of pin minor faces, 15 millimeters~24 millimeters on long limit.Because the pin of negative electrode right angle pin test piece places in the hole of electroplating experimental bath cathode wall, the aperture is to the shielding of power line, current density on the pin significantly reduces, the difference of the current density of aperture and pin enlarges, be that the high district of current density/low district ratio enlarges, make the negative electrode right angle pin test piece of limited length can show wider current density range.Add hole with the benefit that pin forms, jointly enlarged test specification and improved test function and precision.
The beneficial effects of the utility model are: when keeping the effect of Hull Cell experiment original function, enlarge current density and showed scope, current density level zone and viewing window have been increased, the implicit content that some can't be represented in the Hull Cell experiment can be out tested, increased experiential function and improved test mass.
Description of drawings:
The main body figure of Fig. 1 the utility model deep hole simulation electroplating experimental bath
The negative electrode right angle pin test piece shape figure of Fig. 2 the utility model deep hole simulation electroplating experimental bath
Among the figure 1, experimental tank main body 2, cathode wall 3, rectangular through-hole 4, negative electrode right angle pin test piece 5, pin
Embodiment:
In order further to explain the technical solution of the utility model, below by being described in detail in conjunction with the accompanying drawings and embodiments.
Fig. 1 embodiment; Plating bath is put into experimental tank main body (1); Negative electrode right angle pin test piece (4) is placed on the cathode wall (2), and pin (5) imports in the rectangular through-hole (3), after the combination in the lump the desired location in the loading test groove body (1), both can test.
Fig. 2 embodiment; Pin (5) quantity in the negative electrode right angle pin test piece (4) should be identical with rectangular through-hole (3) quantity on the cathode wall (2) and supports the use, and pin (5) stretches in the back side of rectangular through-hole (3).
Claims (3)
1. a deep hole simulation electroplating experimental bath is formed by the Hull Cell improvement, keeps Hull Cell yin, yang pole distance and cathode wall length and placement gradient constant, it is characterized in that; Cathode wall is expanded thick 15 millimeters to 24 millimeters, at wall 1-10 rectangular through-hole is set, its aperture is wide 6 millimeters-10 millimeters, and is high 4 millimeters-24 millimeters, places negative electrode right angle pin test piece in cathode wall, and its pin places in the rectangular opening.
2. a kind of deep hole according to claim 1 is simulated electroplating experimental bath, be it is characterized in that; The desired location of cathode wall in experimental tank adopts the setting of loading onto and discharging.
3. the material of a kind of deep hole simulation electroplating experimental bath according to claim 1, the negative electrode right angle pin test piece adopted, thickness and length and width size are identical with the used test piece of Hull Cell, it is characterized in that: thereunder utilize the material of test piece own to make 1-10 and be 90 pins of spending with the test piece main body, all right angle pin stretch to unanimously, 6 millimeters-10 millimeters of pin minor faces, 15 millimeters-24 millimeters on long limit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320205759 CN203200367U (en) | 2013-04-22 | 2013-04-22 | Deep-hole simulated electroplating experimental tank |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320205759 CN203200367U (en) | 2013-04-22 | 2013-04-22 | Deep-hole simulated electroplating experimental tank |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203200367U true CN203200367U (en) | 2013-09-18 |
Family
ID=49144495
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320205759 Expired - Fee Related CN203200367U (en) | 2013-04-22 | 2013-04-22 | Deep-hole simulated electroplating experimental tank |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203200367U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107190286A (en) * | 2017-05-09 | 2017-09-22 | 贵州振华群英电器有限公司(国营第八九厂) | The experimental rig and its test method of a kind of through hole covering power |
-
2013
- 2013-04-22 CN CN 201320205759 patent/CN203200367U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107190286A (en) * | 2017-05-09 | 2017-09-22 | 贵州振华群英电器有限公司(国营第八九厂) | The experimental rig and its test method of a kind of through hole covering power |
| CN107190286B (en) * | 2017-05-09 | 2019-01-25 | 贵州振华群英电器有限公司(国营第八九一厂) | A kind of experimental rig and its test method of through-hole covering power |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN201525899U (en) | A splint jig for circuit board electroplating | |
| CN110093637A (en) | For flexibility coat copper plate, the electrolytic copper foil of flexible printed-circuit board and preparation method | |
| CN102337578B (en) | Double-sided plating tank, sheet and plating method | |
| CN203200367U (en) | Deep-hole simulated electroplating experimental tank | |
| CN206727468U (en) | A kind of high volume adjustable distribution box of applicability | |
| CN203708620U (en) | Printed circuit board (PCB) with multiple alignment system | |
| CN204887697U (en) | A rigid-flexible mobile phone circuit board | |
| CN204434755U (en) | A kind of level plating shutter device | |
| CN202881424U (en) | Anode baffle for electroplating | |
| CN203295644U (en) | Electroplating anode titanium basket | |
| CN202989324U (en) | Airplane outer cylinder part inner bore electroplating clamp | |
| CN201990748U (en) | Electroplating V-shaped seat | |
| CN205152363U (en) | Electroplating device of two -sided electro -deposition xenogenesis cladding material | |
| CN207182741U (en) | Flat throw motion demonstrator | |
| CN203554777U (en) | Substrate and circuit board | |
| CN203504890U (en) | Magnetic printing jig of FPC circuit board | |
| CN202954122U (en) | Circuit board electroplating device | |
| CN206758393U (en) | Fuse and switching power supply | |
| CN202906993U (en) | Chamfering spring sheet | |
| CN204350102U (en) | A mobile phone fake battery | |
| CN207097811U (en) | A kind of SMD element | |
| CN204922479U (en) | Accurate rectangle foundatin plate | |
| CN204962256U (en) | Accurate rectangle foundatin plate | |
| CN202994043U (en) | Thickness test fixture for PCB | |
| CN202310308U (en) | Thin sandwich plate clamp |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130918 Termination date: 20160422 |