CN208317094U - 柔性电路板 - Google Patents

柔性电路板 Download PDF

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Publication number
CN208317094U
CN208317094U CN201690000587.9U CN201690000587U CN208317094U CN 208317094 U CN208317094 U CN 208317094U CN 201690000587 U CN201690000587 U CN 201690000587U CN 208317094 U CN208317094 U CN 208317094U
Authority
CN
China
Prior art keywords
side ground
flexible circuit
circuit board
dielectric layer
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CN201690000587.9U
Other languages
English (en)
Chinese (zh)
Inventor
金相弼
金大湖
李东炯
赵炳勋
李多涓
丘璜燮
金铉济
郑熙锡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
GigaLane Co Ltd
Original Assignee
GigaLane Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by GigaLane Co Ltd filed Critical GigaLane Co Ltd
Application granted granted Critical
Publication of CN208317094U publication Critical patent/CN208317094U/zh
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/024—Dielectric details, e.g. changing the dielectric material around a transmission line
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
CN201690000587.9U 2015-03-18 2016-03-09 柔性电路板 Expired - Lifetime CN208317094U (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR10-2015-0037226 2015-03-18
KR1020150037226A KR102337398B1 (ko) 2015-03-18 2015-03-18 연성회로기판
PCT/KR2016/002318 WO2016148427A1 (fr) 2015-03-18 2016-03-09 Carte de circuit imprimé souple

Publications (1)

Publication Number Publication Date
CN208317094U true CN208317094U (zh) 2019-01-01

Family

ID=56919234

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201690000587.9U Expired - Lifetime CN208317094U (zh) 2015-03-18 2016-03-09 柔性电路板

Country Status (3)

Country Link
KR (1) KR102337398B1 (fr)
CN (1) CN208317094U (fr)
WO (1) WO2016148427A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114744389A (zh) * 2022-04-14 2022-07-12 浙江大学 一种基于介质槽和介质支撑的柔性电路高频传输线

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102739705B1 (ko) * 2017-01-04 2024-12-06 주식회사 기가레인 연성회로기판
KR102677047B1 (ko) * 2017-01-04 2024-06-20 주식회사 기가레인 연성회로기판
KR101824644B1 (ko) * 2017-05-08 2018-02-01 주식회사 기가레인 선폭 축소형 연성회로기판 및 그 제조방법
WO2026005323A1 (fr) * 2024-06-28 2026-01-02 삼성전자주식회사 Dispositif électronique comprenant une carte de circuit imprimé souple

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100619956B1 (ko) * 2004-11-10 2006-09-07 엘지전자 주식회사 회로기판 연결 장치를 갖는 휴대용 단말기
KR101212094B1 (ko) * 2006-11-14 2012-12-13 삼성전자주식회사 연성회로기판 및 이를 갖는 전자장치
KR100958268B1 (ko) * 2008-02-15 2010-05-19 (주)기가레인 임피던스 미스매칭 없이 신호전송라인의 폭을 넓힐 수 있는인쇄회로기판
KR101065279B1 (ko) * 2008-04-04 2011-09-16 (주)기가레인 신호전송라인에 형성되는 슬롯 패턴을 구비하는인쇄회로기판
KR100987191B1 (ko) * 2008-04-18 2010-10-11 (주)기가레인 신호전송라인 주위의 본딩 시트를 제거한 인쇄회로기판
KR101085726B1 (ko) * 2009-10-23 2011-11-21 삼성전기주식회사 경연성 인쇄회로기판 및 그 제조 방법
JP5041108B2 (ja) 2010-12-03 2012-10-03 株式会社村田製作所 高周波信号線路
US8912581B2 (en) * 2012-03-09 2014-12-16 Taiwan Semiconductor Manufacturing Co., Ltd. 3D transmission lines for semiconductors

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114744389A (zh) * 2022-04-14 2022-07-12 浙江大学 一种基于介质槽和介质支撑的柔性电路高频传输线

Also Published As

Publication number Publication date
KR20160112119A (ko) 2016-09-28
KR102337398B1 (ko) 2021-12-09
WO2016148427A1 (fr) 2016-09-22

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Granted publication date: 20190101

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