CN210772430U - Energy-conserving efficient board that generates heat - Google Patents
Energy-conserving efficient board that generates heat Download PDFInfo
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- CN210772430U CN210772430U CN201921633167.6U CN201921633167U CN210772430U CN 210772430 U CN210772430 U CN 210772430U CN 201921633167 U CN201921633167 U CN 201921633167U CN 210772430 U CN210772430 U CN 210772430U
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- 239000000463 material Substances 0.000 claims abstract description 47
- 238000010438 heat treatment Methods 0.000 claims abstract description 42
- 229910052782 aluminium Inorganic materials 0.000 claims description 10
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 10
- 239000002023 wood Substances 0.000 claims description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 8
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 8
- 239000011347 resin Substances 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 239000011889 copper foil Substances 0.000 claims description 4
- 238000009413 insulation Methods 0.000 claims description 4
- 229910052742 iron Inorganic materials 0.000 claims description 4
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 238000000034 method Methods 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims description 3
- 239000003973 paint Substances 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 2
- 229910052759 nickel Inorganic materials 0.000 claims description 2
- 238000001259 photo etching Methods 0.000 claims description 2
- 230000008569 process Effects 0.000 claims description 2
- 229910052718 tin Inorganic materials 0.000 claims description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims 1
- 238000009434 installation Methods 0.000 abstract description 7
- 238000006243 chemical reaction Methods 0.000 abstract description 6
- 230000005540 biological transmission Effects 0.000 abstract description 5
- 238000010276 construction Methods 0.000 abstract description 5
- 238000010030 laminating Methods 0.000 abstract description 4
- 238000004321 preservation Methods 0.000 abstract description 2
- 230000001737 promoting effect Effects 0.000 abstract description 2
- 238000005265 energy consumption Methods 0.000 description 4
- 230000036541 health Effects 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 206010003246 arthritis Diseases 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000005034 decoration Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 229910021389 graphene Inorganic materials 0.000 description 2
- 230000004060 metabolic process Effects 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000010422 painting Methods 0.000 description 2
- 238000011084 recovery Methods 0.000 description 2
- 239000004575 stone Substances 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 240000008574 Capsicum frutescens Species 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000012774 insulation material Substances 0.000 description 1
- 239000004579 marble Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
Images
Landscapes
- Central Heating Systems (AREA)
- Floor Finish (AREA)
- Surface Heating Bodies (AREA)
Abstract
The utility model discloses an energy-conserving efficient heating plate, heating plate sets gradually heat preservation, insulating layer, medium layer, main material layer and decorative layer from bottom to top, the resistance line silk that the layer was evenly arranged that generates heat, the coefficient of heat conductivity of said medium layer is 0.5-8W/m.K, resistance line silk is in through the laminating of said medium layer on the main material layer, the positive negative pole of power is connected respectively at the both ends of resistance line silk. The utility model discloses a meson layer that heat conductivility is good is in integrated into one piece's resistance line silk pressure equipment of directly laminating on the main material layer, the heat that resistance line silk produced can be transmitted the heating plate outside through meson layer and main material layer fast, and transmission efficiency is high, energy conversion rate compares and obtains promoting greatly in prior art, and whole modular design, and the construction installation is all very convenient.
Description
Technical Field
The utility model belongs to the technical field of the electric heat heating technique and specifically relates to an energy-conserving efficient board that generates heat is related to.
Background
At present, heating murals, heating floor heating and the like on the market can adopt an electrothermal film heating technology. Wherein the heating cable heating in the heating floor heating needs to pave multilayer structures such as heat preservation, wire net, heating cable in advance, and the installation is troublesome to waste time and energy, and is unfavorable for overhauing the change after finishing completely. The electrothermal film heating in the market carries out heat radiation and heat conduction through a current carrying strip and a heating body (generally graphene), the graphene is high in cost, and meson layers in the structure are usually thermal insulation materials, so that heat conversion and transmission are not easy to occur, the working efficiency is low, and the loss is large; the main material structure on the surface is usually wood or stone, the main material can not be recycled when the product is abandoned, so that the resource waste is caused, and the wood is a non-renewable resource and is not in accordance with the great trend of ecological environmental protection. Due to the above problems, there is a need for improvement.
Disclosure of Invention
The utility model provides a not enough to prior art, the utility model provides a but energy-concerving and environment-protective, heat transfer efficiency is high, simple to operate and main material resource recovery's board that generates heat.
The utility model provides a technical scheme that its technical problem adopted is: the heating plate is sequentially provided with a heat insulation layer, an insulating layer, a heating layer, a medium layer, a main material layer and a decorative layer from bottom to top, wherein the heating layer is uniformly distributed resistance circuit wires, the heat conductivity coefficient of the medium layer is 0.5-8W/m.K, the resistance circuit wires are attached to the main material layer through the medium layer, and two ends of each resistance circuit wire are respectively connected with the positive electrode and the negative electrode of a power supply. The arrangement is that the resistor circuit wire integrally formed is directly attached and pressed at the temperature of 230-250 ℃ through the meson layer with good heat conductivity on the main material layer, heat generated by the resistor circuit wire can be rapidly transmitted to the outside of the heating plate through the meson layer and the main material layer, the transmission efficiency is high, the energy conversion rate is greatly improved compared with that in the prior art, and the construction and installation are very convenient due to the integral modular design.
In the above technical solution, further, the resistance wire may be laminated on the main material layer, or may be etched on the main material layer by a photolithography exposure process.
In the above technical solution, further, there is no break point in the middle of the resistance wire, and the coverage area of the resistance wire accounts for more than 85% of the main material layer. Set up like this, can guarantee the wholeness of resistance line silk, it is synchronous even to generate heat, can not cause the too big condition of the local difference in temperature in board surface that generates heat.
In the above technical solution, further, the resistance wire is made of a metal material.
In the above technical solution, further, the resistance wire is made of one of copper, copper foil, iron, aluminum, nickel, and tin. The copper foil is preferred, so that the heat conducting performance is good, the heat transfer is stable, and the service life is long.
In the above technical solution, further, a grounding terminal is further disposed on the main material layer. By the arrangement, the use safety is ensured.
In the above technical solution, further, the main material layer is a metal plate.
In the above technical solution, further, the material of the main material layer is one of aluminum, copper, and iron.
In the above technical solution, further, the main material layer is an aluminum plate. The aluminum plate has fast heat conduction, the electrothermal conversion rate reaches more than 99 percent, the surface temperature of the heating plate can be controlled between 18 ℃ and 40 ℃, and the use energy consumption is less compared with the use energy consumption under the same temperature condition in the prior art; compared with ceramic tiles, wood boards and other materials, the aluminum plate can be recycled, and is more environment-friendly.
In the above technical solution, further, the thickness of the main material layer is 0.5mm to 5mm, preferably 3 mm.
In the above technical solution, the dielectric layer is a mixture of resin, alumina, and aluminum nitride. The heat-conducting property is good, can produce far infrared in a large number when generating heat, and the wavelength of far infrared is 0.75 to 1000 microns, and it is longer to compare in prior art's wavelength, has fine health care effect to rheumatism, arthritis, the pH valve of balanced health, promotion metabolism etc..
In the above technical scheme, further, the insulating layer is a solder mask layer, and the withstand voltage can reach 2000-3500V alternating current. By the arrangement, safety is guaranteed.
In the above technical solution, further, the decorative layer is UV curable resin, and the surface may be bonded with wood paint or wood paper, or printed with textures. The wear-resistant pattern layer is solidified to ensure that the hardness can reach about 5-8H.
In the above technical solution, further, the thickness of the heating plate is 3CM or less. By the arrangement, the whole thickness is thinner than that of the existing product, the transportation and construction are convenient, and the application range is wider.
In the above technical scheme, further, the decorative layer, the main material layer, the insulating layer and the heat-insulating layer are respectively connected through adhesion. Simple structure and convenient connection.
The beneficial effects of the utility model are that ① is in through the direct laminating pressure equipment of the good meson layer of thermal conductivity with integrated into one piece's resistance line silk or through photoetching exposure technology sculpture on the main material layer, the heat that resistance line silk produced can be transmitted the heating plate outside through meson layer and main material layer fast, and transmission efficiency is high, energy conversion rate is compared and is promoted greatly in prior art, and the energy consumption is lower, ② main material layer be aluminum plate, replaces traditional timber and stone material, can carry out the recovery of resource and recycle, ③ whole modular design, thickness is thinner under the circumstances of guaranteeing the performance, and the transportation, construction installation are all very convenient.
Drawings
The present invention will be further explained with reference to the drawings and examples.
Fig. 1 is a schematic structural diagram of the present invention.
Fig. 2 is an enlarged schematic view at a in fig. 1.
Fig. 3 is a schematic diagram of the connection between the resistance wire and the dielectric layer and the main material layer according to the present invention.
Fig. 4 is a sectional view of the present invention.
In the figure, 1 is an insulating layer, 2 is an insulating layer, 3 is a heating layer, 3a is a resistance circuit wire, 4 is a dielectric layer, 5 is a main material layer, 6 is a decorative layer, 7 is a power supply anode, 8 is a power supply cathode, and 9 is a grounding end.
Detailed Description
Referring to fig. 1 to 4, the thickness of the heating plate is 3CM or less. The heating plate is sequentially provided with a heat insulation layer 1, an insulating layer 2, a heating layer 3, a meson layer 4, a main material layer 5 and a decoration layer 6 from bottom to top, wherein the decoration layer 6, the main material layer 5, the insulating layer 2 and the heat insulation layer 1 are respectively connected through bonding. The heating layer 3 is resistance circuit wires 3a which are uniformly distributed, the thermal conductivity coefficient of the dielectric layer 4 is 0.5-8W/m.K, the resistance circuit wires 3a are attached to the main material layer 5 through the dielectric layer 4, and the main material layer 5 is an aluminum plate. There is not the breakpoint in the middle of resistance line silk 3a, resistance line silk 3 a's cover surface accounts for more than 85% on main material layer 5, anodal 7 of power and power negative pole 8 are connected respectively to resistance line silk 3 a's both ends, be equipped with earthing terminal 9 on the main material layer, earthing terminal 9 is located positive negative pole one side. Through the good meson layer 4 of heat conductivility with integrated into one piece's resistance line silk 3a through the temperature direct laminating pressure equipment of 230 ℃ -250 ℃ on the main material layer 5, the heat that resistance line silk 3a produced can be transmitted to the heating plate outside through meson layer 4 and main material layer 5 fast, and transmission efficiency is high, energy conversion rate compares and obtains promoting greatly in prior art, and whole modular design, and the construction installation is all very convenient.
The resistance circuit wire 3a is made of copper foil. The thickness of the main material layer 5 is 3mm of an aluminum plate.
The dielectric layer 4 is a mixture of resin, alumina and aluminum nitride. The heat-conducting property is good, can produce far infrared in a large number when generating heat, and the wavelength of far infrared is 0.75 to 1000 microns, and it is longer to compare in prior art's wavelength, has fine health care effect to rheumatism, arthritis, the pH valve of balanced health, promotion metabolism etc..
The insulating layer 2 is a solder mask layer, and the withstand voltage can reach 2000-3500V alternating current. The decorative layer 6 is made of UV-curable resin, and wood grain paint or wood grain paper can be adhered to the surface of the decorative layer. The wear-resistant pattern layer is solidified to ensure that the hardness can reach about 8H.
The utility model discloses can be applied to multiple field, like the mural painting that generates heat, the photo holder frame that generates heat, the floor that generates heat etc. The utility model discloses when being applied to floor heating, can be with a plurality of the utility model relates to a board module circuit that generates heat establishes ties in proper order or parallelly connected, connect through flexonics spare in advance between two modules, then carry out the modularization according to indoor in-service area demand and assemble and can accomplish the installation, outmost decorative layer 6 can be based on customer's hobby customization wood grain pattern, marble design etc., it controls through a control assembly to accomplish the whole return circuit that forms of floor heating after the installation, rapid heating up 2 minutes floor surface temperature can reach more than 30 degrees centigrade during the heating, can reach the settlement temperature in 20 minutes, high durability and convenient use, instant heating, also need not all-weather in chilly heating season and open, energy consumption greatly reduced.
When the utility model is applied to the heating mural painting and the heating photo frame, the peripheral temperature of the utility model can reach more than 100 ℃ by changing the input voltage.
The above is only an embodiment of the present invention, and is not a limitation to the present invention in any form, and the present invention does not depart from the technical solution of the present invention, and the simple modification, equivalent change or modification made by the present invention all fall into the protection scope of the present invention.
Claims (13)
1. An energy-conserving efficient board that generates heat which characterized in that: the heating plate is sequentially provided with a heat insulation layer, an insulating layer, a heating layer, a medium layer, a main material layer and a decorative layer from bottom to top, the heating layer is uniformly distributed resistance circuit wires, the heat conductivity coefficient of the medium layer is 0.5-8W/m.K, the resistance circuit wires are attached to the main material layer through the medium layer, and two ends of each resistance circuit wire are respectively connected with the positive electrode and the negative electrode of a power supply.
2. An energy-saving and high-efficiency heat generating plate as claimed in claim 1, wherein: the resistance circuit wire is etched on the main material layer through a photoetching type exposure process.
3. An energy-saving and high-efficiency heat generating plate as claimed in claim 1, wherein: the middle of the resistance circuit wire is free from a breakpoint, and the covering surface of the resistance circuit wire accounts for more than 85% of the main material layer.
4. An energy-saving and high-efficiency heat generating plate as claimed in claim 1, wherein: and the main material layer is also provided with a grounding terminal.
5. An energy-saving and high-efficiency heating panel according to any one of claims 1 to 4, characterized in that: the main material layer is a metal plate.
6. An energy-saving and high-efficiency heat generating plate according to claim 5, characterized in that: the material of the main material layer is one of aluminum, copper and iron.
7. An energy-saving and high-efficiency heat generating plate according to claim 5, characterized in that: the thickness of the main material layer is 0.5mm-5 mm.
8. An energy-saving and high-efficiency heating panel according to any one of claims 1 to 3, characterized in that: the resistance circuit wire is made of metal.
9. An energy-saving and high-efficiency heat generating plate according to claim 8, characterized in that: the resistance circuit wire is made of one of copper, copper foil, iron, aluminum, nickel and tin.
10. An energy-saving and high-efficiency heat generating plate as claimed in claim 1, wherein: the dielectric layer is a mixture of resin, aluminum oxide and aluminum nitride.
11. An energy-saving and high-efficiency heat generating plate as claimed in claim 1, wherein: the insulating layer is a solder mask layer, and the withstand voltage is 2000-3500V alternating current.
12. An energy-saving and high-efficiency heat generating plate as claimed in claim 1, wherein: the decorative layer is UV-cured resin, and wood grain paint or wood grain paper can be adhered to the surface of the decorative layer or the surface of the decorative layer is printed with textures.
13. An energy-saving and high-efficiency heat generating plate as claimed in claim 1, wherein: the thickness of the heating plate is less than 3CM, and the decorative layer, the main material layer, the insulating layer and the heat-insulating layer are connected through adhesion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921633167.6U CN210772430U (en) | 2019-09-28 | 2019-09-28 | Energy-conserving efficient board that generates heat |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921633167.6U CN210772430U (en) | 2019-09-28 | 2019-09-28 | Energy-conserving efficient board that generates heat |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210772430U true CN210772430U (en) | 2020-06-16 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921633167.6U Expired - Fee Related CN210772430U (en) | 2019-09-28 | 2019-09-28 | Energy-conserving efficient board that generates heat |
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| CN (1) | CN210772430U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110553306A (en) * | 2019-09-28 | 2019-12-10 | 浙江罗奇泰克科技股份有限公司 | Energy-conserving efficient board that generates heat |
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2019
- 2019-09-28 CN CN201921633167.6U patent/CN210772430U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110553306A (en) * | 2019-09-28 | 2019-12-10 | 浙江罗奇泰克科技股份有限公司 | Energy-conserving efficient board that generates heat |
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200616 Termination date: 20210928 |