CN212069727U - Groove type wet cleaning machine - Google Patents
Groove type wet cleaning machine Download PDFInfo
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- CN212069727U CN212069727U CN202020378099.XU CN202020378099U CN212069727U CN 212069727 U CN212069727 U CN 212069727U CN 202020378099 U CN202020378099 U CN 202020378099U CN 212069727 U CN212069727 U CN 212069727U
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Abstract
Description
技术领域technical field
本实用新型涉及湿法清洗技术领域,尤其涉及槽式湿法清洗机。The utility model relates to the technical field of wet cleaning, in particular to a trough type wet cleaning machine.
背景技术Background technique
在半导体制造领域中,湿法刻蚀工艺通常采用槽式湿法清洗机处理,主要用于去除表面的颗粒污染。In the field of semiconductor manufacturing, the wet etching process is usually processed by a tank wet cleaning machine, which is mainly used to remove particle contamination on the surface.
现有申请号为201711178278.8的实用新型专利公开了一种式湿法清洗机台,为解决现有技术中硅片图形引起的清洗死角无法清除,和湿法清洗过程中硅片二次污染的问题,但,在实际的技术方案中:The utility model patent with the existing application number of 201711178278.8 discloses a type of wet cleaning machine, in order to solve the problem that the cleaning dead angle caused by the silicon wafer pattern cannot be removed in the prior art, and the secondary pollution of the silicon wafer during the wet cleaning process. , but, in the actual technical solution:
即使用户可以通过主设备电脑设定硅片角度,对待清洗硅片进行周向角度调整,规避硅片图形引起的清洗死角,降低由于污染颗粒卡在产品图形中清除不掉的几率,但是在硅片清洗完成、取出的过程中,因硅片处于被污染后的化学清洗液中,所以仍然会直接导致硅片的二次污染。Even if the user can set the angle of the silicon wafer through the main equipment computer, adjust the circumferential angle of the silicon wafer to be cleaned, avoid the cleaning dead angle caused by the silicon wafer pattern, and reduce the probability of contamination particles stuck in the product pattern and cannot be removed. During the process of wafer cleaning and removal, because the wafer is in the contaminated chemical cleaning solution, it will still directly lead to secondary pollution of the wafer.
实用新型内容Utility model content
本实用新型的目的是为了解决现有技术中槽式湿法清洗过程中,在硅片清洗完成、取出的过程中,因硅片处于被污染后的化学清洗液中,所以仍然会直接导致硅片的二次污染的缺点,而提出的槽式湿法清洗机。The purpose of this utility model is to solve the problem that in the prior art tank type wet cleaning process, in the process of completing and taking out the silicon wafer, because the silicon wafer is in the contaminated chemical cleaning solution, it will still directly lead to silicon The disadvantage of the secondary pollution of the sheet, and the proposed trough type wet cleaning machine.
为了实现上述目的,本实用新型采用了如下技术方案:In order to achieve the above-mentioned purpose, the utility model adopts the following technical solutions:
设计槽式湿法清洗机,包括外清洗箱、上盖和导管组成的槽式湿法清洗机,所述外清洗箱的内腔套装有中空的内清洗箱,内清洗箱的内腔与导管相通,所述导管与内清洗箱、外清洗箱的相接处分别安装有保证连接处密封性的密封套管。Design a trough type wet cleaning machine, including a trough type wet cleaning machine composed of an outer cleaning box, an upper cover and a conduit. The inner cavity of the outer cleaning box is set with a hollow inner cleaning box, and the inner cavity of the inner cleaning box and the conduit The joints between the conduit and the inner cleaning box and the outer cleaning box are respectively provided with sealing sleeves to ensure the tightness of the connection.
所述内清洗箱的侧壁上开设有贯穿并延伸至外清洗箱外部的漫槽,所述漫槽位于内清洗箱靠近上盖的一侧且其内腔活动安装有对其密封、与市电相连的电磁铁组件,通电时对其密封的电磁铁组件从漫槽中移出。The side wall of the inner cleaning box is provided with a diffuser penetrating through and extending to the outside of the outer cleaning box. The electromagnet assembly that is electrically connected, and the electromagnet assembly that is sealed to it, moves out of the diffuser when it is energized.
优选的,所述电磁铁组件包括在通电状态下磁性相异内磁板和外磁罩,所述内磁板套装在内清洗箱腔壁的漫槽中,外磁罩安装在外清洗箱的外部且与漫槽的位置相对应,且外磁罩与内磁板之间安装有对内磁板的移动路径导向的导向板。Preferably, the electromagnet assembly includes an inner magnetic plate and an outer magnetic cover that are magnetically different in the energized state, the inner magnetic plate is fitted into the diffused groove of the cavity wall of the inner cleaning box, and the outer magnetic cover is installed outside the outer cleaning box Corresponding to the position of the diffuser groove, a guide plate for guiding the movement path of the inner magnetic plate is installed between the outer magnetic cover and the inner magnetic plate.
优选的,所述内清洗箱的外侧面上安装有将其固定在外清洗箱内腔壁上的固定板,所述固定板与漫槽错位分布。Preferably, a fixing plate for fixing it on the inner cavity wall of the outer cleaning box is installed on the outer surface of the inner cleaning box, and the fixing plate and the diffuser groove are dislocated and distributed.
优选的,所述内清洗箱上漫槽的底部沿着靠近外清洗箱的一侧倾斜。Preferably, the bottom of the upper diffuser of the inner cleaning box is inclined along a side close to the outer cleaning box.
优选的,所述内磁板与外磁罩之间连接有弹性的连接导管。Preferably, an elastic connecting conduit is connected between the inner magnetic plate and the outer magnetic cover.
优选的,所述内清洗箱的底端与外清洗箱的腔底间设有储放液体的储腔。Preferably, a storage cavity for storing liquid is provided between the bottom end of the inner cleaning box and the cavity bottom of the outer cleaning box.
本实用新型结构简单,操作便捷,能够很好的解决现有技术中槽式湿法清洗过程,对清洗完成的硅片造成二次污染的缺点,具有较强的实用性。The utility model has the advantages of simple structure and convenient operation, can well solve the disadvantage of secondary pollution to the cleaned silicon wafer in the prior art in the groove type wet cleaning process, and has strong practicability.
附图说明Description of drawings
图1为本实用新型的左视结构示意图;Fig. 1 is the left side view structure schematic diagram of the present utility model;
图2为本实用新型的右视结构示意图;Fig. 2 is the right side view structure schematic diagram of the present utility model;
图3为本实用新型的局部剖视结构示意图;Fig. 3 is the partial sectional structure schematic diagram of the present utility model;
图4为本实用新型的侧剖结构示意图;Fig. 4 is the side sectional structure schematic diagram of the utility model;
图5为本实用新型图4中A处结构的局部放大示意图。FIG. 5 is a partial enlarged schematic view of the structure at A in FIG. 4 of the present invention.
图中:1-外清洗箱,11-上盖,2-内清洗箱,3-导管,31-密封套管,4-漫槽,41-内磁板,42-导向板,43-外磁罩,44-连接导管,5- 固定板。In the picture: 1-outer cleaning box, 11-upper cover, 2-inner cleaning box, 3-conduit, 31-sealing sleeve, 4-diffuse groove, 41-inner magnetic plate, 42-guide plate, 43-outer magnetic hood, 44-connecting conduit, 5-fixing plate.
具体实施方式Detailed ways
下面将结合本实用新型实施例中的附图,对本实用新型实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本实用新型一部分实施例,而不是全部的实施例。The technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the implementations. example.
参照图1-5,槽式湿法清洗机,包括外清洗箱1、上盖11和导管 3组成的槽式湿法清洗机,外清洗箱1的内腔套装有中空的内清洗箱 2,内清洗箱2的内腔与导管3相通,内清洗箱2的侧壁上开设有贯穿并延伸至外清洗箱1外部的漫槽4,漫槽4位于内清洗箱2靠近上盖11的一侧且其内腔活动安装有对其密封、与市电相连的电磁铁组件,通电时对其密封的电磁铁组件从漫槽4中移出,导管3与内清洗箱2、外清洗箱1的相接处分别安装有保证连接处密封性的密封套管 31。1-5, the trough-type wet cleaning machine includes a trough-type wet cleaning machine composed of an
在湿法清洗的过程中,首先将6垂直放入内清洗箱2的内腔,当化学液体经导管3自下而上导入内清洗箱2内腔的过程中,化学药液自下而上对6进行清洗,在化学液体完全浸没6对其清洗后,将电磁铁组件通电使其从漫槽4中移出,然后内清洗箱2内腔的化学液体经漫槽4,从上而下流出,因在化学药液经导管3自下而上导入内清洗箱2的内腔,同时化学药液经漫槽4自上而下经内清洗箱2导出的过程中,清洗过6产生的被污染的化学药率先经漫槽4导出,所以在将6上部的化学药液导出之后,内清洗箱2内的即为未被6污染的化学药液,然后再将6内清洗箱2中没被污染的化学药液中取出,很好的规避了6在取出过程中被二次污染的问题,且实现方式、结构简单。In the process of wet cleaning, firstly put 6 into the inner cavity of the
电磁铁组件包括在通电状态下磁性相异内磁板41和外磁罩43,内磁板41套装在内清洗箱2腔壁的漫槽4中,外磁罩43安装在外清洗箱1的外部且与漫槽4的位置相对应,且外磁罩43与内磁板41之间安装有对内磁板41的移动路径导向的导向板42,在电磁铁组件通电的情况下,内磁板41和外磁罩43之间相互吸引,带动内磁板41 沿着导向板42从漫槽4中移出,这时,保证了电磁铁组件通电作用下,内清洗箱2内的化学液体经漫槽4导出,在6取出之后再将内磁板41堵在漫槽4中对其密封即可。The electromagnet assembly includes an inner
内清洗箱2的外侧面上安装有将其固定在外清洗箱1内腔壁上的固定板5,固定板5与漫槽4错位分布,通过固定板5保证内清洗箱 2与外清洗箱1之间相对固定,且内清洗箱2与外清洗箱1之间产生的安装间隙保证经漫槽4导出的化学液体的储放。A
内清洗箱2上漫槽4的底部沿着靠近外清洗箱1的一侧倾斜,在化学液体经漫槽4导出的过程中,沿着漫槽4倾斜的底部流动,有效的加快了其导出速率,提高整个过程的效率。The bottom of the
内磁板41与外磁罩43之间连接有弹性的连接导管44,在外磁罩43和内磁板41相吸,连接导管44保证二者之间相对位置不错移的同时,防止在化学液体冲击作用下,内磁板41相对外清洗箱1上的漫槽4错移。An elastic connecting
内清洗箱2的底端与外清洗箱1的腔底间设有储放液体的储腔,在化学药液经漫槽4导出至外清洗箱1内腔的过程中,内清洗箱2底部与外清洗箱1腔底间形成的储腔对导出的化学药液进行集中储放,防止化学药液直接粘附在内清洗箱2的外部增大后续化学药液清洁的难度。Between the bottom end of the
在本实用新型的描述中,尽管已经示出和描述了本实用新型的实施例,对于本领域的普通技术人员而言,可以理解在不脱离本实用新型的原理和精神的情况下可以对这些实施例进行多种变化、修改、替换和变型,本实用新型的范围由所附权利要求及其等同物限定。In the description of the present invention, although the embodiments of the present invention have been shown and described, it will be understood by those of ordinary skill in the art that these The embodiments are subject to various changes, modifications, substitutions and alterations, and the scope of the present invention is defined by the appended claims and their equivalents.
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| CN202020378099.XU CN212069727U (en) | 2020-03-23 | 2020-03-23 | Groove type wet cleaning machine |
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| Date | Code | Title | Description |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: Building C5, No. 1568, Feidu Road, Lingang New Area, China (Shanghai) Pilot Free Trade Zone, Pudong New Area, Shanghai, 201311 Patentee after: New Yidong (Shanghai) Technology Co.,Ltd. Address before: 1212, 12 / F, building 4, yard 6, Zhengda Road, Shijingshan District, Beijing 100043 Patentee before: Beijing xinyidong Technology Co.,Ltd. |
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| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: 101-8, 1st Floor, Building 3, No. A5 Rongchang East Street, Beijing Economic and Technological Development Zone, Daxing District, Beijing 102600 Patentee after: New Yidong (Beijing) Technology Co.,Ltd. Country or region after: China Address before: Building 20, No. 3888 Beiqing Road, Huaxin Town, Qingpu District, Shanghai Patentee before: New Yidong (Shanghai) Technology Co.,Ltd. Country or region before: China |
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| CP03 | Change of name, title or address | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: Sump wet cleaning machine Granted publication date: 20201204 Pledgee: Pudong Development Bank of Shanghai Limited by Share Ltd. Beijing branch Pledgor: New Yidong (Beijing) Technology Co.,Ltd. Registration number: Y2025990000221 |
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| PE01 | Entry into force of the registration of the contract for pledge of patent right |