CN213242585U

CN213242585U - Long-range phosphor powder large-angle scattering patch LED

Info

Publication number: CN213242585U
Application number: CN202022447085.1U
Authority: CN
Inventors: 陈建伟
Original assignee: Shenzhen Good Self Lighting Technology Co ltd
Current assignee: Shenzhen Good Self Lighting Technology Co ltd
Priority date: 2020-10-29
Filing date: 2020-10-29
Publication date: 2021-05-18
Anticipated expiration: 2030-10-29

Abstract

The utility model provides a long-range phosphor powder wide-angle scattering paster LED, include: the LED flip-chip heat conduction electronic circuit board comprises a heat conduction electronic circuit board, a flip-chip LED chip and a plastic shell, wherein a non-Lambertian dome structure cavity is formed in the plastic shell, a mounting groove is formed in the bottom of the plastic shell, the heat conduction electronic circuit board is mounted in the mounting groove, the flip-chip LED chip is mounted on the heat conduction electronic circuit board and located in the non-Lambertian dome structure cavity, and two sides of the plastic shell protrude out of two sides of the heat conduction electronic circuit board. The utility model discloses well plastic casing's diameter is greater than the width of heat conduction electronic circuit board, consequently can obtain decurrent light to obtain the scattered light of bigger luminous angle, not only can produce safe light, still can avoid the blue light to the eyes damage, soft light is not dazzling, free from glare, no ghost image, comfortable light evenly soft light can build warm comfortable light environment.

Description

Long-range phosphor powder large-angle scattering patch LED

Technical Field

The utility model relates to a LED field, in particular to long-range phosphor powder wide-angle scattering paster LED.

Background

Over twenty years of development, LEDs are now shifting from green to healthy lighting. Healthy lighting (including healthy light sources) can be summarized as three main features, safe light/avoiding blue light damage to human eyes. Soft light/no glare, no ghost. Comfortable light/even and soft light can create a warm and comfortable light environment. Based on the trend of LED illumination, the market can be expected to have more urgent need for a large-angle LED light source with scattered light.

US6350041B1 discloses a high output light diffusing bulb using a solid state light source, which is referenced by 167 patents, including one referenced by Intematix. The CREE company remote phosphor is characterized in that an LED chip is far away from a phosphor luminescent layer, and an intermediate medium is air.

Chinese patent ZL2004100524874 discloses a 360-degree (bulk light emitting) high light efficiency photoluminescent diode, which separates an LED chip from a phosphor light emitting layer, the phosphor light emitting layer structure is a lambertian body, the intermediate isolation medium is a resin material, the phosphor and the LED chip are spatially separated, and the phosphor is coated on optical components such as an optical film, a transparent lampshade or a lens, etc. far away from the LED chip, thereby revolutionarily breaking through and surpassing the commonly used white light LED packaging process. Therefore, the remote fluorescent powder technology has general technical value, and the remote fluorescent powder technology has diversity.

However, the patch LED adopts a remote phosphor technology and a "lambertian body" structure using air as a medium, so that light in the negative electrode direction of the optical axis cannot be irradiated, and a dead angle of light emission is likely to occur, and the patch LED still belongs to directional light emission. In addition, the problems of uniform and homogeneous fluorescent powder and color and black plastic color change exist in the extraction and injection molding of the engineering plastic and the rare earth fluorescent powder used by the LED in the prior art.

SUMMERY OF THE UTILITY MODEL

The utility model provides a long-range phosphor powder wide-angle scattering paster LED to solve at least one above-mentioned technical problem.

In order to solve the above problem, as an aspect of the present invention, there is provided a long-range phosphor powder large-angle scattering patch LED, including: the LED flip-chip heat conduction electronic circuit board comprises a heat conduction electronic circuit board, a flip-chip LED chip and a plastic shell, wherein a non-Lambertian dome structure cavity is formed in the plastic shell, a mounting groove is formed in the bottom of the plastic shell, the heat conduction electronic circuit board is mounted in the mounting groove, the flip-chip LED chip is mounted on the heat conduction electronic circuit board and located in the non-Lambertian dome structure cavity, and two sides of the plastic shell protrude out of two sides of the heat conduction electronic circuit board.

Preferably, the mounting groove is provided throughout a radial direction of the plastic housing.

Preferably, the plastic shell is made of PP or PP modified plastic.

Preferably, the heat-conductive electronic circuit board is mounted in the mounting groove by means of adhesion.

Preferably, the heat-conducting electronic circuit board is a ceramic circuit board, an aluminum-based circuit board, an FPC circuit board, or a glass-based circuit board.

Preferably, the PP-modified plastic is a metallocene polypropylene plastic.

Preferably, the orthographic projection of the non-lambertian dome structure cavity in the optical axis direction is a rectangular structure, the width of the rectangular structure is smaller than that of the heat-conducting electronic circuit board, and the width of the mounting groove is larger than that of the non-lambertian dome structure cavity.

Preferably, the bottom surface of the heat-conductive electronic circuit board is higher than the bottom surface of the plastic case.

Preferably, the heat-conducting electronic circuit board is mounted in the mounting groove through a high-temperature-resistant quick-drying structural adhesive.

Preferably, the non-lambertian dome structure cavity is a photoluminescence light mixing cavity.

The utility model discloses well plastic casing's diameter is greater than the width of heat conduction electronic circuit board, consequently can obtain decurrent light to obtain the scattered light of bigger luminous angle, not only can produce safe light, still can avoid the blue light to the eyes damage, soft light is not dazzling, free from glare, no ghost image, comfortable light evenly soft light can build warm comfortable light environment.

Drawings

Fig. 1 schematically shows a prior art LED patch element structure;

figure 2 schematically shows a schematic three-view diagram of the structure of the utility model;

fig. 3 schematically shows a projection relationship diagram of the optical cavity of the present invention on an electronic circuit board;

fig. 4 schematically shows a schematic diagram of the change of the optical path after photoluminescence by excited light according to the present invention.

Reference numbers in the figures: 1. a thermally conductive electronic circuit board; 2. flip-chip LED chip; 3. modifying PP plastic; 4. fluorescent powder; 5. a non-Lambertian dome structure cavity; 6. installing a groove; 7. a plastic housing; 8. an LED circuit board; 9. adhesive glue, 10, resin pouring sealant.

Detailed Description

The embodiments of the invention will be described in detail below with reference to the drawings, but the invention can be implemented in many different ways as defined and covered by the claims.

As an aspect of the utility model, a long-range phosphor powder wide-angle scattering paster LED is provided, include: the LED light source comprises a heat-conducting electronic circuit board 1, one or more flip LED chips 2 and a plastic shell 7, wherein a non-Lambertian dome structure cavity 5 is formed in the plastic shell 7, a mounting groove 6 is formed at the bottom of the plastic shell 7, the heat-conducting electronic circuit board 1 is mounted in the mounting groove 6, the flip LED chips 2 are mounted on the heat-conducting electronic circuit board 1 and located in the non-Lambertian dome structure cavity 5, and two sides of the plastic shell 7 protrude out of two sides of the heat-conducting electronic circuit board 1. Preferably, the mounting groove 6 is provided through the plastic housing 7 in a radial direction.

Preferably, the plastic housing 7 is made of PP or PP-modified plastic. Preferably, the PP modified plastic is metallocene polypropylene plastic, and the problems of uniform and homogeneous fluorescent powder and color and black plastic change are solved.

Preferably, the heat-conductive electronic circuit board 1 is mounted in the mounting groove 6 by means of bonding. Preferably, the heat-conducting electronic circuit board 1 is mounted in the mounting groove 6 through a high-temperature-resistant quick-drying structural adhesive. The plastic shell 7 is subjected to injection molding, the heat-conducting electronic circuit board 1 and the mounting groove 6 are mounted and assembled, and the high-temperature-resistant quick-drying structural adhesive is bonded and mounted, so that the aging process of the surface-mounted LED in the prior art can be omitted, the industrial chain for manufacturing the surface-mounted LED is extended by the injection molding of the plastic shell 7, the LED element packaging process can be greatly simplified, the production efficiency is improved, and the standardized, automatic and intelligent production can be realized.

Preferably, the heat-conducting electronic circuit board 1 is a ceramic circuit board, an aluminum-based circuit board, an FPC circuit board, or a glass-based circuit board.

Preferably, the orthographic projection of the non-lambertian dome structure cavity 5 in the optical axis direction is a rectangular structure, the width of the rectangular structure is smaller than that of the heat-conducting electronic circuit board 1, and the width of the mounting groove 6 is larger than that of the non-lambertian dome structure cavity 5.

Preferably, the bottom surface of the heat-conductive electronic circuit board 1 is higher than the bottom surface of the plastic case 7.

Preferably, the non-lambertian dome structure cavity 5 is a light mixing cavity of a photoluminescence light source. For example, a flame retardant, a photosensitizer, white oil, a dispersing agent and other auxiliaries can be added into the PP or modified PP plastic 3, and the fluorescent powder 4 can be rare earth fluorescent powder, silicate fluorescent powder, nitride fluorescent powder and the like. The blue light emitted by the LED chip is reflected in the light mixing cavity, the blue light is mainly in the light mixing cavity at the moment, the blue light is only an excitation light source, the area which really generates photoluminescence is the fluorescent powder of the plastic shell 7, namely, the blue light is emitted into the plastic shell 7 and is excited by the fluorescent powder 4 to emit light with the wavelength higher than that of incident light, and the process is photoluminescence.

When the LED lamp works, blue light (also called exciting light) emitted by the flip LED chip 2 emits directional light according to the structure of the blue light. The directional luminous beam is reflected multiple times in the non-lambertian dome structure cavity 5 to form scattered light, so that the non-lambertian dome structure cavity 5 is also called a light mixing cavity. The exciting light passing through the light mixing cavity excites the fluorescent powder 4 in the plastic shell 7 to emit light with a wavelength higher than that of the exciting light, and the process is a photoluminescence process. Since the physical shape of the phosphor 4 is irregular particle, the light emitted therefrom can be regarded as space light emission. The transmission of the excitation light in the plastic case 7 is divided into at least two states, one is a transmission state of the excitation light, and the other is a photoluminescence state. When the excitation light is in the photoluminescence state, a part of the light (or reflected light) changes the light path, so that the light path of the directional light emission of the 'excitation light' is changed at least.

To sum up, the utility model discloses a luminous route can conclude to: the light emitted by the flip LED chip 2 reaches the cavity 5 with the non-Lambertian dome structure, then enters the plastic shell 7, one part of the light is transmitted, the other part of the light interacts with the fluorescent powder 4 in the plastic shell 7 to generate photoluminescence, and the photoluminescence is generated by spatial light mixing. In the process, as the diameter of the plastic shell 7 is larger than the width of the heat-conducting electronic circuit board 1, downward light can be obtained, so that scattered light with a larger light-emitting angle can be obtained, safe light can be generated, the damage of blue light to human eyes can be avoided, soft light is not dazzling, glare or double images, and comfortable light can create a warm and comfortable light environment by even and soft light.

In the technical solution, the utility model discloses plastic housing 7's diameter is greater than heat conduction electronic circuit board 1's width, makes plastic housing 7 partly unsettled in heat conduction electronic circuit board 1's width direction, not only can make the light redirecting that the phosphor powder 4 in the plastic housing 7 excited by the exciting light sent out, still can make the exciting light redirecting of transmission in plastic housing 7, from this can obtain shining to the negative pole direction of optical axis.

In one embodiment, the flip-chip LED chip 2 may be die-bonded on the thermally conductive electronic circuit board 1 using the LED flip-chip die-bonding conductive adhesive structure and the mounting method thereof provided in US10,424,706B2; curing for 60 minutes at 155-160 ℃ in an oven; then, the solidified LED circuit board 8 and the plastic shell 7 are mounted and assembled, and then the bonding glue 9 is used for bonding in a marking and uniform gluing mode. And (4) after curing, finishing.

In another embodiment, the plastic housing 7 is injection molded, the actual dimension or total height of the injection molded plastic housing height being 7.0 mm. The flip-chip LED chip 2 may be die-bonded to the heat-conductive electronic circuit board 1 using the die-bonding conductive bonding structure for the flip-chip LED chip and the mounting method thereof provided in US10,424,706B2. And then, curing for 60 minutes at 155-160 ℃ in an oven. Next, the edge portion of the mounting groove 6 of the plastic case 7 is coated with the adhesive 9 by scribing and applying the adhesive uniformly. And then, the solidified LED circuit board 8 and the plastic shell 7 are bonded, installed and assembled, and the assembly is completed after solidification.

The utility model discloses can realize that paster LED wide-angle scattering is luminous, and obtain the healthy light source of scattered light, not only the process is simple, and is efficient, and the process is few, and need not ageing process, and the industrial chain is elongated, and degree of automation is high.

The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A long-range phosphor large-angle scattering patch LED, comprising: the LED heat-conducting lamp comprises a heat-conducting electronic circuit board (1), an inverted LED chip (2) and a plastic shell (7), wherein a non-Lambert dome structure cavity (5) is formed in the plastic shell (7), a mounting groove (6) is formed at the bottom of the plastic shell (7), the heat-conducting electronic circuit board (1) is mounted in the mounting groove (6), the inverted LED chip (2) is mounted on the heat-conducting electronic circuit board (1) and located in the non-Lambert dome structure cavity (5), and two sides of the plastic shell (7) protrude out of two sides of the heat-conducting electronic circuit board (1).

2. The remote phosphor large angle scattering patch LED as claimed in claim 1, wherein the mounting groove (6) is penetratingly disposed along a radial direction of the plastic case (7).

3. The remote phosphor large angle scattering patch LED as claimed in claim 1, wherein the plastic housing (7) is made of PP or PP modified plastic.

4. The remote phosphor large angle scattering patch LED as claimed in claim 1, wherein the heat conductive electronic circuit board (1) is mounted in the mounting groove (6) by means of bonding.

5. The remote phosphor large angle scattering patch LED as claimed in claim 1, wherein the heat conducting electronic circuit board (1) is a ceramic circuit board, or an aluminum-based circuit board, or an FPC circuit board, or a glass-based circuit board.

6. The remote phosphor large angle scattering patch LED as claimed in claim 3, wherein the PP modified plastic is metallocene polypropylene plastic.

7. The remote phosphor large-angle scattering patch LED as claimed in claim 1, wherein the orthographic projection of the non-Lambertian dome structure cavity (5) in the optical axis direction is a rectangular structure, the width of the rectangular structure is smaller than that of the heat-conducting electronic circuit board (1), and the width of the mounting groove (6) is larger than that of the non-Lambertian dome structure cavity (5).

8. The remote phosphor large angle scattering patch LED as claimed in claim 4, wherein the bottom surface of the heat conducting electronic circuit board (1) is higher than the bottom surface of the plastic housing (7).

9. The remote phosphor large-angle scattering patch LED as claimed in claim 1, wherein the heat-conducting electronic circuit board (1) is mounted in the mounting groove (6) by a high temperature-resistant quick-drying type structural adhesive.

10. The remote phosphor large angle scattering patch LED as claimed in claim 7, wherein the non-Lambertian dome structure cavity (5) is a photo-luminescent light mixing cavity.