CN216972740U - Lamp module and substrate processing equipment - Google Patents

Abstract

The utility model discloses a lamp module and substrate processing equipment, wherein the lamp module is used for heating a substrate in a process chamber and comprises: the lamp comprises an upper lamp module and a lower lamp module; wherein, go up the lamp module group and/or lamp module group includes down: the inner lamp electric wires electrically connect a plurality of nonadjacent inner lamps in the inner lamp group to form a controlled area, and the inner lamp electric wires in different controlled areas are used for supplying power to the inner lamp group in a partitioned manner; the outer lamp wires electrically connect a plurality of non-adjacent outer lamps in the outer lamp group to form a controlled area, and the outer lamp wires in different controlled areas are used for supplying power to the outer lamp group in a partition mode. The utility model can control the temperature of the surface of the substrate in a partitioning way, thereby ensuring the uniformity of the temperature of the surface of the substrate, reducing the frequency of opening the cavity and reducing the influence of the change of the local power supply state on the local temperature field of the surface of the substrate.

Description

Lamp module and substrate processing equipment

Technical Field

The utility model relates to the technical field of semiconductor manufacturing, in particular to a lamp module and substrate processing equipment comprising the same.

Background

Substrate processing equipment, such as epitaxial deposition equipment, is an important equipment in semiconductor manufacturing process, and its function is mainly to deposit high-purity and high-performance thin film on the surface of the substrate (or called wafer).

Most of existing substrate processing equipment adopts a lamp module to heat a substrate, the lamp module generally comprises an upper lamp module and a lower lamp module, wherein the upper lamp module generally comprises 32 halogen lamps, the 32 halogen lamps are uniformly distributed on a circle with the same diameter, the 32 lamps are divided into two different areas through reflecting plates with two different reflecting angles to realize the zone heating of the inner area and the outer area, the substrate cannot be independently and uniformly heated, and if the same power is applied to all the halogen lamps in the two lamp areas, the temperature of the outer ring of the substrate is far higher than that of the inner ring of the substrate in the actual process; if different powers need to be applied to the halogen lamps in the two lamp zones in order to ensure that the substrate surface temperature has higher uniformity, not only does a great deal of time need to be spent on adjusting the power distribution of the halogen lamps in the two lamp zones, but also the difference of the service lives of the halogen lamps in the two lamp zones is larger because the power of the halogen lamps in the two lamp zones is larger (the general power ratio is 1: 2.5-1: 3), so that the halogen lamps have to be replaced by frequently opening the cavity, and the maintenance workload and the economic cost are increased.

And the power supply mode of each halogen lamp in the lamp module group in the existing substrate processing equipment is a group of 3 or 4 adjacent lamps, if a certain group of power supply state has larger fluctuation or the lamps are damaged, the temperature of a heating area corresponding to the group of halogen lamps generates larger fluctuation, and the adverse effect on the temperature field uniformity of the surface of the substrate is easily caused.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a lamp module and a substrate processing device comprising the same, which can control the surface temperature of a substrate in a partitioning mode, so that the uniformity of the surface temperature of the substrate is ensured, the open cavity frequency is reduced, and the influence of the change of a local power supply state on the local temperature field of the surface of the substrate is reduced.

In order to achieve the purpose, the utility model is realized by the following technical scheme:

a lamp module for a substrate processing apparatus, the substrate processing apparatus comprising: lamp module and process chamber, process chamber is used for holding the substrate and handles the substrate, the lamp module is used for giving the substrate heating in process chamber, its characterized in that includes:

the upper lamp module is positioned above the process chamber;

the lower lamp module is positioned below the process chamber;

wherein, go up the lamp module group and/or lamp module group down includes: the inner lamp group comprises a plurality of inner lamps, all the inner lamps are distributed in a circumferential manner, and the inner lamp group is used for heating a first area of the substrate; the outer lamp group comprises a plurality of outer lamps, all the outer lamps are distributed in a circumferential mode, the outer lamp group is located on the outer side of the inner lamp group and used for heating a second area of the substrate, and the second area is located on the outer side of the first area;

go up the lamp module group and/or lamp module group still includes down: the inner lamp wires are used for electrically connecting a plurality of non-adjacent inner lamps in the inner lamp group to form a controlled area, and the inner lamp wires in different controlled areas are used for supplying power to the inner lamp group in a partition manner; the outer lamp wires electrically connect a plurality of non-adjacent outer lamps in the outer lamp group to form a controlled area, and the outer lamp wires in different controlled areas are used for supplying power to the outer lamp group in a partition mode.

Preferably, the number of the inner lamps of the inner lamp set is 12, and the number of the outer lamps of the outer lamp set is 30.

Preferably, the power ratio between one inner lamp and one outer lamp is 1: 1.1-1: 1.25.

Preferably, in the inner lamp group, the number of the inner lamps in a controlled area is 2-4; in the outer lamp group, the number of outer lamps in a controlled area is 2-4.

Preferably, in the inner lamp group, two adjacent inner lamps in the same controlled area are separated by at least one inner lamp in another controlled area; in the outer lamp group, two adjacent outer lamps in the same controlled area are separated by at least one outer lamp in another controlled area.

Preferably, the circumferences of the inner lamp group and the outer lamp group are concentric circles.

Preferably, the inner lamp set and the outer lamp set are arranged at intervals in the vertical direction, the inner lamp set is far away from the substrate, and the outer lamp set is close to the substrate.

Preferably, the upper lamp module and/or the lower lamp module further include: the reflecting chamber is used for reflecting the heating light rays emitted by the inner lamp group and the outer lamp group to the process chamber.

Preferably, the diameter range of the circumference where the inner lamp group is located is 200mm-300 mm; the diameter range of the circumference where the outer lamp group is located is 350-450 mm.

Preferably, the vertical distance between the outer lamp set and the inner lamp set is 50-80 mm.

Preferably, the inner lamp and the outer lamp are both halogen lamps.

The present invention also provides a substrate processing apparatus comprising:

a process chamber for receiving and processing a substrate;

the lamp module is used for heating the substrate in the process chamber;

wherein the process chamber comprises an upper quartz ceiling, a lower quartz ceiling, a liner and a tray; the upper quartz ceiling, the lower quartz ceiling and the lining enclose a reaction chamber; the tray is arranged in the reaction chamber and used for bearing the substrate.

Compared with the prior art, the utility model has at least one of the following advantages:

the inner upper lamp group and the outer upper lamp group can respectively heat a first region, namely an inner ring of the upper surface, of the upper surface of the substrate and a second region, namely an outer ring of the upper surface, of the upper surface of the substrate, and the temperature of the upper surface of the substrate can be controlled in a partitioning manner by adjusting the power of the inner upper lamp group and the power of the outer upper lamp group, so that the uniformity of the temperature of the upper surface of the substrate can be controlled conveniently, and the regulation time of the temperature of the upper surface of the substrate is saved.

According to the utility model, by realizing the partition control of the temperature of the upper surface of the substrate and the matching of the number of the inner lamps and the number of the outer lamps, the power ratio of the inner lamps to the outer lamps can be reduced, the service lives of the inner lamps and the outer lamps can be maintained at the same level, so that the inner lamps and the outer lamps can be uniformly replaced, the cavity opening frequency of a process cavity is effectively reduced, and the workload and the economic cost are reduced.

According to the utility model, the inner upper lamp wire, the outer upper lamp wire, the inner lower lamp wire and the outer lower lamp wire are connected with the corresponding non-adjacent lamps, so that the power supply for any one or more of the inner upper lamp group, the outer upper lamp group, the inner lower lamp group and the outer lower lamp group can be realized in a partition mode according to the requirement, thereby reducing the influence of local power supply state change or lamp damage on the local temperature field of the surface of the substrate, and further ensuring the uniformity of the surface temperature of the substrate.

Drawings

Fig. 1 is a schematic cross-sectional view of a substrate processing apparatus according to an embodiment of the present invention;

fig. 2 is a schematic structural diagram of an inner upper lamp set in a lamp module according to an embodiment of the present invention;

fig. 3 is a schematic structural diagram of an external upper lamp set in a lamp module according to an embodiment of the present invention;

fig. 4 is a schematic structural diagram of an inner lower lamp set in a lamp module according to an embodiment of the present invention;

fig. 5 is a schematic structural diagram of an outer lamp set and a lower lamp set in a lamp module according to an embodiment of the present invention;

FIG. 6 is a schematic diagram of a controlled area of an upper lamp set in a prior art lamp module;

FIG. 7 is a schematic diagram of a controlled area of an upper lamp set in a lamp module according to an embodiment of the present invention;

FIG. 8 shows the distribution of the light flux on the substrate surface under different conditions.

Detailed Description

The lamp module and the substrate processing apparatus according to the present invention will be described in further detail with reference to the accompanying drawings and embodiments. The advantages and features of the present invention will become more apparent from the following description. It is to be noted that the drawings are in a very simplified form and are all used in a non-precise scale for the purpose of facilitating and distinctly aiding in the description of the embodiments of the present invention. To make the objects, features and advantages of the present invention comprehensible, reference is made to the accompanying drawings. It should be understood that the structures, ratios, sizes, and the like shown in the drawings and described in the specification are only used for matching with the disclosure of the specification, so as to be understood and read by those skilled in the art, and are not used to limit the implementation conditions of the present invention, so that the present invention has no technical significance, and any structural modification, ratio relationship change or size adjustment should still fall within the scope of the present invention without affecting the efficacy and the achievable purpose of the present invention.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.

With reference to fig. 1 to 8, the present embodiment provides a lamp module for a substrate processing apparatus, the substrate processing apparatus includes a lamp module and a process chamber, the process chamber is used for accommodating and processing the substrate, the lamp module is used for heating the substrate in the process chamber, and the process chamber includes an upper quartz ceiling 103, a lower quartz ceiling 104, a liner 105 and a tray 102; wherein the upper quartz ceiling 103, the lower quartz ceiling 104 and the liner 105 enclose a reaction chamber, and the tray 102 is disposed in the reaction chamber for carrying the substrate 101; the substrate 101 comprises an upper surface and a lower surface which are oppositely arranged; the lamp module includes: the upper lamp module is positioned above the process chamber and used for heating the upper surface of the substrate 101 in a partition manner; the lower lamp module is positioned below the process chamber and is arranged opposite to the upper lamp module; the lower lamp module is used for heating the tray 102 on the lower surface of the substrate 101 in a partition manner, so that the substrate 101 is indirectly heated.

Specifically, in this embodiment, the upper quartz ceiling 103 of the process chamber is disposed above the lower quartz ceiling 104, which are hermetically connected by the liner 105, thereby forming a reaction chamber in which the substrate 101 and the tray 102 are located. Heating light (infrared wave) emitted by the upper lamp module can penetrate through the upper quartz roof 103 to perform zone heating on the upper surface of the substrate 101, heating light emitted by the lower lamp module can penetrate through the lower quartz roof 104 to perform zone heating on the tray 102 and the lower surface of the substrate 101, and the whole substrate 101 can be rapidly heated through the matching of the upper lamp module and the lower lamp module. Meanwhile, the surface temperature of the substrate 101 can be uniformized by adjusting the power of the upper lamp module and the lower lamp module, so as to meet the requirement of the epitaxial process, but the utility model is not limited thereto.

With continued reference to fig. 1 to 5, the upper lamp module and/or the lower lamp module includes: the lamp comprises an inner lamp group and an outer lamp group, wherein the inner lamp group comprises a plurality of inner lamps, and all the inner lamps are distributed in a circumferential manner; the outer lamp group comprises a plurality of outer lamps, all the outer lamps are distributed in a circumferential manner, and the inner lamps and the outer lamps comprise lamps; interior banks and outer banks can set up at last lamp module group or lamp module group down, perhaps set up simultaneously at last lamp module group and lamp module group down, set up in the lamp module group and outer banks of lamp module group call for interior banks and outer banks of lamp, set up in the lamp module group down and outer banks of lamp are called for interior banks and outer banks of lamp. Optionally, the upper lamp module comprises: the lamp assembly comprises an inner upper lamp group 210 and an outer upper lamp group 220, wherein the inner upper lamp group 210 comprises a plurality of inner upper lamps 2101, and all the inner upper lamps 2101 are distributed in a circumference manner; the inner upper lamp group 210 is used for heating a first area of the substrate 101; the outer upper lamp group 220 comprises a plurality of outer upper lamps 2201, and all the outer upper lamps 2201 are distributed circumferentially; the outer upper lamp set 220 is located outside the inner upper lamp set 210 and is used for heating a second area of the substrate 101, and the first area is located in the center of the substrate 101 and the second area is located outside the first area.

It is understood that in some other embodiments, the lower lamp module includes: the lamp assembly comprises an inner lower lamp group 310 and an outer lower lamp group 320, wherein the inner lower lamp group 310 comprises a plurality of inner lower lamps 3101, and all the inner lower lamps 3101 are distributed in a circumference way; the inner lower lamp set 310 is disposed opposite to the inner upper lamp set 210, and is used for heating a first region of the substrate 101; the outer lower lamp group 320 comprises a plurality of outer lower lamps 3201, and all the outer lower lamps 3201 are distributed along the circumference; the outer lower lamp set 320 is located outside the inner lower lamp set 310, and is disposed opposite to the outer upper lamp set 220, for heating a second region of the substrate 101.

In some embodiments, optionally, the inner upper lamp 2101, the outer upper lamp 2201, the inner lower lamp 3101 and the outer lower lamp 3201 are all halogen lamps.

Specifically, heating light rays emitted by all the inner upper lamps 2101 in the inner upper lamp group 210 may pass through the upper quartz ceiling 103 to heat a first region, that is, an inner ring, of the substrate 101, heating light rays emitted by all the outer upper lamps 2201 in the outer upper lamp group 220 may pass through the upper quartz ceiling 103 to heat a second region, that is, an outer ring, of the substrate 101, and then the entire upper surface of the substrate 101 may be heated through cooperation of the inner upper lamp group 210 and the outer upper lamp group 220. In addition, by adjusting the power of each of the inner upper lamp set 210 and the outer upper lamp set 220, the temperature of the first region and the second region of the substrate 101 can be independently controlled, so as to control the uniformity of the surface temperature of the substrate 101, but the utility model is not limited thereto.

Similarly, the heating light emitted by all the inner lower lamps 3101 in the inner lower lamp group 310 can pass through the lower quartz ceiling 104 to heat the first region, i.e., the inner ring, of the substrate 101, and the heating light emitted by all the outer lower lamps 3201 in the outer lower lamp group 320 can pass through the lower quartz ceiling 104 to heat the second region, i.e., the outer ring, of the substrate 101, so that the lower surface of the entire substrate 101 can be heated by the cooperation of the inner lower lamp group 310 and the outer lower lamp group 320. In addition, by adjusting the power of each of the inner lower lamp set 310 and the outer lower lamp set 320, the temperature of the first region and the second region of the lower surface of the substrate 101 can be independently controlled, so as to control the uniformity of the temperature of the lower surface of the substrate 101, but the utility model is not limited thereto.

In this embodiment, optionally, the number of the inner upper lamps 2101 in the inner upper lamp group 210 and the number of the inner lower lamps 3101 in the inner lower lamp group 310 may be 12; the number of the outer upper lamps 2201 in the outer upper lamp group 220 and the number of the outer lower lamps 3201 in the outer lower lamp group 320 may be 30. Experiments prove that when the substrate 101 is heated by comparing the number of the inner lamps and the number of the outer lamps of the lamp module in the embodiment, the power ratio between the inner upper lamp 2101 and the outer upper lamp 2201 in the upper lamp module is about 1: 1.1-1: 1.25 on the premise of realizing the temperature uniformity of the upper surface of the substrate 101; compared with the prior art, the power ratio of the halogen lamp in the two lamp areas of the lamp module is 1: 2.5-1: 3, in the lamp module in this embodiment, the power of the inner upper lamp 2101 and the power of the outer upper lamp 2201 are relatively low, and the service lives of the inner upper lamp 2101 and the outer upper lamp 2201 can be maintained at the same level, so that the inner upper lamp 2101 and the outer upper lamp 2201 can be replaced in a unified manner after reaching the service lives, thereby effectively reducing the cavity opening frequency of the process cavity and reducing the workload and the economic cost.

With continued reference to fig. 1, the diameters of the circumferences of the inner upper lamp set 210 and the inner lower lamp set 310 are the same; the diameters of the circumferences of the outer upper lamp set 220 and the outer lower lamp set 320 are the same.

In some other embodiments, the diameter of the circumference where the inner upper lamp set 210 and the inner lower lamp set 310 are located ranges from 200mm to 300 mm; the diameter of the circumference where the outer upper lamp set 220 and the outer lower lamp set 320 are located ranges from 350mm to 450 mm.

With reference to fig. 1, the outer upper lamp set 220 and the inner upper lamp set 210 are disposed at intervals along a vertical direction, the outer upper lamp set 220 is close to the substrate 101, and the inner upper lamp set 210 is far away from the substrate 101; similarly, the outer lower lamp set 320 and the inner lower lamp set 310 are arranged at intervals along the vertical direction, the outer lower lamp set 320 is close to the substrate 101, and the inner lower lamp set 310 is far away from the substrate 101.

In some other embodiments, the centers of the circles where the inner upper lamp set 210, the outer upper lamp set 220, the inner lower lamp set 310 and the outer lower lamp set 320 are located on the same vertical line.

In some embodiments, the vertical distance between the outer upper lamp set 220 and the inner upper lamp set 210 and the vertical distance between the outer lower lamp set 320 and the inner lower lamp set 310 are both 50mm to 80 mm.

Specifically, the outer upper lamp group 220 and the inner upper lamp group 210 are arranged at intervals in the vertical direction, so that the layered design of the outer upper lamp group 220 and the inner upper lamp group 210 is realized, and the outer upper lamps 2201 in the outer upper lamp group 220 and the inner upper lamps 2101 in the inner upper lamp group 210 are conveniently connected with corresponding electric wires. Also, by disposing the outer lower light group 320 and the inner lower light group 310 at intervals in the vertical direction, a layered design of the outer lower light group 320 and the inner lower light group 310 is achieved, thereby facilitating connection of the outer lower light 3201 in the outer lower light group 320 and the inner lower light 3101 in the inner lower light group 310 with corresponding wires. The inner upper lamp set 210 in the upper lamp module is located at an upper layer, and the outer upper lamp set 220 is located at a lower layer; the inner lower lamp set 310 is located at a lower layer, and the outer lower lamp set 320 is located at an upper layer in the lower lamp module, but the utility model is not limited thereto.

Referring to fig. 7, the upper lamp module and/or the lower lamp module further includes: the lamp wires can be arranged on any one or both of the upper lamp module and the lower lamp module as required, or on any one or both of the inner lamp group and the outer lamp group as required, the lamp wires arranged on the inner upper lamp group are called inner upper lamp wires, the lamp wires arranged on the outer upper lamp group are called outer upper lamp wires, the lamp wires arranged on the inner lower lamp group are called inner lower lamp wires, and the lamp wires arranged on the outer lower lamp group are called outer lower lamp wires; optionally, the inner upper lamp wires electrically connect a plurality of non-adjacent inner upper lamps 2101 in the inner upper lamp group 210, so as to perform power supply to the inner upper lamp group 210 in a partitioned manner; the outer upper lamp wires are electrically connected to a plurality of non-adjacent outer upper lamps 2201 in the outer upper lamp group 220, and are used for supplying power to the outer upper lamp group 220 in a partitioned manner. Optionally, the electrical connection is in series, parallel or a combination of the two.

Similarly, the inner lower lamp wires electrically connect a plurality of non-adjacent inner lower lamps 3101 in the inner lower lamp group 310, so as to supply power to the inner lower lamp group 310 in a partitioned manner; the outer lower lamp wires electrically connect a plurality of non-adjacent outer lower lamps 3201 in the outer lower lamp group 320, and are used for supplying power to the outer lower lamp group 320 in a partitioned manner. Also optionally, the electrical connections are in series, parallel, or a combination thereof.

Specifically, all the inner upper lamps 2101 in the inner upper lamp group 210 may be divided into a plurality of inner upper lamp controlled zones by a plurality of inner upper lamp wires. More specifically, all the inner upper lamps 2101 in each of the inner upper lamp controlled zones are not adjacent to each other, and are separated from each other by at least one inner upper lamp 2101 in another one of the inner upper lamp controlled zones, and preferably, the inner upper lamps 2101 in another one of the inner upper lamp controlled zones are separated from each other by one other, so that when the power supply state of the inner upper lamps 2101 in any one of the inner upper lamp controlled zones changes or lamps are damaged, the power of the inner upper lamps 2101 in the inner upper lamp controlled zone adjacent thereto may be adjusted to perform heating light compensation, thereby reducing the influence of the local power supply state change or lamp damage on the local temperature field on the surface of the substrate 101, and further ensuring the uniformity of the surface temperature of the substrate 101, but the utility model is not limited thereto.

Similarly, all the outer upper lamps 2201 in the outer upper lamp group 220 can be divided into a plurality of outer upper lamp controlled areas by a plurality of outer upper lamp wires; and all the outer upper lamps 2201 in each of the outer upper lamp controlled zones are not adjacent, and are also spaced apart from each other by the outer upper lamps 2201 in at least one other of the outer upper lamp controlled zones, and are also preferably spaced apart from each other by the outer upper lamps 2201 in one other of the outer upper lamp controlled zones.

Similarly, the lower lamp module and the upper lamp module adopt the same controlled area, which is not repeated herein. To describe the inner lamp set and the outer lamp set of the present embodiment more clearly, an optional controlled area division manner is specifically described by taking the inner upper lamp set 210 as an example, and refer to fig. 6 to 8. Fig. 6 is a schematic diagram of a controlled area of an inner upper lamp group 210 of a lamp module in the prior art, in which several adjacent inner upper lamps 2101 are usually electrically connected together to form an inner upper lamp controlled area, for example, lamp 1, lamp 2 and lamp 3 are electrically connected together by inner upper lamp wires to form an independent controlled area, lamp 4, lamp 5 and lamp 6 are electrically connected together to form another independent controlled area, and so on, and although the heating powers of different controlled areas can be independently controlled, a problem is caused: if the power supply state of the controlled area in which the lamps 1, 2 and 3 are located changes or the lamps are damaged, the heat radiation of the area heated by the controlled area will change, thereby causing uneven film deposition on the substrate; referring to the experimental results in fig. 8, a solid line a represents a normal distribution curve of the luminous flux on the surface of the substrate, and a dotted line b represents a distribution curve of the luminous flux on the surface of the substrate when the power supply states of the lamps 1, 2, and 3 are changed in the related art, as can be seen: the dotted line b is a substantial decrease in luminous flux in the substrate region corresponding to the lamps 1, 2, 3 with respect to the solid line a, which obviously affects the quality of the film deposition in this region. Referring to fig. 7, fig. 7 is an alternative structural schematic diagram of the inner upper lamp group 210 of the lamp module of this embodiment, the lamps 1, 3 and 5 are electrically connected together through the inner upper lamp wires to form an independent controlled area, the lamps 2, 4 and 6 are electrically connected together to form another independent controlled area, and so on, so that the controlled areas are arranged to be crossed and spaced from each other to well reduce the influence of the change of the power supply state of a certain controlled area or the damage of the lamps on the heat radiation of the area heated by the controlled area, and referring to the experimental result in fig. 8, the broken line c represents the distribution curve of the surface light flux of the substrate when the power supply state of the lamps 1, 3 and 5 is changed in this embodiment, as can be seen: the magnitude of the decrease in luminous flux is smaller for dashed line c relative to dashed line b, and thus the effect on the uniformity of film deposition on the substrate is correspondingly reduced; as an alternative to this embodiment, the number of the partition lamps may also be two, for example, lamp 1, lamp 4, and lamp 7 form an independent controlled area, lamp 2, lamp 5, and lamp 8 form another independent controlled area, lamp 3, lamp 6, and lamp 9 form another independent controlled area, and so on; optionally, the number of the spacing lamps can be two or more; for the number of the inner upper lamps 2101 electrically connected together for each controlled area, preferably, 2 or more, further preferably, 2 to 4, and more preferably, 2 to 3. The number of inner upper lamps 2101 electrically connected together in a controlled zone is theoretically as small as possible, provided that each lamp forms a controlled zone, i.e.: each lamp is independently adjustable, but the number of the lead wires led out in the way is greatly increased, and for a lamp module with narrow space, the installation and maintenance are difficult, and the control difficulty is increased; but too many are not good, which makes it difficult to precisely control the temperature of a certain area, and in this embodiment, 2-4 are good for avoiding the above problem.

With reference to fig. 1, the upper lamp module and/or the lower lamp module further includes: the reflecting chamber is used for reflecting the heating light rays emitted by the inner lamp group and the outer lamp group to the process chamber, the reflecting chamber arranged on the upper lamp module is called as an upper reflecting chamber, and the reflecting chamber arranged on the lower lamp module is called as a lower reflecting chamber; optionally, the upper reflecting chamber 230 is located above the upper lamp module, and is used for reflecting the heating light of the upper lamp module onto the substrate 101; the lower reflecting chamber 330 is located below the lower lamp module, and reflects the heating light of the lower lamp module onto the substrate 101.

It is understood that in some other embodiments, the reflective chamber includes a reflective plate disposed on any one of the inner lamp set and the outer lamp set, the reflective plate is annular and is used for reflecting the heating light of the inner lamp set or the outer lamp set to the process chamber, the reflective plate disposed on the inner upper lamp set is referred to as an inner upper lamp reflective plate, the reflective plate disposed on the outer upper lamp set is referred to as an outer upper lamp reflective plate, the reflective plate disposed on the inner lower lamp set is referred to as an inner lower lamp reflective plate, and the reflective plate disposed on the outer lower lamp set is referred to as an outer lower lamp reflective plate; optionally, the upper reflecting chamber 230 includes: an inner upper lamp reflecting plate 2301 and an outer upper lamp reflecting plate 2302, wherein the inner upper lamp reflecting plate 2301 is disposed around the inner upper lamp group 210 to reflect the heating light of the inner upper lamp group 210 to a first region of the upper surface of the substrate 101; an outer upper lamp reflection plate 2302 is disposed around the outer upper lamp group 220 to reflect heating light of the outer upper lamp group 220 to a second region of the upper surface of the substrate 101; the lower reflection chamber 330 includes: an inner lower lamp reflector 3301 and an outer lower lamp reflector 3302, the inner lower lamp reflector 3301 is disposed around the inner lower lamp set 310 to reflect the heating light of the inner lower lamp set 310 to a first region of the lower surface of the substrate 101; the outer lower lamp reflector 3302 is disposed around the outer lower lamp set 320 to reflect the heating light of the outer lower lamp set 320 to a second region of the lower surface of the substrate 101.

In a word, the power ratio of the inner lamp to the outer lamp can be reduced by realizing the partition control of the temperature of the upper surface of the substrate and the matching of the number of the inner lamp and the outer lamp, the service lives of the inner lamp and the outer lamp can be maintained at the same level, and therefore the inner lamp and the outer lamp can be replaced in a unified mode, the cavity opening frequency of the process cavity is effectively reduced, and the workload and the economic cost are reduced. According to the utility model, the inner upper lamp wire, the outer upper lamp wire, the inner lower lamp wire and the outer lower lamp wire are connected with the corresponding non-adjacent lamps, so that the power supply for any one or more of the inner upper lamp group, the outer upper lamp group, the inner lower lamp group and the outer lower lamp group can be realized in a partition mode according to the requirement, thereby reducing the influence of local power supply state change or lamp damage on the local temperature field of the surface of the substrate, and further ensuring the uniformity of the surface temperature of the substrate.

While the present invention has been described in detail with reference to the preferred embodiments, it should be understood that the above description should not be taken as limiting the utility model. Various modifications and alterations to this invention will become apparent to those skilled in the art upon reading the foregoing description. Accordingly, the scope of the utility model should be determined from the following claims.

Claims (12)

1. A lamp module for a substrate processing apparatus, the substrate processing apparatus comprising: the utility model provides a lamp module assembly and process chamber, the process chamber is used for holding the substrate and handle the substrate, the lamp module assembly is used for giving the substrate heating in the process chamber, its characterized in that includes:

the upper lamp module is positioned above the process chamber;

the lower lamp module is positioned below the process chamber;

wherein, go up the lamp module group and/or lamp module group down includes: the inner lamp group comprises a plurality of inner lamps, all the inner lamps are distributed circumferentially, and the inner lamp group is used for heating a first area of the substrate; the outer lamp group comprises a plurality of outer lamps, all the outer lamps are distributed in a circumferential mode, the outer lamp group is located on the outer side of the inner lamp group and used for heating a second area of the substrate, and the second area is located on the outer side of the first area;

go up the lamp module group and/or lamp module group still includes down: the inner lamp electric wires electrically connect a plurality of nonadjacent inner lamps in the inner lamp group to form a controlled area, and the inner lamp electric wires in different controlled areas are used for supplying power to the inner lamp group in a partitioned manner; the outer lamp wires electrically connect a plurality of non-adjacent outer lamps in the outer lamp group to form a controlled area, and the outer lamp wires in different controlled areas are used for supplying power to the outer lamp group in a partition mode.

2. The lamp module of claim 1, wherein the number of inner lamps in said inner lamp set is 12 and the number of outer lamps in said outer lamp set is 30.

3. The lamp module according to claim 1 or 2, wherein a power ratio between one of said inner lamps and one of said outer lamps is 1:1.1 to 1: 1.25.

4. The lamp module of claim 1 or 2, wherein in said inner lamp set, the number of inner lamps of a controlled zone is 2-4; in the outer lamp group, the number of outer lamps in a controlled area is 2-4.

5. The lamp module according to claim 1 or 2, wherein in said inner lamp group, two adjacent inner lamps in the same controlled area are separated by at least one inner lamp in another controlled area; in the outer lamp group, two adjacent outer lamps in the same controlled area are separated by at least one outer lamp in another controlled area.

6. The lamp module of claim 1 or 2, wherein the inner and outer lamp sets are located on concentric circles.

7. The lamp module of claim 1 or 2, wherein the inner and outer lamp groups are spaced apart in a vertical direction, the inner lamp group being remote from the substrate and the outer lamp group being proximate to the substrate.

8. The lamp module of claim 1 or 2, wherein the upper lamp module and/or the lower lamp module further comprises: the reflecting chamber is used for reflecting the heating light emitted by the inner lamp group and the outer lamp group to the process chamber.

9. The lamp module of claim 1 or 2, wherein the inner set of lamps is located on a circumference having a diameter in the range of 200mm to 300 mm; the diameter range of the circumference where the outer lamp group is located is 350-450 mm.

10. The lamp module of claim 7, wherein the outer and inner banks are vertically spaced from 50-80mm apart.

11. The lamp module according to claim 1 or 2, wherein said inner lamp and said outer lamp are halogen lamps.

12. A substrate processing apparatus, comprising:

a process chamber for receiving and processing a substrate;

the lamp module of any of claims 1-11, configured to heat a substrate within the process chamber;

wherein the process chamber comprises an upper quartz ceiling, a lower quartz ceiling, a liner and a tray; the upper quartz ceiling, the lower quartz ceiling and the lining enclose a reaction chamber; the tray is arranged in the reaction chamber and used for bearing the substrate.

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