CN219202128U - Exposure device and lithography equipment comprising same - Google Patents

Abstract

The utility model discloses an exposure device and a lithography device comprising the same, belonging to the lithography exposure device. The device comprises an exposure light source made of micro LEDs and a linear module which is suitable for driving the exposure device to move left and right relative to the object bearing table; and the horizontal movement direction of the linear module is inclined by a preset angle relative to the distribution direction of the pixel points in the exposure light source. According to the utility model, the linear module which is not parallel to the distribution direction of the pixel points is configured, and the whole plane to be exposed can be completely paved through two or more continuous exposures, so that the exposure of break points can be realized, and the circuit formed by etching is prevented from being broken.

Description

Exposure device and lithography equipment comprising same

Technical Field

The utility model belongs to a lithography exposure device, in particular to an exposure device and a lithography device comprising the exposure device.

Background

The photolithography apparatus is an apparatus for forming a complex circuit pattern using light, like a photo-printing technique, and a structural pattern of a large-scale integrated circuit device on a mask is drawn on a silicon wafer coated with a photoresist by a projection method for guangdian irradiation, and components of the photoresist chemically react by irradiation of light, thereby generating a circuit pattern. The lithographic apparatus can be used, for example, in the manufacture of semiconductor devices, display panels such as liquid crystal displays, plasma display panels, and electroluminescent displays, integrated circuits, and flat panel displays.

In the prior art, companies have also designed several micro light emitting diodes arranged in a matrix form as an exposure apparatus that can use a patterning device composed of an array of individually operable elements instead of a photomask. The patterning device is programmed to form a beam of light of a desired pattern using an array of individually operable elements. Such a "maskless" system can form patterns of various shapes at no additional cost, since the beam irradiated by the program can be modified to the desired pattern. In addition, maskless systems are faster and cheaper than conventional mask-based systems.

However, the micro light emitting diodes in the exposure device are arranged in a matrix form, and a certain gap is generally formed between the micro light emitting diodes, so that a circuit formed by etching is easy to break for some exposure device ultraviolet digital light sources with overlarge resolution, namely, the interval between the micro light emitting diodes is overlarge.

Disclosure of Invention

In order to overcome the technical defects, the utility model provides an exposure device and a lithography device comprising the exposure device, so as to solve the problems related to the background technology.

The present utility model provides an exposure apparatus including: an exposure light source made of micro LEDs and a linear module suitable for driving the exposure device to move left and right relative to the object bearing table; and the horizontal movement direction of the linear module is inclined by a preset angle relative to the distribution direction of the pixel points in the exposure light source.

Preferably or optionally, the exposure device is a micro LED ultraviolet digital light source.

Preferably or optionally, the wavelength range of the emitted light of the micro LED ultraviolet digital light source is 250nm-450nm.

Preferably or optionally, the micro LED ultraviolet digital light source comprises: the controller is connected with the panel, and the LED arrays are uniformly arranged on the panel at preset gaps;

the controller can independently control the switching of the LED pixel units in the LED array.

The utility model also provides a lithographic apparatus comprising:

an object carrier adapted to hold a semiconductor wafer coated with a resist layer or coating;

the exposure device comprises an exposure light source made of micro LEDs and a linear module which is suitable for driving the exposure device to move left and right relative to the object bearing table; the horizontal movement direction of the linear module is inclined by a preset angle relative to the distribution direction of the pixel points in the exposure light source;

and the computer control center is in signal connection with the exposure device and provides relevant digital data to the exposure device to create a desired pixel pattern.

Preferably or optionally, the exposure device is a micro LED ultraviolet digital light source.

Preferably or optionally, the wavelength range of the emitted light of the micro LED ultraviolet digital light source is 250nm-450nm.

Preferably or optionally, the micro LED ultraviolet digital light source comprises: the controller is connected with the panel, and the LED arrays are uniformly arranged on the panel at preset gaps;

the controller can independently control the switching of the LED pixel units in the LED array.

Preferably or alternatively, a projection lens is also arranged between the exposure device and the surface to be exposed.

The utility model relates to an exposure device and a lithography device comprising the same, which have the following beneficial effects compared with the prior art: according to the utility model, the linear module which is not parallel to the distribution direction of the pixel points is configured, and the whole plane to be exposed can be completely paved through two or more continuous exposures, so that the exposure of break points can be realized, and the circuit formed by etching is prevented from being broken.

Drawings

Fig. 1 is a schematic structural view of a conventional micro LED ultraviolet digital light source.

FIG. 2 is a schematic diagram of a lithographic apparatus according to the utility model.

Fig. 3 is a schematic structural view of a micro LED ultraviolet digital light source in the present utility model.

FIG. 4 is a schematic diagram of a lithographic apparatus according to the utility model.

The reference numerals are: 110. an X-axis transfer unit; 120. an object carrying table; 130. a semiconductor wafer; 210. an exposure light source; 220. a linear module; 300. a computer control center; 230. a projection lens; 221. a panel; 222. and a pixel element.

Detailed Description

In the following description, numerous specific details are set forth in order to provide a more thorough understanding of the present utility model. It will be apparent, however, to one skilled in the art that the utility model may be practiced without one or more of these details. In other instances, well-known features have not been described in detail in order to avoid obscuring the utility model.

Referring to fig. 1, a schematic structural diagram of a conventional micro LED ultraviolet digital light source is shown. Comprising the following steps: a substrate, and an array of LEDs disposed on the substrate. In the exposure process, the computer control center 300 decomposes a desired exposure pattern into different pixel points, assigns coordinates or addresses to each micro LED, and individually controls the on/off of each micro LED, thereby implementing various exposure patterns. Because a certain gap exists between two adjacent micro LEDs, for some micro LED ultraviolet digital light sources with too small resolution, the whole plane to be exposed can be approximately completely paved through the scaling of the lens and the weak diffusion capability of the light source. However, for some micro LED ultraviolet digital light sources with larger resolution, that is, the interval between micro LEDs is too large, the circuit formed by etching is easy to break.

Although the object carrying table 120 is provided on the X-axis transfer unit 110 to be movable with respect to the X-direction or Y-direction of the exposure apparatus, the X-axis transfer unit 110 functions mainly to replace the etched area of the semiconductor wafer 130, and has no auxiliary effect on the exposure process. And the motion direction of the X-axis transmission unit 110 is parallel to the distribution direction of micro LEDs in the micro LED ultraviolet digital light source, and in the motion process, the blind area can still be exposed, so that the technical problem of the application cannot be thoroughly solved.

In view of the above technical problems, the applicant improves on the existing micro LED ultraviolet digital light source and proposes a lithographic apparatus, referring to fig. 2 to 4, which includes: an object stage 120, an exposure apparatus, and a computer control center 300.

Wherein the object carrier 120 is adapted to hold a semiconductor wafer 130 coated with a resist layer or coating; the object carrying stage 120400 is placed on a susceptor made of marble, and an X-axis transfer unit 110 is provided between the object carrying stage 120 and the susceptor, driving the object carrying stage 120 and the semiconductor wafer 130 to move horizontally within a certain range. Since the general metal material is greatly affected by temperature, the flatness of the base is changed due to heating, and therefore, the base is made of marble material. In the photolithography process, parallelism between the exposure apparatus and the semiconductor wafer 130 can be better ensured.

An exposure apparatus is located above the object stage 120, the exposure apparatus including: an exposure light source 210 made of micro LEDs, and a linear module 220 adapted to drive the exposure device to move left and right with respect to the object stage 120; and the horizontal movement direction of the linear module 220 is inclined at a predetermined angle with respect to the distribution direction of the pixels in the exposure light source 210. Referring to fig. 3, by configuring a linear module 220 that is not parallel to the distribution direction of the pixel points, the whole plane to be exposed can be completely paved by two or more continuous exposures, so that the exposure of the break points can be realized, and the circuit formed by etching is prevented from forming open circuit.

It should be noted that, the tolerance level between the guide rail and the slider of the linear module 220 is less than or equal to 9 levels, so as to ensure the accuracy of the linear module. In addition, a grating ruler sensor and a laser interferometer are further configured on the linear module 220, and are used for detecting the motion condition of the linear module 220 in real time, correcting the motion condition of the linear module 220 in time, and improving the motion precision.

Of course, a projection lens 230 is further disposed between the exposure device and the surface to be exposed, and the projection lens 230 may be an magnifying lens or a reducing lens, in this embodiment, a 52mm NIKON micro projection lens 230 is selected for reducing or enlarging the projection area of the pixel element 222 on the surface to be exposed.

In a preferred embodiment, referring to fig. 3, the wavelength range of the emitted light of the micro LED ultraviolet digital light source is 250nm-450nm. The micro LED ultraviolet digital light source comprises: a controller, a panel 221 connected to the controller, and an LED array uniformly disposed on the panel 221 at a predetermined interval; wherein the control board can individually control the switching of the LED pixel elements 222 in the LED array. The exposure device can directly expose the graphic data of the computer onto the wafer or the PCB without using a mask or a DMD, and has simpler structure and stronger operability.

The computer control center 300 is in signal communication with the exposure apparatus and provides the relevant digital data to the exposure apparatus to create the desired pixel pattern. Any modifications and/or variations required in the pixel pattern may be modified or established using the computer control center 300. For micro LED ultraviolet digital light sources, different pixel patterns can be realized by controlling the switch of each LED pixel element 222 in the LED array through a controller.

In order to facilitate understanding of the technical scheme of the exposure device and the lithography apparatus including the exposure device, a brief description is made of the working principle thereof: in operation, the semiconductor wafer 130 coated with the resist layer or the coating layer is fixedly mounted on the object bearing table 120400, then the distance between the exposure device and the semiconductor wafer 130 is adjusted, focusing of the exposure device is achieved, finally the position of the semiconductor wafer 130 relative to the exposure device is adjusted through the X-axis transmission unit 110, the exposure device is aligned with a certain area of the semiconductor wafer 130, the pattern of the micro LED ultraviolet digital light source is adjusted through the controller, the position of the micro LED ultraviolet digital light source relative to the semiconductor wafer 130 is adjusted through the linear module 220, exposure etching of the semiconductor wafer 130 is achieved, and finally the complete pixel pattern data of the computer control center 300 is exposed on the semiconductor wafer 130.

In addition, the specific features described in the above embodiments may be combined in any suitable manner without contradiction. The various possible combinations of the utility model are not described in detail in order to avoid unnecessary repetition.

Claims (9)

1. An exposure apparatus, comprising: an exposure light source made of micro LEDs and a linear module suitable for driving the exposure device to move left and right relative to the object bearing table; and the horizontal movement direction of the linear module is inclined by a preset angle relative to the distribution direction of the pixel points in the exposure light source.

2. The exposure apparatus according to claim 1, wherein the exposure light source is a micro LED ultraviolet digital light source.

3. The exposure apparatus according to claim 2, wherein the micro LED ultraviolet digital light source emits light in a wavelength range of 250nm to 450nm.

4. The exposure apparatus according to claim 2, wherein the micro LED ultraviolet digital light source includes: the controller is connected with the panel, and the LED arrays are uniformly arranged on the panel at preset gaps;

the controller can independently control the switching of the LED pixel units in the LED array.

5. A lithographic apparatus, comprising:

an object carrier adapted to hold a semiconductor wafer coated with a resist layer or coating;

the exposure device comprises an exposure light source made of micro LEDs and a linear module which is suitable for driving the exposure device to move left and right relative to the object bearing table; the horizontal movement direction of the linear module is inclined by a preset angle relative to the distribution direction of the pixel points in the exposure light source;

and the computer control center is in signal connection with the exposure device and provides relevant digital data to the exposure device to create a desired pixel pattern.

6. The lithographic apparatus of claim 5, wherein the exposure light source is a micro LED ultraviolet digital light source.

7. The lithographic apparatus of claim 5, wherein the micro LED uv digital light source emits light in a wavelength range of 250nm-450nm.

8. The lithographic apparatus of claim 5, wherein the micro LED uv digital light source comprises: the controller is connected with the panel, and the LED arrays are uniformly arranged on the panel at preset gaps;

the controller can independently control the switching of the LED pixel units in the LED array.

9. The lithographic apparatus according to claim 5, wherein a projection lens is further provided between the exposure device and the surface to be exposed.

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