CN219800837U

CN219800837U - Heat dissipation core packaging base

Info

Publication number: CN219800837U
Application number: CN202320741823.4U
Authority: CN
Inventors: 张文彬
Original assignee: Yangzhou Xingyu Photoelectric Technology Co ltd
Current assignee: Yangzhou Xingyu Photoelectric Technology Co ltd
Priority date: 2023-04-06
Filing date: 2023-04-06
Publication date: 2023-10-03
Anticipated expiration: 2033-04-06

Abstract

The utility model discloses a heat dissipation chip packaging base, which comprises a plastic package shell, wherein a conductive sheet is arranged in the bottom of the plastic package shell, a chip is arranged on the conductive sheet, an anti-glue sleeve is coated outside the chip, a plastic package cover is arranged at the top of the plastic package shell, a square hole is arranged on the plastic package cover, heat-conducting glue is filled in the square hole, and a fan is arranged at the upper end of the plastic package cover. The utility model discloses a heat on the heat conduction glue is derived the chip, then the fan blows away the heat, has improved the heat dispersion of encapsulation base like this, avoids the chip to take place overheated condition.

Description

Heat dissipation core packaging base

Technical Field

The utility model relates to the technical field of chip packaging bases, in particular to a heat dissipation chip packaging base.

Background

Packaging technology is a technology that packages integrated circuits with insulating plastic or ceramic materials, protecting the circuit chips from the surrounding environment, including from physical and chemical aspects. Now, with the faster and faster speed of the chip, the power is larger and larger, so that the technology of chip packaging is more and more important. Chip packaging today is a housing for mounting semiconductor integrated circuit chips, and serves to mount, secure, seal, protect and enhance the electrothermal performance of the chip, and is a bridge that communicates the world inside the chip with external circuits (contacts on the chip are connected to pins of the housing by wires that in turn are connected to other devices by wires on a printed board).

However, the chip is used as a core component in an electronic device, the operation frequency is high, the reaction time is short, the instant current passing through the chip is large and small, larger heat energy can be generated, the chip is heated and is not smooth to operate, the heat dissipation performance of the traditional packaging base is not good, and the chip is easy to operate.

Disclosure of Invention

The present utility model is directed to a heat dissipation chip package base, so as to solve the problem of poor heat dissipation performance of the package base set forth in the above background art.

In order to solve the technical problems, the utility model provides the following technical scheme:

the utility model provides a heat dissipation chip package base, includes the plastic envelope casing, be equipped with the conducting strip in the plastic envelope casing bottom, install the chip on the conducting strip, the outer cladding of chip has the gum cover of preventing, the plastic envelope lid is installed at plastic envelope casing top, be equipped with square hole on the plastic envelope lid, square hole intussuseption is filled with the heat-conducting glue, the fan is installed to the plastic envelope lid upper end.

Furthermore, the left side and the right side of the conducting strip are respectively provided with a pin wire I, and the pin wires I extend out of the plastic package shell.

Furthermore, the left side and the right side of the fan are respectively provided with a second pin wire.

Further, arc holes are formed in the left side and the right side of the fan.

Compared with the prior art, the utility model has the following beneficial effects:

according to the utility model, the heat on the chip is led out through the heat-conducting adhesive, and then the fan blows out the heat, so that the heat dissipation performance of the packaging base is improved, and the chip is prevented from being overheated.

Drawings

The accompanying drawings are included to provide a further understanding of the utility model and are incorporated in and constitute a part of this specification, illustrate the utility model and together with the embodiments of the utility model, serve to explain the utility model. In the drawings:

fig. 1 is a cross-sectional view of the structure of the present utility model.

In the figure: 1. a plastic package shell; 2. a conductive sheet; 3. a chip; 4. an anti-glue sleeve; 5. a plastic sealing cover; 6. square holes; 7. a heat-conducting adhesive; 8. a fan; 9. a first pin wire; 10. a second pin wire; 11. arc-shaped holes.

Detailed Description

For the purpose of further illustrating the various embodiments, the present utility model provides the accompanying drawings, which are a part of the disclosure of the present utility model, and which are mainly used to illustrate the embodiments and, together with the description, serve to explain the principles of the embodiments, and with reference to these descriptions, one skilled in the art will recognize other possible implementations and advantages of the present utility model, wherein elements are not drawn to scale, and like reference numerals are generally used to designate like elements.

According to an embodiment of the present utility model, a heat dissipating chip package base is provided.

Embodiment one:

as shown in fig. 1, the heat dissipation chip packaging base comprises a plastic package shell 1, wherein a conductive sheet 2 is arranged in the bottom of the plastic package shell 1, a chip 3 is mounted on the conductive sheet 2, an anti-glue sleeve 4 is coated outside the chip 3, a plastic package cover 5 is mounted on the top of the plastic package shell 1, a square hole 6 is formed in the plastic package cover 5, heat conducting glue 7 is filled in the square hole 6, and a fan 8 is mounted at the upper end of the plastic package cover 5;

embodiment two:

the left side and the right side of the conducting strip 2 are respectively provided with a pin wire I9, and the pin wires I9 extend out of the plastic package shell 1;

the left side and the right side of the fan 8 are respectively provided with a pin wire II 10, and the fan 8 is powered by the pin wires II 10;

arc holes 11 are formed in the left side and the right side of the fan 8;

the working principle of the utility model is as follows:

after the chip 3 is mounted, the second pin wire 10 is connected onto the circuit board to supply power to the fan 8, and the fan 8 is started, so that heat generated by the chip 3 during operation is guided onto the heat conducting glue 7 by the heat conducting glue 7, and then the fan 8 blows the heat on the heat conducting glue 7 to the outside through the arc-shaped hole 11, so that the chip 3 is radiated;

therefore, the heat on the chip 3 is conducted out through the heat-conducting adhesive 7, and then the fan 8 blows out the heat, so that the heat dissipation performance of the packaging base is improved, and the chip is prevented from being overheated.

It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Finally, it should be noted that: the foregoing description is only a preferred embodiment of the present utility model, and the present utility model is not limited thereto, but it is to be understood that modifications and equivalents of some of the technical features described in the foregoing embodiments may be made by those skilled in the art, although the present utility model has been described in detail with reference to the foregoing embodiments. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model should be included in the protection scope of the present utility model.

Claims

1. The utility model provides a heat dissipation core packaging base, includes plastic envelope casing (1), its characterized in that: be equipped with conducting strip (2) in plastic envelope casing (1) bottom, install chip (3) on conducting strip (2), chip (3) outer cladding has anti-glue cover (4), plastic envelope lid (5) are installed at plastic envelope casing (1) top, be equipped with square hole (6) on plastic envelope lid (5), square hole (6) intussuseption is filled with heat-conducting glue (7), fan (8) are installed to plastic envelope lid (5) upper end.

2. A heat sink chip package base according to claim 1, wherein: the left side and the right side of the conducting strip (2) are respectively provided with a pin wire I (9), and the pin wires I (9) extend out of the plastic package shell (1).

3. A heat sink chip package base according to claim 1, wherein: and the left side and the right side of the fan (8) are respectively provided with a pin wire II (10).

4. A heat sink chip package base according to claim 1, wherein: arc-shaped holes (11) are formed in the left side and the right side of the fan (8).