CN219829389U - Drying furnace conveyer and drying furnace - Google Patents

Abstract

The utility model discloses a drying furnace transportation device and a drying furnace, which include: a drying transportation mechanism, which is arranged through a drying section and can transport silicon wafers to dry the silicon wafers in the drying section; a cooling transportation mechanism, The path cooling section is configured to receive the dried silicon wafers transported by the drying transport mechanism and continue to transport them for the cooling section to cool the silicon wafers. It can improve energy utilization efficiency, reduce unnecessary energy loss, and extend the service life of the drying and transportation mechanism. The utility model is applied in the field of drying furnaces.

Description

A drying oven transportation device and drying oven

Technical field

The utility model relates to the field of drying ovens, in particular to a drying oven transport device and a drying oven.

Background technique

In the production process of photovoltaic cells, a drying furnace is needed to dry and cool the silicon wafers after screen printing. During the operation of the existing drying equipment, the silicon wafer transport furnace belt is heated in a cycle There is a large difference in the furnace temperature limit between the furnace body and the cooling furnace body, resulting in large energy consumption losses; the temperature of the furnace belt is low, resulting in poor drying effect; the working time is long, and the material of the furnace belt ages and becomes brittle under the impact of cold and heat. Problems such as shortened lifespan.

Utility model content

The utility model aims to solve at least one of the technical problems existing in the prior art. To this end, the utility model proposes a drying furnace transportation device, which can improve energy utilization efficiency, reduce unnecessary energy loss, and extend the service life of the drying transportation mechanism.

A drying oven having the above-mentioned drying oven transport device is also proposed.

The drying oven transportation device according to the first embodiment of the present invention includes:

The drying transport mechanism is set up in the drying section and can transport silicon wafers to dry the silicon wafers in the drying section;

The cooling transport mechanism is arranged along the cooling section and can accept the dried silicon wafers transported by the drying transport mechanism and continue transporting them for the cooling section to cool the silicon wafers.

The drying oven transportation device according to the first embodiment of the present invention has at least the following beneficial effects:

1. The drying transport mechanism only transports in the drying section. The drying transport mechanism will not take out the heat in the drying section to be cooled in the cooling section. The drying transport mechanism reduces the impact of the drying transport mechanism on the drying section. The heat loss is reduced, and the drying section does not need to use too much heat to heat the drying transport mechanism;

2. The cooling transport mechanism can dissipate heat for the dried silicon wafers alone, without connecting to the cooling transport mechanism for heat dissipation. The heat dissipation efficiency for the silicon wafers is higher, and the cooling section can use lower heat dissipation power consumption. Achieve the same heat dissipation effect as before, with higher energy utilization;

3. The operating environment of the drying and transporting mechanism remains stable, and sudden heating and cooling are not prone to occur. The extreme temperature difference range is small, which can extend the service life of the drying and transporting mechanism.

According to some embodiments of the present invention, the rollers of the first transportation mechanism and the second transportation mechanism are made of cold and heat shock-resistant materials.

According to some embodiments of the present invention, the drying transport mechanism and the cooling transport mechanism are one of a barrel conveyor, a belt conveyor or a plate conveyor.

According to some embodiments of the present invention, the drying transport mechanism is a belt conveyor.

According to some embodiments of the present invention, the drying transport mechanism includes a transport belt, a driving source and several transmission parts. The transport belt is drivingly connected to the driving source and the transmission parts. Between the driving source and the transmission parts The conveyor belt rotates under the driving of the transmission member, and the conveyor belt is provided with a tilted portion on both sides along its conveying direction.

According to some embodiments of the present invention, the cooling transport mechanism is a cold and heat shock resistant transport mechanism.

The drying oven according to the second embodiment of the present invention includes:

The drying section is equipped with a drying device;

A cooling section is provided with a cooling device and is located adjacent to the drying section;

Transport device, the transport device is the drying oven transport device according to the first embodiment of the present invention, the drying transport mechanism is arranged through the drying section, and the cooling transport mechanism is arranged through the cooling section , and the drying transport mechanism can transport silicon wafers to the cooling transport mechanism.

The drying oven according to the second embodiment of the present invention has at least the following beneficial effects: the drying transport mechanism and the cooling transport mechanism are set up separately, the drying transport mechanism only transports in the drying section, and its heat will be transported in the drying section. The accumulation in the dry section will not be cooled by the cooling section after passing through the cooling section, so the heat utilization efficiency is higher. Moreover, the change of cold and heat experienced by the drying transport mechanism is small, and it will not pass through the drying section and the cooling section in sequence. When sudden cooling and sudden heating occur, the material requirements are lower, and long-term use will not be damaged by the sudden cooling and heating environment.

According to some embodiments of the present invention, the cooling device includes a first cooling component, which is disposed toward the silicon wafer on the cooling transport mechanism and capable of cooling the silicon wafer.

According to some embodiments of the present invention, the first cooling assembly includes an impurity-removing blowing assembly and a main exhaust assembly. The impurity-removing blowing assembly is provided with an impurity-removing air outlet, and the impurity-removing air outlet faces the cooling transport mechanism. Silicon wafer is installed, and the main exhaust component is used to extract gas.

According to some embodiments of the present invention, the cooling device includes a second cooling component, which is disposed along the transport direction of the cooling transport mechanism and opposite to the first cooling component. The cooling transport mechanism is located in the middle of the cooling transport mechanism.

According to some embodiments of the present invention, the second cooling assembly includes a cooling blowing assembly and a secondary exhausting assembly. The cooling blowing assembly is arranged toward the silicon wafer on the cooling transport mechanism. The secondary exhausting assembly is used to extract the gas between the first cooling component and the second cooling component.

Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention.

Description of the drawings

The utility model will be further described below in conjunction with the accompanying drawings and examples, wherein:

Figure 1 is a schematic structural diagram of a drying oven transport device in a drying oven according to an embodiment of the present invention;

Figure 2 is a schematic side view of a drying oven transport device in a drying oven according to an embodiment of the present invention;

Figure 3 is a schematic top view of the drying oven transport device in the drying oven according to an embodiment of the present invention;

Figure 4 is an exploded schematic diagram of the cooling section of the drying oven transport device according to an embodiment of the present invention;

Figure 5 is an exploded schematic diagram of the cooling transport mechanism in the drying oven transport device according to an embodiment of the present invention;

Figure 6 is a specific schematic diagram of the drum of the cooling transport mechanism in the drying oven transport device according to an embodiment of the present invention.

Reference number:

Drying transport mechanism 100;

Drying section 200; drying device 210;

Cooling transport mechanism 300; frame 310; roller 320; connector 330; gear 340;

Cooling section 400; cooling device 410; first cooling component 411; impurity removal blower component 4111; main exhaust component 4112; second cooling component 412; cooling blower component 4121; secondary exhaust component 4122.

Detailed ways

The embodiments of the present invention are described in detail below. Examples of the embodiments are shown in the drawings, in which the same or similar reference numerals throughout represent the same or similar elements or elements with the same or similar functions. The embodiments described below with reference to the drawings are exemplary and are only used to explain the present invention and cannot be understood as limitations of the present invention.

In the description of the present invention, it should be understood that the orientation descriptions involved, such as the orientation or positional relationship indicated by up and down, etc. are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present utility model and The simplified description does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be construed as a limitation of the present invention.

In the description of the present invention, several refers to one and more than one, and plural refers to two and more than two. If there is a description of first and second, it is only for the purpose of distinguishing technical features, and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of indicated technical features or implicitly indicating the order of indicated technical features. relation.

In the description of the present utility model, unless otherwise explicitly limited, words such as setting, installation, and connection should be understood in a broad sense. Those skilled in the art can reasonably determine the specific meaning of the above words in the present utility model in combination with the specific content of the technical solution. .

In the related art, a drying furnace is usually provided with a drying section and a cooling section. After the silver paste on the surface of the silicon wafer is dried, it is cooled through the cooling section. The same transport device is usually used to pass through the drying section and the cooling section. In the drying section, the transport device is heated. When passing through the cooling section, the transport device is cooled. The transport device is repeatedly heated and cooled. The extreme temperature difference endured by the transport device is large. When the transport device is subjected to cold and heat shocks for a long time, its material is prone to aging. , becomes brittle, shortens lifespan, and is not conducive to long-term use. At the same time, when the cooled transportation device enters the drying section, it will reabsorb the heat in the drying section, reducing the heating effect of the drying section. When the heated transportation device enters the cooling section, it will dissipate heat together with the silicon wafer. The cooling effect of the cooling section is reduced, and its energy utilization efficiency is low.

Referring to Figures 1, 2 and 3, a drying oven transport device according to one embodiment of the present invention includes:

The drying transport mechanism 100 is arranged through the drying section 200 and can transport silicon wafers to dry the silicon wafers in the drying section 200;

The cooling transport mechanism 300 is arranged along the cooling section 400 and can receive the dried silicon wafers transported by the drying transport mechanism 100 and continue transporting them for the cooling section 400 to cool the silicon wafers.

It is worth understanding that the drying transport mechanism 100 only transports in the drying section 200, and the drying transport mechanism 100 will not take out the heat in the drying section 200 to be cooled in the cooling section 400. The drying transport mechanism 100 reduces The heat loss caused by the drying transport mechanism 100 to the drying section 200 is eliminated, and the drying section 200 does not need to use too much heat to heat the drying transport mechanism 100; the cooling transport mechanism 300 can dissipate the heat of the dried silicon wafer alone, and There is no need to connect the cooling transport mechanism 300 for heat dissipation, the heat dissipation efficiency of the silicon wafer is higher, and the cooling section 400 can use lower heat dissipation power consumption to achieve the same heat dissipation effect as before, and the energy utilization rate is higher; drying The use environment of the transport mechanism 100 remains stable, sudden heating and cooling phenomena are not prone to occur, and the extreme temperature difference range is small, which can extend the service life of the drying transport mechanism 100 .

Specifically, the drying transport mechanism 100 and the cooling transport mechanism 300 can be disposed adjacent to each other, so that the silicon wafers can be directly transferred from the drying transport mechanism 100 to the cooling transport mechanism 300 to realize the transfer of the silicon wafers. Of course, after deciding on the transport rhythm of the silicon wafers, the drying transport mechanism 100 and the cooling transport mechanism 300 can also be separated by a long distance, and the drying transport mechanism 100 and the cooling transport mechanism 300 can be transported through their transfer devices. The transfer device can be a robot arm.

Referring to Figures 1, 2 and 3, the drying transport mechanism 100 and the cooling transport mechanism 300 are one of a barrel conveyor, a belt conveyor or a plate conveyor.

It is worth understanding that the drying transport mechanism 100 and the cooling transport mechanism 300 can be different transport mechanisms, or they can be the same transport mechanism. It only needs to be realized that the drying transport mechanism 100 is arranged in the drying section 200 and the cooling transport mechanism 300 is arranged in the drying section 200. That's it in cooling section 400.

Referring to Figures 1, 2 and 3, the drying transport mechanism 100 is a belt conveyor.

It is worth understanding that the conveying devices in the related art are all belt conveyors for transporting silicon wafers, and in the drying furnace, the silicon wafers are mainly dried, and the length of the drying transport mechanism 100 will be longer than the cooling transport mechanism 300 . length, when improving the drying oven in the related technology, the belt conveyor can be directly retained, and a cooling transport mechanism 300 and corresponding structures are provided at the rear of the belt conveyor in the transportation direction to facilitate direct transportation of the drying oven in the related technology. The device can be improved at low cost and can be widely used.

Referring to Figures 1, 2 and 3, the drying transport mechanism 100 includes a transport belt, a driving source and a number of transmission parts. The transport belt is connected to the driving source and transmission parts, and rotates under the driving of the driving source and transmission parts. The conveyor belt is provided with a raised portion on both sides along its conveying direction.

It is worth understanding that when the silicon wafer is transported on the conveyor belt, the silicon wafer may slide relative to the conveyor belt, causing the position of the silicon wafer relative to the conveyor belt to shift. The silicon wafer must be moved through the raised parts on both sides of the conveyor belt. The position limit makes it difficult for the silicon wafer to deviate relative to the position of the conveyor belt. When the silicon wafer is transferred to the conveyor belt, the transportation position of the silicon wafer is fixed, so that the silicon wafer can be transported to the cooling transportation mechanism 300 at a fixed position. The wafer transfer between the dry transport mechanism 100 and the cooling transport is more reliable.

Specifically, the driving source is a motor and a driving roller 320 connected to the motor, and the transmission member is a rotatable transmission roller 320. The driving roller 320 can tension the conveyor belt with the transmission roller 320, so that the conveyor belt is subject to a certain tension. It can rotate with the rotation of the driving roller 320 .

In some specific embodiments of the present invention, the cooling transport mechanism 300 is a thermal shock-resistant transport mechanism.

Among them, the thermal shock resistant material refers to a material that can simultaneously withstand the drying temperature in the drying section 200 and the cooling temperature in the cooling section 400 in the drying furnace, and is not easily damaged by temperature differences, such as ceramics and stainless steel.

It is worth understanding that when the cooling transport mechanism 300 receives the silicon wafers transported by the drying transport mechanism 100, the silicon wafers themselves have high temperatures, and heat transfer occurs between the silicon wafers and the cooling transport mechanism 300, causing the temperature of the cooling transport mechanism 300 to rise. High, at the same time, the silicon wafer and the cooling transport mechanism 300 are cooled together. The cooling transport mechanism 300 is subject to a certain degree of cold and heat shock, and the cold and heat shock resistant transport mechanism can better withstand this cooling shock, and is not easily deformed due to cold and heat shock, and is long-term It is not easy to be damaged during use and has a longer service life.

5 and 6 , the cooling transport mechanism 300 can be a cylindrical conveyor, and the contact between the cylindrical conveyor and the silicon wafer is line contact, so that the contact area between the cooling transport mechanism 300 and the silicon wafer is smaller. , reducing the efficiency of heat transfer, thereby reducing the heating rate of the cooling transport mechanism 300, and the range of hot and cold shocks is smaller, reducing the impact of hot and cold shocks on the cooling transport mechanism.

Specifically, referring to Figures 5 and 6, the specific structure of the cooling conveying mechanism includes: a frame 310 and a plurality of rollers 320 arranged side by side along the transportation direction. Both ends of the rollers 320 are connected to the frame 310 through connectors 330. , and the drum 320 is rotatably connected to the connector 330. One end of the drum 320 is provided with a gear 340. The axis of the gear 340 is collinear with the axis of the drum 320. All the gears 340 can be connected to the driving source through the same chain belt, and the driving source can It is a motor, the rotation of the motor drives the chain belt to rotate, the chain belt drives all the gears 340 to rotate together, and all the gears 340 drive all the rollers 320 to rotate together to realize the transportation of the cooling conveying mechanism.

Among them, the material of the frame body 310 can be an aluminum profile, which can effectively reduce the overall weight of the cooling delivery mechanism and facilitate adjustment of the angle between it and the horizontal plane.

Referring to Figures 1, 2 and 3, the drying oven according to the second embodiment of the present invention includes:

The drying section 200 is provided with a drying device 210;

The cooling section 400 is provided with a cooling device 410 and is located adjacent to the drying section 200;

The transportation device is the drying oven transportation device according to the first embodiment of the present invention. The drying transportation mechanism 100 is arranged through the drying section 200, and the cooling transportation mechanism 300 is arranged through the cooling section 400, and the drying transportation mechanism 100 can Transfer the silicon wafer to the cooling transport mechanism 300.

It is worth understanding that the drying transport mechanism 100 and the cooling transport mechanism 300 are set up separately. The drying transport mechanism 100 is only transported in the drying section 200, and its heat will be accumulated in the drying section 200 and will not be cooled. After section 400, it is cooled by the cooling section 400, so the heat utilization efficiency is higher. Moreover, the change in cold and heat experienced by the drying transport mechanism 100 is small, and it will not pass through the drying section 200 and the cooling section 400 in sequence, causing sudden cooling and heating. , has lower material requirements, and will not be damaged by sudden cold and hot environments after long-term use.

In this embodiment, the drying transport mechanism 100 is the drying oven transport device according to the first embodiment of the present invention.

It is worth understanding that using a drying oven transport device in the drying section 200 can also directly reduce the area of silicon wafer surface wear in the drying section 200 , making the lower surface of the silicon wafer less likely to be worn in the drying section 200 .

As shown in reference 4, the cooling device 410 includes a first cooling component 411. The first cooling component 411 is disposed toward the silicon wafer on the cooling transport mechanism 300 and can cool the silicon wafer.

It is worth understanding that the silicon wafer on the cooling transport mechanism 300 is cooled by the first cooling assembly 411 and the solidified silver aluminum paste debris on the surface of the silicon wafer is simultaneously removed to ensure that there are no debris on the surface of the silicon wafer.

Among them, the first cooling component 411 is mostly air-cooled, and the silicon wafer is cooled by blowing normal temperature or low-temperature gas toward the silicon wafer.

Referring to FIGS. 1 , 2 and 3 , the first cooling assembly 411 includes an impurity-removing blowing assembly 4111 and a main exhaust assembly 4112 . The impurity-removing blowing assembly 4111 is provided with an impurity-removing air outlet, and the impurity-removing air outlet faces the cooling transport mechanism 300 . Silicon wafer is installed, and the main exhaust component 4112 is used to extract gas.

It is worth understanding that the first cooling component 411 cools the silicon wafer by setting the impurity removal blower component 4111, and at the same time removes the solidified silver aluminum paste debris on the surface of the silicon wafer to ensure that there are no debris on the surface of the silicon wafer, and the main exhaust The component 4112 absorbs the wind blown out by the impurity removal blower component 4111 to form a stable air flow circulation. The debris on the surface of the silicon wafer can move away from the silicon wafer with the air flow, preventing the debris from returning to the surface of the silicon wafer due to turbulence. First, The air flow within the cooling assembly 411 is more stable.

Specifically, the impurity removal blowing assembly 4111 is two blowing ducts, and the main exhaust assembly 4112 includes a blower and a first exhaust plate. The air flow in the first cooling component 411 is taken away by the blower and the first air extraction plate to ensure that the air flow is stably extracted.

Referring to FIG. 4 , the cooling device 410 includes a second cooling component 412 . The second cooling component 412 is disposed along the transport direction of the cooling transport mechanism 300 and is opposite to the first cooling component 411 , with the cooling transport mechanism 300 between them. , located in the middle of the cooling transport mechanism 300 .

It is worth understanding that the cooling blower component 4121 in the second cooling component 412 cools the other surface of the silicon wafer, so that the silicon wafer cools down faster. The first cooling component 411 and the second cooling component 412 work together to cool the silicon wafer on the cooling transport mechanism 300, so that the temperature of the silicon wafer is more uniform, and both sides of the silicon wafer dissipate heat at the same time, resulting in higher heat dissipation efficiency.

Specifically, when the cooling transport mechanism 300 is a drum conveyor, there is usually a gap between the two rollers 320. The lower surface of the silicon wafer in this gap is suspended, and the lower surface of the silicon wafer will be more easily in contact with the airflow of the second cooling assembly 412. Contact to achieve convection heat exchange, and the entire lower surface of the silicon wafer is blown by the air flow, and the upper and lower surfaces of the silicon wafer dissipate heat at the same time, making the heat dissipation more uniform and the heat dissipation efficiency higher.

Referring to FIG. 4 , the second cooling assembly 412 includes a cooling blowing assembly 4121 and a secondary exhausting assembly 4122. The cooling blowing assembly 4121 is arranged toward the silicon wafer on the cooling transport mechanism 300. The secondary exhausting assembly 4122 is used to extract the first cooling assembly 411 and the secondary exhausting assembly 4122. The gas between the second cooling components 412.

It is worth understanding that the second cooling component 412 cools the lower surface of the silicon wafer through the cooling and blowing component 4121, so that the temperature of the lower surface of the silicon wafer is reduced, and the secondary exhaust component 4122 can form air flow circulation in the corresponding area of the second cooling component 412 , and form another air flow circulation that is independent of the first cooling component 411. The simultaneous operation of the two air flow circulations can improve the air flow circulation efficiency, thereby improving the cooling efficiency.

Specifically, the cooling and blowing assembly 4121 can be a plurality of fans, specifically, it can be three groups of fans arranged along the conveying direction of the cooling transport mechanism 300, and the secondary air extraction assembly 4122 is a second air extraction plate.

The embodiments of the present utility model are described in detail above with reference to the accompanying drawings. However, the present utility model is not limited to the above-mentioned embodiments. Within the scope of knowledge possessed by those of ordinary skill in the art, other modifications may be made without departing from the purpose of the present utility model. Make various changes.

Claims (10)

1. A drying oven transportation device, characterized in that it includes: The drying transport mechanism is set up in the drying section and can transport silicon wafers to dry the silicon wafers in the drying section; The cooling transport mechanism is arranged along the cooling section and can accept the dried silicon wafers transported by the drying transport mechanism and continue transporting them for the cooling section to cool the silicon wafers. 2. The drying oven transportation device according to claim 1, characterized in that: the drying transportation mechanism and the cooling transportation mechanism are one of a barrel conveyor, a belt conveyor or a plate conveyor. 3. The drying oven transportation device according to claim 1, characterized in that: the drying transportation mechanism is a belt conveyor. 4. The drying oven transportation device according to claim 1, characterized in that: the drying transportation mechanism includes a transportation belt, a driving source and a plurality of transmission parts, and the transportation belt, the driving source and the transmission parts The conveyor belt is connected by transmission and rotates under the drive of the driving source and the transmission member. The conveyor belt is provided with a tilted portion on both sides along its conveying direction. 5. The drying oven transportation device according to claim 1, characterized in that the cooling transportation mechanism is a cold and heat shock resistant transportation mechanism. 6. A drying oven, characterized in that it includes: The drying section is equipped with a drying device; A cooling section is provided with a cooling device and is located adjacent to the drying section; Transport device, the transport device is the drying oven transport device according to any one of claims 1 to 5, the drying transport mechanism is arranged through the drying section, and the cooling transport mechanism is arranged through the cooling section , and the drying transport mechanism can transport silicon wafers to the cooling transport mechanism. 7. The drying oven according to claim 6, wherein the cooling device includes a first cooling component, the first cooling component is disposed toward the silicon wafer on the cooling transport mechanism and capable of cooling the silicon wafer. 8. The drying oven according to claim 7, characterized in that: the first cooling assembly includes an impurity removal blower assembly and a main exhaust assembly, the impurity removal blower assembly is provided with an impurity removal air outlet, and the impurity removal air outlet Disposed toward the silicon wafer on the cooling transport mechanism, the main exhaust assembly is used to extract gas. 9. The drying oven according to claim 7, characterized in that: the cooling device includes a second cooling component, the second cooling component is arranged along the transport direction of the cooling transport mechanism and is connected with the first cooling component. The cooling components are arranged opposite to each other, with the cooling transport mechanism between them, located in the middle of the cooling transport mechanism. 10. The drying oven according to claim 9, wherein the second cooling component includes a cooling blowing component and a secondary exhaust component, and the cooling blowing component is arranged toward the silicon wafer on the cooling transport mechanism, so The secondary exhaust component is used to extract gas between the first cooling component and the second cooling component.