CN222128200U - Camera device of vehicle and vehicle - Google Patents
Camera device of vehicle and vehicle Download PDFInfo
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- CN222128200U CN222128200U CN202323419540.7U CN202323419540U CN222128200U CN 222128200 U CN222128200 U CN 222128200U CN 202323419540 U CN202323419540 U CN 202323419540U CN 222128200 U CN222128200 U CN 222128200U
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Abstract
本实用新型提供了一种车辆的摄像头装置及车辆，涉及摄像头散热技术领域。摄像头装置包括镜头、壳体、感光芯片、PCB板和散热组件，其中，壳体与镜头连接，壳体的内部中空，感光芯片、PCB板和散热组件设置在壳体的内部，且PCB板与感光芯片连接，散热组件分别与感光芯片、PCB板和壳体连接，用于吸收感光芯片和PCB板的热量，并将感光芯片的热量和PCB板的热量传递至壳体，使得散热组件能够同时对感光芯片和PCB板进行散热，提高摄像头装置的散热性能。
The utility model provides a camera device for a vehicle and the vehicle, and relates to the technical field of camera heat dissipation. The camera device includes a lens, a housing, a photosensitive chip, a PCB board and a heat dissipation component, wherein the housing is connected to the lens, the interior of the housing is hollow, the photosensitive chip, the PCB board and the heat dissipation component are arranged inside the housing, and the PCB board is connected to the photosensitive chip, and the heat dissipation component is respectively connected to the photosensitive chip, the PCB board and the housing, and is used to absorb the heat of the photosensitive chip and the PCB board, and transfer the heat of the photosensitive chip and the PCB board to the housing, so that the heat dissipation component can dissipate heat for the photosensitive chip and the PCB board at the same time, thereby improving the heat dissipation performance of the camera device.
Description
Technical Field
The utility model relates to the technical field of camera heat dissipation, in particular to a camera device of a vehicle and the vehicle.
Background
In recent years, with the increase of requirements of ADAS sensing capability, the resolution of a camera serving as a main sensing device of the ADAS is increased, and power consumption and heat productivity corresponding to a high-resolution camera are also increased.
In the prior art, the heat dissipation assembly is generally arranged on the periphery of the PCB or the periphery of the photosensitive chip, and heat of the PCB or the photosensitive chip is transferred to the shell through the heat dissipation assembly, so that heat dissipation of each assembly in the camera is realized.
Disclosure of utility model
An object of the first aspect of the present utility model is to provide a camera device for a vehicle, which solves a technical problem that a heat dissipation component disposed in a camera cannot simultaneously dissipate heat of a PCB and a photosensitive chip in the prior art.
Another object of the first aspect of the present utility model is to improve the heat dissipation efficiency of the heat dissipation assembly by rationally designing the structure of the heat dissipation assembly.
An object of a second aspect of the present utility model is to provide a vehicle having the camera device described above.
According to an object of a first aspect of the present utility model, there is provided a camera device for a vehicle, including a lens, a housing, a PCB board, and a heat dissipating assembly, wherein the housing is connected to the lens, an inside of the housing is hollow, the photosensitive chip is disposed inside the housing, the PCB board is disposed inside the housing, and the PCB board is connected to the photosensitive chip, the heat dissipating assembly is disposed inside the housing, and the heat dissipating assembly is respectively connected to the photosensitive chip, the PCB board, and the housing, and is configured to absorb heat of the photosensitive chip and the PCB board, and transfer heat of the photosensitive chip and heat of the PCB board to the housing.
Optionally, the PCB board defines a mounting hole, and the photosensitive chip is located in the mounting hole and connected to the PCB board.
Optionally, the heat dissipation assembly includes fin and heat conduction cover, the fin sets up one side of PCB board, and with sensitization chip with the laminating of PCB board, the heat conduction cover respectively with the fin with the casing is connected, so that will the heat transfer of fin reaches the casing.
Optionally, an opening for installing the lens is formed in one side of the housing, the photosensitive chip is arranged opposite to the lens, the radiating fin is located on one side, away from the lens, of the photosensitive chip, and the heat conducting cover is connected with one side, away from the photosensitive chip, of the radiating fin.
Optionally, the fin includes the mid portion and sets up the week side portion of mid portion week side, the mid portion highly be higher than the height of week side portion, the mid portion with photosensitive chip laminating, week side portion with the PCB board laminating.
Optionally, the surface of the housing is coated with a heat dissipating coating.
Optionally, the heat-conducting cover includes interconnect's horizontal portion and erects portion, horizontal portion is circular or cyclic annular, horizontal portion at least part with the fin laminating, erects portion by horizontal portion's edge extends outwards and buckles and forms, erects portion at least part with the inner wall laminating of casing.
Optionally, the outer surface of the lens is coated with a heat dissipation coating.
Optionally, high heat-conducting glue is coated between the PCB and the radiating fin, and between the photosensitive chip and the radiating fin.
According to an object of the second aspect of the utility model, the utility model also provides a vehicle comprising a camera device as described in any of the above.
The camera device comprises a lens, a shell, a photosensitive chip, a PCB and a heat dissipation component, wherein the shell is connected with the lens, the shell is hollow, the photosensitive chip is arranged in the shell, the PCB is arranged in the shell and is connected with the photosensitive chip, the heat dissipation component is arranged in the shell and is respectively connected with the photosensitive chip, the PCB and the shell, and the heat dissipation component is used for absorbing heat of the photosensitive chip and the PCB and transmitting the heat of the photosensitive chip and the heat of the PCB to the shell. In the above technical scheme, the radiating component links to each other with sensitization chip and PCB board to absorb the heat of sensitization chip and PCB board, radiating component also links to each other with the casing simultaneously, in order to heat transfer to the casing with the heat of sensitization chip and PCB board, makes radiating component can dispel the heat to sensitization chip and PCB board simultaneously, improves camera device's heat dispersion.
Further, the heat conducting cover in the heat radiating assembly comprises a transverse part and a vertical part which are connected with each other, the transverse part is round or annular, at least part of the transverse part is attached to the heat radiating fin, the vertical part is formed by extending outwards from the edge of the transverse part and bending, and at least part of the vertical part is attached to the inner wall of the shell. According to the technical scheme, the transverse part of the heat conducting cover is connected with the radiating fins, the vertical part of the heat conducting cover is connected with the shell through the joint mode, so that the contact area between the heat conducting cover and the radiating fins as well as between the heat conducting cover and the shell is increased, the heat of the radiating fins can be quickly transferred to the shell through the heat conducting cover, and the radiating efficiency of the radiating assembly is improved.
The above, as well as additional objectives, advantages, and features of the present utility model will become apparent to those skilled in the art from the following detailed description of a specific embodiment of the present utility model when read in conjunction with the accompanying drawings.
Drawings
Some specific embodiments of the utility model will be described in detail hereinafter by way of example and not by way of limitation with reference to the accompanying drawings. The same reference numbers will be used throughout the drawings to refer to the same or like parts or portions. It will be appreciated by those skilled in the art that the drawings are not necessarily drawn to scale. In the accompanying drawings:
FIG. 1 is a schematic cross-sectional view of a camera device according to one embodiment of the utility model;
fig. 2 is a schematic partial enlarged view at a shown in fig. 1.
Reference numerals:
100-camera device, 10-lens, 20-casing, 30-sensitization chip, 40-PCB board, 50-heat dissipation subassembly, 60-high heat conduction glue, 21-trompil, 22-upper casing, 23-lower casing, 41-mounting hole, 51-fin, 511-mid portion, 512-week side portion, 52-heat conduction cover, 521-heat dissipation coating, 522-horizontal portion, 523-vertical portion.
Detailed Description
Embodiments of the present utility model are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative and intended to explain the present utility model and should not be construed as limiting the utility model.
In the description of the present utility model, it should be understood that the directions or positional relationships indicated by the terms "upper", "lower", "left", "right", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of description and simplification of the description, and do not indicate or imply that the apparatus or element in question must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present utility model.
The terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature, i.e. one or more such features. In the description of the present utility model, the meaning of "plurality" means at least two, for example, two, three, etc., unless specifically defined otherwise. When a feature "comprises or includes" a feature or some of its coverage, this indicates that other features are not excluded and may further include other features, unless expressly stated otherwise.
Unless specifically stated or limited otherwise, the terms "connected," "mounted," and the like should be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed, mechanically connected, electrically connected, directly connected, or indirectly connected through intermediaries, or in communication with each other between two elements or in an interaction relationship between two elements, unless otherwise specifically stated. Those of ordinary skill in the art will understand the specific meaning of the terms described above in the present utility model as the case may be.
Fig. 1 is a schematic cross-sectional view of a camera device 100 according to an embodiment of the present utility model, and fig. 2 is a schematic partial enlarged view at a shown in fig. 1. As shown in fig. 1 to 2, the present utility model provides a camera device 100. The camera device 100 may generally include a lens 10, a housing 20, a photosensitive chip 30, a PCB board 40 and a heat dissipation assembly 50, wherein the housing 20 is connected with the lens 10, the housing 20 is hollow, the photosensitive chip 30, the PCB board 40 and the heat dissipation assembly 50 are all disposed in the housing 20, the PCB board 40 is connected with the photosensitive chip 30, and the heat dissipation assembly 50 is respectively connected with the photosensitive chip 30, the PCB board 40 and the housing 20 for absorbing heat of the photosensitive chip 30 and the PCB board 40, and transferring heat of the photosensitive chip 30 and heat of the PCB board 40 to the housing 20, and transferring heat transferred to the housing 20 to the outside of the housing 20, so as to realize heat dissipation of the photosensitive chip 30 and the PCB board 40. Here, the photosensitive chip 30 and the PCB 40 are connected to the housing 20 through the heat dissipation assembly 50, and the packaging mode of the photosensitive chip 30 is COB packaging, that is, gold wire bonding mode through WB equipment.
In this embodiment, the heat dissipation assembly 50 is connected with the photosensitive chip 30 and the PCB board 40 to absorb heat of the photosensitive chip 30 and the PCB board 40, and meanwhile, the heat dissipation assembly 50 is also connected with the housing 20 to transfer heat of the photosensitive chip 30 and heat of the PCB board 40 to the housing 20, and heat of the photosensitive chip 30 and heat of the PCB board 40 are transferred to outside of the housing 20 through thermal conductivity of the housing 20 itself, so that the heat dissipation assembly 50 can dissipate heat of the photosensitive chip 30 and the PCB board 40 at the same time, heat dissipation performance inside the camera device 100 is improved, performance degradation of electronic components inside the camera device 100 and fogging of the lens 10 due to high heat inside the housing 20 of the camera device 100 are avoided, definition of the camera device 100 is reduced, and damage of the PCB board 40 and the photosensitive chip 30 due to fog inside the camera device 100 is prevented. Here, the housing 20 includes an upper housing 22 and a lower housing 23, and the upper housing 22 is located above the lower housing 23.
In this embodiment, the PCB 40 defines a mounting hole 41, and the photo chip 30 is located in the mounting hole 41 and connected to the PCB 40. Specifically, the mounting hole 41 is provided at the middle position of the PCB 40, and the size of the mounting hole 41 is consistent with the size of the photosensitive chip 30, so that when the photosensitive chip 30 is mounted in the mounting hole 41, the left and right sides of the photosensitive chip 30 are attached to the left and right sides of the mounting hole 41 of the PCB 40 to fix the photosensitive chip 30 inside the PCB 40. Here, the top of the photo chip 30 is flush with the upper surface of the PCB board 40. In other embodiments, the photosensitive chip 30 may be disposed above the PCB 40 or below the PCB 40.
In this embodiment, the heat dissipation assembly 50 includes a heat dissipation plate 51 and a heat conduction cover 52, the heat dissipation plate 51 is disposed at one side of the PCB board 40, and the heat dissipation plate 51 is attached to the photosensitive chip 30 and the PCB board 40, and the heat conduction cover 52 is connected to the heat dissipation plate 51 and the housing 20, respectively, to transfer heat of the heat dissipation plate 51 to the housing 20. That is, the heat sink 51 is disposed to be attached to the photosensitive chip 30 and the PCB 40, so that the heat sink 51 can absorb the heat of the photosensitive chip 30 and the heat of the PCB 40 to the heat sink 51 itself, and meanwhile, the heat conducting cover 52 is disposed to be connected with the heat sink 51 and the housing 20, so that the heat of the heat sink 51 is transferred to the housing 20, and then the heat is transferred to the outside of the housing 20 through the housing 20, thereby realizing the simultaneous heat dissipation of the photosensitive chip 30 and the PCB 40, improving the heat dissipation efficiency of the camera device 100, reducing the internal working temperature of the camera device 100, and improving the performance of the camera. Here, the heat conductive cover 52 is a cover structure made of metal.
In this embodiment, the heat sink 51 is a steel sheet, and the thickness of the heat sink 51 ranges from 0.1mm to 0.2mm. For example, it may be 0.1mm, 0.12mm, 0.14mm, 0.16mm, 0.18mm or 0.2mm. In other embodiments, the heat sink 51 may be other sheet-like structures having a heat dissipating function.
In this embodiment, an opening 21 for mounting the lens 10 is provided on one side of the housing 20, the photosensitive chip 30 is disposed opposite to the lens 10, the heat sink 51 is located on the side of the photosensitive chip 30 away from the lens 10, and the heat conductive cover 52 is connected to the side of the heat sink 51 away from the photosensitive chip 30. Specifically, the lens 10 and the heat sink 51 are respectively located at two opposite sides of the photosensitive chip 30, so that the heat sink 51 absorbs heat of the photosensitive chip 30 to itself and transfers heat of the photosensitive chip 30 to the housing 20 through the heat conductive cover 52 while not affecting the photosensitive chip 30 to convert light of the lens 10 into an electronic signal.
In this embodiment, the heat sink 51 includes a middle portion 511 and a peripheral portion 512 provided on the peripheral side of the middle portion 511, the middle portion 511 has a height higher than that of the peripheral portion 512, the middle portion 511 is attached to the photosensitive chip 30, and the peripheral portion 512 is attached to the PCB board 40. Specifically, the photosensitive chip 30 is located in the mounting hole 41 of the PCB 40, the bottom of the photosensitive chip 30 is higher than the bottom of the mounting hole 41 of the PCB 40, and the middle portion 511 of the heat sink 51 is higher than the peripheral portion 512, so that the heat sink 51 can be simultaneously contacted with the photosensitive chip 30 and the PCB 40, so that the heat of the photosensitive chip 30 and the heat of the PCB 40 can be simultaneously transferred to the heat sink 51, thereby realizing efficient heat dissipation of the camera device 100.
In this embodiment, the surface of the housing 20 is coated with a heat dissipating coating 521. Specifically, the heat dissipation coating 521 in this embodiment is a graphene coating, and the inner surface and the outer surface of the housing 20 of the camera device 100 are both coated with the graphene coating, so that the heat of the photosensitive chip 30 and the heat of the PCB board 40 are sequentially transferred from the heat sink 51 to the heat conduction cover 52, and finally, when transferred to the housing 20 through the heat conduction cover 52, the graphene coating on the inner and outer surfaces of the housing 20 can improve the heat dissipation capability of the housing 20, thereby realizing efficient heat dissipation of the camera device 100. Here, the case 20 is an aluminum alloy base material.
In this embodiment, the thickness of the graphene coating on the surface of the housing 20 ranges from any value between 20 μm to 50 μm. For example, it may be 20 μm, 30 μm, 40 μm or 50 μm. Here, the thickness of the graphene coating may be designed according to the heat dissipation strength required for the camera device 100. In other embodiments, the heat dissipation coating 521 may also be a carbon nanomaterial or other materials with heat dissipation function.
In this embodiment, the heat conductive cover 52 includes a transverse portion 522 and a vertical portion 523 connected to each other, the transverse portion 522 is circular or annular, at least part of the transverse portion 522 is fitted with the heat sink 51, the vertical portion 523 is formed by extending and bending an edge of the transverse portion 522 outward, and at least part of the vertical portion 523 is fitted with an inner wall of the housing 20. Specifically, at least part of the lateral part 522 of the heat conducting cover 52 is attached to the heat sink 51, and at least part of the vertical part 523 of the heat conducting cover 52 is attached to the inner wall of the housing 20, so that after the heat of the photosensitive chip 30 and the heat of the PCB board 40 are absorbed by the heat sink 51 to the body, the heat is sequentially transferred to the lateral part 522 of the heat conducting cover 52 located at the bottom of the heat sink 51, the vertical part 523 of the heat conducting cover 52 attached to the inner wall of the housing 20, and then transferred to the housing 20, and finally the heat of the photosensitive chip 30 and the heat of the PCB board 40 are transferred to the outside of the housing 20, thereby realizing heat dissipation of the camera device 100. Here, the lateral portion 522 of the heat conductive cover 52 may be partially bonded to the heat sink 51, or may be entirely bonded to the heat sink 51, and the vertical portion of the heat conductive cover 52 may be bonded to the lower case 23.
In this embodiment, when the lateral portion 522 of the heat conductive cover 52 is circular, the lateral portion 522 of the heat conductive cover 52 is completely bonded to the bottom of the heat sink 51, and the maximum transfer of heat to the heat sink 51 can be achieved. When the lateral portion 522 of the heat conductive cover 52 is annular, the lateral portion 522 of the heat conductive cover 52 is bonded to the bottom portion of the heat sink 51, and the weight of the heat conductive cover 52 can be reduced while the heat of the heat sink 51 is transferred, so that the weight of the camera device 100 can be reduced, and the camera device 100 can be made lightweight.
In this embodiment, the outer surface of the lens 10 is coated with a heat dissipation coating 521. Specifically, the graphene coating is coated on the outer surface of the lens 10, so that heat in the housing 20 of the camera device 100 can be transferred to the outside of the housing 20 of the camera device 100 through the outer surface of the lens 10 coated with the graphene coating, a heat transfer path inside the camera device 100 is increased, and the heat dissipation efficiency of the camera device 100 is improved.
In this embodiment, the high thermal conductive adhesive 60 is coated between the PCB 40 and the heat sink 51, and between the photosensitive chip 30 and the heat sink 51. Specifically, the high heat-conducting glue 60 is coated between the PCB 40 and the heat sink 51 and between the photosensitive chip 30 and the heat sink 51, so that the PCB 40 and the photosensitive chip 30 can be fixedly connected with the heat sink 51, and the heat conduction effect can be achieved, so that the heat of the PCB 40 and the heat of the photosensitive chip 30 can be transferred to the heat sink 51, and the heat of the PCB 40 and the heat of the photosensitive chip 30 can be transferred to the outside of the camera device 100 sequentially through the heat-conducting cover 52 and the shell 20, so that the heat dissipation inside the camera device 100 is achieved.
The utility model also provides a vehicle comprising a camera device 100 as defined in any one of the above. For the camera device 100, a detailed description is omitted here.
The camera device 100 of this embodiment includes a photosensitive chip 30, a PCB board 40 and a heat dissipation assembly 50, the PCB board 40 is connected with the photosensitive chip 30, and the heat dissipation assembly 50 is connected with the photosensitive chip 30, the PCB board 40 and the housing 20 respectively, for absorbing heat of the photosensitive chip 30 and the PCB board 40, and transferring heat of the photosensitive chip 30 and heat of the PCB board 40 to the housing 20, so that the heat dissipation assembly 50 can dissipate heat of the photosensitive chip 30 and the PCB board 40 at the same time, and heat dissipation performance of the camera device is improved. In addition, in this embodiment, the lateral portion 522 of the heat conducting cover 52 is connected to the heat dissipating fin 51 and the vertical portion 523 is connected to the housing 20 in a bonding manner, so that the contact area between the heat conducting cover 52 and the heat dissipating fin 51 as well as between the heat conducting cover 52 and the housing 20 is increased, and the heat dissipating efficiency of the heat dissipating assembly 50 is improved.
By now it should be appreciated by those skilled in the art that while a number of exemplary embodiments of the utility model have been shown and described herein in detail, many other variations or modifications of the utility model consistent with the principles of the utility model may be directly ascertained or inferred from the present disclosure without departing from the spirit and scope of the utility model. Accordingly, the scope of the present utility model should be understood and deemed to cover all such other variations or modifications.
Claims (10)
1. A camera device for a vehicle, comprising:
a lens;
a housing connected to the lens, the housing having a hollow interior;
The photosensitive chip is arranged in the shell;
The PCB is arranged in the shell and connected with the photosensitive chip;
The heat dissipation assembly is arranged in the shell and is respectively connected with the photosensitive chip, the PCB and the shell, and is used for absorbing heat of the photosensitive chip and the PCB and transmitting the heat of the photosensitive chip and the heat of the PCB to the shell.
2. The camera device of claim 1, wherein the camera device comprises a camera module,
The PCB is limited with the mounting hole, the sensitization chip is located in the mounting hole, and with the PCB is connected.
3. The camera device of claim 2, wherein the heat dissipation assembly comprises:
the radiating fin is arranged on one side of the PCB and is attached to the photosensitive chip and the PCB;
And the heat conducting cover is respectively connected with the radiating fin and the shell so as to transfer the heat of the radiating fin to the shell.
4. A camera device according to claim 3, wherein an opening for mounting the lens is provided on one side of the housing, the light-sensing chip being arranged opposite to the lens;
The radiating fin is located one side of the photosensitive chip far away from the lens, and the heat conducting cover is connected with one side of the radiating fin far away from the photosensitive chip.
5. The camera device of claim 4, wherein the camera device comprises a camera module,
The radiating fin comprises a middle part and a peripheral part arranged on the peripheral side of the middle part, the height of the middle part is higher than that of the peripheral part, the middle part is attached to the photosensitive chip, and the peripheral part is attached to the PCB.
6. The camera device according to any one of claims 3 to 5, wherein,
The surface of the shell is coated with a heat dissipation coating.
7. The camera device according to any one of claims 3 to 5, wherein,
The heat conduction cover comprises a transverse portion and a vertical portion which are connected with each other, the transverse portion is round or annular, at least part of the transverse portion is attached to the radiating fin, the vertical portion is formed by extending outwards from the edge of the transverse portion and bending the edge of the transverse portion, and at least part of the vertical portion is attached to the inner wall of the shell.
8. The camera device according to any one of claims 3 to 5, wherein,
The outer surface of the lens is coated with a heat dissipation coating.
9. The camera device according to any one of claims 3 to 5, wherein,
And high heat-conducting glue is coated between the PCB and the radiating fins and between the photosensitive chip and the radiating fins.
10. A vehicle comprising a camera device according to any one of claims 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202323419540.7U CN222128200U (en) | 2023-12-14 | 2023-12-14 | Camera device of vehicle and vehicle |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202323419540.7U CN222128200U (en) | 2023-12-14 | 2023-12-14 | Camera device of vehicle and vehicle |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN222128200U true CN222128200U (en) | 2024-12-06 |
Family
ID=93674298
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202323419540.7U Active CN222128200U (en) | 2023-12-14 | 2023-12-14 | Camera device of vehicle and vehicle |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN222128200U (en) |
-
2023
- 2023-12-14 CN CN202323419540.7U patent/CN222128200U/en active Active
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