CN222322012U

CN222322012U - Backboard assembly and display device

Info

Publication number: CN222322012U
Application number: CN202420328542.0U
Authority: CN
Inventors: 胡飞; 王正; 曾思航
Original assignee: Guangzhou Shiyuan Electronics Thecnology Co Ltd
Current assignee: Guangzhou Shiyuan Electronics Thecnology Co Ltd
Priority date: 2024-02-21
Filing date: 2024-02-21
Publication date: 2025-01-07
Anticipated expiration: 2034-02-21

Abstract

The application discloses a back plate assembly and display equipment, wherein the back plate assembly comprises a back plate body, a back shell, a computer module and a heat dissipating device, the back shell comprises a bottom plate and a side plate which are connected, the side plate is connected with the back plate body, the side plate is matched with the bottom plate and the back plate body to define a mounting cavity, the side plate is provided with an air outlet communicated with the mounting cavity, the computer module is accommodated in the mounting cavity, the heat dissipating device is provided with an air flue and an air suction inlet and an air outlet communicated with the air flue, the heat dissipating device is connected with the back plate body, the air suction inlet is opposite to the air outlet and is communicated with the air outlet, and the heat dissipating device is used for driving air flow exhausted from the heat dissipating device to flow into the air flue through the air outlet and the air suction inlet in sequence and to be exhausted from the air outlet. The technical scheme of the application can improve the heat dissipation efficiency of the computer module, thereby reducing the temperature of the computer module and ensuring the normal operation of the computer module.

Description

Backboard assembly and display device

Technical Field

The application relates to the technical field of display equipment, in particular to a backboard assembly and display equipment.

Background

In the related art, a PC (Personal Computer) module, i.e., a computer module, is installed in display devices such as an interactive tablet and a touch-type multimedia display all-in-one machine, so as to perform interactive control. The PC module is installed generally between backplate and backshell, and the hot air that can discharge when the PC module operates is in order to dispel the heat, and the last air outlet that corresponds the PC module of backshell has seted up hot air, but because the air-out efficiency of air outlet is slower, leads to the outside that the hot air of PC module exhaust can't conduct the backshell fast, has so led to forming hot air and form the inner loop between backplate and backshell to lead to the temperature of PC module to rise, and then influence the performance of PC module.

Disclosure of utility model

The embodiment of the application provides a backboard component and display equipment, which can improve the heat dissipation efficiency of a computer module, thereby reducing the temperature of the computer module and ensuring the normal operation of the computer module.

In a first aspect, embodiments of the present application provide a backplate assembly, the backplate assembly comprising:

a back plate body;

The rear shell comprises a bottom plate and a side plate which are connected, the side plate is connected with the backboard body, the side plate is matched with the bottom plate and the backboard body to define an installation cavity, and an air outlet communicated with the installation cavity is formed in the side plate;

a computer module accommodated in the installation cavity, and

The heat dissipation device is provided with an air duct and an air suction opening and an air outlet which are communicated with the air duct, the heat dissipation device is connected with the backboard body, the air suction opening is opposite to and communicated with the air outlet, and the heat dissipation device is used for driving air flow exhausted from the heat dissipation device to flow into the air duct through the air outlet and the air suction opening in sequence and to be exhausted from the air outlet.

In some embodiments, the heat dissipating device comprises a housing and a fan, the housing is provided with an air duct, the air outlet and the air suction inlet are formed in the housing, the fan is connected to the housing and is positioned in the air duct, and the air outlet side of the fan is arranged towards the air outlet;

The shell is detachably connected to the backboard body, and one side, provided with the air suction port, of the shell is abutted to the surface, provided with the air outlet, of the side plate.

In some embodiments, the side of the shell facing the side plate is provided with an opening to form the air suction port.

In some embodiments, the air outlet comprises a plurality of sub-outlets which are oppositely arranged corresponding to the computer module, a flange is arranged on one side of the shell, facing the side plate, of the shell, the flange is circumferentially arranged along the air suction opening, and the flange is attached to the side plate and is positioned on the outer sides of the plurality of sub-outlets.

In some embodiments, the casing includes a connecting plate and a mounting plate which are oppositely arranged, and a side wall plate connected between the connecting plate and the mounting plate, wherein the connecting plate, the mounting plate and the side wall plate are enclosed to form the air duct and the air suction inlet, the side wall plate is provided with the air outlet, and the surface of the connecting plate, which is away from the mounting plate, is detachably connected with the backboard body;

The fan is connected to the surface of the mounting plate facing the connecting plate, and the air inlet side of the fan is arranged at intervals with the connecting plate.

In some embodiments, a distance d between the air inlet side of the fan and the connection plate is greater than or equal to 10mm;

And/or the surface of the mounting plate, which faces away from the backboard body, is coplanar with the surface of the rear shell, which faces away from the backboard body.

In some embodiments, the backboard body comprises a board body and a reinforcing part protruding above the board body, and the side board is connected with the reinforcing part;

The connecting plate comprises an abutting section, an avoidance section and a bonding section which are sequentially connected, the abutting section is abutted with the plate body, one end, deviating from the avoidance section, of the bonding section is abutted with the side plate and located above the reinforcing part, and the avoidance section and the reinforcing part are arranged at intervals;

The laminating section with perpendicular distance between the mounting panel is less than the butt section with perpendicular distance between the mounting panel, the fan with the butt section sets up relatively.

In some embodiments, a vertical distance between a side of the fan facing the side plate and the avoidance section is d1, and d1 is less than 10mm;

And/or, the vertical distance between the abutting section and the fitting section is d2, and d2 is larger than 5mm.

In some embodiments, the bottom plate is provided with a heat dissipation hole, and the heat dissipation hole is located between the air outlet and the computer module.

In a second aspect, an embodiment of the present application provides a display device, including a display screen and a back panel assembly as described above, where the display screen is disposed on the back panel assembly.

According to the backboard component and the display device provided by the embodiment of the application, the heat dissipation device is arranged to drive the airflow exhausted from the computer module to flow into the air duct after sequentially passing through the air outlet and the air suction inlet, and then to be exhausted from the air outlet. So with the hot air exhaust efficiency in the improvement installation cavity to reduce the condition emergence of the hot air internal circulation in installation cavity, with the heat influence to parts such as installation cavity interior computer module, reduce the air temperature who gets into in the computer module simultaneously, and then improve the radiating efficiency of the computer module of installation cavity interior, guarantee the normal operating of computer module, prolong its life. In addition, the heat dissipating device is directly connected to the back plate body and communicated with the air outlet at the side plate, so that other vacant positions except the back shell of the back plate body are fully utilized, and the situation that the thickness of the whole machine is increased due to direct superposition of the heat dissipating device and the back shell is avoided, so that the back-stage installation is facilitated.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, and it is obvious that the drawings in the following description are only some embodiments of the present application, and other drawings may be obtained according to the structures shown in these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic diagram of a back plate assembly according to an embodiment of the present application;

FIG. 2 is a schematic diagram of an assembly structure of a back plate assembly according to the present application;

FIG. 3 is a schematic view of the back shell of the back plate assembly of the present application;

FIG. 4 is a schematic cross-sectional view of a back plate assembly of the present application;

FIG. 5 is an enlarged view of a portion of FIG. 4 at A;

FIG. 6 is a schematic diagram of a heat dissipating device of a back plate assembly according to the present application;

FIG. 7 is a schematic cross-sectional view of a heat sink of the back plate assembly of the present application;

FIG. 8 is a schematic cross-sectional view of another view of the backplate assembly of the present application;

fig. 9 is a partial enlarged view at B in fig. 8.

Reference numerals illustrate:

100. Back panel assembly, 10, back panel body, 11, panel body, 12, reinforcement part, 20, back shell, 21, bottom plate, 211, heat dissipation hole, 212, air inlet, 213, vent, 22, side plate, 221, air outlet, 2211, sub-outlet, 2212, sub-air outlet, 10A, installation cavity, 30, computer module, 31, heat dissipation inlet, 32, heat dissipation outlet, 40, heat dissipation device, 41, shell, 41a, air duct, 41b, air suction inlet, 41c, air outlet, 411, connection plate, 4111, abutting section, 4112, avoiding section, 4113, abutting section, 412, installation plate, 413, side wall plate, 414, flanging, 42, fan, 50 and board card.

The achievement of the objects, functional features and advantages of the present application will be further described with reference to the accompanying drawings, in conjunction with the embodiments.

Detailed Description

For the purpose of making the objects, technical solutions and advantages of the present application more apparent, the following detailed description of the embodiments of the present application will be given with reference to the accompanying drawings.

When the following description refers to the accompanying drawings, the same numbers in different drawings refer to the same or similar elements, unless otherwise indicated. The implementations described in the following exemplary examples do not represent all implementations consistent with the application. Rather, they are merely examples of apparatus and methods consistent with some aspects of the application as detailed in the accompanying claims.

In the description of the present application, it should be understood that the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. The specific meaning of the above terms in the present application will be understood in specific cases by those of ordinary skill in the art. Furthermore, in the description of the present application, unless otherwise indicated, "a plurality" means two or more. "and/or" describes an association relationship of an association object, and indicates that there may be three relationships, for example, a and/or B, and may indicate that there are three cases of a alone, a and B together, and B alone. The character "/" generally indicates that the context-dependent object is an "or" relationship.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description presented herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The term "and/or" as used herein includes any and all combinations of one or more of the associated listed items.

The first aspect of the present application proposes a display device, which may be a device capable of displaying information, such as an interactive tablet, a touch-type multimedia display all-in-one machine, a television, or a computer monitor. In an embodiment of the present application, the display device includes a display screen and a back panel assembly 100, the display screen is disposed on the back panel assembly 100, the display screen includes, but is not limited to, an LCD display, an LED display screen, and the like.

Referring to fig. 1 and 2, a second aspect of the present application proposes a back plate assembly 100, the back plate assembly 100 comprising a back plate body 10, a back case 20, a computer module 30, and a board card 50.

The backboard body 10, the backboard body 10 is used as a supporting main body, and the backboard main body is rectangular and is convenient for later installation. The front side of the backplate body 10 is used to support a display screen, while the back side of the backplate body 10 is used to support other components of the backplate assembly 100. The backplate body 10 can be aluminum material spare to make backplate body 10 heat conductivility good, need not to add other heat conduction material spare on the backplate body 10, make the simple structure of backplate body 10, with low costs, light in weight, be convenient for carry, be favorable to backplate body 10's lightweight.

Referring to fig. 3 in combination, the rear case 20 includes a bottom plate 21 and a side plate 22 connected to each other, the side plate 22 is connected to the back plate body 10, the side plate 22 is located between the bottom plate 21 and the back plate body 10 and cooperates with the back plate body 10 to define a mounting cavity 10A, and the side plate 22 is provided with an air outlet 221 communicating with the mounting cavity 10A. The bottom plate 21 and the side plate 22 may be integrally formed by injection molding, so as to improve the overall structural strength of the rear housing 20, or the bottom plate 21 and the side plate 22 may be connected by screws or buckles, so as to facilitate later maintenance and replacement. It should be noted that, the side plate 22 may be disposed along the peripheral side of the bottom plate 21, so that not only the contact area between the side plate 22 and the back plate body 10 may be increased, but also the stability of connection between the back shell 20 and the back plate body 10 may be improved, and meanwhile, the protection of the devices in the mounting cavity 10A may be further improved. In addition, the rear housing 20 is further provided with an air inlet 212 communicated with the installation cavity 10A, so that external air flow can enter the installation cavity 10A through the air inlet 212 and then is discharged from the air outlet 221, thereby forming air convection heat dissipation in the installation cavity 10A, and further heat dissipation can be performed on other components in the installation cavity 10A.

The computer module 30, the computer module 30 is accommodated in the installation cavity 10A. The computer module 30 is provided with a fan, and the computer module 30 is provided with a heat dissipation inlet 31 and a heat dissipation outlet 32 which are communicated with the inside, so that the fan drives the air flow in the installation cavity 10A to enter from the heat dissipation inlet 31 to cool the inside of the computer module 30, and then is discharged from the heat dissipation outlet 32. The heat dissipation outlet 32 of the computer module 30 is disposed opposite to at least a portion of the air outlet 221, so as to improve the air flow discharging efficiency of the computer module 30 from the air outlet 221. It should be noted that, the bottom plate 21 is provided with the ventilation opening 213 corresponding to the heat dissipation inlet 31, so that the air flow outside the installation cavity 10A can directly pass through the ventilation opening 213 to enter the heat dissipation inlet 31, thereby improving the heat dissipation efficiency of the computer module 30.

The board 50 is electrically connected with the computer module 30, and the board 50 may include a power board and a control board. In some embodiments, one or more of the cards 50 may be provided. The board 50 may be disposed in a suitable area of the back plate body 10 and located in the mounting cavity 10A according to practical applications.

In the related art, the air outlet 221 of the rear housing 20 has a low air outlet efficiency, so that the hot air exhausted from the computer module 30 cannot be quickly conducted to the outside of the rear housing 20, and thus the hot air is circulated between the back plate body 10 and the rear housing 20, thereby increasing the temperature of the computer module 30 and affecting the performance of the computer module 30.

In order to solve the above-mentioned problems, referring to fig. 1, 4 to 6, the back plate assembly 100 according to the present application further includes a heat dissipating device 40, wherein the heat dissipating device 40 is provided with an air duct 41a, and an air suction opening 41b and an air exhaust opening 41c communicating with the air duct 41a, the heat dissipating device 40 is connected to the back plate body 10, and the air suction opening 41b is opposite to and communicates with the air outlet 221.

By providing the heat sink 40 to drive the air flow discharged from the computer module 30, the air flow can flow into the air duct 41a after passing through the air outlet 221 and the air suction inlet 41b in sequence, and be discharged from the air outlet 41 c. So with the hot air exhaust efficiency in the improvement installation cavity 10A to reduce the condition emergence of the hot air internal circulation in the installation cavity 10A, with the heat influence to parts such as computer module 30 in the reduction installation cavity 10A, reduce the air temperature in getting into computer module 30 simultaneously, and then improve the radiating efficiency of computer module 30 in the installation cavity 10A, guarantee the normal operating of computer module 30, prolong its life. In addition, the heat dissipating device 40 is directly connected to the back plate body 10 and is communicated with the air outlet 221 at the side plate 22, so that other vacant positions of the back plate body 10 except the back shell 20 are fully utilized, and the situation that the thickness of the whole machine is increased due to direct superposition of the heat dissipating device 40 and the back shell 20 is avoided, so that the back-stage installation is facilitated.

In some configurations, the base 21 is provided with heat dissipating holes 211, and the heat dissipating holes 211 are located between the air outlet 221 and the computer module 30. This further improves the efficiency of exhausting hot air within the mounting chamber 10A. It should be noted that the heat dissipation holes 211 may be provided in plurality and arranged in an array.

In some structural forms, referring to fig. 5 to 7 in combination, the heat dissipating device 40 includes a housing 41 and a fan 42, where the fan 42 may be a centrifugal fan 42, and the centrifugal fan 42 has advantages of high efficiency, high temperature resistance, excellent performance, novel and compact structure, small vibration, light weight, convenient installation and maintenance, long service life, and the like. The housing 41 is provided with an air duct 41a, and is provided with an air outlet 41c and an air suction inlet 41b, the fan 42 is connected to the housing 41 and is positioned in the air duct 41a, and the air outlet side of the fan 42 is arranged towards the air outlet 41 c. The housing 41 is detachably connected to the back plate body 10. The fan 42 is operated to enable the air flow in the air duct 41a of the housing 41 to flow, so that the air flow discharged by the heat dissipating device 40 is driven to flow into the air duct 41a through the air outlet 221 and the air suction inlet 41b in sequence. The housing 41 may be provided in a flat configuration so as to ensure a space for mounting the blower 42 while avoiding an excessive thickness of the back plate assembly 100 as a whole. The housing 41 may be detachably connected to the back board body 10 by screws or fasteners, so that the heat dissipating device 40 may be replaced at any time to repair or adapt to computer modules 30 of different sizes. And because the side of the shell 41 provided with the air suction port 41b is abutted against the surface of the side plate 22 provided with the air outlet 221, hot air flowing out of the air outlet can enter the air suction port more quickly, so that the hot air discharging efficiency in the installation cavity 10A is improved. It should be noted that, the heat dissipating device 40 may also adopt a matching mode of the air pump and the housing 41, and the air pump may be used to pump air, so that the air flow exhausted from the heat dissipating device 40 may be driven to flow into the air duct 41a through the air outlet 221 and the air suction inlet 41b in sequence, and be exhausted from the air outlet 41 c.

Further, the housing 41 is provided open to one side of the side plate 22 to form the suction port 41b. Wherein the air suction port 41b is opened to increase the air intake area, thereby further improving the hot air discharging efficiency in the installation cavity 10A.

Further, the air outlet 221 includes a plurality of sub-outlets 2211 disposed opposite to the computer module 30, a flange 414 is disposed on a side of the housing 41 facing the side plate 22, the flange 414 is disposed along a circumferential direction of the air suction opening 41b, and the flange 414 is attached to the side plate 22 and located outside the plurality of sub-outlets 2211.

The flange 414 may be integrally formed with the housing 41, so as to ensure the overall structural strength. And through setting up turn-ups 414 laminating curb plate 22 and being located the outside of a plurality of sub-export 2211, so can strengthen the leakproofness of butt between casing 41 and the curb plate 22, reduce the outside air current that gets into wind channel 41a from inlet scoop 41b, avoid sheltering from sub-export 2211 simultaneously, guarantee the efficiency of induced drafting of air current in the inlet scoop 41b to installation cavity 10A, and increased heat abstractor 40 and backshell 20's area of contact, in order to improve heat abstractor 40 installation's stability. The width of the flange 414 is not less than 1mm, for example, 2mm, 3mm, 4mm, etc., and may be specifically selected by those skilled in the art. In addition, the plurality of sub-outlets 2211 are arranged at intervals, and of course, the side plate 22 is further provided with a plurality of sub-outlets 2212 staggered with the computer module 30, and the sub-outlets 2212 are communicated with the installation cavity 10A, so that the hot air discharging efficiency in the installation cavity 10A is further improved.

Referring to fig. 6 and 7, alternatively, the housing 41 includes a connecting plate 411 and a mounting plate 412 which are disposed opposite to each other, and a side wall 413 connected between the connecting plate 411 and the mounting plate 412, wherein the connecting plate 411, the mounting plate 412 and the side wall 413 enclose an air duct 41a and an air suction opening 41b, the side wall 413 is provided with an air outlet 41c, and a surface of the connecting plate 411 facing away from the mounting plate 412 is detachably connected with the back plate body 10. The fan 42 is connected to the surface of the mounting plate 412 facing the connection plate 411, and the air inlet side of the fan 42 is spaced from the connection plate 411.

It should be noted that, the connecting plate 411, the mounting plate 412 and the side wall 413 may be integrally formed, so as to ensure structural strength of the housing 41, and further ensure stability of the air duct 41 a. Of course, the connecting plate 411, the mounting plate 412 and the side wall 413 may be fixed by fastening or screw connection, so as to facilitate the replacement in the later period. The connecting plate 411 is attached to the back plate body 10 and is fastened and fixed, so as to further improve the stability of connection. And the fan 42 is connected to the mounting plate 412, because the mounting plate 412 is far away from the air duct 41a and the housing 41 is arranged, so that the fan 42 is far away from the backboard body 10, and the vibration influence on the backboard body 10 when the fan 42 operates is reduced.

Further, the distance between the air intake side of the blower 42 and the connection plate 411 is d, which is greater than or equal to 10mm. By limiting the dimension between the air inlet side of the fan 42 and the connecting plate 411, the air inlet side of the fan 42 has enough space to flow air, so that the resistance of the air duct 41a is reduced, and the air flow efficiency is improved.

Referring to fig. 8 and 9, alternatively, the surface of mounting plate 412 facing away from backplate body 10 is coplanar with the surface of back housing 20 facing away from backplate body 10. That is, the mounting plate 412 is not higher than the surface of the rear case 20 facing away from the rear panel body 10, thereby avoiding an increase in the thickness of the rear panel assembly 100 as a whole, and the heat sink 40 does not interfere when the rear panel assembly 100 is mounted on a wall surface, so that the subsequent mounting is facilitated.

In some structural forms, referring to fig. 5 and 7, the back plate body 10 includes a plate body 11 and a reinforcing portion 12 protruding above the plate body 11, and the side plate 22 is connected to the reinforcing portion 12. The connecting plate 411 includes a butt section 4111, an avoidance section 4112 and a joint section 4113, which are sequentially connected, the butt section 4111 is in butt connection with the plate body 11, one end of the joint section 4113, which deviates from the avoidance section 4112, is in butt connection with the side plate 22, and the avoidance section 4112 is arranged at intervals with the reinforcing portion 12. The perpendicular distance between the mating segment 4113 and the mounting plate 412 is less than the perpendicular distance between the abutment segment 4111 and the mounting plate 412, with the fan 42 disposed opposite the abutment segment 4111.

It will be appreciated that the reinforcing portion 12 is provided on the board body 11 to improve the structural strength of the back board body 10 itself and to improve the stability of the connection with the rear case 20. In order to accommodate the reinforcement portion 12, the connection plate 411 includes an abutment section 4111, a relief section 4112 and a fitting section 4113 adapted thereto, so as to improve the connection stability of the connection plate 411, and further improve the overall installation stability of the heat dissipating device 40. Meanwhile, since the vertical distance between the fitting section 4113 and the mounting plate 412 is smaller than the vertical distance between the abutting section 4111 and the mounting plate 412, the blower 42 is disposed at a position opposite to the abutting section 4111, so that the space on the air intake side of the blower 42 is ensured, and the resistance is reduced.

Referring to fig. 8 and 9 in combination, further, a vertical distance d1 between a side of the fan 42 facing the side plate 22 and the escape section 4112 is d1, and d1 is less than 10mm. Thus, the length of the air duct 41a is limited, the system resistance is reduced, and the air outlet efficiency is improved.

Optionally, a vertical distance between the abutment segment 4111 and the mating segment 4113 is d2, d2 being greater than 5mm. So with the length that lengthens dodging section 4113 to when the air current passes through, deflection angle is comparatively mild, thereby reduces the system resistance, improves air-out efficiency.

In the description of the present application, it should be understood that, if there is an orientation or positional relationship indicated by terms such as "upper", "lower", "left", "right", etc. based on the orientation or positional relationship shown in the drawings, it is merely for convenience of describing the present application and simplifying the description, and it is not intended to indicate or imply that the apparatus or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus the terms describing the positional relationship in the drawings are merely for exemplary illustration and are not to be construed as limitations of the present patent, and that the specific meaning of the terms described above may be understood by those skilled in the art according to specific circumstances.

The foregoing description of the preferred embodiments of the application is not intended to be limiting, but rather is intended to cover all modifications, equivalents, and alternatives falling within the spirit and principles of the application.

Claims

1. A backplate assembly for use in a display device, the backplate assembly comprising:

a back plate body;

a computer module accommodated in the installation cavity, and

2. The back plate assembly of claim 1, wherein the heat dissipating device comprises a housing and a fan, the housing is provided with an air duct, the air outlet and the air suction inlet are provided, the fan is connected to the housing and is positioned in the air duct, and an air outlet side of the fan is arranged towards the air outlet;

3. The back plate assembly of claim 2, wherein a side of the housing facing the side plate is open to form the suction port.

4. The back plate assembly of claim 3, wherein the air outlet comprises a plurality of sub-outlets oppositely arranged corresponding to the computer module, a flange is arranged on one side of the shell facing the side plate, the flange is circumferentially arranged along the air suction opening, and the flange is attached to the side plate and is positioned outside the plurality of sub-outlets.

5. The back plate assembly of claim 2, wherein the housing comprises a connecting plate and a mounting plate which are oppositely arranged, and a side wall plate connected between the connecting plate and the mounting plate, wherein the air duct and the air suction inlet are formed by surrounding the connecting plate, the mounting plate and the side wall plate, the air outlet is formed in the side wall plate, and the surface of the connecting plate, which is away from the mounting plate, is detachably connected with the back plate body;

6. The back plate assembly of claim 5, wherein a distance d between an air intake side of the blower and the connection plate is greater than or equal to 10mm;

7. The back plate assembly of claim 5, wherein said back plate body comprises a plate body and a reinforcement portion protruding above said plate body, said side plate being connected to said reinforcement portion;

8. The back plate assembly of claim 7, wherein a vertical distance between a side of the fan facing the side plate and the relief section is d1, d1 being less than 10mm;

9. The back panel assembly of any one of claims 1 to 8, wherein the base panel is provided with heat dissipating holes, the heat dissipating holes being located between the air outlet and the computer module.

10. A display device comprising a display screen and a backplate assembly according to any one of claims 1 to 9, the display screen being provided on the backplate assembly.