CR8043A - Aparato termico para un dispositivo electronico - Google Patents

Aparato termico para un dispositivo electronico

Info

Publication number
CR8043A
CR8043A CR8043A CR8043A CR8043A CR 8043 A CR8043 A CR 8043A CR 8043 A CR8043 A CR 8043A CR 8043 A CR8043 A CR 8043A CR 8043 A CR8043 A CR 8043A
Authority
CR
Costa Rica
Prior art keywords
electronic device
thermal
flow cycle
electronic
join
Prior art date
Application number
CR8043A
Other languages
English (en)
Inventor
N Killen Craig
Original Assignee
Delta Design Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Delta Design Inc filed Critical Delta Design Inc
Publication of CR8043A publication Critical patent/CR8043A/es

Links

Classifications

    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D23/00—Control of temperature
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
    • G01R31/2875—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature related to heating
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2280/00—Mounting arrangements; Arrangements for facilitating assembling or disassembling of heat exchanger parts
    • F28F2280/02—Removable elements
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Environmental & Geological Engineering (AREA)
  • Thermal Sciences (AREA)
  • Sustainable Development (AREA)
  • Mechanical Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Toxicology (AREA)
  • Automation & Control Theory (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Control Of Temperature (AREA)

Abstract

La presente invencion proporciona un aparato para controlar la temperatura de al menos un dispositivo electronico. El aparato comprende un ciclo de flujo a traves del cual se conduce un fluido refrigerante para absorber y liberar alternamente energia termica. Una cabeza termica se conecta al ciclo de flujo para unir el dispositivo electronico.
CR8043A 2003-03-19 2005-10-13 Aparato termico para un dispositivo electronico CR8043A (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US45577103P 2003-03-19 2003-03-19
US10/616,106 US6975028B1 (en) 2003-03-19 2003-07-09 Thermal apparatus for engaging electronic device

Publications (1)

Publication Number Publication Date
CR8043A true CR8043A (es) 2006-05-31

Family

ID=33101222

Family Applications (1)

Application Number Title Priority Date Filing Date
CR8043A CR8043A (es) 2003-03-19 2005-10-13 Aparato termico para un dispositivo electronico

Country Status (6)

Country Link
US (1) US6975028B1 (es)
EP (1) EP1611610A4 (es)
JP (1) JP2006523838A (es)
KR (1) KR20050115922A (es)
CR (1) CR8043A (es)
WO (1) WO2004086827A2 (es)

Families Citing this family (48)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10328719B4 (de) * 2003-06-25 2007-02-01 Infineon Technologies Ag Verfahren zum Testen von elektronischen Bauteilen
JP4512815B2 (ja) * 2004-07-30 2010-07-28 エスペック株式会社 バーンイン装置
JP4426396B2 (ja) * 2004-07-30 2010-03-03 エスペック株式会社 冷却装置
US7352200B2 (en) * 2005-01-12 2008-04-01 International Business Machines Corporation Functional and stress testing of LGA devices
US7870800B2 (en) * 2006-05-15 2011-01-18 Centipede Systems, Inc. Apparatus including a fluid coupler interfaced to a test head
US8151872B2 (en) * 2007-03-16 2012-04-10 Centipede Systems, Inc. Method and apparatus for controlling temperature
KR101106608B1 (ko) * 2007-05-21 2012-01-20 후지쯔 세미컨덕터 가부시키가이샤 반도체장치의 시험장치 및 시험방법
US20100158391A1 (en) * 2008-12-24 2010-06-24 Yahoo! Inc. Identification and transfer of a media object segment from one communications network to another
CN103384585B (zh) * 2010-12-01 2016-08-10 Abb股份公司 机器人机械手系统
US8909851B2 (en) 2011-02-08 2014-12-09 SMART Storage Systems, Inc. Storage control system with change logging mechanism and method of operation thereof
US8935466B2 (en) 2011-03-28 2015-01-13 SMART Storage Systems, Inc. Data storage system with non-volatile memory and method of operation thereof
US9098399B2 (en) 2011-08-31 2015-08-04 SMART Storage Systems, Inc. Electronic system with storage management mechanism and method of operation thereof
US9021319B2 (en) 2011-09-02 2015-04-28 SMART Storage Systems, Inc. Non-volatile memory management system with load leveling and method of operation thereof
US9021231B2 (en) 2011-09-02 2015-04-28 SMART Storage Systems, Inc. Storage control system with write amplification control mechanism and method of operation thereof
US9063844B2 (en) 2011-09-02 2015-06-23 SMART Storage Systems, Inc. Non-volatile memory management system with time measure mechanism and method of operation thereof
US9239781B2 (en) 2012-02-07 2016-01-19 SMART Storage Systems, Inc. Storage control system with erase block mechanism and method of operation thereof
US9465049B2 (en) * 2012-04-13 2016-10-11 James B. Colvin Apparatus and method for electronic sample preparation
US9298252B2 (en) 2012-04-17 2016-03-29 SMART Storage Systems, Inc. Storage control system with power down mechanism and method of operation thereof
US8949689B2 (en) 2012-06-11 2015-02-03 SMART Storage Systems, Inc. Storage control system with data management mechanism and method of operation thereof
US9671962B2 (en) 2012-11-30 2017-06-06 Sandisk Technologies Llc Storage control system with data management mechanism of parity and method of operation thereof
US9123445B2 (en) 2013-01-22 2015-09-01 SMART Storage Systems, Inc. Storage control system with data management mechanism and method of operation thereof
US9329928B2 (en) 2013-02-20 2016-05-03 Sandisk Enterprise IP LLC. Bandwidth optimization in a non-volatile memory system
US9214965B2 (en) 2013-02-20 2015-12-15 Sandisk Enterprise Ip Llc Method and system for improving data integrity in non-volatile storage
US9183137B2 (en) 2013-02-27 2015-11-10 SMART Storage Systems, Inc. Storage control system with data management mechanism and method of operation thereof
US9470720B2 (en) * 2013-03-08 2016-10-18 Sandisk Technologies Llc Test system with localized heating and method of manufacture thereof
TW201506420A (zh) 2013-03-15 2015-02-16 森薩塔科技麻薩諸塞公司 直接注射式相變溫度控制系統
US10049037B2 (en) 2013-04-05 2018-08-14 Sandisk Enterprise Ip Llc Data management in a storage system
US9170941B2 (en) 2013-04-05 2015-10-27 Sandisk Enterprises IP LLC Data hardening in a storage system
US9543025B2 (en) 2013-04-11 2017-01-10 Sandisk Technologies Llc Storage control system with power-off time estimation mechanism and method of operation thereof
US10546648B2 (en) 2013-04-12 2020-01-28 Sandisk Technologies Llc Storage control system with data management mechanism and method of operation thereof
US10013033B2 (en) 2013-06-19 2018-07-03 Sandisk Technologies Llc Electronic assembly with thermal channel and method of manufacture thereof
US9898056B2 (en) 2013-06-19 2018-02-20 Sandisk Technologies Llc Electronic assembly with thermal channel and method of manufacture thereof
US9313874B2 (en) 2013-06-19 2016-04-12 SMART Storage Systems, Inc. Electronic system with heat extraction and method of manufacture thereof
US9244519B1 (en) 2013-06-25 2016-01-26 Smart Storage Systems. Inc. Storage system with data transfer rate adjustment for power throttling
US9367353B1 (en) 2013-06-25 2016-06-14 Sandisk Technologies Inc. Storage control system with power throttling mechanism and method of operation thereof
US9146850B2 (en) 2013-08-01 2015-09-29 SMART Storage Systems, Inc. Data storage system with dynamic read threshold mechanism and method of operation thereof
US9448946B2 (en) 2013-08-07 2016-09-20 Sandisk Technologies Llc Data storage system with stale data mechanism and method of operation thereof
US9361222B2 (en) 2013-08-07 2016-06-07 SMART Storage Systems, Inc. Electronic system with storage drive life estimation mechanism and method of operation thereof
US9431113B2 (en) 2013-08-07 2016-08-30 Sandisk Technologies Llc Data storage system with dynamic erase block grouping mechanism and method of operation thereof
US9158349B2 (en) 2013-10-04 2015-10-13 Sandisk Enterprise Ip Llc System and method for heat dissipation
US9152555B2 (en) 2013-11-15 2015-10-06 Sandisk Enterprise IP LLC. Data management with modular erase in a data storage system
US9549457B2 (en) 2014-02-12 2017-01-17 Sandisk Technologies Llc System and method for redirecting airflow across an electronic assembly
US9497889B2 (en) 2014-02-27 2016-11-15 Sandisk Technologies Llc Heat dissipation for substrate assemblies
US9519319B2 (en) 2014-03-14 2016-12-13 Sandisk Technologies Llc Self-supporting thermal tube structure for electronic assemblies
US9485851B2 (en) 2014-03-14 2016-11-01 Sandisk Technologies Llc Thermal tube assembly structures
US9348377B2 (en) 2014-03-14 2016-05-24 Sandisk Enterprise Ip Llc Thermal isolation techniques
US9921265B2 (en) 2015-12-18 2018-03-20 Sensata Technologies, Inc. Thermal clutch for thermal control unit and methods related thereto
JP7061770B2 (ja) * 2018-03-30 2022-05-02 日立Astemo株式会社 冷却装置

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1336076A (en) * 1971-06-10 1973-11-07 Int Computers Ltd Apparatus for cooling electrical circuit components
US3757530A (en) 1972-04-12 1973-09-11 Control Data Corp Cooling system for data processing apparatus
US4138692A (en) 1977-09-12 1979-02-06 International Business Machines Corporation Gas encapsulated cooling module
US4341432A (en) * 1979-08-06 1982-07-27 Cutchaw John M Liquid cooled connector for integrated circuit packages
USRE35721E (en) * 1983-12-14 1998-02-03 Hitachi, Ltd. Cooling device of semiconductor chips
US5083373A (en) * 1986-04-25 1992-01-28 Hamburgen William R Method for providing a thermal transfer device for the removal of heat from packaged elements
US5164661A (en) 1991-05-31 1992-11-17 Ej Systems, Inc. Thermal control system for a semi-conductor burn-in
JPH10506459A (ja) * 1994-09-09 1998-06-23 マイクロモジュール・システムズ 回路のメンブレンプローブ
US5581441A (en) 1995-06-07 1996-12-03 At&T Global Information Solutions Company Electrically-operated heat exchanger release mechanism
US5574627A (en) 1995-07-24 1996-11-12 At&T Global Information Solutions Company Apparatus for preventing the formation of condensation on sub-cooled integrated circuit devices
US5847293A (en) 1995-12-04 1998-12-08 Aetrium Incorporated Test handler for DUT's
US5918469A (en) 1996-01-11 1999-07-06 Silicon Thermal, Inc. Cooling system and method of cooling electronic devices
US5977785A (en) 1996-05-28 1999-11-02 Burward-Hoy; Trevor Method and apparatus for rapidly varying the operating temperature of a semiconductor device in a testing environment
US5882691A (en) 1997-03-06 1999-03-16 Conboy; John S. automatic dry wall compound applicator
EP1016337B1 (en) 1997-04-04 2008-05-21 Delta Design, Inc. Temperature control system for an electronic device
US6147506A (en) 1997-04-29 2000-11-14 International Business Machines Corporation Wafer test fixture using a biasing bladder and methodology
EP0915499B1 (en) 1997-11-05 2011-03-23 Tokyo Electron Limited Semiconductor wafer holding apparatus
US6054676A (en) 1998-02-09 2000-04-25 Kryotech, Inc. Method and apparatus for cooling an integrated circuit device
US6307394B1 (en) 1999-01-13 2001-10-23 Micron Technology, Inc. Test carrier with variable force applying mechanism for testing semiconductor components
JP4054473B2 (ja) * 1999-02-22 2008-02-27 株式会社アドバンテスト 電子部品試験装置および電子部品の試験方法
US6184504B1 (en) * 1999-04-13 2001-02-06 Silicon Thermal, Inc. Temperature control system for electronic devices
US6668570B2 (en) 2001-05-31 2003-12-30 Kryotech, Inc. Apparatus and method for controlling the temperature of an electronic device under test
US6543246B2 (en) 2001-07-24 2003-04-08 Kryotech, Inc. Integrated circuit cooling apparatus
US6731127B2 (en) * 2001-12-21 2004-05-04 Texas Instruments Incorporated Parallel integrated circuit test apparatus and test method

Also Published As

Publication number Publication date
EP1611610A4 (en) 2006-09-06
EP1611610A2 (en) 2006-01-04
WO2004086827A3 (en) 2005-01-20
US20050280144A1 (en) 2005-12-22
US6975028B1 (en) 2005-12-13
WO2004086827A2 (en) 2004-10-07
JP2006523838A (ja) 2006-10-19
KR20050115922A (ko) 2005-12-08

Similar Documents

Publication Publication Date Title
CR8043A (es) Aparato termico para un dispositivo electronico
ATE479833T1 (de) Kraftwerk mit wärmeauskopplung
MX359037B (es) Generador de sistema de absorcion co-caldeado.
FR2868519A1 (fr) Generateur thermique a materiau magneto-calorique et procede de generation de thermies
WO2011082912A3 (de) Thermoelektrischer wärmetauscher
BRPI0711638A2 (pt) método e sistema para gerar energia de uma fonte de calor
WO2010130764A3 (de) Wärmeübertrager und verfahren zur umwandlung von thermischer energie eines fluids in elektrische energie
ATE521994T1 (de) Thermogenerator
WO2010143896A3 (en) Heat-dissipating device and electronic apparatus having the same
TW200708232A (en) Heat-dissipation structure and method thereof
ATE493332T1 (de) Schiff mit thermischer energierückgewinnung und entsprechendes verfahren
UA101795C2 (ru) Двигательное устройство температурного перепада
TW201713201A (en) Thermal dissipation module
RU2013110000A (ru) Шумоглушитель
GB2477230A (en) Downhole thermal component temperature management system and method
BR112013005738A2 (pt) ferramenta de perfilagem de poço
WO2010010442A3 (en) Wind turbine tower heat exchanger
ITMI20091821A1 (it) Scambiatore di calore a gas di scarico per un generatore termoelettrico
TW200639115A (en) Passive thermoacoustic cooling apparatus
CN204328956U (zh) 一种led汽车灯的散热装置
WO2014195882A3 (fr) Procede de production d'energie par combustion de matieres, et installation pour la mise en oeuvre du procede
TW201414978A (zh) 散熱裝置
WO2014063810A3 (de) Vorrichtung zum umwandeln thermischer energie in mechanische energie sowie kraftfahrzeug mit einer solchen vorrichtung
JP6093881B2 (ja) エンジンアセンブリ
MX351102B (es) Proceso produccion de energia util a partir de energia termica.

Legal Events

Date Code Title Description
FA Abandonment or withdrawal (granting procedure)