CS182611B1 - Power semiconducting element - Google Patents

Power semiconducting element

Info

Publication number
CS182611B1
CS182611B1 CS175976A CS175976A CS182611B1 CS 182611 B1 CS182611 B1 CS 182611B1 CS 175976 A CS175976 A CS 175976A CS 175976 A CS175976 A CS 175976A CS 182611 B1 CS182611 B1 CS 182611B1
Authority
CS
Czechoslovakia
Prior art keywords
semiconducting element
power semiconducting
power
semiconducting
Prior art date
Application number
CS175976A
Other languages
English (en)
Inventor
Pavel Reichel
Pavel Kafunek
Jiri Kovar
Oldrich Pokorny
Michal Pellant
Jaroslav Zuna
Jindrich Kratina
Original Assignee
Pavel Reichel
Pavel Kafunek
Jiri Kovar
Oldrich Pokorny
Michal Pellant
Jaroslav Zuna
Jindrich Kratina
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Pavel Reichel, Pavel Kafunek, Jiri Kovar, Oldrich Pokorny, Michal Pellant, Jaroslav Zuna, Jindrich Kratina filed Critical Pavel Reichel
Priority to CS175976A priority Critical patent/CS182611B1/cs
Priority to SE7702467A priority patent/SE7702467L/xx
Priority to DD19789077A priority patent/DD129256A1/xx
Priority to DE19772711776 priority patent/DE2711776A1/de
Priority to US05/778,869 priority patent/US4129881A/en
Publication of CS182611B1 publication Critical patent/CS182611B1/cs

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/13—Containers comprising a conductive base serving as an interconnection
    • H10W76/138—Containers comprising a conductive base serving as an interconnection having another interconnection being formed by a cover plate parallel to the conductive base, e.g. sandwich type
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07351—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting
    • H10W72/07354—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/341—Dispositions of die-attach connectors, e.g. layouts
    • H10W72/347—Dispositions of multiple die-attach connectors
CS175976A 1976-03-18 1976-03-18 Power semiconducting element CS182611B1 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
CS175976A CS182611B1 (en) 1976-03-18 1976-03-18 Power semiconducting element
SE7702467A SE7702467L (sv) 1976-03-18 1977-03-04 Effekthalvledarelement
DD19789077A DD129256A1 (de) 1976-03-18 1977-03-16 Leistungshalbleiterbauelement
DE19772711776 DE2711776A1 (de) 1976-03-18 1977-03-17 Leistungshalbleiterbauelement
US05/778,869 US4129881A (en) 1976-03-18 1977-03-18 Heat sink cooled, semiconductor device assembly having liquid metal interface

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CS175976A CS182611B1 (en) 1976-03-18 1976-03-18 Power semiconducting element

Publications (1)

Publication Number Publication Date
CS182611B1 true CS182611B1 (en) 1978-04-28

Family

ID=5352773

Family Applications (1)

Application Number Title Priority Date Filing Date
CS175976A CS182611B1 (en) 1976-03-18 1976-03-18 Power semiconducting element

Country Status (5)

Country Link
US (1) US4129881A (cs)
CS (1) CS182611B1 (cs)
DD (1) DD129256A1 (cs)
DE (1) DE2711776A1 (cs)
SE (1) SE7702467L (cs)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4254431A (en) * 1979-06-20 1981-03-03 International Business Machines Corporation Restorable backbond for LSI chips using liquid metal coated dendrites
US4386362A (en) * 1979-12-26 1983-05-31 Rca Corporation Center gate semiconductor device having pipe cooling means
DE3143336A1 (de) * 1981-10-31 1983-05-19 SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg Halbleitergleichrichterbaueinheit
US4545840A (en) * 1983-03-08 1985-10-08 Monolithic Memories, Inc. Process for controlling thickness of die attach adhesive
US4954875A (en) * 1986-07-17 1990-09-04 Laser Dynamics, Inc. Semiconductor wafer array with electrically conductive compliant material
US4897708A (en) * 1986-07-17 1990-01-30 Laser Dynamics, Inc. Semiconductor wafer array
JP2786193B2 (ja) * 1987-10-26 1998-08-13 株式会社日立製作所 半導体冷却装置
EP0364619B1 (de) * 1988-10-19 1993-12-29 Ibm Deutschland Gmbh Vorrichtung zum Plasma- oder reaktiven Ionenätzen und Verfahren zum Ätzen schlecht wärmeleitender Substrate
DE3941041A1 (de) * 1989-07-31 1991-02-07 Siemens Ag Anordnung mit einem halbleiterbauelement
DE4101205A1 (de) * 1990-02-09 1991-08-14 Asea Brown Boveri Gekuehltes hochleistungshalbleiterbauelement
WO1992022090A1 (en) * 1991-06-03 1992-12-10 Motorola, Inc. Thermally conductive electronic assembly
US5706171A (en) * 1995-11-20 1998-01-06 International Business Machines Corporation Flat plate cooling using a thermal paste retainer
US6339120B1 (en) 2000-04-05 2002-01-15 The Bergquist Company Method of preparing thermally conductive compounds by liquid metal bridged particle clusters
US6984685B2 (en) * 2000-04-05 2006-01-10 The Bergquist Company Thermal interface pad utilizing low melting metal with retention matrix
US6797758B2 (en) * 2000-04-05 2004-09-28 The Bergquist Company Morphing fillers and thermal interface materials
JP2004532743A (ja) * 2000-10-25 2004-10-28 ワシントン ステート ユニバーシティ リサーチ ファウンデーション 圧電マイクロトランスデューサ、その使用法および製造法
US6387733B1 (en) 2001-05-22 2002-05-14 Rf Micro Devices, Inc. Time-based semiconductor material attachment
US7411792B2 (en) * 2002-11-18 2008-08-12 Washington State University Research Foundation Thermal switch, methods of use and manufacturing methods for same
JP7203214B2 (ja) * 2018-10-19 2023-01-12 ヒタチ・エナジー・スウィツァーランド・アクチェンゲゼルシャフト 浮動性実装を有する電力半導体装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3226608A (en) * 1959-06-24 1965-12-28 Gen Electric Liquid metal electrical connection
US3248615A (en) * 1963-05-13 1966-04-26 Bbc Brown Boveri & Cie Semiconductor device with liquidized solder layer for compensation of expansion stresses
DE1514483B2 (de) * 1965-06-22 1971-05-06 Siemens AG, 1000 Berlin u 8000 München Druckkontakt halbleiter gleichrichter
US3475660A (en) * 1967-12-01 1969-10-28 Int Rectifier Corp Hollow cylindrical semiconductor device
US3852803A (en) * 1973-06-18 1974-12-03 Gen Electric Heat sink cooled power semiconductor device assembly having liquid metal interface

Also Published As

Publication number Publication date
DD129256A1 (de) 1978-01-04
SE7702467L (sv) 1977-09-19
US4129881A (en) 1978-12-12
DE2711776A1 (de) 1977-09-29

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