CS200634B1 - Method of coating the adhesive resinous layers - Google Patents

Description

The present invention relates to a method for applying adhesive resin layers.

So far, the adhesive resin layers have been applied by spreading a layer of resin of the desired thickness on the product, then curing the layer with hot air to obtain the necessary adhesive properties.

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The method used hitherto is disadvantageous in that uneven air flow can cause uneven pre-hardening of the layer. Since the viscosity of the resin is reduced during heating, an uneven layer may also be formed. Unevenness in the thickness and degree of precure of the layer may be a defect in some applications.

These drawbacks are overcome by the method of applying the adhesive resin layers of the invention using molds that can be heated and cooled coated with a release layer. Its essence is that the resin is not first applied to the mold, then the product is pressed into the resin at a distance corresponding to the thickness of the final adhesive resin layer. Then, the mold is heated in a thermal loop, the course of which depends on the type of resin, thereby pre-curing the resin to the degree where the resin obtains the desired adhesive properties. The course of the thermal loop depends on the type of resin to be treated. After the precure has been completed, the mold is cooled and the article with the adhesive resin layer applied is removed from the mold. The progress achieved by the invention is that it can be achieved uniformly thick

A0200 634

634 and uniformly pre-cured adhesive resin layers, since heat is transferred to the strand only by a thin release layer, which only slightly influences the heat transfer.

The principle of the invention is illustrated in the accompanying drawing, in which Figs. 1a and 1e show the individual phases of the method for applying adhesive resin strings.

In FIG. 1a, a portion of a mold 2 coated with a release layer 6 is indicated. The porn 2 is made of a thermally conductive material so that it can be heated 1 to cool. Resin 1 is applied to this form.

FIG. 1b shows the mold 6 of FIG. The product has to be pushed into the resin 1 at a distance t, i.e. corresponding to the thickness of the final adhesive resin layer 2.

Figure 1 shows the effect of heat Q1 on mold 2, which heats fox 6 in a thermal loop, the course of which depends on the type of resin used. The heat Q1 can be supplied, for example, by means of electric heating. By supplying heat 1 from the mold 2 from the mold 2, the resin 1 is precured to a degree where it obtains the desired adhesive properties.

In Figure 1d, the cooling of the mold 2 is shown symbolically, for example by means of a cooling liquid. This removes heat Q 2 from the resin χ.

FIG. 1e shows the article 6 after being removed from the foxma 2 when the resin 6 has been converted into the final adhesive resin layer 6 deposited on the article 6. £ removal from _the mold 2 can be done e.g. by hand or mechanically.

Below are two exemplary embodiments of the inventive deposition method

Example 1

The epoxy resin is applied to the polytetrafluoroethylene coated form. An epoxy glass laminate sheet of sheet-like copper is pressed into the resin layer at the desired distance. The mold is heated to 150 ° C and immersed at this temperature for 10 to 30 minutes. Thereafter, the mold is cooled and the adhesive layer is removed from the die.

Example 2

The polyester resin is applied to the polytetrafluoroethylene-coated foxmy. A metal plate is pressed into the resin layer at a desired distance from the mold. The mold is heated to 50 ° C and immersed at this temperature for 2 to 10 minutes. The foxma is then smoothed and the blanket covered with adhesive is removed from the mold.

The process is particularly suitable for epoxy and polyester resins, but can be used for all other types of resins.

200 034

The main field of application of the method of applying adhesive resin layers is the formation of adhesive layers for the deposition of conductors in electrical engineering. The method can also be applied in other fields.

Claims (1)

fIndllS t HES OUT A method of applying adhesive resin layers using a mold which can be heated to cool, coated with a release layer, characterized in that the resin is first applied to the mold, then the product is pressed into the resin at a distance corresponding to the thickness of the final adhesive resin layer. a cycle, the course of which depends on the type of resin, thereby pre-curing to the degree where the resin obtains the desired adhesive properties, after which the mold is cooled and the article with the adhesive resin layer applied is removed from the mold.