CS231041B1 - Lapping suspension - Google Patents

Abstract

The invention relates to a lapping suspension consisting of abrasive particles, foaming and liquid components and additives. The essence of the invention is that the lapping suspension contains synthetic diamond dust with a grain size of up to 10 wt in an amount of 0.5 to 3 g, 10 to 30 g of ether, of the general formula ROR, where R is an alkyl with 2 to 4 carbon atoms, at least 1.4 g of dodecylbenzenesulfonate and the remainder up to a content of 50 g of water

Description

The invention relates to a lapping suspension consisting of abrasive particles, a foaming and a liquid component, and grids.

So far, the production of glued ferrite surfaces after previous abrasion has been carried out by two operations. Since the surface to be ground has a roughness Ra of about 0.5 µm, the first wet wet rapping is carried out on a cast iron or steel-cast wheel on a lapping machine and then glued onto the second wheel with diamond dust having a grain size of 0 to 3 µm from wet to roughness. <0.025 / im.

A disadvantage of the prior art process is the difficulty of maintaining the intersection of the lapping discs during work and the associated reproduction of the production of a defined quality of finely glued surfaces. Coarse bonding on loose abrasive leads to a loss of ferrite, which results in a significant failure of the surface plenperelelity and a rapid change in the flatness of the bonded wheel. In the case of fine gluing, the flatness of the surfaces to be glued and the rounding of the edges are often disturbed, which is generally the greater the smaller the overall reduction of the gluing time and the longer the time of gluing. Diamond dust with a grain size of 0 to 3 jum could only be used for the final fine bonding of ferrite surfaces in the mixture used so far.

These disadvantages are overcome by a suspension consisting of abrasive particles, foamable liquid component and additives according to the invention, which comprises synthetic diamond dust having a grain size of up to 10 µm in an amount of 0.5 to 3 g, 10 to 30 g of ether, at least 1.4 g of dodecylbenzenesulfonate and the remainder to 50 g of water.

When using diamond dust in the newly proposed suspension, the abrasive on the metal lapping disc is increased to such an extent that the abraded ferrite surfaces can be gently bonded without coarse gluing, while maintaining the required polished surface quality with a roughness Re below 0.01 zun and at the same time maintaining the flatness of the polished plohh 0,000 2 µm not 25 mm in length at the original time of fine bonding while achieving a plenperelelity of the areas below 0.005 mm.

Thus, the bonding time associated with the rough bonding handling times and the sorted SiC powder is saved. Because coarse bonding and fine bonding are carried out on the same equipment,

The power of the lapping machine increases by about 30%. - The use of a new fine-bonding slurry allows the flat polishing of ferrites in conjunction with other materials, such as glass or ceramic welded ferrites, β further opens up new technological possibilities in the manufacture of ferrite circuits for higher-grade magnetic gates.

By eliminating the bonding with a relatively soft SiC powder, it is also possible with the slurry to evenly harden dust-treatable hard materials, such as ceramics, metals, cemented carbide products, cubic boron nitride polycrystalline materials or diamond polycrystals - compacts. By planar bonding, especially for materials containing cubic boron nitride, significant increases in their utility properties can be expected. Due to the slow disintegration and the increased abrasiveness of the diamond dust in the proposed suspension, this is also advantageous for fine bonding of small holes and dies.

The lapping suspension of the present invention may also contain some adjuncts or preservatives, for example diol, but these substances, generally reducing the diamond's ebrezosity in the proposed suspension, depending on the amount in the suspension. Diethyl ether, dipropyl ether, dibutyl ether and combinations thereof, i.e. ethers having the generic designation R-O-R, where R are alkyl groups of 2 to 4 carbons, may be used to prepare the suspension.

As the detergent, alkyl sulfenes, alkyrylsulfonenes of organic substances or mixtures thereof in aqueous solution, preferably alkylsulfonates, for example, n-dodecylbenzenesulfonate, can be used. A higher amount of detergent or shampoo is advantageous for keeping the surface of the metal adhesive disc clean, especially when bonding hard polycrystals of diamond or cubic boron nitride.

For fine bonding and bonding of soft materials, diamond dust in the 0 to 3 µm fraction is used, and for superhard materials 3 to 8 µm.

Example

Preparation of lapping suspension

Weigh 1 g of synthetic diamond dust of a fraction of 1 to 3 µm (or 0 to 3 µm) into an agate spreading dish and pour 15 g of ethyl ether. Diamond clusters are gently rubbed by a chump. 7 g of a 28% aqueous solution of dodecylbenzene sulfonate are added to the dish and mixed with diethyl ether and diamond dust. The resulting mixture forms a gel-like hairstyle. The mixture is made up to 50 g with water. The lapping mixture is stirred or shaken before use.

The preparation of the lapping suspension for the polycrystalline materials of diamond or cubic boron nitride is the same, but for lapping a diamond dust having a grain size of 3 to 10 µm is used, preferably a fraction of 3 to 5 µm having the same concentration. ,

Claims (1)

Lapping suspension consisting of abrasive particles, foaming and liquid components and additives, characterized in that it contains synthetic diamond dust having a grain size of up to 10 µm in an amount of 0.5 to 3 g, 10 to 30 g of ether of the formula ROR, wherein R means veins 1 of 2 to 4 carbon atoms, at least 1.4 g of dodecylbenzenesulfonate and the remainder up to 50 g of water.